CN102169159A

CN102169159A - Point measurement device with strain gauge

Info

Publication number: CN102169159A
Application number: CN2011100005317A
Authority: CN
Inventors: 陈正泰; 陈志伟; 戴谷芳; 李志宏
Original assignee: HAUMAN TECHNOLOGIES CORP
Current assignee: HAUMAN TECHNOLOGIES CORP
Priority date: 2011-01-04
Filing date: 2011-01-04
Publication date: 2011-08-31

Abstract

The invention relates to a point measurement device with a strain gauge. The point measurement device comprises a swing arm, a probe-clamping part, a control unit and a probe; the swing arm can receive external power; the strain gauge is arranged on the swing arm; when the swing arm is deformed, a resistance value of the strain gauge is changed; moreover, one end of the probe-clamping part is fixed on the swing arm, and the other end of the probe-clamping part clamps the probe; the control unit is electrically connected with the strain gauge and capable of detecting a variable of the resistance value of the strain gauge and converting the variable of the resistance value into a weight unit (such as gram) according to a contrast table so as to execute a corresponding control procedure; therefore, the control unit can obtain and control a down pressure of the probe to a wafer according to the measured variable of the resistance value of the strain gauge.

Description

The spot measurement device of tool strain gauge

Technical field

The invention relates to spot measurement device, refer to a kind of spot measurement device that has additional strain gauge on this spot measurement device especially, changing the characteristic of self-resistance amount by this strain gauge because of when distortion, compute goes out this spot measurement device to pressure that wafer produced accurately.

Background technology

In recent years; flourish along with high-tech industry; the application product of integrated circuit (integrated circuit) is popularized gradually; because it mainly designs on the surface of semiconductor crystal wafer; so also impel the technology of wafer manufacturing process (Wafer Process) constantly to progress greatly; research according to the iSuppli of research institution is pointed out; in global information; under the demand of communication and consumption electronic products significantly draws high; cause the rate of capacity utilization of wafer factory also constantly to climb; cause the demand of the Silicon Wafer of semiconductor industry to begin to increase; iSuppli estimates; the total shipment area of the Silicon Wafer of semiconductor industry will increase to 8,200,000,000 squares of English Foot in 2010 from 7,000,000,000 squares of English Foot in 2009; year rate of growth reaches 17.4%; therefore; for effectively promoting the yield rate of dispatching from the factory of product wafer; to avoid the bad of follow-up associated electrical product; the dealer is after producing wafer; usually can survey device by some electric current is sent to LED crystal grain on the wafer exactly; and the light characteristic (as: wavelength that is sent by the LED crystal grain of measuring on this wafer; luminous intensity; color etc.); judge the quality bills of materials of wafer, with the yield rate of dispatching from the factory of energy keyholed back plate wafer.

Now be example only with regard to the hardware configuration of traditional spot measurement device, describe, see also shown in Figure 1, this spot measurement device 1 mainly comprises a base 11, one swing arm 12 and a probe 13, wherein this base 11 is slightly c-shaped, and can receive a foreign current, the upper limb of its contiguous end in bottom is provided with one first conductive junction point 111, the lower edge of the contiguous end in its top then is installed with a flexible member 113 (as: spring), in addition, one end of this swing arm 12 is provided with a probe clamping part 14, its other end then extends towards the direction of the other end of this base 11, and be articulated on the other end of this base 11, to form an electrical connection, again, the lower edge of these swing arm 12 contiguous other ends still is provided with one second conductive junction point 122, its other end that can pass through to articulate is as the strong point, swing up and down, make this second conductive junction point 122 be separated from each other or mutual butt with this first conductive junction point 111, to form off state or short-circuit condition at this second

conductive junction point

122 and 111 of this first conductive junction points, again, the end face of this swing arm 12 is still compressed by an end of this flexible member 113, make this second conductive junction point 122 normally butt to this first conductive junction point 111, and form an electric loop, moreover, this probe 13 is to be clamped on this probe clamping part 14, and be electrically connected with this base 11, so, when this spot measurement device 1 near a wafer 15, and with this probe 13 when the end face of this wafer 15 compresses, this probe 13 will be subjected to the reacting force influence that this wafer 15 transmits, and this probe clamping part 14 and this swing arm 12 are produced a thrust that makes progress, when these probe 13 suffered reacting forces overcome this flexible member 113 and bestow the downward pressure of this swing arm 12, one end of this swing arm 12 promptly can be towards the direction displacement away from this wafer 15, and then this second conductive junction point 122 is separated with 111 of this first conductive junction points, at this moment, the foreign current that this base 11 is received, promptly can pass through this swing arm 12 in regular turn, this probe clamping part 14 and this probe 13, be sent to the LED crystal grain on this wafer 15, make this LED crystal grain luminous because of receiving electric current, and the light source that sends can be by 17 receptions of an integrating sphere (integrating sphere), can judge the quality good and the bad of this wafer 15 by measuring the light characteristic that this LED crystal grain is sent for the dealer.

See also shown in Figure 1 again; aforesaid traditional spot measurement device 1; still have many disappearances in the use; at first; position for firm this probe 13; avoid it on the process of wafer 15,, and fail positively to drive this swing arm 12 because of stressed rotation voluntarily; so; it is comparatively thick and heavy that the dealer can design this probe clamping part 14 usually, to strengthen the clamping area of this probe clamping part 14, simultaneously; also can increase the length of this probe 13; make this probe clamping part 14 can firmly clamp this probe 13, thus, the overall volume of this spot measurement device 1 is huge with causing; except spot measurement device 1 is reached the slimming; more can make the distance of 15 of this integrating sphere 17 and this wafers far away, cause the measurement error value of this integrating sphere 17 bigger, influence the yield rate of dispatching from the factory of wafer 15.In addition; traditional spot measurement device 1 is the strength that presses down that must control this probe 13 accurately; because; if it is excessive to press down strength; then wafer 15 just is not easy to promote to move on this probe 13; to cause the surface distress of the LED crystal grain of this wafer 15, and probe 13 also weares and teares easily, otherwise; if it is too small to press down strength; then this probe 13 and the surface of the LED crystal grain of this wafer 15 can contact not good, the accuracy that influence is measured, present; the dealer is usually by adjusting the compressing power of this flexible member 113; reach the strength that presses down of this probe 13 of control, but because aforementioned adjustment operation, by manually finishing; so error that regular meeting adjusts; what cause this probe 13 presses down strength not as dealer's expection, badly influences dealer's production routine, and has significantly reduced the detecting sensitivity of this spot measurement device 1.

In sum as can be known, because traditional spot measurement device, because of the mode of employing mechanical switch, and must adjust flexible member, to control the strength that presses down of this probe with manpower, make its design and do not meet dealer's current demand trend, therefore, how at traditional disappearance that spot measurement device had, improve, with the detecting sensitivity and the precision of effective lifting spot measurement device, promptly become the important topic that relevant dealer institute desire is inquired into.

Summary of the invention

Because traditional spot measurement device is because of the start design of mechanical switch, and must adopt the artificial compressing power of adjusting flexible member, cause taking place easily the problem of error, therefore, the inventor is through the permanent research and experiment of making great efforts, and development and Design goes out the spot measurement device of a kind of tool strain gauge of the present invention finally, in the hope of by appearance of the present invention, and can provide a kind of spot measurement device of brand-new structure, and effectively solve original problem.

A purpose of the present invention, provide a kind of spot measurement device of tool strain gauge, comprise a swing arm, one strain gauge, one probe clamping part, one control module (as: computing machine) and a probe, wherein an end of this swing arm is fixed on the stiff end of a device, and can receive an external power source, its other end then is connected on the end of this probe clamping part, this swing arm is provided with this strain gauge, when this swing arm produces deflection, can make the resistance value of this strain gauge change, in addition, this control module is electrically connected to this strain gauge, and can detect the resistance change amount of this strain gauge, and with the comparison list of this resistance change amount according to actual measurement acquisition in advance, be converted to a unit of weight (as: gram), and shown, or carry out analysis and judgement according to this, moreover, this probe is clamped and fastened in the other end of this probe clamping part, so, when the probe of this spot measurement device compresses towards the end face of this wafer, when this wafer being produced amount of pressure, this wafer can produce last one acting force that makes progress to this probe clamping part, force this probe clamping part to drive this swing arm towards direction distortion away from this wafer, and then make strain gauge flexural deformation in this swing arm, make the resistance change amount of this control module energy according to this strain gauge that measures, learn and control the press down strength of this probe, can significantly promote the detecting sensitivity and the precision of this spot measurement device to this wafer.

Another object of the present invention, be that this probe comprises a kink and a horizontal part, and this kink is to form one less than 145 degree and greater than 90 angles of spending with this horizontal part, one end of this horizontal part can be clamped and fastened in the other end of this probe clamping part, and this kink can be exposed to outside this probe clamping part, so, and the overall volume that can significantly reduce this spot measurement device, and make the integrating sphere can more approaching wafer to be detected, to improve the accuracy that detects.

Description of drawings

Fig. 1 is traditional spot measurement device synoptic diagram;

Fig. 2 is a synoptic diagram of spot measurement device of the present invention; And

Fig. 3 is another synoptic diagram of spot measurement device of the present invention.

Drawing reference numeral

Spot measurement device ... 2

Swing arm ... 21

Strain gauge ... 211

The probe clamping part ... 22

Probe ... 23

Kink ... 231

Horizontal part ... 232

Control module ... 24

Wafer ... 30

Stiff end ... 31

Motor ... 32

Carrier ... 33

Angle ... θ

Embodiment

Can be for just your juror to the object of the invention, technical characterictic and effect thereof, do further understanding and understand, for the embodiment conjunction with figs., be described in detail as follows now:

Because traditional spot measurement device is the design that adopts mechanical switch, thereby the problems of having derived, so the inventor is the hardware support body that has redesigned a no mechanical switch, solving the traditional problem that the dealer is faced, and still can reach the outward appearance of slimming.For this reason, the inventor has used " strain gauge " this element especially, look into, strain gauge (Strain Gage) is called strainometer again, its principle is to utilize the variation of the resistance value of the plain conductor in it, measures its dependent variable, mainly can be along with the change of length because of resistance value, and the variation that is directly proportional, therefore, when strain gauge is pasted on the test body, this strain gauge and this test body can be considered as one, and along with this test body is bent when distortion, its length also can change thereupon, causes the resistance value of this strain gauge to change, so, the inventor is bonded to aforesaid strain gauge on the spot measurement device, to form a brand-new spot measurement device.

The present invention is a kind of spot measurement device of tool strain gauge, see also shown in Figure 2, in a preferred embodiment of the present invention, this spot measurement device 2 comprises a swing arm 21, one probe clamping part 22, one probe 23 and a control module 24 (as: computing machine), wherein an end of this swing arm 21 is to be fixed on the stiff end 31 of a device, and can receive external power source, with can be during one wafer 30 in test, required power supply is provided, again, the other end of this swing arm 21 then is connected on the end of this probe clamping part 22, and on its end face and the bottom surface, attach respectively and be provided with a strain gauge 211, stressed and when producing deflection, the resistance value of this strain gauge 211 is changed, in this embodiment in this swing arm 21, be that to be respectively equipped with a strain gauge 211 with the end face of this swing arm 21 and bottom surface be example, only, in other embodiments of the invention, also can be only on the wherein one side of swing arm 21, be provided with a strain gauge 211, close first Chen Ming.

See also shown in Figure 2 again, this probe 23 is that conductive material is made, and comprise a kink 231 and a horizontal part 232, wherein an end of this horizontal part 232 is clamped and fastened in the other end of this probe clamping part 22,231 of this kinks can be exposed to outside this probe clamping part 22, and 232 of this kink 231 and this horizontal parts can form one less than 145 degree and greater than 90 angle theta of spending, again, this probe 23 still forms with this swing arm 21 and is electrically connected, can receive the power supply that this swing arm 21 is transmitted, so, when this wafer 30 approaching towards the direction of this probe 23, and after its end face is subjected to the compressing of kink 231 of this probe 23, can receive the power supply that this probe 23 transmits, and form a loop, impel the LED crystal grain on this wafer 30 to give out light, for the quality bills of materials of judging this wafer 30.

Hold, in other embodiments of the invention, this probe clamping part 22 can be integrally formed with this swing arm 21, is provided with but not only be defined as separately.Moreover, see also shown in Figure 2 again, this control module 24 is electrically connected to this strain gauge 211, and can detect the current resistance value of this strain gauge 211, and learn the resistance change amount of this strain gauge 211, therefore, when these wafer 30 these probes 23 of pushing and pressing, and when making this swing arm 21 produce the bending distortion, this control module 24 just can be learnt the resistance change amount of this strain gauge 211, succeed, this control module 24 can be according to the comparison list of actual measurement acquisition in advance, this resistance change amount is converted to a unit of weight (as: gram), wherein, because when the bending distortion upwards takes place in this swing arm 21, himself can desire to return to original state, so can produce a downward restoring force, therefore, this table of comparisons is after the dealer complies with actual measurement in advance, learn when the resistance change amount of this strain gauge 211 is a certain numerical value, the correspondence that this swing arm 21 of representative can make this probe 23 produce presses down strength, so, the dealer just can be by the resistance change amount of this strain gauge 211 of detecting, learn that indirectly present this wafer 30 has born the strength that presses down of how much weight, and this wafer 30 born predetermined press down strength after, promptly stop to move of this wafer 30, make the demand that strength can meet the dealer that presses down of this probe 23, and can be not excessive or too small, decapacitation is avoided damaging outside the surface of LED crystal grain of this wafer 30, this probe 23 is contacted well with the surface of the LED crystal grain of this wafer 30, and then reach the effect that presses down strength of this probe 23 of accurate control.

See also Fig. 2 and shown in Figure 3, wherein Fig. 3 is for highlighting the technical characterictic of this case, and deliberately the flexural deformation aspect of swing arm 21 is drawn in exaggeration, and in fact, this swing arm 21 only needs slight deformation, promptly can influence the resistance value of strain gauge 211, close chat earlier bright.For example, suppose that predetermined this probe 23 of dealer only produces the strength that presses down of 10 grams to this wafer 30, when the staff drives a motor 32, and when making this motor 32 drive a carrier 33 towards the direction displacement of this probe 23, be placed in wafer 30 on this carrier 33 promptly can be gradually near the kink 231 of this probe 23, until this wafer 30 by 231 of this kinks against, at this moment, because the resistance change amount of this strain gauge 211, do not reach the numerical value of 10 grams of the table of comparisons as yet, so move on this carrier 33 still can continue, force 30 pairs of these probes 23 of this wafer to apply an acting force that makes progress, and then cause this swing arm 21 that the bending distortion takes place, but simultaneously, this wafer 30 also can bear the strength that presses down that this probe 23 applied, when this swing arm 21 is deformed to a certain degree by bending, and after the resistance change amount of this strain gauge 211 has reached 10 numerical value that restrain of this table of comparisons, this motor 32 promptly can stop to drive this carrier 33, with avoid that this probe 23 applied to press down strength excessive, and damaged the surface of this wafer 30, so, global design by spot measurement device 2 of the present invention, can significantly promote the detecting sensitivity and the precision of this spot measurement device 2 in fact, and can effectively avoid damaging this wafer 30 because of applying the excessive strength that presses down.

This special one carry be, of the present invention some side device can use traditional probe clamping part and probe (promptly not being provided with horizontal part and kink), but not the probe that only is defined in previous embodiment and is disclosed, on the spot measurement device that can be applied to more polynary design, in sum as can be known, spot measurement device of the present invention is the resistance change amount by strain gauge, add automatic control by control module, beginning reaches the press down strength of accurate control probe to wafer, so can avoid as traditional spot measurement device, because of the artificial adjustment error condition that flexible member caused, secondly, because spot measurement device of the present invention does not use the design of mechanical switch, the Therefore, omited setting of flexible member, simultaneously, this probe adopts the design of bending, and the one end is assembled in this probe clamping part, so can significantly dwindle the volume of this spot measurement device, reaching the design of slimming, and make the integrating sphere can more approaching wafer to be detected, increase the accuracy that detects.

The above only is preferred embodiment of the present invention, but the interest field that the present invention advocated; be not limited thereto, by all those skilled in the art, according to the disclosed technology contents of the present invention; can think easily and equivalence change, all should belong to and not break away from protection category of the present invention.

Claims

1. the spot measurement device of a tool strain gauge is characterized in that, the spot measurement device of described tool strain gauge comprises:

One swing arm, one end are fixed on the stiff end of a device, and receive an external power source;

One strain gauge is installed in the described swing arm, and can be along with the deflection of described swing arm the variation of the value of having a resistance;

One probe clamping part, the one end is connected to the other end of described swing arm;

One probe is fixed by described probe clamping part clamping, and is electrically connected with described swing arm; And

One control module is electrically connected to described strain gauge, detects the resistance change amount of described strain gauge, and with described resistance change amount according to comparison list, be converted to a unit of weight, and carry out corresponding handling procedure.

2. the spot measurement device of tool strain gauge as claimed in claim 1 is characterized in that, described probe comprises:

One horizontal part, one end are clamped and fastened in the other end of described probe clamping part; And

One kink forms an angle with described horizontal part, and is exposed to outside the described probe clamping part.

3. the spot measurement device of tool strain gauge as claimed in claim 2 is characterized in that, described angle is less than 145 degree and greater than 90 degree.

4. the spot measurement device of tool strain gauge as claimed in claim 3 is characterized in that, described swing arm and described probe clamping part are one-body molded.