CN102181642A - PCB (Printed Circuit Board) base material produced by mixed waste and preparation method thereof - Google Patents

PCB (Printed Circuit Board) base material produced by mixed waste and preparation method thereof Download PDF

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Publication number
CN102181642A
CN102181642A CN2011100784458A CN201110078445A CN102181642A CN 102181642 A CN102181642 A CN 102181642A CN 2011100784458 A CN2011100784458 A CN 2011100784458A CN 201110078445 A CN201110078445 A CN 201110078445A CN 102181642 A CN102181642 A CN 102181642A
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waste material
waste
base material
preparation
pcb board
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CN102181642B (en
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吴丹
彭映平
黄善球
朱东年
王民生
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Jiangyin new fortune Aluminum Technology Co., Ltd.
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Jiangyin Xinren Technology Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Abstract

The invention relates to a PCB (Printed Circuit Board) base material produced by mixed waste and a preparation method thereof. The PCB base material is characterized in that the PCB base material contains high ferrum and high silicon, wherein the ratio of Fe to Si is 1.08-1.39; and the content of trace elements Mn and Zn exceeds 0.1%. The preparation method comprises the following process flows: recovering waste; grouping alloy; preparing furnace charge; charging; melting; stirring and drossing; adjusting ingredients; refining for the first time; refining and processing for the second time; degassing and drossing in a degassing box; filtering and deslagging; casting into a casting plate with the thickness of 6.0-7.5mm; carrying out cold rolling until the the casting plate is 2.8-3.3mm; carrying out intermediate annealing according to 550DEG C/10h; carrying out cold rolling to 0.8mm; trimming by a reeling machine; cold rolling until the casting plate is 0.38mm; and rolling into the finished product with the thickness of 0.1-0.2mm by a foil roll. The PCB base material has the advantages of clean surface, even color, no scratches, creases, bumping and the like, and stable quality.

Description

A kind of with mixing waste production pcb board base material and preparation method thereof
Technical field
The present invention relates to a kind ofly produce pcb board base material and preparation method thereof, belong to the aluminium processing technique field with mixing waste.
Background technology
In the aluminium sheet aluminium foil process of producing product owing to the unequal reason of side cut, broken belt, bottoming produces waste material inevitably, if do not add processing, perhaps handled slow, the accumulation that causes, not only will have a strong impact on the clean and tidy of site environment, and unfavorable for 5S of factory and ERP management work implementation.Therefore, the management of waste material is had higher requirement, promptly the shelf-time lacks, and the cycle of melting down is fast, vacate the waste material basket as early as possible and in time collect waste material, thereby minimizing waste material and waste material basket takies the factory building space too much.So waste material is farthest recycled, be important background of the present invention.
In the prior art, the waste material of identical aluminium alloy is used to produce identical alloy product, and the higher-grade aluminium alloy scrap is produced low-grade alloy product, is that each aluminum fabrication plant carries out reasonable plan and the normal mode that waste recovery is utilized at present.But this scheme has directly been run counter to the purpose that is used for preparing conventional aluminium sheet strip and foil goods with low raw materials cost and operational cost, therefore, need provide a kind of method to prepare conventional aluminium sheet strip and foil goods with mixing waste.
Pcb board (printed circuit board) base material is one of conventional aluminium sheet strip and foil goods, this product is except requiring aluminium alloy plate shape good, tensile strength is between 155 ~ 220Mpa, surface cleaning, color and luster are even, do not have to wipe scuffing, folding line and damage, outside the defective such as gravure, environment for use is a normal temperature environment, is not very high to the harsh degree of the requirement of chemical ingredients.Producing this product with mixing waste and have low raw materials cost and process cost advantage, is that mixing waste is recycled the first-selected product of producing.
Summary of the invention
The invention reside in the mixing waste that a kind of high waste utilization rate is provided and produce pcb board base material and preparation method thereof.
Iron and silicone content are higher in the pcb board base material chemical ingredients of the present invention, and its Fe:Si is between 1.08~1.39, and micro-Mn, Zn content surpass 0.1%, and concrete Chemical Composition (massfraction) % is as follows:
Figure 2011100784458100002DEST_PATH_IMAGE002
Preparation method's technical process is: waste recovery → alloy grouping → furnace charge preparation → shove charge → melt → stir and skim → adjust in composition → stove and handle, (initial refining) → converter and leaving standstill, the degasification of (secondary refining) → degasification tank skims → and the filter cleaner → casting of strumbox two channels twin-stage ceramic filter plate becomes casting plate → cold rolling 2.8~3.3mm → 550 ℃/10h of employing process annealing of 6.0~7.5mm → be cold rolled to 0.8mm → rewind reel 0.38mm → paper tinsel of cutting edge → be cold rolled to roll and be rolled down to finished product thickness 0.1~0.2mm;
Described waste recovery process is: will reclaim waste material and screen grouping, by the alloy species difference that reclaims waste material, dividing 1XXX is that to make up golden waste material, Al-Zn-Mn be that alloy contains that MnZn makes up golden waste material, 8XXX is that iron content silicon makes up golden waste material, 8XXX is that the iron content copper silicon makes up golden waste material and body waste material group of the present invention to fine aluminium; By reclaiming waste material thickness difference, the waste material of thickness>1.5mm directly adds smelting furnace and carries out the melting remelting, thickness 〉=0.2 ~≤waste material of 1.5mm packs and makes enclosed mass and add smelting furnace and carry out the melting remelting, and the waste material of thickness<0.2mm enters intermediate frequency furnace to carry out quick remelting and pours into ingot casting and add smelting furnace and carry out the melting remelting.
Described furnace charge is prepared proportioning and is defined as: it is the fine aluminium group that (1), waste material use 1XXX, and 8XXX is that iron content, silicon make up golden waste material, total input amount≤40% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=60%; (2), to use 8XXX be that iron content, silicon, copper make up golden waste material to waste material, total input amount≤15% of waste material, secondary waste material≤15% wherein, virgin aluminium ingot 〉=85%; (3) to use Al-Zn-Mn be alloyed scrap to waste material, total input amount≤10% of waste material, secondary waste material≤10% wherein, virgin aluminium ingot 〉=90%; (4), waste material uses body waste material of the present invention, total input amount≤30% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=70%;
Described 550 ℃/10h intermediate annealing process is: adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 1 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature;
Total working modulus is more than 94% after the described process annealing.
The present invention is a starting point with 8011 alloys, on this alloy basis, Mn, Zn mass percent are controlled in 0.13%, micro-mass percents such as Cu, Mg, Ti are controlled in 0.05%, strip casting process and 550 ℃ of high-temperature annealing process of 2.8 ~ 3.3mm thickness through 6.0~7.5mm, overcome the deficiency that waste recovery is utilized in the prior art, satisfy with technical requirementss such as mixing waste production pcb board backing material plate shape, mechanical property, surface quality.
Characteristics of the present invention are as follows:
1, belong to high Fe, high Si alloy in aluminium alloy, its Fe:Si is between 1.08~1.39, and micro-Mn, Zn content surpass 0.1%, and its chemical ingredients is as described in the following table:
Figure 2011100784458100002DEST_PATH_IMAGE004
The present invention with the pcb board base material of producing 1XXX be fine aluminium make up golden waste material, Al-Zn-Mn be alloy contain MnZn make up golden waste material, 8XXX be iron content silicon to make up golden waste material, 8XXX be that the iron content copper silicon makes up and adds the aluminium ingot of aluminum content 99.50% or more on the basis of golden waste material and body waste material of the present invention again stove leaves standstill and secondary refining → degasification tank degasification slagging-off → strumbox two channels twin-stage ceramic filter plate filter cleaner → casting and make the casting plate through smelting furnace melting and initial refining → leave standstill, and then pass through cold rolling → process annealing → paper tinsel to roll and make the pcb board base material.
2, to annex the waste material scope wide and many in the present invention, especially be that to make up golden waste material, Al-Zn-Mn be that alloy contains that MnZn makes up golden waste material, 8XXX is that iron content silicon makes up golden waste material, 8XXX is that the iron content copper silicon makes up golden waste material and body waste management of the present invention to fine aluminium at the various 1XXX that produces in particularly for production process of product alloy species, can in time handle the accumulation of on-the-spot waste material rapidly, create good on-the-spot bad border, improve the comprehensive utilization ratio of waste material, save production cost, have distinguishing feature.
3, the present invention is a starting point with 8011 alloys, on this alloy basis, utilize 0.13% with interior Mn, Zn, 0.05% with trace elements such as interior Cu, Mg, Ti, carries out performance effect separately in 550 ℃ of high-temperature annealing process at the strip casting process of 6.0~7.5mm and 2.8 ~ 3.3mm thickness.
Trace element Mn content is controlled in 0.13%, helps the recrystallization temperature of the Mn raising aluminium among the Al, and the remarkable refinement recrystal grain of energy, and the Mn solid solution can improve 20 ~ 100 ℃ of recrystallization temperatures, and pass through MnAl in aluminium 6Dispersoid particle hinders recrystal grain and grows up, and can improve alloy strength and dissolving Fe simultaneously, forms Al 6(Fe, Mn) reduces FeAl 3The spiculation compound keeps the plasticity of alloy to the influence of mechanical property; Mn content surpasses 0.13%, through recrystallization annealing, and the excessive MnAl that separates out 6The second phase compound is distributed in crystal boundary with netted form, help promoting the annexation between the recrystal grain, and form thick recrystal grain, cause the finished product surface color and luster non-uniform phenomenons such as orange peel, striped aberration to occur, and can't satisfy the requirement of pcb board substrate product surface quality.
Fe:Si is controlled between 1.08~1.39, make Fe, Si, Al in aluminum substrate mainly with β (Al 5Spontaneous core when FeSi) becoming crystallization mutually plays refinement melt function of organization, and then the flowability and the casting that improve alloy melt organize grain refining effect, and through the cold working hardening distortion, when distortion heat reaches more than 160 ℃, alloy can show good Plastic Deformation; The intensity of alloy and wear resistance are good under the hard state, are difficult for producing wiping between layer and the layer when serial section buttress plate is produced scratching.
Trace elements zn content is controlled in 0.13%, makes Zn and micro-Mg among the Al, forms strengthening phase MgZn 2, alloy is produced tangible strengthening effect, when the ratio control of Zn and Mg during, stress corrosion crack drag maximum in 2.7 left and right sides, when the ratio of Zn and Mg greater than 2.2, and Cu content is when being slightly larger than Mg, Cu and other elements can produce strengthening phase S(CuMgAl 2) and improve alloy strength, Cu can reduce crystal boundary and intracrystalline potential difference, can suppress intergranular crack trend, improves the alloy anti-stress corrosion performance.Zn, the Mg of trace, Cu exist among the Al, also can improve the yield strength of alloy, make the alloy after viscous deformation have good elasticity, the thin plate that helps 0.1 ~ 0.2mm thickness more keeps planeness and warping resistance ability, in serial section buttress plate production process, avoid folding line, damage, defective such as gravure takes place.Because of the density of Zn is 7.14 gram/cubic centimetres, be far longer than the density (2.702 gram/cubic centimetre) of Al, Zn content was above 0.13% o'clock, Zn intracrystalline gravity segregation in the αGu Rongti of Al increases, easily form coarse grain through recrystallization annealing, cause the finished product surface color and luster non-uniform phenomenons such as orange peel, striped aberration to occur, and can't satisfy the requirement of pcb board substrate product surface quality.
Ti is an interpolation element commonly used in the aluminium alloy, with AlTi 5The thread form of B adds the Al melt, forms Al 3Ti and B 2Ti phase compound, the non-spontaneous core when becoming crystallization plays refinement casting function of organization, in the recrystallization annealing process, plays the effect of secondary recrystallization crystal grain forming core, the raising of favourable alloy plasticity.
4, of the present invention, by the process annealing of 2.8 ~ 3.3mm thickness calendering sheet material high temperature, make Al 6(Fe, Mn), MgZn 2, S(CuMgAl 2) compound is with β (Al 5FeSi), Al 3Ti and B 2Ti phase compound is that the crystal particle crystal boundary disperse on every side of core is separated out, make alloy have the characteristics of advantages of higher tensile strength, yield strength and unit elongation, this alloy is in the aluminium strip course of processing, through total working modulus after the process annealing is 94% above cold deformation, crystal grain obtains abundant fragmentation, recrystal grain along maximum main transformer shape developing direction be elongated, drawing-down, form the uniform Deformation structure of surface color, thereby kept the great surface quality of pcb board base material.
Embodiment
A kind of preparation method who produces the pcb board base material with mixing waste, its feature is as follows: described pcb board base material high ferro, high silicon, its Fe:Si is between 1.08~1.39, trace element Mn, Zn content surpass 0.1%, described 0.1 ~ 0.2mmPCB plate substrate alloying element massfraction mainly is made up of the following table content, and its technological process is as follows:
1, chemical ingredients sees the following form described:
Figure 2011100784458100002DEST_PATH_IMAGE006
2, the technological process of production of casting volume is: waste recovery → alloy grouping → furnace charge preparations → shove charge → melt → stir becomes the casting plate of 6.0~7.5mm with composition → stove interior processing (the initial refining) → converter and leave standstill the degasification of (secondary refining) → degasification tank and skim of skimming → adjust → strumbox two channels twin-stage ceramic filter plate filter cleaner → casting.
Wherein the waste recovery process is: will reclaim waste material and screen grouping, by the alloy species difference that reclaims waste material, dividing 1XXX is that to make up golden waste material, Al-Zn-Mn be that alloy contains that MnZn makes up golden waste material, 8XXX is that iron content silicon makes up golden waste material, 8XXX is that the iron content copper silicon makes up golden waste material and body waste material group of the present invention to fine aluminium; By reclaiming waste material thickness difference, the waste material of thickness>1.5mm directly adds smelting furnace and carries out the melting remelting, thickness 〉=0.2 ~≤waste material of 1.5mm packs and makes enclosed mass and add smelting furnace and carry out the melting remelting, and the waste material of thickness<0.2mm enters intermediate frequency furnace to carry out quick remelting and pours into ingot casting and add smelting furnace and carry out the melting remelting.
Regulation to waste material during wherein furnace charge is prepared is: it is the fine aluminium group that (1), waste material use 1XXX, and 8XXX is that iron content, silicon make up golden waste material, total input amount≤40% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=60%; (2), to use 8XXX be that iron content, silicon, copper make up golden waste material to waste material, total input amount≤15% of waste material, secondary waste material≤15% wherein, virgin aluminium ingot 〉=85%; (3) to use Al-Zn-Mn be alloyed scrap to waste material, total input amount≤10% of waste material, secondary waste material≤10% wherein, virgin aluminium ingot 〉=90%; (4), waste material uses body waste material of the present invention, total input amount≤30% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=70%;
3, casting is rolled up other quality index and is met YS/T90-2002 " aluminium and aluminium alloy cast strip standard " requirement;
4, the casting plate of the technological process of production: 6.0~7.5mm → cold rolling 2.8~3.3mm → 550 ℃/10h of employing process annealing → the be cold rolled to 0.8mm → rewind reel 0.38mm → paper tinsel of cutting edge → be cold rolled to rolls and is rolled down to finished product thickness 0.1~0.2mm.
5, intermediate annealing process system
Adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 0.5 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature.
The pcb board base material the key technical indexes that the present invention produced is:
A) state: H16
B) dimensions and permissible variation:
Thickness * width * length: 0.1 ~ 0.2 ± 0.01 * 1245 ± 1 * 1092/1041/940 ± 1 mm,
Diagonal lines tolerance :≤1mm.
C) mechanical property: tensile strength (Mpa): 155~220, unit elongation: 〉=1%;
D) surface cleaning, color and luster are even, do not have scuffing, the folding line of wiping and damage, defective such as gravure.
E) surface flatness should be not more than 20I.
Above-mentioned technical indicator explanation, 0.1 ~ 0.2mm thickness pcb board base material that the present invention produced can reach the drill bit heat radiation fully, avoid drill bit to fracture, avoid motherboard to wipe purposes such as scuffing, minimizing motherboard through hole burr, satisfies vlsi circuitry plate (pcb board) and makes the drilling operating processing requirement.Simultaneously, solve waste material and farthest recycle, shorten the waste material shelf-time, reduce the production scene occupation of capital, reduce production costs, increase economic efficiency.
Embodiment 1:
1, the Chemical Composition proportioning of material sees the following form described:
2, the technological process of production of casting volume is: waste recovery → alloy grouping → furnace charge preparations → shove charge (18 tons) → fusing (720 ℃ of melt temperatures) → stir and skim (740 ℃ of melt temperatures) → adjustment composition (730 ℃ of melt temperatures) → stove interior processing (melt temperature carries out the nitrogen injection refining one time for 750 ℃) → converter and leave standstill (melt temperature carries out the secondary nitrogen refining for 740 ℃) → degasification tank degasification (730 ℃ of melt temperatures) → strumbox two channels twin-stage ceramic filter plate filter cleaner (upper strata 30ppi that skims, the 60ppi of lower floor, 720 ℃ of melt temperatures) → casting becomes the casting plate (690 ℃ of melt continuous casting and rolling temperature) of 6.7mm.
To use 1XXX be the fine aluminium group to waste material during wherein furnace charge was prepared, and 8XXX is that iron content, silicon make up golden waste material, total input amount≤40% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=60%.
3, casting is rolled up other quality index and is met YS/T90-2002 " aluminium and aluminium alloy cast strip standard " requirement;
4, casting plate → cold rolling 3.3mm → 550 ℃/10h of employing process annealing → be cold rolled to 0.8mm → rewind reel of the calendering technological process of production: 6.7mm 0.38mm → paper tinsel of cutting edge → be cold rolled to rolls and is rolled down to finished product thickness 0.13mm.
5, intermediate annealing process system
Adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 0.5 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature.
6, the finishing technological process of production: the 0.13mm paper tinsel rolls into product → mechanical properties test → stretch bending and rectifys cleaning aligning → crosscut section → inspection packing, thereby obtains the pcb board base material finished product of specific mechanical property and respective surfaces quality.
Embodiment 2:
1, the Chemical Composition proportioning of material sees the following form described:
Figure 2011100784458100002DEST_PATH_IMAGE010
2, the technological process of production of casting volume is: waste recovery → alloy grouping → furnace charge preparations → shove charge (18 tons) → fusing (720 ℃ of melt temperatures) → stir and skim (740 ℃ of melt temperatures) → adjustment composition (730 ℃ of melt temperatures) → stove interior processing (melt temperature carries out the nitrogen injection refining one time for 750 ℃) → converter and leave standstill (melt temperature carries out the secondary nitrogen refining for 740 ℃) → degasification tank degasification (730 ℃ of melt temperatures) → strumbox two channels twin-stage ceramic filter plate filter cleaner (upper strata 30ppi that skims, the 60ppi of lower floor, 720 ℃ of melt temperatures) → casting becomes the casting plate (700 ℃ of melt continuous casting and rolling temperature) of 7.2mm.
To use 8XXX be that iron content, silicon, copper make up golden waste material to waste material during wherein furnace charge was prepared, total input amount≤15% of waste material, secondary waste material≤15% wherein, virgin aluminium ingot 〉=85%;
3, casting is rolled up other quality index and is met YS/T90-2002 " aluminium and aluminium alloy cast strip standard " requirement;
4, casting plate → cold rolling 2.8mm → 550 ℃/10h of employing process annealing → be cold rolled to 0.8mm → rewind reel of the calendering technological process of production: 7.2mm 0.38mm → paper tinsel of cutting edge → be cold rolled to rolls and is rolled down to finished product thickness 0.17mm.
5, intermediate annealing process system
Adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 0.5 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature.
6, the finishing technological process of production: the 0.17mm paper tinsel rolls into product → mechanical properties test → stretch bending and rectifys cleaning aligning → crosscut section → inspection packing, thereby obtains the pcb board base material finished product of specific mechanical property and respective surfaces quality.
Embodiment 3:
1, the Chemical Composition proportioning of material sees the following form described:
Figure 2011100784458100002DEST_PATH_IMAGE012
2, the technological process of production of casting volume is: waste recovery → alloy grouping → furnace charge preparations → shove charge (18 tons) → fusing (720 ℃ of melt temperatures) → stir and skim (740 ℃ of melt temperatures) → adjustment composition (730 ℃ of melt temperatures) → stove interior processing (melt temperature carries out the nitrogen injection refining one time for 750 ℃) → converter and leave standstill (melt temperature carries out the secondary nitrogen refining for 740 ℃) → degasification tank degasification (730 ℃ of melt temperatures) → strumbox two channels twin-stage ceramic filter plate filter cleaner (upper strata 30ppi that skims, the 60ppi of lower floor, 720 ℃ of melt temperatures) → casting becomes the casting plate (705 ℃ of melt continuous casting and rolling temperature) of 7.5mm.
To use Al-Zn-Mn be alloyed scrap to waste material during wherein furnace charge was prepared, total input amount≤10% of waste material, secondary waste material≤10% wherein, virgin aluminium ingot 〉=90%.
3, casting is rolled up other quality index and is met YS/T90-2002 " aluminium and aluminium alloy cast strip standard " requirement;
4, casting plate → cold rolling 2.8mm → 550 ℃/10h of employing process annealing → be cold rolled to 0.8mm → rewind reel of the calendering technological process of production: 7.5mm 0.38mm → paper tinsel of cutting edge → be cold rolled to rolls and is rolled down to finished product thickness 0.18mm.
5, intermediate annealing process system
Adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 0.5 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature.
6, the finishing technological process of production: the 0.18mm paper tinsel rolls into product → mechanical properties test → stretch bending and rectifys cleaning aligning → crosscut section → inspection packing, thereby obtains the pcb board base material finished product of specific mechanical property and respective surfaces quality.
Embodiment 4:
1, the Chemical Composition proportioning of material sees the following form described:
Figure 2011100784458100002DEST_PATH_IMAGE014
2, the technological process of production of casting volume is: waste recovery → alloy grouping → furnace charge preparations → shove charge (18 tons) → fusing (720 ℃ of melt temperatures) → stir and skim (740 ℃ of melt temperatures) → adjustment composition (730 ℃ of melt temperatures) → stove interior processing (melt temperature carries out the nitrogen injection refining one time for 750 ℃) → converter and leave standstill (melt temperature carries out the secondary nitrogen refining for 740 ℃) → degasification tank degasification (730 ℃ of melt temperatures) → strumbox two channels twin-stage ceramic filter plate filter cleaner (upper strata 30ppi that skims, the 60ppi of lower floor, 720 ℃ of melt temperatures) → casting becomes the casting plate (695 ℃ of melt continuous casting and rolling temperature) of 7.0mm.
Waste material used body waste material of the present invention during wherein furnace charge was prepared, total input amount≤30% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=70%.
3, casting is rolled up other quality index and is met YS/T90-2002 " aluminium and aluminium alloy cast strip standard " requirement;
4, casting plate → cold rolling 3.3mm → 550 ℃/10h of employing process annealing → be cold rolled to 0.8mm → rewind reel of the calendering technological process of production: 7.0mm 0.38mm → paper tinsel of cutting edge → be cold rolled to rolls and is rolled down to finished product thickness 0.15mm.
5, intermediate annealing process system
Adopt the annealing of furnace gas temperature control method, that is ,≤100 ℃ of shove charges heated up 1.5 hours to 550 ℃, were incubated 10 hours; 0.5 hour to the 340 ℃ air cooling of coming out of the stove of lowering the temperature.
6, the finishing technological process of production: the 0.15mm paper tinsel rolls into product → mechanical properties test → stretch bending and rectifys cleaning aligning → crosscut section → inspection packing, thereby obtains the pcb board base material finished product of specific mechanical property and respective surfaces quality.
1XXX system described in the present invention refers to the first series alloy for " 1 " of alloy designations.
8XXX system described in the present invention refers to the first series alloy for " 8 " of alloy designations.

Claims (10)

1. produce the CB plate substrate with mixing waste for one kind, it is characterized in that: the Chemical Composition massfraction % of described pcb board base material is as follows:
Figure 2011100784458100001DEST_PATH_IMAGE002
Wherein, Fe:Si is between 1.08~1.39, and Mn, Zn content surpass 0.1%.
2. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 1 is characterized in that: described preparation method's technical process: and waste recovery → alloy grouping → furnace charge preparation → shove charge → melt → stir with the composition → initial refining of skimming → adjust → secondary refining processing → degasification tank degasification skims → and filter cleaner → casting becomes casting plate → cold rolling 2.8~3.3mm → 550 ℃/10h of employing process annealing of 6.0~7.5mm → be cold rolled to 0.8mm → rewind reel 0.38mm → paper tinsel of cutting edge → be cold rolled to roll and be rolled down to finished product thickness 0.1~0.2mm.
3. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described waste recovery, grouping process are: will reclaim waste material and screen grouping by the alloy species difference, then by reclaiming waste material thickness difference, the waste material of thickness>1.5mm directly adds smelting furnace and carries out the melting remelting, thickness 〉=0.2 ~≤waste material of 1.5mm packs and makes enclosed mass and add smelting furnace and carry out the melting remelting, and the waste material of thickness<0.2mm enters intermediate frequency furnace to carry out quick remelting and pours into ingot casting and add smelting furnace and carry out the melting remelting.
4. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described furnace charge is prepared proportioning and is: it is the fine aluminium group that waste material uses 1XXX, 8XXX is that iron content, silicon make up golden waste material, total input amount≤40% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=60%.
5. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described furnace charge is prepared proportioning and is: it is that iron content, silicon, copper make up golden waste material that waste material uses 8XXX, total input amount≤15% of waste material, secondary waste material≤15% wherein, virgin aluminium ingot 〉=85%.
6. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described furnace charge is prepared proportioning and is: it is alloyed scrap that waste material uses Al-Zn-Mn, total input amount≤10% of waste material, secondary waste material≤10% wherein, virgin aluminium ingot 〉=90%.
7. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described furnace charge is prepared proportioning and is: waste material uses body waste material of the present invention, total input amount≤30% of waste material, secondary waste material≤30% wherein, virgin aluminium ingot 〉=70%.
8. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2, it is characterized in that: described 550 ℃/10h intermediate annealing process is: adopt the annealing of furnace gas temperature control method, that is, and≤100 ℃ of shove charges, heated up 1.5 hours to 550 ℃, and be incubated 10 hours; Lowered the temperature the air cooling of coming out of the stove 0.5 hour to 340 ℃.
9. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 7 is characterized in that: total working modulus is more than 94% after the described process annealing.
10. a kind of preparation method who produces the pcb board base material with mixing waste according to claim 2 is characterized in that: described filter cleaner adopts strumbox two channels twin-stage ceramic filter plate to filter.
CN201110078445A 2011-03-30 2011-03-30 PCB (Printed Circuit Board) base material produced by mixed waste and preparation method thereof Expired - Fee Related CN102181642B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102851550A (en) * 2012-09-04 2013-01-02 江阴新仁科技有限公司 Super capacitor battery positive electrode aluminum alloy foil and casting hot continuous rolling process thereof
CN103409667A (en) * 2013-07-30 2013-11-27 江阴新仁科技有限公司 Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil
CN104313399A (en) * 2014-09-23 2015-01-28 江阴新仁科技有限公司 Electrostatic precipitation multilayer expansion web of aluminum foil and preparation method thereof
CN108330375A (en) * 2018-01-24 2018-07-27 云南浩鑫铝箔有限公司 A kind of method that electrolytic aluminium liquid casting prepares new energy resource power battery aluminium foil
CN110293225A (en) * 2018-03-23 2019-10-01 通用汽车环球科技运作有限责任公司 Al alloy powder for powder bed fusion increasing material manufacturing technique
CN110964935A (en) * 2019-12-04 2020-04-07 江苏鼎胜新能源材料股份有限公司 Manufacturing method of aluminum material with good corrosion resistance for new energy automobile circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555247B2 (en) * 2000-07-11 2003-04-29 Mitsubishi Aluminum Kabushiki Kaisha Aluminum alloy plate for planographic printing plate
CN1572533A (en) * 2003-05-30 2005-02-02 住友轻金属工业株式会社 Aluminum alloy sheet for lithographic printing plate
CN101307404A (en) * 2008-06-05 2008-11-19 江阴博威合金材料有限公司 High performance air conditioning aluminum foil and method for preparing same
CN101705394A (en) * 2009-10-15 2010-05-12 江阴新仁科技有限公司 Aluminum alloy and process for processing aluminum alloy plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6555247B2 (en) * 2000-07-11 2003-04-29 Mitsubishi Aluminum Kabushiki Kaisha Aluminum alloy plate for planographic printing plate
CN1572533A (en) * 2003-05-30 2005-02-02 住友轻金属工业株式会社 Aluminum alloy sheet for lithographic printing plate
CN101307404A (en) * 2008-06-05 2008-11-19 江阴博威合金材料有限公司 High performance air conditioning aluminum foil and method for preparing same
CN101705394A (en) * 2009-10-15 2010-05-12 江阴新仁科技有限公司 Aluminum alloy and process for processing aluminum alloy plate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102851550A (en) * 2012-09-04 2013-01-02 江阴新仁科技有限公司 Super capacitor battery positive electrode aluminum alloy foil and casting hot continuous rolling process thereof
CN102851550B (en) * 2012-09-04 2014-06-18 江阴新仁科技有限公司 Super capacitor battery positive electrode aluminum alloy foil and casting hot continuous rolling process thereof
CN103409667A (en) * 2013-07-30 2013-11-27 江阴新仁科技有限公司 Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil
CN103409667B (en) * 2013-07-30 2015-07-15 江阴新仁科技有限公司 Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil
CN104313399A (en) * 2014-09-23 2015-01-28 江阴新仁科技有限公司 Electrostatic precipitation multilayer expansion web of aluminum foil and preparation method thereof
CN104313399B (en) * 2014-09-23 2016-04-13 江阴新仁科技有限公司 Electrostatic precipitation multilayer expansion web aluminium foil and preparation method thereof
CN108330375A (en) * 2018-01-24 2018-07-27 云南浩鑫铝箔有限公司 A kind of method that electrolytic aluminium liquid casting prepares new energy resource power battery aluminium foil
CN110293225A (en) * 2018-03-23 2019-10-01 通用汽车环球科技运作有限责任公司 Al alloy powder for powder bed fusion increasing material manufacturing technique
CN110964935A (en) * 2019-12-04 2020-04-07 江苏鼎胜新能源材料股份有限公司 Manufacturing method of aluminum material with good corrosion resistance for new energy automobile circuit board

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