CN102221134A - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
CN102221134A
CN102221134A CN2010101466937A CN201010146693A CN102221134A CN 102221134 A CN102221134 A CN 102221134A CN 2010101466937 A CN2010101466937 A CN 2010101466937A CN 201010146693 A CN201010146693 A CN 201010146693A CN 102221134 A CN102221134 A CN 102221134A
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plate body
lighting device
light
illuminating module
light source
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CN2010101466937A
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赖振田
赖其渊
周志勇
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN2010101466937A priority Critical patent/CN102221134A/zh
Priority to US12/824,208 priority patent/US8388195B2/en
Priority to JP2011067651A priority patent/JP2011228286A/ja
Publication of CN102221134A publication Critical patent/CN102221134A/zh
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

一种照明装置,包括壳体、设于壳体内的光源,及与壳体结合的透光板,光源发出的光可透过透光板向壳体外射出,该光源包括若干互相独立的发光模组,每一发光模组包括板体及设于板体上的若干发光二极管,板体上形成供气流通过的若干通道。与现有技术相比,本发明照明装置在发光模组上形成供气流通过的通道,借助空气的流动对发光模组进行散热,无需设置多余的散热元件即可达到良好的散热效果,同时还具有易于加工、成本低的特点。

Description

照明装置
技术领域
本发明涉及一种照明装置,特别涉及一种具有良好散热性能的、采用半导体发光元件作为光源的照明装置。
背景技术
作为一种新兴的光源,发光二极管凭借其发光效率高、体积小、重量轻、环保等优点,已被广泛地应用到当前的各个领域当中,大有取代传统光源的趋势。
随着发光二极管或其模组的功率、亮度的增大,其产生的热量也越来越大,若不能妥善解决发光二极管的发热问题,则发光二极管的工作寿命将受到严重影响。因此通常都在照明装置内安装一散热装置对发光二极管模组进行散热。传统的散热装置包括散热基板及附着在基板上的散热鳍片,依靠较多的散热鳍片增大散热面积,进而提升散热性能。然而,在照明装置内设置过多的散热鳍片不但使照明装置的体积增大,重量增加,同时也增加了照明装置的制造成本。另外,也有采用风扇散热或者热管等利用相变化原理散热的照明装置,但这些元件往往造价太高,不利于照明装置在产业上的推广应用。
发明内容
有鉴于此,有必要提供一种具有良好散热性能同时成本低廉的照明装置。
一种照明装置,包括壳体、设于壳体内的半导体发光光源,及与壳体结合的透光板,半导体发光光源发出的光可透过透光板向壳体外射出,该半导体发光光源包括若干互相独立的发光模组,每一发光模组上形成供气流通过的若干通道。
一种照明装置,包括壳体、设于壳体内的光源,及与壳体结合的透光板,光源发出的光可透过透光板向壳体外射出,该光源包括若干互相独立的发光模组,每一发光模组包括板体及设于板体上的若干发光二极管,板体上形成供气流通过的若干通道。
与现有技术相比,本发明照明装置在发光模组上形成供气流通过的通道,借助空气的流动对发光模组进行散热,无需设置多余的散热元件即可达到良好的散热效果,同时还具有易于加工、成本低的特点。
下面参照附图,结合具体实施例对本发明作进一步的描述。
附图说明
图1为本发明照明装置第一实施例的立体分解示意图。
图2为图1中的照明装置的一发光模组的放大示意图。
图3为本发明照明装置第二实施例中的一发光模组的放大示意图。
图4为本发明照明装置第三实施例中的一发光模组的立体示意图。
图5为本发明照明装置第四实施例中的一发光模组的放大示意图。
图6为本发明照明装置第五实施例中的一发光模组的放大示意图。
主要元件符号说明
壳体                    11
底板                    111
固定孔                  112
侧壁                    113
透光板                  13
半导体发光光源          20
发光模组                21、22、23、24、25
板体                    212、222、232、242、252
发光二极管              214
通孔                    215
凹槽                    225
片体                    233
间隙                    235
凸起                    246、256
凹陷                    253
具体实施方式
请参阅图1及图2,本发明第一实施例中的照明装置包括壳体11、设于壳体11内的半导体发光光源20,及与壳体11结合的透光板13,半导体发光光源20发出的光可透过透光板13向壳体11外射出,该半导体发光光源20包括若干互相独立的发光模组21,每一发光模组21上形成供气流通过的若干通道。
壳体11可由散热性能好的材料制成。壳体11包括一个底板111和由底板111边缘向上延伸形成的四个侧壁113。在壳体11的底板111上开设有若干固定孔112,这些固定孔112可供固定件穿过从而将发光模组21固定在壳体11内。当然,也可增设一些固定孔112在壳体11上,作为供气流通过的管道。
透光板13由透明的材料制成,其结合在壳体11的四个侧壁113上,将发光模组21盖设在壳体11内以保护发光模组21。
每一发光模组21包括一板体212及设置在板体212的上表面上的若干半导体发光元件,如发光二极管214。板体212由导热性能良好的材料例如金属、陶瓷等制成。板体212的下表面与壳体11接触,发光二极管214工作时产生的热量可借由板体212散发,进一步的也可借由壳体11散发。本实施例中,在板体212上开设若干通孔215作为供气流通过的通道。因此该照明装置可进一步借助空气在通孔215内的流动对发光模组21进行散热,无需设置多余的散热元件即可达到良好的散热效果。这些通孔215也易于加工,不会增加照明装置的制造成本。
由于发光模组21互相独立,当某一发光模组21需要更换时,只需更换该一发光模组21即可,不会影响其他发光模组21的正常工作。
当然在发光模组21上形成供气流通过的通道并不限于是上述实施例中的通孔215的形式。下面以多个不同实施例进行说明。
请参考图3,本发明照明装置的第二实施例中的一发光模组22在其板体222上开设有若干凹槽225,这些凹槽225作为供气流通过的通道。本实施例中在板体222的上、下表面均开设有凹槽225。可以理解的,在其他实施例中也可仅在板体222的一个表面上(例如上表面或者下表面)开设凹槽225。这些凹槽225呈直线形,并在两个不同方向上交叉延伸。具体某一条凹槽225的宽度从其一端向另一端呈逐渐增大或者减小的趋势变化。这样更加有利于空气的流动。当然,凹槽225也不仅限于直线形,也可以是曲线形、弧线形等其它形状。凹槽225也可呈不规则排布。这些凹槽225不但可作为气流通过的通道,还能增大板体222的表面积,以提升散热性能。
请参考图4,本发明照明装置的第三实施例中的一发光模组23在其板体232的边缘沿不同方向延伸形成若干片体233,从而在各片体233之间形成间隙235,这些间隙235作为供气流通过的通道。本实施例仅在板体232的两个长边的边缘上形成间隙235,应理解间隙的235的位置不限于此,也可以形成在其他位置例如板体232的两个短边上。
请参考图5,本发明照明装置的第四实施例中的一发光模组24在其板体242的上、下表面均凸设有若干凸起246。这些凸起246规则的排列在板体242的上、下表面,且板体242的上、下表面的同一位置对应一个凸起246。凸起246的高度一致。这些凸起246可增加板体242的散热面积,以提升散热性能。可以理解的,在其他实施例中,凸起246可呈不规则排列,也可仅设置在板体242的一个表面上,其高度也可呈规则性的变化等。
请参考图6,本发明照明装置的第五实施例中的一发光模组25在其板体252的上表面设有若干凹陷253,在板体252的下表面设有若干凸起256。板体252的上、下表面的同一位置对应一个凹陷253和一个凸起256。凹陷253和凸起256均呈规则排列。这些凹陷253和凸起256同样可增加板体242的散热面积。同样的,凹陷253和凸起256也可呈不规则排列,其深度或者高度也可呈规则性的变化。可以理解的,在板体252的同一个表面上可同时形成凹陷253和凸起256。
值得指出的是,上述多个实施例中的特征并不限于单独存在,例如第一实施例中的板体212上除形成通孔215外,也可在板体212的表面上形成第二实施例中的凹槽225,或者在板体212的边缘形成第三实施例中的间隙235,同时还可在板体212的表面上形成凹陷253或者凸起256等。

Claims (10)

1.一种照明装置,包括壳体、设于壳体内的半导体发光光源,及与壳体结合的透光板,半导体发光光源发出的光可透过透光板向壳体外射出,其特征在于:该半导体发光光源包括若干互相独立的发光模组,每一发光模组上形成供气流通过的若干通道。
2.如权利要求1所述的照明装置,其特征在于:所述发光模组上形成若干通孔,所述通孔作为供气流通过的通道。
3.如权利要求1所述的照明装置,其特征在于:所述发光模组的至少一个表面上形成若干凹槽,所述凹槽作为供气流通过的通道。
4.如权利要求1所述的照明装置,其特征在于:所述发光模组的边缘向不同方向延伸形成片体,从而在各片体之间形成间隙,所述间隙作为供气流通过的通道。
5.如权利要求1-4项中任意一项所述的照明装置,其特征在于:所述发光模组包括板体及设于板体上的若干发光二极管,所述通道形成于板体上。
6.如权利要求5所述的照明装置,其特征在于:所述板体的至少一个表面上形成若干凹陷或者凸起。
7.如权利要求5所述的照明装置,其特征在于:所述板体的一个表面上形成若干凹陷,另一个表面上形成若干凸起。
8.一种照明装置,包括壳体、设于壳体内的光源,及与壳体结合的透光板,光源发出的光可透过透光板向壳体外射出,其特征在于:该光源包括若干互相独立的发光模组,每一发光模组包括板体及设于板体上的若干发光二极管,板体上形成供气流通过的若干通道。
9.如权利要求8所述的照明装置,其特征在于:所述通道为在板体上形成的通孔、凹槽、板体边缘上形成的间隙的其中的一种或者多种的组合。
10.如权利要求8或者9所述的照明装置,其特征在于:所述板体的表面上形成凸起或者凹陷。
CN2010101466937A 2010-04-14 2010-04-14 照明装置 Pending CN102221134A (zh)

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Application Number Priority Date Filing Date Title
CN2010101466937A CN102221134A (zh) 2010-04-14 2010-04-14 照明装置
US12/824,208 US8388195B2 (en) 2010-04-14 2010-06-27 Illumination device with heat dissipation structures
JP2011067651A JP2011228286A (ja) 2010-04-14 2011-03-25 照明装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913236A (zh) * 2014-03-12 2015-09-16 欧司朗有限公司 照明模块和包括该照明模块的照明组

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130016510A1 (en) * 2011-07-12 2013-01-17 Sanders Brian C Modular led illumination apparatus
US20130100670A1 (en) * 2011-10-20 2013-04-25 Osram Sylvania Inc. Lighting system with a heat sink having plurality of heat conduits
KR101301719B1 (ko) * 2013-01-24 2013-09-10 주식회사 트루스타 Led 램프용 전극모듈
CN109448562B (zh) * 2018-12-11 2024-02-23 深圳市齐普光电子股份有限公司 一种联动模块化led显示模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070086188A1 (en) * 2004-05-18 2007-04-19 Onscreen Technologies, Inc. LED Assembly with Vented Circuit Board
CN201003698Y (zh) * 2007-02-09 2008-01-09 鸿坤科技股份有限公司 Led灯组散热结构及具有该led灯组散热结构的路灯
CN201093389Y (zh) * 2007-09-28 2008-07-30 东莞市精航科技有限公司 一种led灯具的灯板结构
CN201318652Y (zh) * 2008-12-17 2009-09-30 东莞市邦臣光电有限公司 Led光源板及led路灯灯体
CN101577270A (zh) * 2008-05-06 2009-11-11 鸿富锦精密工业(深圳)有限公司 半导体发光组件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7355562B2 (en) * 2004-02-17 2008-04-08 Thomas Schubert Electronic interlocking graphics panel formed of modular interconnecting parts
JP5320560B2 (ja) * 2008-05-20 2013-10-23 東芝ライテック株式会社 光源ユニット及び照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070086188A1 (en) * 2004-05-18 2007-04-19 Onscreen Technologies, Inc. LED Assembly with Vented Circuit Board
CN201003698Y (zh) * 2007-02-09 2008-01-09 鸿坤科技股份有限公司 Led灯组散热结构及具有该led灯组散热结构的路灯
CN201093389Y (zh) * 2007-09-28 2008-07-30 东莞市精航科技有限公司 一种led灯具的灯板结构
CN101577270A (zh) * 2008-05-06 2009-11-11 鸿富锦精密工业(深圳)有限公司 半导体发光组件
CN201318652Y (zh) * 2008-12-17 2009-09-30 东莞市邦臣光电有限公司 Led光源板及led路灯灯体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913236A (zh) * 2014-03-12 2015-09-16 欧司朗有限公司 照明模块和包括该照明模块的照明组
CN104913236B (zh) * 2014-03-12 2019-07-09 欧司朗有限公司 照明模块和包括该照明模块的照明组

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