CN102232786A - Electric pressure cooker - Google Patents
Electric pressure cooker Download PDFInfo
- Publication number
- CN102232786A CN102232786A CN2011101049967A CN201110104996A CN102232786A CN 102232786 A CN102232786 A CN 102232786A CN 2011101049967 A CN2011101049967 A CN 2011101049967A CN 201110104996 A CN201110104996 A CN 201110104996A CN 102232786 A CN102232786 A CN 102232786A
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- Prior art keywords
- electric pressure
- cooling device
- pot
- cooking saucepan
- pressure cooking
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- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 238000010411 cooking Methods 0.000 claims description 25
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 5
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 4
- 238000000151 deposition Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The invention belongs to the field of small kitchen appliances, and relates to an electric pressure cooker, in particular to a semiconductor refrigeration electric pressure cooker which comprises an inner cooker and an upper cover arranged on the inner cooker, wherein a semiconductor cooling device is arranged outside the upper cover or/and the inner cooker. The semiconductor cooling device directly cools the surface of the inner pot, and the quick cooling effect is realized while the structure is simple. The electric pressure cooker has simple and reasonable structure and simple and convenient operation, and has lower energy consumption compared with the traditional pump type temperature and pressure reduction.
Description
Technical field
The invention belongs to small household appliances field, kitchen, relate to a kind of electric pressure cooking saucepan, especially a kind of semiconductor refrigerating electric pressure cooking saucepan.
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Background technology
In kitchen life, electric pressure cooking saucepan slowly becomes the necessary cooking pot tool of people, electric pressure cooking saucepan behind end-of-job, because of high pressure is arranged in the pot, user's pot cover that can not will begin in a minute.Carry out the exhaust step-down and must push pressure limiting valve aside.Or allow pot interior food cool off naturally, and just to uncap after waiting pressure in the pot to reduce, use is convenient and swift inadequately.For this reason, traditional pressure cooker, people adopt water pouring or wet towel etc. to cool off step-down usually, but owing to be provided with a large amount of electronic components in the electric pressure cooking saucepan, the pot body of electric pressure cooking saucepan also is provided with LCDs, button etc., the service life that direct liquid cools then can reduce electric pressure cooking saucepan.
In order to overcome above technological deficiency, publication number is the electric pressure cooking saucepan that Chinese utility application that CN201404062Y, name are called " electric pressure cooking saucepan of the quick step-down of a kind of energy " has disclosed a kind of quick step-down, it comprises pot body and places pot pot cover of body top, be provided with cooling control system between pot body and the pot cover, cooling system comprises water pipe, water pump, and one section of water pipe places on the pot cover, and another section places pot nside, water pump is located on pot body, and heat abstractor is located on pot body.By above-mentioned setting, after culinary art finishes, can be manually or automatically control start pump working, the heat-conducting medium that drives then in the sealing water pipe circulates fast, heat-conducting medium is taken heat out of on pot cover top, by heat abstractor heat is dispersed in the outside air, so repeatedly fast in the pot body, can realize that a pot body internal pressure reduces in the short period of time, reaches the effect of quick step-down.In fact, this patent is to adopt water pouring or wet towel etc. to cool off a kind of differentiation mode of step-down method to tradition, is moved on the electric pressure cooking saucepan.Though can realize the quickening of pressure decay rate, because its complex structure, and cool off by water, can bring potential safety hazard to electric pressure cooking saucepan after the time is permanent.In addition, a large amount of water pipes, pump are set, and liquid of depositing, radiator fan or the like, bring bigger weight for electric pressure cooking saucepan self.The user all brings great inconvenience when using or depositing.
Summary of the invention
The essential technique problem that the present invention is intended to solve is to provide a kind of simple and reasonable, radiating rate electric pressure cooking saucepan faster.
At above essential technique problem, the corresponding technical solution scheme of the present invention is:
A kind of electric pressure cooking saucepan comprises interior pot and the loam cake that places on the described interior pot, and described loam cake is or/and described interior pot is outside equipped with semiconductor cooling device.Semiconductor cooling device directly to loam cake or/and interior pot outer surface cools off, in simple in structure, also realized the effect of quick cooling.
As the further optimization to technique scheme, described semiconductor cooling device and described inner pot outer wall are close to.Especially the refrigeration end of semiconductor cooling device and described inner pot outer wall are close to.
As the further optimization to technique scheme, described loam cake is or/and also be provided with radiator fan outside the pot in described.Radiator fan can distribute the heat that semiconductor heats end.
As the further optimization to technique scheme, described semiconductor cooling device comprises semiconductor paster, fin and radiator fan, and fin is arranged at the face that heats of semiconductor paster, and radiator fan is arranged on the fin or the side.
As further optimization to technique scheme, indent inside the past described interior pot of described interior pot or loam cake, described semiconductor cooling device is arranged in the described concave cavity.
As the further optimization to technique scheme, the number of described semiconductor cooling device is 1 ~ 10.Semiconductor cooling device more than 10 is set, and in the course of the work, because quantity is more, the heat that semiconductor heats end is difficult to distribute, and too much semiconductor also causes certain wasting of resources.
In the present invention, the number of semiconductor cooling device is preferably 2, one of the bottom of a pan arranged outside, and the external wall of pot is provided with one.This moment, relative lowest water level and higher level were lowered the temperature simultaneously, reached preferable cooling-down effect, thereby realized quick step-down.
Compared with prior art, beneficial effect of the present invention mainly shows as: simple and reasonable, easy and simple to handle, the energy consumption of conventional pump formula decrease temperature and pressure is lower relatively.
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
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Description of drawings
Fig. 1 is the generalized section that electric pressure cooking saucepan loam cake of the present invention is provided with semiconductor cooling device.
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The specific embodiment
As shown in Figure 1, a kind of electric pressure cooking saucepan of the present invention, pot 1 and the loam cake 2 that places on the interior pot 1 in comprising, the upper surface of loam cake 2 is provided with semiconductor cooling device.Semiconductor cooling device directly cools off loam cake 2, because steam is a form up, at loam cake 2 semiconductor cooling device is set, and directly the steam in the pot is cooled off.Realized the effect of quick cooling.
The wall portion of semiconductor cooling device and loam cake 2 is close to.Especially the wall portion of the refrigeration end of semiconductor cooling device and loam cake 2 is close to.
Loam cake 1 also is provided with radiator fan.Radiator fan can distribute the heat that semiconductor heats end.
Semiconductor cooling device comprises semiconductor paster 3, fin 4 and radiator fan 5, and fin 4 is arranged at the face that heats of semiconductor paster, and radiator fan 5 is arranged on the fin 4.
Loam cake 2 is toward interior pot 1 the inside indent, and semiconductor cooling device is arranged in the concave cavity.
The number of semiconductor cooling device is 1 ~ 10.Semiconductor cooling device more than 10 is set, and in the course of the work, because quantity is more, the heat that semiconductor heats end is difficult to distribute, and too much semiconductor also causes certain wasting of resources.
In the present embodiment, the number of semiconductor cooling device is preferably 2, and interior pot 1 bottom outside is provided with one, and the upper surface of loam cake 2 is provided with one.This moment, relative higher level and vapor region were lowered the temperature simultaneously, reached preferable cooling-down effect, thereby realized quick step-down.
In sum, after those of ordinary skill in the art reads file of the present invention, need not creative mental labour according to technical scheme of the present invention and technical conceive and make other various corresponding conversion scheme, the scope that all belongs to the present invention and protected.
Claims (7)
1. electric pressure cooking saucepan, comprise interior pot (1) and place described in loam cake (2) on the pot, it is characterized in that described loam cake (2) or/and in described pot (1) be outside equipped with semiconductor cooling device (3).
2. a kind of electric pressure cooking saucepan according to claim 1 is characterized in that described semiconductor cooling device and described inner pot outer wall be close to.
3. a kind of electric pressure cooking saucepan according to claim 1 is characterized in that the upper surface of described semiconductor cooling device and described loam cake is close to.
4. according to the described a kind of electric pressure cooking saucepan of one of claim 1-3, it is characterized in that described loam cake or/and also be provided with radiator fan in described outside the pot.
5. according to the described a kind of electric pressure cooking saucepan of one of claim 1-3, it is characterized in that described semiconductor cooling device comprises semiconductor paster, fin and radiator fan, fin is arranged at the face that heats of semiconductor paster 3, and radiator fan is arranged on the fin or the side.
6. a kind of electric pressure cooking saucepan according to claim 1 is characterized in that described interior pot or loam cake indent, and described semiconductor cooling device is close to the concave surface in the described concave cavity.
7. a kind of electric pressure cooking saucepan according to claim 1, the number that it is characterized in that described semiconductor cooling device is 1 ~ 10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101049967A CN102232786A (en) | 2011-04-26 | 2011-04-26 | Electric pressure cooker |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101049967A CN102232786A (en) | 2011-04-26 | 2011-04-26 | Electric pressure cooker |
Publications (1)
Publication Number | Publication Date |
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CN102232786A true CN102232786A (en) | 2011-11-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011101049967A Pending CN102232786A (en) | 2011-04-26 | 2011-04-26 | Electric pressure cooker |
Country Status (1)
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CN (1) | CN102232786A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104248336A (en) * | 2014-09-12 | 2014-12-31 | 九阳股份有限公司 | Pressure cooking utensil allowing fast cooling |
CN106859288A (en) * | 2017-01-22 | 2017-06-20 | 九阳股份有限公司 | A kind of cooker |
CN114010054A (en) * | 2021-08-09 | 2022-02-08 | 嘉兴君和三维技术有限公司 | Electric rice cooker |
CN114938914A (en) * | 2021-11-05 | 2022-08-26 | 广东美芝制冷设备有限公司 | Refrigeration control method, control device and cooking appliance |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS646808B2 (en) * | 1984-11-12 | 1989-02-06 | Taiyo Saabisu Kk | |
CN2071924U (en) * | 1990-09-29 | 1991-02-27 | 李士春 | Box for chilling and heating food |
JP2001017313A (en) * | 1999-07-09 | 2001-01-23 | Mitsubishi Electric Corp | Rice cooker |
JP3305623B2 (en) * | 1997-07-14 | 2002-07-24 | 三菱電機株式会社 | Induction heating cooker |
JP2004208741A (en) * | 2002-12-27 | 2004-07-29 | Hitachi Hometec Ltd | Rice cooker |
JP4016808B2 (en) * | 2002-11-07 | 2007-12-05 | 松下電器産業株式会社 | Cooking device |
CN201189085Y (en) * | 2007-12-29 | 2009-02-04 | 美的集团有限公司 | Electric pressure cooker capable of being cooled quickly |
CN201445326U (en) * | 2009-05-27 | 2010-05-05 | 姚凌 | Electric cooker cooking food by remote control of microcomputer |
CN301189085S (en) * | 2009-09-29 | 2010-05-12 | 天津市金锚集团有限责任公司 | Cleaning tool (jm-3807) |
-
2011
- 2011-04-26 CN CN2011101049967A patent/CN102232786A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS646808B2 (en) * | 1984-11-12 | 1989-02-06 | Taiyo Saabisu Kk | |
CN2071924U (en) * | 1990-09-29 | 1991-02-27 | 李士春 | Box for chilling and heating food |
JP3305623B2 (en) * | 1997-07-14 | 2002-07-24 | 三菱電機株式会社 | Induction heating cooker |
JP2001017313A (en) * | 1999-07-09 | 2001-01-23 | Mitsubishi Electric Corp | Rice cooker |
JP4016808B2 (en) * | 2002-11-07 | 2007-12-05 | 松下電器産業株式会社 | Cooking device |
JP2004208741A (en) * | 2002-12-27 | 2004-07-29 | Hitachi Hometec Ltd | Rice cooker |
CN201189085Y (en) * | 2007-12-29 | 2009-02-04 | 美的集团有限公司 | Electric pressure cooker capable of being cooled quickly |
CN201445326U (en) * | 2009-05-27 | 2010-05-05 | 姚凌 | Electric cooker cooking food by remote control of microcomputer |
CN301189085S (en) * | 2009-09-29 | 2010-05-12 | 天津市金锚集团有限责任公司 | Cleaning tool (jm-3807) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104248336A (en) * | 2014-09-12 | 2014-12-31 | 九阳股份有限公司 | Pressure cooking utensil allowing fast cooling |
CN104248336B (en) * | 2014-09-12 | 2016-06-08 | 九阳股份有限公司 | A kind of pressure cooking device of quick cooling |
CN106859288A (en) * | 2017-01-22 | 2017-06-20 | 九阳股份有限公司 | A kind of cooker |
CN114010054A (en) * | 2021-08-09 | 2022-02-08 | 嘉兴君和三维技术有限公司 | Electric rice cooker |
CN114938914A (en) * | 2021-11-05 | 2022-08-26 | 广东美芝制冷设备有限公司 | Refrigeration control method, control device and cooking appliance |
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Application publication date: 20111109 |