CN102242948A - Tiled radiant floor heating - Google Patents

Tiled radiant floor heating Download PDF

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Publication number
CN102242948A
CN102242948A CN201110166347XA CN201110166347A CN102242948A CN 102242948 A CN102242948 A CN 102242948A CN 201110166347X A CN201110166347X A CN 201110166347XA CN 201110166347 A CN201110166347 A CN 201110166347A CN 102242948 A CN102242948 A CN 102242948A
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China
Prior art keywords
floor heating
layer
elementary cell
groove
heating together
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Pending
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CN201110166347XA
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Chinese (zh)
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秦秀芬
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Individual
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Individual
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Priority to CN201110166347XA priority Critical patent/CN102242948A/en
Publication of CN102242948A publication Critical patent/CN102242948A/en
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Abstract

The invention relates to a tiled radiant floor heating, which comprises a plurality of basic units which can be tiled to form a flat radiant floor heating structure, wherein each basic unit comprises a base layer, a circuit layer, a heat insulation layer and an electric heating layer which are laminated in turn from bottom to top; and the circuit layer is electrically connected with the electric heating layer. The invention has the advantages that: (1) due to the design of tiling a plurality of components to form the radiant floor heating, the radiant floor heating is easy to mount and construct, convenient, rapid and low in cost, the tiling area can be optionally changed with indoor or outdoor space, and the shape can be optionally adjusted according to different tiling areas; (2) the radiant floor heating can be applied on the surface of floors, is rapid to radiate, energy-saving, and convenient to fold, and the requirements of heating in winter and being folded in summer can be met; (3) surface decorative materials are diversified and can be combined with carpets, woods and floor tiles; and (4) preferably, a carbon crystal board is adopted to form the electric heating layer, far infrared heat can be radiated, and a health-care function is realized.

Description

Piece floor heating together
Technical field
The present invention relates to a kind of floor heating structure, particularly a kind of floor heating material of freely piecing together of carrying out.
Background technology
Floor heating is the abbreviation of floor panel heating, English is Radiant Floor Heating, be to be radiator with whole ground, by the heating agent in the flooring radiation layer, evenly heat whole ground, utilize the make progress rule of radiation of the accumulation of heat on ground self and heat to conduct from the bottom to top, reach the purpose of heating.Compare with traditional heating system, it is even, comfortable that floor heating has heat radiation, and cleaning is healthy, and environmental protection and energy saving are elegant in appearance, safe and reliable, advantages such as extra long life and efficient sound insulation.
Present floor heating is divided into two kinds of water floor heating and electric floor heatings.According to present industry construction reference: the water floor heating is that not to be higher than 60 ℃ hot water with temperature be heating agent, circulates in the heating tube in being embedded in the below ground packed layer, heats whole floor; The electricity floor heating is outer surface to be allowed to be limited on the operating temperature 65 ℃ heating cable be embedded in the floor, is the mode of the firm and hard heatedly terrain surface radiation heating of thermal source with the heating cable.
Existing water floor heating is mainly by boiler, water collecting and diversifying device, ground coiled pipe, dry floor heating module, the auxilliary material in ground, temperature controller reach accessory compositions such as part elbow, its complex structure, construction time is long, electric floor heating is then mainly by heating cable, temperature controller, compositions such as the auxilliary material in ground, though its structure is simpler than water floor heating, but still need carry out comparatively complicated ground construction, the cost height, and the construction time is still long.
Summary of the invention
The objective of the invention is to propose a kind of floor heating of piecing together, it is simple in structure, can structure be installed by piecing mode together, and convenient and quick construction is with low cost, thereby has overcome deficiency of the prior art.
For achieving the above object, the present invention has adopted following technical scheme:
A kind ofly piece floor heating together, it is characterized in that: it comprises can piece a plurality of elementary cells that form smooth floor heating structure each other together, described elementary cell comprises basic unit, circuit layer, thermal insulation layer and the electrothermal layer that is cascading from top to bottom, and circuit layer is electrically connected with electrothermal layer.
Preferably, described elementary cell also comprises surperficial decoration materials, and these surface decoration materials are covered on the electrothermal layer.
As a kind of preferred implementation, the groove coupling structures to form through cooperatively interacting between the neighboring unit cells.
Further, described elementary cell is a rectangular elements, its relative edges at two ends portion respectively indent and evagination form one with upper groove and one with upper protruding block, and described groove and projection can cooperatively interact.
The width of rebate of described groove is less than the width of a select location between notch and the bottom land.
A kind ofly piece floor heating together, it is characterized in that: it comprises a plurality of elementary cells, these a plurality of elementary cells are pieced the smooth floor heating structure of formation together through a plurality of abaculus that are distributed between each elementary cell, described elementary cell comprises basic unit, circuit layer, thermal insulation layer and the electrothermal layer that is cascading from top to bottom, and circuit layer is electrically connected with electrothermal layer.
As a kind of preferred implementation, described elementary cell also comprises surperficial decoration materials, and described surperficial decoration materials are covered on the electrothermal layer.
Further, described elementary cell is a rectangular elements, at least the regional area indent on each elementary cell four limit forms one with upper groove, and the respective slot that is provided with on wherein arbitrary groove and the neighboring unit cells cooperates formation one embedding hole, and described abaculus is arranged in this embedding hole.
The width of rebate of described groove is less than the width of a select location between notch and the bottom land.
Described groove can be selected for use but be not limited to Y connected in star and dovetail groove.
Compared with prior art, the invention has the advantages that:
(1) adopt with a plurality of assemblies and piece the design that forms floor heating together, make floor heating be easy to install and make up, convenient and swift, with low cost, and lay area and can change arbitrarily with the size in indoor or outdoors space, its form also can be adjusted arbitrarily according to the difference of laying work area;
(2) the present invention can be placed in the floor surface application, and radiation is quick and energy-conservation, takes in conveniently, can realize the floor heating in winter, the demand of taking in summer;
(3) the decoration materials variation of the present invention surface can combine with carpet, timber, floor tile;
(4) the present invention preferably adopts the brilliant plate of carbon to constitute electrothermal layer, and its radiation-curable far-infrared thermal produces health care.
Description of drawings
Fig. 1 is the basic structure schematic diagram that the present invention pieces floor heating together;
Fig. 2 is the package assembly schematic diagram of a preferred embodiment of the present invention;
Fig. 3 is the decomposition texture schematic diagram of a preferred embodiment of the present invention;
Fig. 4 is the package assembly schematic diagram of circuit layer in a preferred embodiment of the present invention;
Fig. 5 is the package assembly schematic diagram of abaculus and circuit layer in a preferred embodiment of the present invention;
Fig. 6 is the structural representation of another preferred embodiment of the present invention.
Fig. 7 is the package assembly schematic diagram of circuit layer in another preferred embodiment of the present invention;
The specific embodiment
Consulting Fig. 1 is the basic structure that the present invention pieces floor heating together, it comprises can piece a plurality of elementary cells that form smooth floor heating structure each other together, each elementary cell comprises a of basic unit, circuit layer b, thermal insulation layer c and the electrothermal layer d that is cascading from top to bottom, and circuit layer b is electrically connected with electrothermal layer d.Preferably, described elementary cell also comprises surperficial decoration materials e, and these surface decoration materials are covered on the electrothermal layer d.
Below in conjunction with accompanying drawing and some preferred embodiments technical scheme of the present invention is described further.
Embodiment 1 consults Fig. 2-3, this is pieced floor heating together and is spliced to form by a plurality of rectangle elementary cells, each elementary cell 1 comprises the 1a of basic unit, circuit layer 1b, thermal insulation layer 1c and the electrothermal layer 1d that is cascading from top to bottom, and circuit layer 1b is electrically connected with electrothermal layer 1d, simultaneously, also can cover surperficial decoration materials (not shown) on the described electrothermal layer 1d.The equal indent of the regional area on each elementary cell four limit forms two grooves, and wherein the respective slot that is provided with on each groove and the neighboring unit cells cooperates formation one embedding hole, and an abaculus 2 is set in each embedding hole.Aforementioned grooves can have the structure of width of rebate less than the width of a select location between notch and the bottom land, preferably adopts the Y connected in star, so that neighboring unit cells can more fastening amalgamation.
Consult Fig. 4, be distributed with some leads in the circuit layer 1b in the aforementioned elementary cell, these leads are electrically connected with electrothermal layer 1d.When being spliced to form electric warming up, the lead in the circuit layer in each elementary cell is connected to each other, and forms supply network.
Further, consult Fig. 5, be provided with the wire casing that can supply lead to pass in each abaculus, so can realize the electrical connection of the circuit layer in each elementary cell, and it is smooth to keep piecing together the warm maintenance of electricity.
Aforementioned supply network can be connected with power supply through temperature control assembly (as thermocouple), switch and Arming Assembly (as fuse) etc., so makes this splicing electricity warm safer controlled.
The aforementioned electric thermosphere can be selected for use but be not limited to materials such as conventional heating wire, Electric radiant Heating Film and set up formation, but preferably adopts the brilliant plate of carbon, and it can produce far infrared, has heating and health care concurrently.
Aforementioned basic unit, thermal insulation layer etc. can be selected for use but be not limited to materials such as timber, plastics, cloth, metal, pottery and form, and same, the matrix of circuit layer also can adopt previous materials to form.
The aforementioned surfaces decoration materials can adopt various material and pattern etc. equally, and it can combine with carpet, floor, floor tile etc. respectively.
Attached reaching as if adopting the brilliant plate of carbon to constitute electrothermal layer, then also can directly form surface decorations layer in carbon crystalline substance plate Surface Machining or coating patterned layer, and need not to add separately surperficial decoration materials.
Embodiment 2 consults Fig. 6, and should to piece the floor heating structure together substantially the same manner as Example 1, also be spliced to form by a plurality of rectangle elementary cells, each elementary cell 3 also comprises basic unit, circuit layer, thermal insulation layer and the electrothermal layer that is cascading from top to bottom, and circuit layer is electrically connected with electrothermal layer, simultaneously, also can cover surperficial decoration materials on the described electrothermal layer.Its difference only is, is respectively equipped with two grooves and projection on the relative both sides of each elementary cell, and described groove and projection can cooperatively interact.This groove also can preferably adopt the Y connected in star, so that neighboring unit cells can more fastening amalgamation.
Consulting Fig. 7 is the package assembly schematic diagram of circuit layer in another preferred embodiment of the present invention; This structure can rotate freely and piece together, and is non-directional, avoids anisotropy to form short circuit.
In addition, piece the floor heating circumference together and also form flat configuration, also can adopt side direction edge closing bar 41,42 for making.
The present invention can produce following effect: (1) can place floor surface, radiation quick and energy-conservation (traditional floor heating designs in floor panel structure, after heat energy is absorbed by the floor in a large number just radiation go into indoor); (2) take in conveniently, can realize the floor heating in winter, the demand of taking in summer; (3) surperficial decoration materials variation can combine with carpet, timber, floor tile; (4) adopt the brilliant plate of carbon as supplying heat source, tool far infrared thermal radiation has health-care effect; (5) can be paved with ground, room, or local the laying used.
Above embodiment is only for the usefulness that the present invention is described, but not limitation of the present invention, person skilled in the relevant technique under the situation that does not break away from the spirit and scope of the present invention, has been done various conversion or modification, all belongs to category of the present invention.

Claims (10)

1. piece floor heating together for one kind, it is characterized in that: it comprises can piece a plurality of elementary cells that form smooth floor heating structure each other together, described elementary cell comprises basic unit, circuit layer, thermal insulation layer and the electrothermal layer that is cascading from top to bottom, and circuit layer is electrically connected with electrothermal layer.
2. according to claim 1ly piece floor heating together, it is characterized in that: described elementary cell also comprises surperficial decoration materials, and described surperficial decoration materials are covered on the electrothermal layer.
3. according to claim 1 and 2ly piece floor heating together, it is characterized in that: groove coupling structures to form through cooperatively interacting between the neighboring unit cells.
4. according to claim 3ly piece floor heating together, it is characterized in that: described elementary cell is a rectangular elements, its relative edges at two ends portion respectively indent and evagination form one with upper groove and one with upper protruding block, and described groove and projection can cooperatively interact.
5. according to claim 4ly piece floor heating together, it is characterized in that: the width of rebate of described groove is less than the width of a select location between notch and the bottom land.
6. piece floor heating together for one kind, it is characterized in that: it comprises a plurality of elementary cells, these a plurality of elementary cells are pieced the smooth floor heating structure of formation together through a plurality of abaculus that are distributed between each elementary cell, described elementary cell comprises basic unit, circuit layer, thermal insulation layer and the electrothermal layer that is cascading from top to bottom, and circuit layer is electrically connected with electrothermal layer.
7. according to claim 6ly piece floor heating together, it is characterized in that: described elementary cell also comprises surperficial decoration materials, and described surperficial decoration materials are covered on the electrothermal layer.
8. describedly piece floor heating together according to claim 6 or 7, it is characterized in that: described elementary cell is a rectangular elements, at least the regional area indent on each elementary cell four limit forms one with upper groove, the respective slot that is provided with on wherein arbitrary groove and the neighboring unit cells cooperates and forms an embedding hole, and described abaculus is arranged in this embedding hole.
9. according to claim 8ly piece floor heating together, it is characterized in that: the width of rebate of described groove is less than the width of a select location between notch and the bottom land.
10. according to claim 9ly piece floor heating together, it is characterized in that: described groove is Y connected in star or dovetail groove.
CN201110166347XA 2011-06-21 2011-06-21 Tiled radiant floor heating Pending CN102242948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110166347XA CN102242948A (en) 2011-06-21 2011-06-21 Tiled radiant floor heating

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Application Number Priority Date Filing Date Title
CN201110166347XA CN102242948A (en) 2011-06-21 2011-06-21 Tiled radiant floor heating

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CN102242948A true CN102242948A (en) 2011-11-16

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102393039A (en) * 2011-11-18 2012-03-28 秦秀芬 Self-heating wood floor
CN102980235A (en) * 2012-11-08 2013-03-20 哈尔滨维尔士科技发展有限公司 Thermoregulation heating type anti-static floor
CN103090446A (en) * 2012-11-26 2013-05-08 昆山桑德勒电子实业有限公司 Circuit connection structure for short circuit prevention of spliced floor heating
CN104780734A (en) * 2015-04-24 2015-07-15 国网上海市电力公司 Cabinet network line sorting board
CN107327092A (en) * 2017-08-16 2017-11-07 杭州锦韵尔工艺品有限公司 Freely assembled type floor heating piece

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2202771Y (en) * 1994-08-05 1995-07-05 林王丽珠 Composite ground pad
CN2764852Y (en) * 2004-12-17 2006-03-15 黄坤岳 Warm floor
CN2871707Y (en) * 2006-01-16 2007-02-21 朴成杰 Geothermal assembled floor block
WO2007049909A1 (en) * 2005-10-25 2007-05-03 Chunyul Energy Co., Ltd. An electric heating radiator
CN202141120U (en) * 2011-06-21 2012-02-08 秦秀芬 Collaged radiant floor heating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2202771Y (en) * 1994-08-05 1995-07-05 林王丽珠 Composite ground pad
CN2764852Y (en) * 2004-12-17 2006-03-15 黄坤岳 Warm floor
WO2007049909A1 (en) * 2005-10-25 2007-05-03 Chunyul Energy Co., Ltd. An electric heating radiator
CN2871707Y (en) * 2006-01-16 2007-02-21 朴成杰 Geothermal assembled floor block
CN202141120U (en) * 2011-06-21 2012-02-08 秦秀芬 Collaged radiant floor heating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102393039A (en) * 2011-11-18 2012-03-28 秦秀芬 Self-heating wood floor
CN102980235A (en) * 2012-11-08 2013-03-20 哈尔滨维尔士科技发展有限公司 Thermoregulation heating type anti-static floor
CN103090446A (en) * 2012-11-26 2013-05-08 昆山桑德勒电子实业有限公司 Circuit connection structure for short circuit prevention of spliced floor heating
CN104780734A (en) * 2015-04-24 2015-07-15 国网上海市电力公司 Cabinet network line sorting board
CN107327092A (en) * 2017-08-16 2017-11-07 杭州锦韵尔工艺品有限公司 Freely assembled type floor heating piece

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Application publication date: 20111116