CN102174851B - Floorboard for floor heating - Google Patents
Floorboard for floor heating Download PDFInfo
- Publication number
- CN102174851B CN102174851B CN2011100637887A CN201110063788A CN102174851B CN 102174851 B CN102174851 B CN 102174851B CN 2011100637887 A CN2011100637887 A CN 2011100637887A CN 201110063788 A CN201110063788 A CN 201110063788A CN 102174851 B CN102174851 B CN 102174851B
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- heat
- substrate
- syndeton
- heated
- heating
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000009413 insulation Methods 0.000 claims description 12
- 238000005034 decoration Methods 0.000 claims description 11
- 210000005056 cell body Anatomy 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000005267 amalgamation Methods 0.000 claims description 4
- 238000013329 compounding Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a floorboard for floor heating. A first connecting structure is arranged at one side of a substrate, a second connecting structure is arranged at the other side of the substrate, the first connecting structure on one substrate can be mutually buckled with the second connecting structure on the other adjacent substrate, and when one first connecting structure and one second connecting structure are buckled, an accommodating cavity extending longitudinally can be formed; the front of each substrate is provided with a decorative surfacing board in a compounding way, a heat-conducting medium layer is arranged between each substrate and the corresponding decorative surfacing board, each heat-conducting medium layer comprises a heat-conducting part arranged on the front of the substrate as well as a first heated part and a second heated part, wherein the first heated part and the second heated part are arranged at two sides of the heat-conducting part and are respectively located on the first connecting structure and the second connecting structure; and when each first connecting structure and the corresponding second connecting structure are buckled, the first heated part and the second heated part are spliced to form a heating member accommodating cavity which is located inside the accommodating cavity and extends longitudinally, and a heating member is arranged in the heating member accommodating cavity and can transmit heat to the first heated part and the second heated part during heating.
Description
Technical field
The invention belongs to the decoration material technical field, relate to the floor, especially relate to a kind of heating floor.
Background technology
In the prior art, the heat-conducting medium of heating floor or heater element all are arranged with the floor branch, or lay on the ground or be installed in the inside such as other members such as base plate between ground and the floor.For example, the Chinese patent document discloses a kind of composite floor for heating [application number: CN 200510040599.2], solution be the problem that existing heating floor coefficient of thermal conductivity is low, distortion is big, the surface is prone to be full of cracks.It comprises dash board, inferior dash board, central layer, base plate, is provided with horizontal thermal trough in the central layer, and vertical thermal trough is set in the base plate, and the vertical each other and perforation of horizontal thermal trough and vertical thermal trough laterally is filled with heat-conducting medium in thermal trough and the vertical thermal trough.In the technique scheme, heat-conducting medium needs elder generation with heat transferred base plate and central layer, then passes to time dash board and dash board again by base plate and central layer; Its heat conduction path is long; Heat conduction efficiency is lower, and the manufacturing process more complicated, and heat is difficult to be passed to rapidly floor surface.
The somebody has invented a kind of floor [application number: CN200910047756.0] of internal heat-conducting structure, comprises a floor body, a plurality of heat-conducting medium things, a floor heating pipe, snap close piece and snap close piece once on one.It is inner that each described heat-conducting medium thing laterally is positioned at described floor body, and an end and said floor heating pipe contact.Described upward snap close piece is positioned at a side of said floor body; Defined the last support chamber of an epirelief; Described down snap close piece is positioned at the opposite side of said floor body, has defined a recessed following support chamber, and wherein said floor heating pipe lies in a horizontal plane in the described support chamber down.When the following snap close piece on the last snap close piece on a floor and adjacent floor is meshed; Described upward support chamber is complementary with following support chamber and has formed a container cavity; Described floor heating pipe is contained in wherein, thereby described floor heating pipe is embedded in the two adjacent said floors, has not only reduced the thickness of laying floor; And heat is directly transferred to each described heat-conducting medium thing from said floor heating pipe, reduced heat waste.Though this scheme has been improved flooring structure to a certain extent, it is not good still to exist the heat laser propagation effect, and heat is easy to loss, heat even inadequately, technical problem such as the processing and manufacturing difficulty is big.
Summary of the invention
The objective of the invention is provides a kind of reasonable in design, simple in structure to the problems referred to above, and the heat laser propagation effect is good, the heating floor of homogeneous heating.
For achieving the above object; The present invention has adopted following technical proposal: this heating floor; Comprise substrate; Side at substrate is provided with first syndeton; Opposite side is provided with second syndeton, and second syndeton on first syndeton on the substrate and another substrate of adjacent setting can fasten each other, and when first syndeton and second syndeton fastening, can form the containing cavity of longitudinal extension; It is characterized in that; The front of described substrate is compounded with the decoration dash board, and at substrate with decorate between the dash board and be provided with the heat-conducting medium layer of being processed by Heat Conduction Material, described heat-conducting medium layer comprises the heat-conducting part that is positioned at substrate front side and is arranged on the heat-conducting part both sides and lays respectively at first syndeton and first portion of being heated of portion and second of being heated at the second syndeton place; Described first be heated portion and second portion of being heated pieced together the heating member containing cavity that is positioned at containing cavity and longitudinal extension when described first syndeton and second syndeton fastened, and described heating member is arranged in the heating member containing cavity and heating member can be with heat transferred first portion of being heated of portion and second of being heated when heating.
Because the sidepiece of heat-conducting medium layer is attached to the periphery of heating member, therefore can fully absorbs the heat of heating member, thereby it is passed to the front of substrate.Usually the whole sidepiece of heat-conducting medium layer is identical with the length of heat-conducting medium layer, so heating member can be simultaneously heats the sidepiece of whole heat-conducting medium layer, thereby effectively improves heat transfer efficiency.The heating member here can be the water pipe of the hot water that can circulate, and also can be electrothermal piece, like heating cable etc.First be heated portion and second portion of being heated here can be bent into circular arc, and forms the heating member containing cavity after both amalgamations, to improve heating surface area.The both sides of the heat-conducting medium layer among the present invention all can be heated, so heats is good.
In above-mentioned heating floor, form heat-insulation chamber between described heating member containing cavity and the containing cavity.Owing to be provided with heat-insulation chamber, can reduce heat and distribute, thereby improve the thermal efficiency to base plate bottom or sidepiece.The heat-insulation chamber here can be arranged on the below or the sidepiece of heating member containing cavity.Because the caloric requirement of heating floor is conduction upwards, so heat-insulation chamber can not be arranged on the top of warmware containing cavity usually.
In above-mentioned heating floor, described first be heated portion and the heat-conducting part is connected as a single entity structure, and described second be heated portion and the heat-conducting part is connected as a single entity structure.
In above-mentioned heating floor, described heat-conducting part is that shape and substrate front side adapt and is the plates of integral structure.Therefore, be heated portion and second portion of being heated of the heat-conducting part of this scheme, first is connected as a single entity structure, and can adopt Heat Conduction Material one-body molded and make.
In above-mentioned heating floor; Described heat-conducting part has the pipeline of longitudinal extension towards the one side of substrate; Have the cell body that is used to place above-mentioned pipeline of longitudinal extension on the described substrate, described pipeline is positioned on the center line of heat-conducting part, and another calandria is housed in pipeline.The calandria here can be the water pipe of the hot water that can circulate, and also can be electrothermal piece, like heating cable etc.Usually, adopt electrothermal piece to be advisable.
As another kind of scheme, in above-mentioned heating floor, described heat-conducting part is put together by first plates and second plates of split setting, and the amalgamation seam of described first plates and second plates is positioned on the center line of heat-conducting part.
In above-mentioned heating floor, a pipeline with longitudinal extension is arranged in described first plates and second plates, another has the carrier that is positioned at said pipeline periphery; Have the cell body that is used to place above-mentioned carrier and pipeline of longitudinal extension on the described substrate, described pipeline is positioned on the center line of heat-conducting part, and another calandria is housed in pipeline.
The calandria here can be the water pipe of the hot water that can circulate, and also can be electrothermal piece, like heating cable etc.Usually, adopt electrothermal piece to be advisable.
In above-mentioned heating floor; Described first syndeton and second syndeton have concavo-convex joint portion respectively; On first syndeton, have horizontally disposed supporting plane, described first is heated has gripper shoe in the portion, and described gripper shoe is arranged on the supporting plane.Owing to gripper shoe and supporting plane are set, can effectively improve heat-conducting medium layer mounting stability.
In above-mentioned heating floor, pass through adhesive together between described substrate, heat-conducting medium layer and the decoration dash board, and on the heat-conducting medium layer, have the through hole that some confession adhesives charge into.
In above-mentioned heating floor; Described substrate is provided with the passage of some longitudinal extensions; One side, first Mosaic face of described decoration dash board; Opposite side is provided with second Mosaic face, and another second Mosaic face of decorating on dash board of first Mosaic face of a decoration dash board and adjacent setting can coincide each other.First Mosaic face here and second Mosaic face can for face directly, structure such as inclined-plane, male and fomale(M&F).
Compared with prior art, the advantage of this heating floor is: 1, reasonable in design, simple in structure, the heat bang path is short, and heat-transfer effect is good, and thermal losses is few.2, be easy to processing and manufacturing, be difficult for producing be full of cracks, mechanical strength is high, and assembly unit is easy to maintenance.
Description of drawings
Fig. 1 is the structural representation of embodiment 1 provided by the invention.
Fig. 2 is the perspective view of heat-conducting medium layer among the embodiment 1 provided by the invention.
Fig. 3 is the bonding state structural representation of embodiment 1 provided by the invention.
Fig. 4 is the perspective view of heat-conducting medium layer among the embodiment 2 provided by the invention.
Fig. 5 is the side-looking structural representation of embodiment 2 provided by the invention.
Fig. 6 is the perspective view of heat-conducting medium layer among the embodiment 3 provided by the invention.
Fig. 7 is the side-looking structural representation of heat-conducting medium layer among the embodiment 4 provided by the invention.
Fig. 8 is the side-looking structural representation of embodiment 4 provided by the invention.
Fig. 9 is the side-looking structural representation of heat-conducting medium layer among the embodiment 5 provided by the invention.
Figure 10 is the bonding state structural representation of embodiment 6 provided by the invention.
Among the figure, substrate 1, joint portion 10, first syndeton 11, supporting plane 11a, second syndeton 12, containing cavity 13, heat-insulation chamber 14, passage 15, cell body 16, decorate dash board 2, heat-conducting medium layer 3, heat-conducting part 30, first plates 301, second plates 302, first be heated portion 31, gripper shoe 31a, second be heated portion 32, heating member containing cavity 33, pipeline 34, carrier 35, through hole 36, heating member 4.
The specific embodiment
Embodiment 1:
As shown in figs. 1 and 3, this heating floor comprises substrate 1, is provided with first syndeton 11 in a side of substrate 1, and opposite side is provided with second syndeton 12.First syndeton 11 and second syndeton 12 have concavo-convex joint portion 10 respectively.Second syndeton 12 on first syndeton 11 on one substrate 1 and another substrate 1 of adjacent setting can fasten each other, and when first syndeton 11 and second syndeton, 12 fastenings, can form the containing cavity 13 of longitudinal extension.The front of substrate 1 is compounded with decorates dash board 2, between substrate 1 and decoration dash board 2, is provided with the heat-conducting medium layer of being processed by Heat Conduction Material 3.The heating member 4 of the containing cavity 13 interior longitudinal extensions of can packing into.The sidepiece that the both sides of heat-conducting medium layer 3 lay respectively at first syndeton 11 and second syndeton, 12 places and heat-conducting medium layer 3 can be attached to the periphery of heating member 4.Pass through adhesive together between substrate 1, heat-conducting medium layer 3 and the decoration dash board 2, and on heat-conducting medium layer 3, have the through hole 36 that some confession adhesives charge into.On first syndeton 11, have horizontally disposed supporting plane 11a, first is heated has gripper shoe 31a in the portion 31, and described gripper shoe 31a is arranged on the supporting plane 11a.On substrate 1, be provided with the passage 15 of some longitudinal extensions.Decorate a side first Mosaic face of dash board 2, opposite side is provided with second Mosaic face, and another second Mosaic face of decorating on dash board 2 of first Mosaic face of a decoration dash board 2 and adjacent setting can coincide each other.First Mosaic face here and second Mosaic face can for face directly, structure such as inclined-plane, male and fomale(M&F).In the present embodiment, first Mosaic face and second Mosaic face are the inclined-plane.
More particularly, heat-conducting medium layer 3 comprises and is positioned at the positive heat-conducting part of substrate 1 30 and is arranged on heat-conducting part 30 both sides and lays respectively at first syndeton 11 and first portion 32 of being heated of portion 31 and second of being heated at second syndeton, 12 places.First portion 32 of being heated of portion 31 and second of being heated pieced together heating member containing cavity 33 when first syndeton 11 and second syndeton 12 fastened, and heating member 4 is arranged in the heating member containing cavity 33.Form heat-insulation chamber 14 between heating member containing cavity 33 and the containing cavity 13.The calandria 4 here can be the water pipe of the hot water that can circulate, and also can be electrothermal piece, like heating cable etc.The heat-insulation chamber 14 here can be arranged on the below or the sidepiece of heating member containing cavity 33.Because the caloric requirement of heating floor is conduction upwards, so heat-insulation chamber 14 can not be arranged on the top of warmware containing cavity 33 usually.In the present embodiment, heat-insulation chamber 14 is arranged on the below of heating member containing cavity 33.
As shown in Figure 2, first the be heated portion 31 is connected as a single entity structure with heat-conducting part 30, and second portion 32 of being heated is connected as a single entity structure with heat-conducting part 30.Heat-conducting part 30 is that shape and substrate 1 front adapt and is the plates of integral structure.Promptly first portion 31, second portion 32 and the heat-conducting part 30 that be heated that be heated here is integral structure, can adopt that Heat Conduction Material is one-body molded to be made.
As shown in figs. 1 and 3, in the present embodiment, the joint portion 10 at first syndeton, 11 places is the F type, and the joint portion 10 at the joint portion 10 at second syndeton, 12 places and first syndeton, 11 places matches.
Embodiment 2:
Shown in Figure 4 and 5, in the present embodiment, heat-conducting part 30 has the pipeline 34 of longitudinal extension towards the one side of substrate 1, has the cell body 16 that is used to place above-mentioned pipeline 34 of longitudinal extension on the substrate 1.Pipeline 34 is positioned on the center line of heat-conducting part 30, and another calandria 4 is housed in pipeline 34.All the other all with embodiment 1 roughly the same, do not do and give unnecessary details.
Embodiment 3:
As shown in Figure 6, in the present embodiment, heat-conducting part 30 is put together by first plates 301 and second plates 302 of split setting.The amalgamation seam of first plates 301 and second plates 302 is positioned on the center line of heat-conducting part 30.All the other all with embodiment 1 roughly the same, do not do and give unnecessary details.
Embodiment 4:
Shown in Fig. 7 and 8, in the present embodiment, have on first plates 301 to have on pipeline 34, the second plates 302 of longitudinal extension and be positioned at the peripheral carrier 35 of said pipeline 34.Have the cell body 16 that is used to place above-mentioned carrier 35 and pipeline 34 of longitudinal extension on the substrate 1.Pipeline 34 is positioned on the center line of heat-conducting part 30, and another calandria 4 is housed in pipeline 34.All the other all with embodiment 1 roughly the same, do not do and give unnecessary details.
Embodiment 5:
As shown in Figure 9, in the present embodiment, have the pipeline 34 that has longitudinal extension on carrier 35, the second plates 302 of longitudinal extension on first plates 301.That is, pipeline 34 and carrier 35 place-exchange once, all the other all with embodiment 4 roughly the same, this paper does not do and gives unnecessary details.
Embodiment 6:
Shown in figure 10, in the present embodiment, heat-insulation chamber 14 is arranged on the sidepiece of heating member containing cavity 33.In the present embodiment, the joint portion 10 at first syndeton, 11 places is the L type, and the joint portion 10 at the joint portion 10 at second syndeton, 12 places and first syndeton, 11 places matches.All the other all with embodiment 1 roughly the same, this paper does not do and gives unnecessary details.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although this paper has used substrate 1, joint portion 10, first syndeton 11, supporting plane 11a, second syndeton 12, containing cavity 13, heat-insulation chamber 14, passage 15, cell body 16, decorates dash board 2, heat-conducting medium layer 3, heat-conducting part 30, first plates 301, second plates 302, first are heated portion 31, gripper shoe 31a, second is heated terms such as portion 32, heating member containing cavity 33, pipeline 34, carrier 35, through hole 36, heating member 4 morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain essence of the present invention more easily; It all is contrary with spirit of the present invention being construed to any additional restriction to them.
Claims (10)
1. heating floor; Comprise substrate (1); Side at substrate (1) is provided with first syndeton (11); Opposite side is provided with second syndeton (12); Second syndeton (12) on first syndeton (11) on one substrate (1) and another substrate (1) of adjacent setting can fasten each other; And when first syndeton (11) and second syndeton (12) fastening, can form the containing cavity (13) of longitudinal extension; It is characterized in that; The front of described substrate (1) is compounded with decorates dash board (2), is provided with the heat-conducting medium layer of being processed by Heat Conduction Material (3) at substrate (1) with decorating between the dash board (2), and described heat-conducting medium layer (3) comprises the heat-conducting part (30) that is positioned at substrate (1) front and is arranged on heat-conducting part (30) both sides and lays respectively at first syndeton (11) and second syndeton (12) is located first portion (32) of being heated of portion (31) and second of being heated; Described first portion (32) of being heated of portion (31) and second of being heated pieced together the heating member containing cavity (33) that is positioned at containing cavity (13) and longitudinal extension when described first syndeton (11) and second syndeton (12) fastened, and heating member (4) is arranged on the interior and heating member (4) of heating member containing cavity (33) can be with heat transferred first portion (32) of being heated of portion (31) and second of being heated when heating.
2. heating floor according to claim 1 is characterized in that, forms heat-insulation chamber (14) between described heating member containing cavity (33) and the containing cavity (13).
3. heating floor according to claim 1 and 2 is characterized in that, described first be heated portion (31) and the heat-conducting part (30) is connected as a single entity structure, and described second portion (32) of being heated is connected as a single entity structure with heat-conducting part (30).
4. heating floor according to claim 3 is characterized in that, described heat-conducting part (30) is that shape and substrate (1) front adapt and is the plates of integral structure.
5. heating floor according to claim 4; It is characterized in that; Described heat-conducting part (30) has the pipeline (34) of longitudinal extension towards the one side of substrate (1); Have the cell body that is used to place above-mentioned pipeline (34) (16) of longitudinal extension on the described substrate (1), described pipeline (34) is positioned on the center line of heat-conducting part (30), and another heating member (4) is housed in pipeline (34).
6. heating floor according to claim 3; It is characterized in that; Described heat-conducting part (30) is put together by first plates (301) and second plates (302) that split is provided with, and the amalgamation seam of described first plates (301) and second plates (302) is positioned on the center line of heat-conducting part (30).
7. heating floor according to claim 6 is characterized in that, a pipeline (34) with longitudinal extension is arranged in described first plates (301) and second plates (302), and another has the carrier (35) that is positioned at said pipeline (34) periphery; Have the cell body (16) that is used to place above-mentioned carrier (35) and pipeline (34) of longitudinal extension on the described substrate (1), described pipeline (34) is positioned on the center line of heat-conducting part (30), and another heating member (4) is housed in pipeline (34).
8. heating floor according to claim 3; It is characterized in that; Described first syndeton (11) and second syndeton (12) have concavo-convex joint portion (10) respectively; On first syndeton (11), have horizontally disposed supporting plane (11a), described first is heated has gripper shoe (31a) in the portion (31), and described gripper shoe (31a) is arranged on the supporting plane (11a).
9. heating floor according to claim 1 and 2; It is characterized in that; Pass through adhesive together between described substrate (1), heat-conducting medium layer (3) and the decoration dash board (2), and on heat-conducting medium layer (3), have the through hole (36) that some confession adhesives charge into.
10. heating floor according to claim 1 and 2; It is characterized in that; Described substrate (1) is provided with the passage (15) of some longitudinal extensions; One side of described decoration dash board (2) is provided with first Mosaic face, and opposite side is provided with second Mosaic face, and second Mosaic face that another of first Mosaic face of a decoration dash board (2) and adjacent setting decorated on dash board (2) can coincide each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100637887A CN102174851B (en) | 2010-11-22 | 2011-03-08 | Floorboard for floor heating |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020621240 | 2010-11-22 | ||
| CN201020621240.0 | 2010-11-22 | ||
| CN2011100637887A CN102174851B (en) | 2010-11-22 | 2011-03-08 | Floorboard for floor heating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102174851A CN102174851A (en) | 2011-09-07 |
| CN102174851B true CN102174851B (en) | 2012-11-07 |
Family
ID=44518072
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200703390U Expired - Lifetime CN201972365U (en) | 2010-11-22 | 2011-03-08 | Geothermal floor |
| CN2011100637887A Expired - Fee Related CN102174851B (en) | 2010-11-22 | 2011-03-08 | Floorboard for floor heating |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200703390U Expired - Lifetime CN201972365U (en) | 2010-11-22 | 2011-03-08 | Geothermal floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN201972365U (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201972365U (en) * | 2010-11-22 | 2011-09-14 | 李渊 | Geothermal floor |
| CN102425292A (en) * | 2011-11-23 | 2012-04-25 | 李渊 | Novel heating system |
| CN103711282B (en) * | 2013-12-11 | 2016-06-15 | 安徽圣源橡塑科技有限公司 | A kind of functional form integrated form high polymer alloy ground heating floor and preparation method thereof |
| CN105421718B (en) * | 2015-12-09 | 2017-07-11 | 安徽扬子地板股份有限公司 | Electric heating floor and its manufacture method and installation method |
| CN106836713A (en) * | 2017-01-23 | 2017-06-13 | 姜传鉷 | A kind of substrate on spontaneous heating environment-friendly type floor, floor, metal composite floor and installation method |
| CN108532871B (en) * | 2018-04-16 | 2021-04-02 | 淄博锦昊陶瓷有限公司 | Electric heating ceramic tile with prevent function of splitting |
| WO2020165821A1 (en) * | 2019-02-14 | 2020-08-20 | Zhejiang Lexiang Aluminium Industry Co., Ltd | Heating panel and heating system therefrom |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19646812A1 (en) * | 1996-11-13 | 1998-06-04 | Alwa Gmbh | Wall heating panel for living areas |
| CN101298799A (en) * | 2008-07-03 | 2008-11-05 | 北京建筑工程学院 | Dry-type hot water heating floor |
| CN101509311A (en) * | 2009-01-06 | 2009-08-19 | 上海溢邦装饰建材有限公司 | Internal heat conducting structure floor |
| CN101532332A (en) * | 2009-03-18 | 2009-09-16 | 上海溢邦装饰建材有限公司 | Floor with internal heat-conducting structure |
| CN101858134A (en) * | 2010-06-10 | 2010-10-13 | 李增清 | Composite veneer |
| CN201972365U (en) * | 2010-11-22 | 2011-09-14 | 李渊 | Geothermal floor |
-
2011
- 2011-03-08 CN CN2011200703390U patent/CN201972365U/en not_active Expired - Lifetime
- 2011-03-08 CN CN2011100637887A patent/CN102174851B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19646812A1 (en) * | 1996-11-13 | 1998-06-04 | Alwa Gmbh | Wall heating panel for living areas |
| CN101298799A (en) * | 2008-07-03 | 2008-11-05 | 北京建筑工程学院 | Dry-type hot water heating floor |
| CN101509311A (en) * | 2009-01-06 | 2009-08-19 | 上海溢邦装饰建材有限公司 | Internal heat conducting structure floor |
| CN101532332A (en) * | 2009-03-18 | 2009-09-16 | 上海溢邦装饰建材有限公司 | Floor with internal heat-conducting structure |
| CN101858134A (en) * | 2010-06-10 | 2010-10-13 | 李增清 | Composite veneer |
| CN201972365U (en) * | 2010-11-22 | 2011-09-14 | 李渊 | Geothermal floor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN201972365U (en) | 2011-09-14 |
| CN102174851A (en) | 2011-09-07 |
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