CN102240606A - Method for separating nonmetal materials from waste circuit boards by flotation - Google Patents
Method for separating nonmetal materials from waste circuit boards by flotation Download PDFInfo
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- CN102240606A CN102240606A CN2011101153655A CN201110115365A CN102240606A CN 102240606 A CN102240606 A CN 102240606A CN 2011101153655 A CN2011101153655 A CN 2011101153655A CN 201110115365 A CN201110115365 A CN 201110115365A CN 102240606 A CN102240606 A CN 102240606A
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Abstract
The invention discloses a method for separating nonmetal material from waste circuit boards by flotation, which is characterized by comprising the following steps: grinding tailings, which are obtained after crushing waste circuit boards, reselection and recovery of metals by magnetic separation, to less than 0.1 millimeters, adding water according to a liquid-to-solid ratio between 2:1 to 3:1 to make pulp, adding silicon defoaming agent according to a ratio of 100 to 200 grams per ton, and stirring for 5 to 8 minutes; and adding one, two or three of laurylamine, octadecylamine and mixed amine in an amount of 50 to 800 grams per ton as a collector and terpenic oil in an amount of 0 to 20 grams per ton, stirring for 2 to 5 minutes, and separating inorganic substances from organic substances by 1 time of coarse selection, 1 to 3 times of concentration and 1 to 3 times of scavenging. In the invention, the process flow is simple, the damage to the environment is small, the cost is low, the recycling rate of the waste circuit boards is improved, and the full-value pollution-free production of the waste circuit boards is realized.
Description
Technical field
The present invention relates to a kind of resource and reclaim the field, particularly a kind of method that from waste printed circuit board, reclaims non-metallic material.
Background technology
Waste printed circuit board has been the assembly electronic circuit board of various electronic devices and components, it forms complicated, and material category is many, is difficult to obtain satisfied resource effect with simple PROCESS FOR TREATMENT.The nonmetallic materials that waste printed circuit board comprises have two big classes: the one, and organic composite material comprises plastics, resin glass fiber material and Tetefol etc.; The 2nd, inorganic material mainly contains metal and electronic ceramics etc.The metal material recovery and utilization technology is comparatively ripe in the at present domestic and international waste printed circuit board, can obtain the metallic copper and the nonmetal tailings of copper content about 95% after employing fragmentation-gravity treatment.Copper content is generally about 0.2 ~ 0.4% in the nonmetal tailings, comprise inorganic matter (electronic ceramics) and organic matter (fiberglass resin) simultaneously, comprehensive recovery value height, but because complicated component, separation difficulty to many, the weak effect of processing resource problem of nonmetal tailings, comprises as filler reuse, pyrolysis oil preparation etc. all existing product purity poor at present, utilization rate is low, the problem that the processing procedure environmental pollution is big.
Summary of the invention
The objective of the invention is for effectively solving problems such as the recovery utilization rate that exists in the nonmetal tailings treatment technology that waste printed circuit board fragmentation-gravity treatment obtains is low, environmental pollution is serious, realize waste printed circuit board efficiently, cycling and reutilization economically.The present invention realizes by following steps:
1) tailings of waste printed circuit board after metal is reclaimed in fragmentation-gravity treatment-magnetic separation is crushed to below the 0.1mm, and the liquid-solid ratio by 2/1 ~ 3/1 adds water furnishing slurry, adds silicon defoamer 100 ~ 200 gram/tons, stirs 5 ~ 8 minutes;
2) adopt in lauryl amine, octadecylamine and the mixed amine a kind of, two or three as collecting agent, consumption is 50 ~ 800 gram/tons, terpenic oil 0 ~ 20 gram/ton stirred 2 ~ 5 minutes, roughly selected through 1 time, 1 ~ 3 time is selected, scans separation inorganic matter and organic matter 1 ~ 3 time.
Above-mentioned silicon defoamer is dimethicone or waterglass.
Principle of the present invention is based on the moistened surface gender gap of nonmetal inorganic matter in the waste printed circuit board and organic matter material itself, and the variation of the surface nature of each material under the floating agent effect own, by flotation inorganic matter and organic matter are separated, thereby reach the purpose of recovery.
Characteristics of the present invention are: technological process is simple, and production cost is low, and has remedied the deficiency of mechanical separation method.On the basis very little to environmental hazard, improved the resource rate of waste printed circuit board significantly, can obtain to contain the inorganic powder of electronic ceramics more than 85% after the sorting and contain the organic dust of glass fiber resin more than 95%, organic matter can directly be made in composite as applying filler again, and inorganic matter can be used for making pottery or cement etc.; Secondly, the present invention has solved various environmental pollutions and the human body harm that present widely used method is brought effectively, used beneficiation reagent is comparatively friendly to environment, and tail water can be realized recycling or reaches emission request through simple process, realize the cleaner production of waste printed circuit board total head.
The specific embodiment
Embodiment 1: waste printed circuit board is through fragmentation, after metal is reclaimed in gravity treatment, gets tailings 500 grams, is crushed to below the 0.1mm, add water 1500ml furnishing slurry after, add defoamer dimethicone 0.1 gram, stirred 5 minutes; Add 500 gram/ton octadecylamines again
:Lauryl amine
:Mixed amine mass ratio=25
:25
:50 collecting agent, 10 gram/ton terpenic oils stirred 2 minutes, carried out FLOTATION SEPARATION; Roughly select through 1 time, 2 times selected, scans for 1 time.Acquisition contains inorganic material powders 103.1 grams of electronic ceramics 86.17% and contains organic matter powder 396.9 grams of glass fiber resin 97.19%.
Embodiment 2: waste printed circuit board is through fragmentation, after metal is reclaimed in gravity treatment, gets tailings 500 grams, is crushed to below the 0.1mm, add water 1000ml furnishing slurry after, add silicon defoamer waterglass 0.05 gram, stirred 5 minutes; Add 50 gram/ton octadecylamines again
:Mixed amine mass ratio=50
:50 collecting agent, 20 gram/ton terpenic oils stirred 3 minutes, carried out FLOTATION SEPARATION; Roughly select through 1 time, 3 times selected, scans for 1 time.Acquisition contains inorganic material powders 112.6 grams of electronic ceramics 87.56% and contains organic matter powder 387.4 grams of glass fiber resin 95.36%.
Embodiment 3: waste printed circuit board is through fragmentation, after metal is reclaimed in gravity treatment, gets tailings 500 grams, be crushed to add water 1500ml furnishing slurry below the 0.1mm after, add silicon defoamer waterglass 0.075 gram, stirred 8 minutes; Add 300 gram/ton lauryl amines again, 5 gram/ton terpenic oils stirred 5 minutes, carried out FLOTATION SEPARATION; Roughly select through 1 time, 5 times selected, scans for 3 times.Acquisition contains inorganic material powders 126.5 grams of electronic ceramics 85.98% and contains organic matter powder 373.5 grams of glass fiber resin 97.38%.
Embodiment 4: waste printed circuit board is through fragmentation, after metal is reclaimed in gravity treatment, gets tailings 500 grams, is crushed to below the 0.1mm, add water 1000ml furnishing slurry after, add silicon defoamer dimethicone 0.1 gram, stirred 8 minutes; Add 800 gram/ton mixed amine collecting agents again, stirred 5 minutes, carry out FLOTATION SEPARATION; Roughly select through 1 time, 3 times selected, scans for 2 times.The inorganic material powders 96.6 of electron gain pottery 89.25% restrains and contains organic matter powder 403.4 grams of glass fiber resin 95.03%.
Claims (2)
1. the method for a FLOTATION SEPARATION waste circuit board non-metal material is characterized in that being made up of following steps:
1) tailings of waste printed circuit board after metal is reclaimed in fragmentation-gravity treatment-magnetic separation is crushed to below the 0.1mm, and the liquid-solid ratio by 2/1 ~ 3/1 adds water furnishing slurry, adds silicon defoamer 100 ~ 200 gram/tons, stirs 5 ~ 8 minutes;
2) adopt in lauryl amine, octadecylamine and the mixed amine a kind of, two or three as collecting agent, consumption is 50 ~ 800 gram/tons, terpenic oil 0 ~ 20 gram/ton stirred 2 ~ 5 minutes, roughly selected through 1 time, 1 ~ 3 time is selected, scans separation inorganic matter and organic matter 1 ~ 3 time.
2. the method for FLOTATION SEPARATION waste circuit board non-metal material according to claim 1 is characterized in that above-mentioned silicon defoamer is dimethicone or waterglass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110115365 CN102240606B (en) | 2011-05-05 | 2011-05-05 | Method for separating nonmetal materials from waste circuit boards by flotation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110115365 CN102240606B (en) | 2011-05-05 | 2011-05-05 | Method for separating nonmetal materials from waste circuit boards by flotation |
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| Publication Number | Publication Date |
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| CN102240606A true CN102240606A (en) | 2011-11-16 |
| CN102240606B CN102240606B (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110115365 Expired - Fee Related CN102240606B (en) | 2011-05-05 | 2011-05-05 | Method for separating nonmetal materials from waste circuit boards by flotation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106076657A (en) * | 2016-06-16 | 2016-11-09 | 兰州理工大学 | The flotation separation method of copper in a kind of waste mobile phone circuit board |
| CN107073478A (en) * | 2014-09-15 | 2017-08-18 | 毕加伦比兹公司 | The method that such discarded object is handled and removed for the purpose of reclaiming the component being included in electron wastes |
| CN108940567A (en) * | 2018-07-02 | 2018-12-07 | 兰州理工大学 | Hydro-thermal vulcanization-warm water flotation separation method of copper in a kind of useless circuit board |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
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| JP2001096261A (en) * | 1999-10-01 | 2001-04-10 | Matsushita Electric Ind Co Ltd | Method of recycling waste electric appliance resource |
| JP2005000841A (en) * | 2003-06-12 | 2005-01-06 | Takehiko Futaki | Method for recycling waste materials from printed circuit board |
| CN1611309A (en) * | 2003-10-31 | 2005-05-04 | 中国矿业大学北京校区 | Method for recovering valuable resource from waste printed circuit board |
| CN101407596A (en) * | 2008-09-25 | 2009-04-15 | 上海第二工业大学 | Method for recycling epoxy resins and glass fibre from non-metal powder of waste printed circuit board |
| CN101417284A (en) * | 2008-12-09 | 2009-04-29 | 中南大学 | Recovery method of waste circuit board value resource |
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2011
- 2011-05-05 CN CN 201110115365 patent/CN102240606B/en not_active Expired - Fee Related
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| JP2001096261A (en) * | 1999-10-01 | 2001-04-10 | Matsushita Electric Ind Co Ltd | Method of recycling waste electric appliance resource |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107073478A (en) * | 2014-09-15 | 2017-08-18 | 毕加伦比兹公司 | The method that such discarded object is handled and removed for the purpose of reclaiming the component being included in electron wastes |
| CN107073478B (en) * | 2014-09-15 | 2021-10-08 | 毕加伦比兹公司 | Method for treating and removing electronic waste with the aim of recovering components contained in such waste |
| CN106076657A (en) * | 2016-06-16 | 2016-11-09 | 兰州理工大学 | The flotation separation method of copper in a kind of waste mobile phone circuit board |
| CN106076657B (en) * | 2016-06-16 | 2018-01-02 | 兰州理工大学 | The flotation separation method of copper in a kind of waste mobile phone circuit board |
| CN108940567A (en) * | 2018-07-02 | 2018-12-07 | 兰州理工大学 | Hydro-thermal vulcanization-warm water flotation separation method of copper in a kind of useless circuit board |
| CN108940567B (en) * | 2018-07-02 | 2020-04-07 | 兰州理工大学 | Hydrothermal vulcanization-warm water flotation separation method for copper in waste circuit board |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
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| Publication number | Publication date |
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| CN102240606B (en) | 2013-06-19 |
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Effective date of registration: 20170804 Address after: 510651 Changxin Road, Guangzhou, Guangdong, No. 363, No. Patentee after: GUANGDONG INSTITUTE OF RESOURCES COMPREHENSIVE UTILIZATION Address before: 510651 Changxin Road, Guangzhou, Guangdong, No. 363, No. Patentee before: GUANGZHOU Research Institute OF NON FERROUS METALS |
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