CN102182949A - LED bulb - Google Patents

LED bulb Download PDF

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Publication number
CN102182949A
CN102182949A CN2011101070262A CN201110107026A CN102182949A CN 102182949 A CN102182949 A CN 102182949A CN 2011101070262 A CN2011101070262 A CN 2011101070262A CN 201110107026 A CN201110107026 A CN 201110107026A CN 102182949 A CN102182949 A CN 102182949A
Authority
CN
China
Prior art keywords
led
plastic part
pcb
plastic
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101070262A
Other languages
Chinese (zh)
Inventor
金国平
陈建丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North First Light Source Technology (dalian) Ltd By Share Ltd
Original Assignee
North First Light Source Technology (dalian) Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North First Light Source Technology (dalian) Ltd By Share Ltd filed Critical North First Light Source Technology (dalian) Ltd By Share Ltd
Priority to CN2011101070262A priority Critical patent/CN102182949A/en
Publication of CN102182949A publication Critical patent/CN102182949A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an LED bulb. A bulb cap is connected with an upper plastic part, a lower plastic part is arranged below the upper plastic part, a printed circuit board (PCB) is arranged on the lower plastic part, an LED is connected with the PCB, a shell is arranged outside the LED and fixed on the lower plastic part, and a metal substrate is arranged between the PCB and the LED. The heat-radiating metal substrate is additionally arranged between the PCB and the LED, therefore, the LED bulb disclosed by the invention can effectively dissipate heat and has a prolonged service life; and the LED bulb can meet the wide-range voltage requirement, does not cause stroboflash, does not pollute the power grid, is environment-friendly and energy-saving, and has high lighting efficiency and low heat productivity.

Description

A kind of LED ball bubble
Technical field
The present invention relates to the lighting apparatus field, relate in particular to a kind of LED lamp.
Background technology
Along with the continuous development of LED technology, LED not only is applied to special lighting fields such as indicator lamp, backlight, and begins to be widely used in various general lightings field as the substitute products of incandescent lamp, electricity-saving lamp.LED has long, advantage such as light efficiency is high, radiationless, shock resistance and low-power consumption of life-span, belong to energy-conservation environmental protection illumination, therefore the LED lamp that with LED is light source also continues to bring out, but existing LED lamp is that the LED light source directly is installed in plastic casing, the LED lantern festival of this mode produces a large amount of heats, and because radiating effect is poor, cause the low and life-span weak point of light efficiency, can't satisfy the needs of normal illumination.
Summary of the invention
In order to overcome problems such as existing LED lamp radiating effect is poor, service life is short, the invention provides a kind of LED ball bubble.
The technical scheme that the present invention is adopted for achieving the above object is: a kind of LED ball bubble, and the crown top of burner is connected with last plastic, and plastic is down installed in last plastic below, the PCB circuit board is installed on the following plastic, LED is connected with the PCB circuit board, and the LED outside is provided with shell, and shell is fixed on the following plastic.
Be provided with metal substrate between described PCB circuit board and the LED.
LED ball of the present invention bubble has increased the heat radiating metal substrate between circuit board and LED, can efficiently radiates heat, prolonged the service life of LED; And can adapt to wide voltage request, no stroboscopic, pollution-free to electrical network, environment protecting and power-saving; The luminous efficiency height, caloric value is little.
Description of drawings
Fig. 1 is the structure chart of LED ball bubble of the present invention.
The specific embodiment
LED ball bubble structure of the present invention as shown in Figure 1, the crown top of burner 1 is connected with last plastic 2, plastic 3 is down installed in last plastic 2 belows, last plastic 2 is made of plastic with following plastic 3, plays the effect of insulation.PCB circuit board 4 is installed on the following plastic 3, LED 7 is connected with PCB circuit board 4, LED 7 is by 4 power supplies of PCB circuit board, LED 7 outsides are provided with shell 5, shell adopts glass to make, shell 5 is fixed in plastic 3 edges down, is provided with metal substrate 6 between PCB circuit board 4 and the LED 7, and metal substrate 6 is used for heat radiation.
Adopt said structure, between PCB circuit board 4 and LED 7, increased heat radiating metal substrate 6, can efficiently radiates heat, prolonged the service life of LED; And LED ball bubble of the present invention can adapt to wide voltage request, and no stroboscopic is pollution-free to electrical network, environment protecting and power-saving; The luminous efficiency height, caloric value is little.

Claims (2)

1. a LED ball steeps, it is characterized in that: the crown top of burner (1) is connected with last plastic (2), plastic (3) is down installed in last plastic (2) below, following plastic (3) is gone up PCB circuit board (4) is installed, LED(7) be connected with PCB circuit board (4), LED(7) outside is provided with shell (5), and shell (5) is fixed on the following plastic (3).
2. a kind of LED ball bubble according to claim 1 is characterized in that: described PCB circuit board (4) and LED(7) between be provided with metal substrate (6).
CN2011101070262A 2011-04-27 2011-04-27 LED bulb Pending CN102182949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011101070262A CN102182949A (en) 2011-04-27 2011-04-27 LED bulb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101070262A CN102182949A (en) 2011-04-27 2011-04-27 LED bulb

Publications (1)

Publication Number Publication Date
CN102182949A true CN102182949A (en) 2011-09-14

Family

ID=44569211

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101070262A Pending CN102182949A (en) 2011-04-27 2011-04-27 LED bulb

Country Status (1)

Country Link
CN (1) CN102182949A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201221693Y (en) * 2008-06-11 2009-04-15 朱志明 LED ball bulb lamp
CN101761803A (en) * 2009-12-11 2010-06-30 无锡爱迪信光电科技有限公司 Low power consumption and high-efficiency LED bulb lamp
KR20100111354A (en) * 2009-04-07 2010-10-15 강주훈 Structure to radiate heat of led lamp using skived fin
CN202056602U (en) * 2011-04-27 2011-11-30 北首光源科技(大连)股份有限公司 Light-emitting diode (LED) bulb

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201221693Y (en) * 2008-06-11 2009-04-15 朱志明 LED ball bulb lamp
KR20100111354A (en) * 2009-04-07 2010-10-15 강주훈 Structure to radiate heat of led lamp using skived fin
CN101761803A (en) * 2009-12-11 2010-06-30 无锡爱迪信光电科技有限公司 Low power consumption and high-efficiency LED bulb lamp
CN202056602U (en) * 2011-04-27 2011-11-30 北首光源科技(大连)股份有限公司 Light-emitting diode (LED) bulb

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20110914