CN102177613A - Method for protecting a condutive material structure provided on a carrier - Google Patents
Method for protecting a condutive material structure provided on a carrier Download PDFInfo
- Publication number
- CN102177613A CN102177613A CN2008801314583A CN200880131458A CN102177613A CN 102177613 A CN102177613 A CN 102177613A CN 2008801314583 A CN2008801314583 A CN 2008801314583A CN 200880131458 A CN200880131458 A CN 200880131458A CN 102177613 A CN102177613 A CN 102177613A
- Authority
- CN
- China
- Prior art keywords
- conducting material
- material structure
- carrier
- protective cover
- environmental protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A method for protecting a conductive material structure provided on a carrier comprises the steps of covering (26) the conductive material structure with an environmental protection layer except for in a set of pre-specified areas, where said set of pre-specified areas includes at least one contact area on the conductive material structure; and placing (28) electrical contact enhancing material on the contact area, which placing of electrical contact enhancing material is performed after the conductive material structure has been covered with the environmental protection layer.
Description
Technical field
Present invention relates in general to the conducting material structure on the carrier, for example conductor on the carrier and/or radiant element.More specifically, the present invention relates to protect the method for the conducting material structure on the carrier.
Background technology
The pattern or the structure that are arranged on the electric conducting material on the carrier need be connected to other elements, for example other conducting material structures or pattern, circuit, parts and element.
Known employing protective material covers such pattern so that protect this pattern to resist the influence of environment, for example the burn into humidity, from EMD of other elements etc.
In order to improve and being electrically connected of another element, also wish usually to contact reinforcing material for this pattern setting.
US 6,910, and 636 show a kind of antenna that is covered by dielectric protective layer and cover layer, and through hole passes this cover layer.Herein also by outside contact mat being inserted in this through hole and provide contact area via this through hole.Protective layer, contact layer and antenna are the part of IC-card.
US 2007/0035466 shows the dielectric mask that places on the conductive pattern.This mask has the opening that is used to form conductive pattern.This conductive pattern can be antenna.
US 6,353, and 420 show and are arranged on suprabasil antenna.This substrate also has through hole.By providing with the electric conducting material filler opening and being electrically connected of antenna.Extra play be can also use, environmental influence and mechanical damage are used to be protected from.
US 2002/0094639 shows antenna and the antenna contact lead-wire in the RFID circuit.This contact lead-wire is covered by the insulating barrier with via hole in one embodiment, and this via hole is filled with metal for the purpose that contacts.Transistor arrangement is arranged at the top of insulating barrier subsequently.
The contact reinforcing material may compare costliness.These materials and then may be that environment is not expected.So their use of being interested in to limit.
Provide for carrier with conducting material structure cover with the process that contact reinforcing material in, also should under the situation that additional step is not provided, carry out to contacting the restriction of reinforcing material, to keep low production cost.
Summary of the invention
Therefore one object of the present invention is to provide a kind of amount that limits the contact reinforcing material of use, avoids the method for the conducting material structure on the protection carrier of additional treatment step simultaneously.
The present invention is based on this structure and to be provided with when electrically contacting reinforcing material, the environmental protective cover that is used to protect conducting material structure to avoid environmental impact can be used as the realization of mask.
According to a first aspect of the invention, provide a kind of method as defined in claim 1.
Further preferred implementation defines in the dependent claims.
The invention provides a kind of method of protecting the conducting material structure on the carrier; wherein limit the amount of the contact reinforcing material that uses; avoid the problem of additional treatment step to obtain solution simultaneously: to cover conducting material structure with environmental protective cover by following steps; comprise except the zone of one group of preassignment of at least one contact area on the conducting material structure; and electrically contact reinforcing material in this contact area setting, wherein after being coated with environmental protective cover, carries out conducting material structure electrically contacting the setting of reinforcing material.
Description of drawings
Referring now to accompanying drawing, the present invention will be described for the mode by example, in the accompanying drawing:
Fig. 1 shows the top view of the carrier that is provided with conducting material structure;
Fig. 2 shows the top view of the carrier among Fig. 1, and wherein conducting material structure is covered by environmental protective cover;
Fig. 3 shows the top view of the carrier among Fig. 2, and wherein the contact area of conducting material structure has received and electrically contacted reinforcing material;
Fig. 4 shows the end view of the carrier among Fig. 1;
Fig. 5 shows the end view of the carrier among Fig. 2;
Fig. 6 shows the end view of the carrier among Fig. 3; And
Fig. 7 shows the flow chart of the certain methods step in the inventive method.
Embodiment
Below, will provide the detailed description of preferred implementation that protection is arranged on the method for the conducting material structure on the carrier.In explanation, the unrestricted purpose for explanation proposes specific details, and for example special applications, technology etc. are to provide thorough of the present invention.But the present invention can be applicable to break away from other execution modes of these specific detail, and this is tangible for a person skilled in the art.In other cases, omit detailed description, explanation of the present invention is become ambiguous in order to avoid unnecessary details makes to well-known method, device and circuit.
The present invention is directed to substantially conducting material structure is set on carrier, material structure that promptly can conduction current.Such structure can be arranged on conductor or the antenna radiator trace on circuit board, flexible membrane, shell (chassis), lid, casing or the intermediate plate of an electronic equipment.An electronic equipment that is provided with the such carrier with conducting material structure can be the object such as portable electric appts, as game machine or electronic notebook.Such portable electric appts also can be portable communication device, as mobile phone, kneetop computer or desktop computer.
Usually, the such conducting material structure on the carrier is to be provided with as entity is installed, and this installation entity is installed in such electronic equipment as a lamellar body.So conducting material structure of the present invention can be arranged on the outside of this entity, on the surface as this entity.This means that carrier will become the outer surface of such installation entity in this case.This means that also conducting material structure is the object of environmental hazard (for example corrosion and moist).Therefore conducting material structure will need environmental protective cover or environmental protection lid, and the protection conducting material structure is avoided the harm of this environment, for example protects conducting material structure to avoid the harm of air, dust and/or water.
In addition, conducting material structure will be connected to other entities, for example parts in the electronic equipment and circuit.In order to reach this purpose, be necessary for conducting material structure in addition the contact reinforcing material is set, wherein such contact reinforcing material can play the effect that reduces contact resistance.
It is by for whole conducting material structure the contact reinforcing material being set, after this covering conducting material structure with protective layer with the mode that contacts reinforcing material in many cases that such protective layer is set.Such deficiency has been to use excessive contact reinforcing material.This may be very expensive, especially when the contact reinforcing material that uses during as gold.
Therefore the method that provides a kind of protection to be arranged on the conducting material structure on the carrier is provided in the present invention, and it has limited the amount of contact reinforcing material, and this contact reinforcing material only is used to the necessary situation that guarantees that zone that the hope in this structure contacts contacts.In addition, this carries out according to the present invention, need not to carry out any additional method step.
Fig. 1-3 shows the top view of the carrier with conducting material structure, and this conducting material structure has passed through three independent production stages of the present invention.Fig. 4-6 shows the end view of identical production stage, and Fig. 7 shows the flow process of the treatment step of execution.
The method according to this invention starts to carrier 10 conducting material structure is set.Such example structure 12 is shown in Fig. 1-6.This structure 12 is for being arranged on radiate element structure or the antenna structure 12 on the carrier 10 herein.In addition, this antenna structure 12 is the form of plane inverse F type multiband antenna (multi-band PIFA) herein.In addition, this structure 12 comprises at least one contact area, and promptly this structure will be connected to the zone of another entity, for example is connected to conductor, circuit, circuit board, parts etc.Because the structure according to this example is PIFA, therefore on structure 12, be provided with two such zones 14 and 16.Certainly, for the conducting material structure of other types, has more or less such zone.Under the situation of PIFA, such zone 14 is the signal join domain that is used to be connected to radio circuit, and another zone 16 is for being used to be connected to earthy ground area.To being provided with the connection of radio circuit and earthy the connection via the circuit board that was arranged in 10 minutes with carrier.
Yet be to be appreciated that the present invention is not limited to the carrier and the conducting material structure of these types.Carrier with conducting material structure can have three-dimensional extension, that is, conducting material structure and carrier all can extend three dimensions.Three-dimensional herein conducting material structure can be arranged on the curved surface of carrier or be arranged on two planes that are provided with at an angle to each other of carrier, is 90 degree as exemplary angle.One or more surfaces like this can be the outside or outside parts that entity is installed, and this installation entity for example resembles the shell or the intermediate plate of portable electric appts.Conducting material structure can be arranged on the carrier by laser direct forming (LDS), wherein is doped with the plastic material laser radiation of electric conducting material (as copper) particle.This laser makes metal appear at the surface of plastic material subsequently.Be to be appreciated that herein and can also adopt other modes that conducting material structure is set, for example mold interconnecting device (Moulded Interconnect Device, MID), two-shot moulding process (Two Shot Moulding) and photoimaging.The electric conducting material that is used for this structure is that metal (for example copper, nickel or silver) is more favourable.Yet this material is not limited to metal, can also for example be conducting polymer or conducting resinl.
Now still with reference to figure 7, step 24, the present invention is from being provided with conducting material structure (being aerial radiation body structure 12 herein) for carrier 10.Afterwards, step 26 except the one group of zone that comprises at least one contact area (being two contact areas 14 and 16) herein, covers radiator structure with environmental protective cover or over cap 18.In addition, this over cap 18 also is arranged on a side that deviates from carrier 10 of this conducting material structure 12 herein.This means that the insulated part of wanting in structure be provided with protective layer, rather than protective layer is set will being used to contact the zone that other equipment maybe will be used to carry out other activities (for example be used to test search coverage).The mask of protective material can be sprayed on these zones herein.Can also use the printing technology of various ways, for example ink jet printing, silk screen printing or bat printing.Protective layer 18 is printed on the radiator structure 12, except contact area in this embodiment.In addition, to adopt bat printing herein be more favourable to printing technology.Material can be plastic material herein.Can also be the metal that is not easy to be corroded, for example gold, silver or nickel in some cases.But based on the cost reason, the electrical insulating material that resembles plastic material and so on is favourable.This material can be acrylic lacquer or polyester.Select mask herein so that the structure below its protection is avoided for example corroding and/or the environmental hazard of humidity etc.Use plastics to also have another advantage.It will provide the Electrostatic Discharge protection to miscellaneous part in the equipment.As fruit structure is antenna, will limit the influence to antenna efficiency and radio frequency (RF) characteristic.
Because bat printing uses print station (pad), it receives material according to the desired results on the print station, print station is pressed on the surface that can have Any shape then, and therefore when structure being arranged under the situation of crooked carrier surface, it is especially useful using bat printing.Print station makes its shape be suitable for support shapes herein, this means that the conducting material structure that is arranged on crooked carrier surface can be capped.Such position of conducting material structure is favourable in many portable electric appts that need to keep small-sized.Therefore this means that the inner space of such equipment (as mobile phone) is more effectively utilized.
Be to be appreciated that herein and can also use mask technique, for example, on the part that will keep protective material, mask is set, never establish the zone of mask and remove protective material, and remove mask material subsequently on total, to deposit protective material.
After structure 12 usefulness protective layers 18 cover,, will electrically contact the non-contact area that is capped 14 and 16 that reinforcing material 20,22 places structure 12 in step 28.Therefore after conducting material structure 12 is covered by environmental protective cover 18, carried out electrically contacting the setting of reinforcing material.This material can be placed these contact areas by plating.Should be appreciated that plating can be electroless plating or plating.Electrically contact in this step of reinforcing material in setting, protective layer 18 is taken on the effect of mask, stops other parts of this structure to receive the contact reinforcing material.Contacting reinforcing material herein can be metal, as gold, silver, nickel or tin, or the combination of these metals, for example combination of gold and nickel.
Be to be appreciated that herein and also can adopt other technologies, for example sputter or chemical vapour deposition (CVD) except plating.
By this way, contact is being set during reinforcing material, the effect that is used to protect the lid of the final product structure in electronic equipment to be installed to take on mask.This means the amount that has reduced the contact reinforcing material that uses.This still finishes under the situation of not using additional treatment step.
The environmental protective cover of printing has further advantage.It is used in aesthetic attractive surface is set on the carrier.Can be the surface by this printing patterning design, for example design of logo, figure or some other types are set.It also can be used for being provided with the symbol such as text and numeral, therefore can provide written and/or patterning information.
As above-mentioned, one group of zone covering of protected seam does not comprise the electric contact area of other entities that are used for being connected to electronic equipment.But this group also can comprise other zones, for example will be used to test the search coverage of contact material structure.Such search coverage can receive or can not receive the contact reinforcing material.
The advantageous version of method that protection according to the present invention has the carrier of conducting material structure has been described.But, be appreciated that these modification can change in the scope of appended claim.Therefore the present invention is only limited by appended claim.
Claims (13)
1. a protection is arranged on the method for the conducting material structure (12) on the carrier (10), and this method may further comprise the steps:
-covering step; cover (26) described conducting material structure (12) with environmental protective cover (18), except the zone of one group of preassignment (14,16); the zone of wherein said one group of preassignment comprise on the described conducting material structure (12) at least one contact area (14,16) and
-step is set, go up setting (28) at described contact area (14,16) and electrically contact reinforcing material (20,22), wherein after described conducting material structure is coated with described environmental protective cover, carry out the described setting that electrically contacts reinforcing material.
2. method according to claim 1, wherein, described covering step comprises described protective layer is printed on the described conducting material structure.
3. method according to claim 2, wherein, the described bat printing that is printed as.
4. according to the described method of arbitrary aforementioned claim, wherein, the step that electrically contacts reinforcing material is set is included in when utilizing described environmental protective cover, will electrically contact reinforcing material and be plated to described contact area as mask.
5. according to the described method of arbitrary aforementioned claim, wherein, described conducting material structure has defined at least one antenna radiator.
6. according to the described method of arbitrary aforementioned claim, wherein, described environmental protective cover protects described structure to avoid the air influence.
7. according to the described method of arbitrary aforementioned claim, wherein, described environmental protective cover is an electrical insulating material.
8. according to the described method of arbitrary aforementioned claim, wherein, the side that deviates from carrier (10) that the step that covers described conducting material structure with environmental protective cover is included in described conducting material structure (12) applies described environmental protective cover (18).
9. according to the described method of arbitrary aforementioned claim, wherein, described carrier and described conducting material structure have three-dimensional extension.
10. according to the described method of arbitrary aforementioned claim, wherein, described carrier is to be used to be installed in an installation entity on the electronic equipment, and described conducting material structure is arranged at least one outer surface of described installation entity.
11. method according to claim 10, wherein, a described electronic equipment is a portable electric appts.
12. method according to claim 11, wherein, described portable electric appts is a portable radio communication equipment.
13. method according to claim 12, wherein, described portable radio communication equipment is a mobile phone.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2008/063475 WO2010040399A1 (en) | 2008-10-08 | 2008-10-08 | Method for protecting a condutive material structure provided on a carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102177613A true CN102177613A (en) | 2011-09-07 |
Family
ID=40467055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801314583A Pending CN102177613A (en) | 2008-10-08 | 2008-10-08 | Method for protecting a condutive material structure provided on a carrier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102177613A (en) |
| WO (1) | WO2010040399A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106233823A (en) * | 2014-04-23 | 2016-12-14 | Zf腓德烈斯哈芬股份公司 | For protecting electronic circuit carrier from the Method and circuits module of environmental effect |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738568A (en) * | 2011-04-13 | 2012-10-17 | 榕柏科技有限公司 | Method for applying printing and laser engraving to manufacture antenna on curved substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001143037A (en) * | 1999-11-17 | 2001-05-25 | Dainippon Printing Co Ltd | Noncontact data carrier and manufacturing method therefor |
| TWI222846B (en) * | 1999-12-03 | 2004-10-21 | Delphi Tech Inc | Method for joining an integrated circuit and a flexible circuit |
| CN1775989A (en) * | 2005-11-22 | 2006-05-24 | 昆明贵金属研究所 | Cu-Ag-RE alloy in-situ nano fiber composite material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6147662A (en) * | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
| US7930815B2 (en) * | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
| JP4649598B2 (en) * | 2006-05-30 | 2011-03-09 | フジコピアン株式会社 | Method for forming terminal portion of antenna of non-contact communication medium, heat-sensitive protective layer peeling sheet, metal vapor deposition layer transfer sheet |
-
2008
- 2008-10-08 WO PCT/EP2008/063475 patent/WO2010040399A1/en active Application Filing
- 2008-10-08 CN CN2008801314583A patent/CN102177613A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001143037A (en) * | 1999-11-17 | 2001-05-25 | Dainippon Printing Co Ltd | Noncontact data carrier and manufacturing method therefor |
| TWI222846B (en) * | 1999-12-03 | 2004-10-21 | Delphi Tech Inc | Method for joining an integrated circuit and a flexible circuit |
| CN1775989A (en) * | 2005-11-22 | 2006-05-24 | 昆明贵金属研究所 | Cu-Ag-RE alloy in-situ nano fiber composite material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106233823A (en) * | 2014-04-23 | 2016-12-14 | Zf腓德烈斯哈芬股份公司 | For protecting electronic circuit carrier from the Method and circuits module of environmental effect |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010040399A1 (en) | 2010-04-15 |
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Application publication date: 20110907 |