CN102173274B - Application process for non-conducting decorative membranes - Google Patents
Application process for non-conducting decorative membranes Download PDFInfo
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- CN102173274B CN102173274B CN 201010616971 CN201010616971A CN102173274B CN 102173274 B CN102173274 B CN 102173274B CN 201010616971 CN201010616971 CN 201010616971 CN 201010616971 A CN201010616971 A CN 201010616971A CN 102173274 B CN102173274 B CN 102173274B
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Abstract
The invention discloses an application process for non-conducting decorative membranes, which comprises the following steps: 1, plating a layer of silicon oxide (thickness: 80-120nm) on a substrate by way of vacuum plasma plating; 2, plating a layer of titanium oxide (thickness: 500-1200 nm) on the surface of the silicon oxide obtained in the step 1 by way of vacuum plasma plating; 3, plating a layer of zirconium oxide (thickness: 150-1800nm) on the surface of the titanium oxide obtained in the step 2 by way of vacuum plasma plating; 4, plating a layer of titanium oxide (thickness: 500-1200nm) on the surface of the zirconium oxide obtained in the step 3 by way of vacuum plasma plating; and 5, repeating the steps 3 and 4 according to the needs on brightness or color. Compared with the traditional application process for decorative membranes, in the application process disclosed by the invention, the application of different non-conducting membranes is realized through depositing silicon oxide, titanium oxide and zirconium oxide on the substrates made of different materials and arranging different sequential membrane layers by using the vacuum plasma film-plating technology, therefore, the application process disclosed by the invention has the characteristics of strong operability, flexibly, reliably and strong adaptability, and the like.
Description
Technical field
The present invention relates to the technique for applying of decorating film technical field, particularly a kind of non-conductive decorating film.
Background technology
Decorating film is widely used on various electronic products such as mobile phone, electronic game machine etc. and various lamp decorations, casket, ornament etc., with decorative effect and the visual effect that improves it.
The application process of existing decorating film is generally first to plate one deck tin or aluminium on offset plate, then adds the color diagram layer, carries out recently UV and crosses glue.Because tin and aluminium are all conductive materials, easily produce static; Coating color is limited, and color is abundant not; It is large that UV crosses the glue cost, complex process, and also decorating film easily comes off.
Therefore, the technique for applying of existing decorating film can not satisfy modern society's production to the requirement of decorating film.
Summary of the invention
The objective of the invention is by a kind of brand-new technique for applying, utilizing this technique decorating film can be arranged with distinctive order is applied on metal, glass, PC, Pmma and PET etc., colourful change color is arranged and dazzle color effect and decorating film has non-conductive, difficult drop-off, the characteristics such as colourity is abundant.
For achieving the above object, the technical solution adopted in the present invention is: a kind of technique for applying of non-conductive decorating film, and it comprises the following steps:
The first, utilize the vacuum plasma plating mode at plating one deck 80-120nm silica on substrate;
The second, utilize plating one deck 500-1200nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Three, utilize the scandium oxide of plating one deck 150-1800nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Four, utilize plating one deck 500-1200nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
The 5th, according to the needs of color or brightness, repeating step three and step 4.
Compare with traditional decorating film technique for applying, the present invention utilizes the vacuum plasma coating technique cvd silicon oxide, titanium oxide and scandium oxide on the substrate of dissimilar material and different order rete thereof to be arranged to realize the application of non-conductive film, has the characteristics such as strong operability, flexibility and reliability, strong adaptability.
The specific embodiment
The below provides example, and the present invention is described in further detail:
Embodiment 1: the technique for applying of a kind of non-conductive decorating film of the present invention, and it comprises the following steps:
The first, utilize the vacuum plasma plating mode at plating one deck 80nm silica on substrate;
The second, utilize plating one deck 500nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Three, utilize the scandium oxide of plating one deck 500nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Four, utilize plating one deck 500nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step.
Embodiment 2: the technique for applying of a kind of non-conductive decorating film of the present invention, and it comprises the following steps:
The first, utilize the vacuum plasma plating mode at plating one deck 120nm silica on substrate;
The second, utilize plating one deck 600nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Three, utilize the scandium oxide of plating one deck 700nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Four, utilize plating one deck 500nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Five, utilize the scandium oxide of plating one deck 600nm on the surface of vacuum plasma plating mode titanium oxide in previous step.
Embodiment 3: the technique for applying of a kind of non-conductive decorating film of the present invention, and it comprises the following steps:
The first, utilize the vacuum plasma plating mode at plating one deck 100nm silica on substrate;
The second, utilize plating one deck 1000nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Three, utilize the scandium oxide of plating one deck 1200nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Four, utilize plating one deck 500nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Five, utilize the scandium oxide of plating one deck 1500nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Six, utilize plating one deck 1000nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Seven, utilize the scandium oxide of plating one deck 1700nm on the surface of vacuum plasma plating mode titanium oxide in previous step.
As the method for above-mentioned embodiment, adopt the technique for applying of other non-conductive decorating films that obtain with the same or similar method of this embodiment, all within protection domain of the present invention.
Claims (1)
1. the technique for applying of a non-conductive decorating film, it is characterized in that: it comprises the following steps:
The first, utilize the vacuum plasma plating mode at plating one deck 80-120nm silica on substrate;
The second, utilize plating one deck 500-1200nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
Three, utilize the scandium oxide of plating one deck 150-1800nm on the surface of vacuum plasma plating mode titanium oxide in previous step;
Four, utilize plating one deck 500-1200nm titanium oxide on the surface of vacuum plasma plating mode silica in previous step;
The 5th, according to the needs of color or brightness, repeating step three and step 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010616971 CN102173274B (en) | 2010-12-31 | 2010-12-31 | Application process for non-conducting decorative membranes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010616971 CN102173274B (en) | 2010-12-31 | 2010-12-31 | Application process for non-conducting decorative membranes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102173274A CN102173274A (en) | 2011-09-07 |
| CN102173274B true CN102173274B (en) | 2013-05-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010616971 Expired - Fee Related CN102173274B (en) | 2010-12-31 | 2010-12-31 | Application process for non-conducting decorative membranes |
Country Status (1)
| Country | Link |
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| CN (1) | CN102173274B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103129034B (en) * | 2013-01-18 | 2015-11-18 | 肇庆市双石金属实业有限公司 | A kind of Thermochromic decorative layer of iodide doping of flexibility |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1548403A (en) * | 2003-05-09 | 2004-11-24 | 山 汪 | Protecting composite membrane and its prepn |
| DE102005053262A1 (en) * | 2005-11-08 | 2007-05-10 | Weinert, Hilmar, Dipl.-Ing. | Strip-form material with porous coating, useful e.g. as catalyst or in electrophoresis, is obtained by evaporating mixed layer of insoluble and soluble materials onto substrate and dissolving out soluble material |
| CN1974235A (en) * | 2006-12-27 | 2007-06-06 | 淮杰企业有限公司 | Vacuum coating apparatus, method and product with laser pattern formed on substrate surface |
| CN101423926A (en) * | 2008-06-13 | 2009-05-06 | 东莞劲胜精密组件股份有限公司 | Non-conductive film vacuum coating process |
| CN101556344A (en) * | 2008-04-11 | 2009-10-14 | 鸿富锦精密工业（深圳）有限公司 | Optical element |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2725390B2 (en) * | 1989-07-28 | 1998-03-11 | 日立電線株式会社 | Copper wiring ceramic substrate and manufacturing method |
| US7153594B2 (en) * | 2002-12-23 | 2006-12-26 | Höganäs Ab | Iron-based powder |
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2010
- 2010-12-31 CN CN 201010616971 patent/CN102173274B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1548403A (en) * | 2003-05-09 | 2004-11-24 | 山 汪 | Protecting composite membrane and its prepn |
| DE102005053262A1 (en) * | 2005-11-08 | 2007-05-10 | Weinert, Hilmar, Dipl.-Ing. | Strip-form material with porous coating, useful e.g. as catalyst or in electrophoresis, is obtained by evaporating mixed layer of insoluble and soluble materials onto substrate and dissolving out soluble material |
| CN1974235A (en) * | 2006-12-27 | 2007-06-06 | 淮杰企业有限公司 | Vacuum coating apparatus, method and product with laser pattern formed on substrate surface |
| CN101556344A (en) * | 2008-04-11 | 2009-10-14 | 鸿富锦精密工业（深圳）有限公司 | Optical element |
| CN101423926A (en) * | 2008-06-13 | 2009-05-06 | 东莞劲胜精密组件股份有限公司 | Non-conductive film vacuum coating process |
Non-Patent Citations (1)
| Title |
|---|
| JP平3-60192A 1991.03.15 |
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| CN102173274A (en) | 2011-09-07 |
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Granted publication date: 20130522 Termination date: 20131231 |