CN102221225A - Temperature sensor structure of microwave oven - Google Patents

Temperature sensor structure of microwave oven Download PDF

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Publication number
CN102221225A
CN102221225A CN2010101452313A CN201010145231A CN102221225A CN 102221225 A CN102221225 A CN 102221225A CN 2010101452313 A CN2010101452313 A CN 2010101452313A CN 201010145231 A CN201010145231 A CN 201010145231A CN 102221225 A CN102221225 A CN 102221225A
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China
Prior art keywords
sensor
micro
probe
lower cover
wave oven
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Granted
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CN2010101452313A
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Chinese (zh)
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CN102221225B (en
Inventor
方亚林
齐静明
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LG Electronics Tianjin Appliances Co Ltd
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LG Electronics Tianjin Appliances Co Ltd
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Priority to CN201010145231.3A priority Critical patent/CN102221225B/en
Publication of CN102221225A publication Critical patent/CN102221225A/en
Application granted granted Critical
Publication of CN102221225B publication Critical patent/CN102221225B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a temperature sensor structure of a microwave oven, comprising a sensor probe, a sensor housing and a probe hole, wherein the sensor probe is arranged outside an oven cavity of the microwave oven, and is used for receiving infrared signals emitted by foods in the oven cavity through observing holes formed on the oven cavity, measuring the temperature of the foods and converting temperature signals into electric signals to be input into a controller of the microwave oven; the sensor housing is installed on the outer side of the oven cavity by a fixing part, and formed by combining a shell upper cover with a shell lower cover for holding and protecting the sensor probe; and the probe hole is a through hole formed on the shell lower cover such that the sensor probe can receive heat signals, and the shell upper cover and the shell lower cover are fixedly connected by a buckle. Therefore, according to the invention, the production and installation flows can be simplified, and further the cost is saved and the productivity is improved.

Description

The arrangement of temperature sensor of micro-wave oven
Technical field
The invention belongs to the technical field of micro-wave oven, be specifically related to fixed forms such as a kind of employing buckle and bayonet lock sensor is carried out accurately fixing, and can save the arrangement of temperature sensor of the micro-wave oven of production cost.
Technical background
Micro-wave oven is that magnetron produces microwave behind power connection, and these microwave irradiations on heating objects such as food and the device of cooking food.Such micro-wave oven can be divided into home-use micro-wave oven that is equipped with small-sized magnetron and the commerce micro-wave oven that is equipped with large-scale or a plurality of magnetrons.Micro-wave oven can also be divided into home-use micro-wave oven according to the mode of heat food and generally adopt rotation to fill the glass rotating disk mode of food, and commerce mainly adopts the figure of confusion mode of scattered radiation microwave with micro-wave oven.Commercial mainly be applicable to the convenience store that utilization rate is high and the food supply retail shop of cooking food at short notice, so generally need the high relatively output of more home-use micro-wave oven with micro-wave oven.
Fig. 1 is the microwave oven structure schematic diagram; Fig. 2 is the schematic diagram of temperature sensor set-up mode of the micro-wave oven of prior art; Fig. 3 be prior art the schematic diagram of arrangement of temperature sensor of micro-wave oven.
As shown in Figure 1 to Figure 3, micro-wave oven comprises by the shell that forms outward appearance, furnace chamber 20 and is positioned at the electricity storage chamber 30 of furnace chamber 20 right side sides, also comprises the door 40 that is located at furnace chamber 20 fronts.Right-hand member at the lateral surface of door 40 is provided with handle, and the two ends of handle are screwed with door 40 and are connected.Shell forms the micro-wave oven outward appearance, also plays the effect of the inner furnace chamber 20 of protection simultaneously, so shell generally will be made of the steel plate with certain intensity.Shell comprises the rear board 17 at the base plate 13 below the top panel 11 of the top and two sides that cover furnace chamber 20 simultaneously, protection, the front panel 15 that forms furnace chamber 20 fronts and protection furnace chamber 20 back sides.Furnace chamber 20 is spaces of cooking such as cooking food thing, is made of the tetragonal chest of front openings, and the food after both can having put into food and take out the cooking from opening the place ahead of furnace chamber 20 is provided with the barbecue tube 21 that is used for baking food on the top of furnace chamber.There is certain space the right side side of furnace chamber 20, and this space is to be the electricity storage chamber 30 that electronic unit is set, and electricity storage chamber 30 inside are provided with a plurality of electronic units such as transformer 31, magnetron 33, capacitor 37.Be provided with control panel assembly 26 in the front of electricity storage chamber 30.
In addition, the inside of electricity storage chamber 30 is provided with demarcation strip 39 between transformer 31 and radiator fan 35.Transformer 31, radiator fan 35, capacitor 37 and demarcation strip 39 be fixed on sub-panel above.Between sub-panel and base plate 13 top at intervals.
In a plurality of electronic units, transformer 31 and magnetron 33 produce the microwave of irradiation furnace chamber 20 inside.Electronic unit generates heat in the process that produces microwave, so in the time of cooking food, the temperature of electricity storage chamber 30 rises.Need to suck extraneous air for the electricity storage chamber 30 of cooling off heating, so radiator fan 35 sucks extraneous air.
In the arrangement of temperature sensor of the micro-wave oven of prior art, sensor probe is arranged on outside the furnace chamber 20 of micro-wave oven, see through the peephole that forms on the furnace chamber and receive the infrared signal that food sends in the furnace chamber and measure food temperature, temperature signal is converted to the controller that the signal of telecommunication is input to micro-wave oven; Sensor outer housing 60 is installed in furnace chamber 20 outsides by fixed part 61, by outer casing upper cover 60a and shell lower cover 60b two parts be combined into, holds and protects sensor probe; Probe hole 62 is formed on the through hole on the shell lower cover 60b, makes sensor probe can accept thermal signal.
But, there is following problem in the prior art:
In the prior art, between sensor probe and sensor outer housing interfix and the loam cake of sensor outer housing and lower cover between all need to adopt extra accessories such as screw to realize, so increased the micro-wave oven overall production cost, and the positioning accuracy of sensor probe fixedly the time can't be guaranteed accurately, therefore can cause sensor probe that deviation takes place when image data, thereby have influence on the accurately normal operation of micro-wave oven.Sensor outer housing is generally fixed by the flanging outside the furnace chamber of two screws and micro-wave oven in the prior art, fixing trouble relatively, and production efficiency is crossed the low waste that causes manpower and materials easily.
Summary of the invention
The present invention provides fixed forms such as a kind of employing buckle and bayonet lock that sensor is carried out accurately fixing for solving the technical problem that exists in the prior art, and can save the arrangement of temperature sensor of the micro-wave oven of production cost.
The technical scheme that the present invention takes for the technical problem that exists in the solution prior art is:
The arrangement of temperature sensor of micro-wave oven of the present invention, comprise: sensor probe, be arranged on outside the furnace chamber of micro-wave oven, see through the peephole that forms on the furnace chamber and receive the infrared signal that food sends in the furnace chamber and measure food temperature, temperature signal is converted to the controller that the signal of telecommunication is input to micro-wave oven; Sensor outer housing is installed in the furnace chamber outside by fixed part, by outer casing upper cover and shell lower cover two parts be combined into, holds and protects sensor probe; Probe hole is formed on the through hole that covers under the shell, makes sensor probe can accept thermal signal, and outer casing upper cover and shell lower cover are mutually permanently connected by buckle.
The present invention can also adopt following technical measures:
The bayonet lock of circular shape is set on a certain edge of outer casing upper cover inboard, simultaneously on outer casing upper cover edge, buckle is set with respect to the bayonet lock opposite side, pin-and-hole corresponding with the bayonet lock position and the draw-in groove corresponding with snapped-in position are set respectively on the corresponding sidewall of shell lower cover, when sensor outer housing was installed, bayonet lock cooperated respectively with draw-in groove with pin-and-hole, buckle.
The inside of described shell lower cover is provided with a plurality of support columns that are used to support sensor probe, the top of part support column is provided with the alignment pin of projection, the alignment pin distribution or asymmetrical distribution, sensor probe is provided with fixed head simultaneously, on fixed head, be provided with quantity, position all with the alignment pin corresponding positioning hole, when sensor probe is packed sensor outer housing into, the mutual corresponding matching of alignment pin and locating hole; In bottom, the inner space of shell lower cover outstanding location-plate is set, the location-plate setting that matches with the outline of sensor probe, when sensor probe was installed, sensor probe did not contact with the inwall of shell lower cover, forms the space between the two; The compressing post is set on the outer casing upper cover, and when outer casing upper cover and shell lower cover matched, the compressing capital was lived the sensor probe in the shell lower cover.
The inner space cross section of described sensor outer housing is a rectangle.
The place, joint portion of described four sidewalls in shell lower cover inner space vertically is provided with support column respectively.
Only the top of three support columns is provided with alignment pin therein, and the locating hole of three position correspondences is set on the fixed head of sensor probe equally.
Described location-plate is around the probe hole setting, and its cross section is an annulus with the probe hole concentric.
Described compressing post is arranged on the center of outer casing upper cover.
Described support column and location-plate and shell lower cover are one-body molded, and compressing post and outer casing upper cover are one-body molded.
But the fixed part on the sensor shell fixes by the card post of deformation and the outer ledge of screw and furnace chamber.
Advantage and good effect that the present invention has are:
In the arrangement of temperature sensor of micro-wave oven of the present invention, the both sides of outer casing upper cover are provided with bayonet lock and buckle respectively, simultaneously on the sidewall of shell lower cover respectively correspondence pin-and-hole and draw-in groove are set, when shell assemble, first bayonet lock is inserted in the pin-and-hole, buckle and draw-in groove are cooperatively interacted, thereby outer casing upper cover and shell lower cover are fixed, do not adopt screw to fix between loam cake and the lower cover, make assembling process simpler, can enhance productivity, also save the expense of screw simultaneously.Inside at the shell lower cover vertically is provided with support column, and the top at support column is provided with alignment pin, be provided with and the alignment pin position corresponding positioning hole on the fixed head of sensor probe, when alignment pin matches with locating hole, the horizontal level of sensor probe just is defined, and horizontal moving can't take place.Because alignment pin adopts asymmetric setting on the top of support column, sensor probe is merely able to the direction that is provided with that keeps specific in the shell lower cover, thereby makes the fixed position of probe more accurate.Be looped around probe hole location-plate on every side and fix the external margin of sensor probe, make the fixing more stable of probe, avoid probe in installing and using, to be offset, the heat that when the space that forms between the inwall of sensor probe and shell lower cover can be at running of microwave oven, the external heat source outside the furnace chamber is produced be distributed to uniformly sensor probe around, prevent that sensor probe is because of the inhomogeneous data acquisition mistake that causes of being heated.At the center of outer casing upper cover the compressing post is set, the compressing post can withstand sensor probe when mounted, makes between sensor probe and alignment pin and the location-plate to keep cooperating closely, thereby makes fixing of probe more stable.Sensor outer housing is by fixing outside the card post on the fixed part and screw and the furnace chamber, and a screw has only been adopted in the installation of whole sensor shell, thereby has reduced production cost.
Description of drawings
Fig. 1 is the microwave oven structure schematic diagram;
Fig. 2 is the schematic diagram of temperature sensor set-up mode of the micro-wave oven of prior art;
Fig. 3 be prior art the schematic diagram of arrangement of temperature sensor of micro-wave oven;
Fig. 4 is the schematic diagram of the arrangement of temperature sensor of micro-wave oven of the present invention;
Fig. 5 is the structural representation of shell lower cover in the arrangement of temperature sensor of micro-wave oven of the present invention;
Fig. 6 is the structural representation of outer casing upper cover in the arrangement of temperature sensor of micro-wave oven of the present invention;
Fig. 7 is the cutaway view of the arrangement of temperature sensor of micro-wave oven of the present invention.
The specific embodiment
It is following that the present invention is described in detail with reference to drawings and Examples:
Fig. 4 is the schematic diagram of the arrangement of temperature sensor of micro-wave oven of the present invention; Fig. 5 is the structural representation of shell lower cover in the arrangement of temperature sensor of micro-wave oven of the present invention; Fig. 6 is the structural representation of outer casing upper cover in the arrangement of temperature sensor of micro-wave oven of the present invention; Fig. 7 is the cutaway view of the arrangement of temperature sensor of micro-wave oven of the present invention.
Extremely shown in Figure 7 as Fig. 4, the arrangement of temperature sensor of micro-wave oven of the present invention, comprise: sensor probe 70, be arranged on outside the furnace chamber of micro-wave oven, see through the peephole that forms on the furnace chamber and receive the infrared signal that food sends in the furnace chamber and measure food temperature, temperature signal is converted to the controller that the signal of telecommunication is input to micro-wave oven; Sensor probe adopts a plurality of sample points simultaneously food temperature to be measured, each sample point all drops on same the diameter of meal tray, when running of microwave oven, meal tray rotation, position that each sample point lives through forms a planar range, this scope be exactly the measurement category of all sample points be the field range of sensor probe; Sensor outer housing 60 is installed in the furnace chamber outside by fixed part 61, by outer casing upper cover 60a and shell lower cover 60b two parts be combined into, holds and protects sensor probe; Probe hole 62 is formed on the through hole on the shell lower cover 60b, make sensor probe can accept thermal signal, a plurality of support columns 63 that are used to support sensor probe are set in the inside of shell lower cover 60b, the top of part support column is provided with the alignment pin of projection, the alignment pin distribution or asymmetrical distribution, sensor probe is provided with fixed head 71 simultaneously, on fixed head, be provided with quantity, position all with the alignment pin corresponding positioning hole, when sensor probe is packed sensor outer housing into, the mutual corresponding matching of alignment pin and locating hole; In bottom, the inner space of shell lower cover outstanding location-plate 64 is set, the location-plate setting that matches with the outline of sensor probe, when sensor probe was installed, sensor probe did not contact with the inwall of shell lower cover, forms the space between the two; Compressing post 66 is set on the outer casing upper cover, and when outer casing upper cover and shell lower cover matched, the compressing capital was lived the sensor probe in the shell lower cover.
Outer casing upper cover and shell lower cover are mutually permanently connected by buckle.The bayonet lock 67 of circular shape is set on a certain edge of outer casing upper cover inboard, simultaneously on outer casing upper cover edge, buckle 68 is set with respect to the bayonet lock opposite side, pin-and-hole corresponding with the bayonet lock position and the draw-in groove corresponding with snapped-in position are set respectively on the corresponding sidewall of shell lower cover, when sensor outer housing is installed, bayonet lock is inserted in the corresponding pin-and-hole respectively earlier, and then exert pressure on the outer casing upper cover, make buckle on the outer casing upper cover block draw-in groove on the shell lower cover sidewall, bayonet lock and pin-and-hole, buckle cooperates respectively with draw-in groove, thereby outer casing upper cover and shell lower cover are interfixed.Draw-in groove can be arranged on the lateral wall of shell lower cover, is convenient to separating of buckle and draw-in groove.
The inner space cross section of sensor outer housing is a rectangle in the present invention, for guaranteeing that sensor takies still less space when mounted, the cross section of the inner space of sensor outer housing also can adopt square, in the center of shell lower cover 60b bottom circular probe hole 62 is set.
Place, joint portion at four sidewalls of shell lower cover inner space vertically is provided with support column 63 respectively, only the top of three support columns is provided with protruding alignment pin therein, the locating hole of three position correspondences is set on the fixed head of sensor probe equally, when sensor probe is fitted into the shell lower cover, make alignment pin insert locating hole, three alignment pins cooperate respectively with locating hole, and the support column support is lived the fixed head of sensor probe, prevent that sensor probe is subjected to displacement in the shell lower cover.Simultaneously, because the top of one of them support column is not provided with alignment pin, when installing, probe then is merely able to make the fixed position of probe more accurate according to unique position set-up mode.
The outstanding location-plate that is provided with is around the probe hole setting on shell lower cover bottom surface, and its cross section is an annulus with the probe hole concentric, thus formation tubular wooden partition.The lower end of sensor probe is a cylindrical shape, just in time is inserted in the tubular structure of location-plate when mounted, and cooperatively interacts with location-plate, makes the position of probe accurately corresponding mutually with the probe hole of shell lower cover bottom, avoids taking place deviation.
Compressing post 66 is set in the center of outer casing upper cover 60a, the lower end of compressing post is the plane, when loam cake and lower cover interfix, the compressing capital is lived sensor probe, make and be subjected to uniform downward pressure on the sensor probe, guarantee sensor probe in the sensor outer housing internal fixation on the position of design in advance, prevent that alignment pin from deviating from from locating hole.
Support column and location-plate and shell lower cover are one-body molded, and compressing post and outer casing upper cover are one-body molded, produce and installation procedure thereby can simplify, and further save cost and enhance productivity.
But the fixed part on the sensor shell fixes by the card post 69 of deformation and the outer ledge of screw and furnace chamber.Two through holes are set on the furnace chamber outer ledge, card cylindricality on the fixed part is passed one of them through hole after becoming contraction, recovers shape then and blocks through hole, and screw passes another through hole and fixed part simultaneously, sensor outer housing and furnace chamber are fixed, made sensor probe be installed in assigned address.
In the arrangement of temperature sensor of micro-wave oven of the present invention, the both sides of outer casing upper cover are provided with bayonet lock and buckle respectively, simultaneously on the sidewall of shell lower cover respectively correspondence pin-and-hole and draw-in groove are set, when shell assemble, first bayonet lock is inserted in the pin-and-hole, buckle and draw-in groove are cooperatively interacted, thereby outer casing upper cover and shell lower cover are fixed, do not adopt screw to fix between loam cake and the lower cover, make assembling process simpler, can enhance productivity, also save the expense of screw simultaneously.Inside at the shell lower cover vertically is provided with support column, and the top at support column is provided with alignment pin, be provided with and the alignment pin position corresponding positioning hole on the fixed head of sensor probe, when alignment pin matches with locating hole, the horizontal level of sensor probe just is defined, and horizontal moving can't take place.Because alignment pin adopts asymmetric setting on the top of support column, sensor probe is merely able to the direction that is provided with that keeps specific in the shell lower cover, thereby makes the fixed position of probe more accurate.Be looped around probe hole location-plate on every side and fix the external margin of sensor probe, make the fixing more stable of probe, avoid probe in installing and using, to be offset, the heat that when the space that forms between the inwall of sensor probe and shell lower cover can be at running of microwave oven, the external heat source outside the furnace chamber is produced be distributed to uniformly sensor probe around, prevent that sensor probe is because of the inhomogeneous data acquisition mistake that causes of being heated.At the center of outer casing upper cover the compressing post is set, the compressing post can withstand sensor probe when mounted, makes between sensor probe and alignment pin and the location-plate to keep cooperating closely, thereby makes fixing of probe more stable.Sensor outer housing is by fixing outside the card post on the fixed part and screw and the furnace chamber, and a screw has only been adopted in the installation of whole sensor shell, thereby has reduced production cost.The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention with preferred embodiment openly as above, yet, be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, certainly can utilize the technology contents of announcement to make a little change or modification, become the equivalent embodiment of equivalent variations, be the content that does not break away from technical solution of the present invention in every case, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all belong in the scope of technical solution of the present invention.

Claims (10)

1. the arrangement of temperature sensor of a micro-wave oven, comprise: sensor probe, be arranged on outside the furnace chamber of micro-wave oven, see through the peephole that forms on the furnace chamber and receive the infrared signal that food sends in the furnace chamber and measure food temperature, temperature signal is converted to the controller that the signal of telecommunication is input to micro-wave oven; Sensor outer housing is installed in the furnace chamber outside by fixed part, by outer casing upper cover and shell lower cover two parts be combined into, holds and protects sensor probe; Probe hole is formed on the through hole that covers under the shell, makes sensor probe can accept thermal signal, it is characterized in that: outer casing upper cover and shell lower cover are mutually permanently connected by buckle.
2. the arrangement of temperature sensor of micro-wave oven according to claim 1, it is characterized in that: the bayonet lock that circular shape is set on a certain edge of outer casing upper cover inboard, simultaneously on outer casing upper cover edge, buckle is set with respect to the bayonet lock opposite side, pin-and-hole corresponding with the bayonet lock position and the draw-in groove corresponding with snapped-in position are set respectively on the corresponding sidewall of shell lower cover, when sensor outer housing was installed, bayonet lock cooperated respectively with draw-in groove with pin-and-hole, buckle.
3. the arrangement of temperature sensor of micro-wave oven according to claim 1 and 2, it is characterized in that: the inside of shell lower cover is provided with a plurality of support columns that are used to support sensor probe, the top of part support column is provided with the alignment pin of projection, the alignment pin distribution or asymmetrical distribution, sensor probe is provided with fixed head simultaneously, on fixed head, be provided with quantity, position all with the alignment pin corresponding positioning hole, when sensor probe is packed sensor outer housing into, the mutual corresponding matching of alignment pin and locating hole; In bottom, the inner space of shell lower cover outstanding location-plate is set, the location-plate setting that matches with the outline of sensor probe, when sensor probe was installed, sensor probe did not contact with the inwall of shell lower cover, forms the space between the two; The compressing post is set on the outer casing upper cover, and when outer casing upper cover and shell lower cover matched, the compressing capital was lived the sensor probe in the shell lower cover.
4. the arrangement of temperature sensor of micro-wave oven according to claim 3, it is characterized in that: the inner space cross section of sensor outer housing is a rectangle.
5. the arrangement of temperature sensor of micro-wave oven according to claim 4 is characterized in that: the place, joint portion at four sidewalls of shell lower cover inner space vertically is provided with support column respectively.
6. the arrangement of temperature sensor of micro-wave oven according to claim 5, it is characterized in that: only the top of three support columns is provided with alignment pin therein, and the locating hole of three position correspondences is set on the fixed head of sensor probe equally.
7. the arrangement of temperature sensor of micro-wave oven according to claim 6 is characterized in that: location-plate is around the probe hole setting, and its cross section is an annulus with the probe hole concentric.
8. the arrangement of temperature sensor of micro-wave oven according to claim 3 is characterized in that: oppress the center that post is arranged on outer casing upper cover.
9. the arrangement of temperature sensor of micro-wave oven according to claim 3, it is characterized in that: support column and location-plate and shell lower cover are one-body molded, and compressing post and outer casing upper cover are one-body molded.
10. the arrangement of temperature sensor of micro-wave oven according to claim 1 is characterized in that: but the fixed part on the sensor shell fixes by the card post of deformation and the outer ledge of screw and furnace chamber.
CN201010145231.3A 2010-04-13 2010-04-13 Temperature sensor structure of microwave oven Expired - Fee Related CN102221225B (en)

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CN201010145231.3A CN102221225B (en) 2010-04-13 2010-04-13 Temperature sensor structure of microwave oven

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CN201010145231.3A CN102221225B (en) 2010-04-13 2010-04-13 Temperature sensor structure of microwave oven

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CN102221225B CN102221225B (en) 2015-04-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111256176A (en) * 2020-02-25 2020-06-09 广东美的厨房电器制造有限公司 Infrared sensor assembly and microwave oven

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5589094A (en) * 1994-03-18 1996-12-31 Goldstar Co., Ltd. Microwave oven employing thermopile type sensor
CN1428599A (en) * 2001-12-27 2003-07-09 石塚电子株式会社 Contactless temp. sensor and detecting circuit for said sensor
JP2004061283A (en) * 2002-07-29 2004-02-26 Ishizuka Electronics Corp Infrared sensor, and determining device of size and surface temperature of object, using sensor
CN1626886A (en) * 2003-12-12 2005-06-15 乐金电子(天津)电器有限公司 Microwave oven
CN2726158Y (en) * 2004-06-21 2005-09-14 连展科技(深圳)有限公司 Transmission interface connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589094A (en) * 1994-03-18 1996-12-31 Goldstar Co., Ltd. Microwave oven employing thermopile type sensor
CN1428599A (en) * 2001-12-27 2003-07-09 石塚电子株式会社 Contactless temp. sensor and detecting circuit for said sensor
JP2004061283A (en) * 2002-07-29 2004-02-26 Ishizuka Electronics Corp Infrared sensor, and determining device of size and surface temperature of object, using sensor
CN1626886A (en) * 2003-12-12 2005-06-15 乐金电子(天津)电器有限公司 Microwave oven
CN2726158Y (en) * 2004-06-21 2005-09-14 连展科技(深圳)有限公司 Transmission interface connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111256176A (en) * 2020-02-25 2020-06-09 广东美的厨房电器制造有限公司 Infrared sensor assembly and microwave oven

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