CN102142432B - Focal plane assembly capable of realizing same viewing field splicing - Google Patents
Focal plane assembly capable of realizing same viewing field splicing Download PDFInfo
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- CN102142432B CN102142432B CN201010558175.6A CN201010558175A CN102142432B CN 102142432 B CN102142432 B CN 102142432B CN 201010558175 A CN201010558175 A CN 201010558175A CN 102142432 B CN102142432 B CN 102142432B
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Abstract
The invention discloses a focal plane assembly capable of realizing same viewing field splicing, belonging to the technical field of aerospace optical remote sensors. The focal plane assembly comprises three imaging circuit boards, three photosensitive devices, two reflecting mirrors, two bosses and a structural frame, wherein the three photosensitive devices are respectively positioned on three imaging circuit boards and are distributed on three planes; reflecting mirrors are cross to realize twice reflection and once perpendicular incidence, thereby overcoming the detect that image elements are leaked when a big-shell photosensitive device is spliced by the traditional two-surface layout; and the physical structures of the photosensitive devices or the circuit board can be prevented from mutually interfering on the splicing direction, the photosensitive surfaces of the three photosensitive devices are connected end to end, and parts of regions of the junction are overlapped so as to realize seamless splicing. According to the focal plane assembly, three (which can be expanded to multiple pieces) photosensitive devices, especially three big-shell devices, can be subjected to seamless same viewing field splicing, the size requirement on an imaging circuit is lowered, the performance is improved, the cost is lowered, and the focal plane size is enlarged so as to enlarge the ground coverage width.
Description
Technical field
The present invention relates to a kind ofly, belong to the space flight optical remote sensor technical field with the field stitching focal plane subassembly.
Background technology
Along with the space flight optical remote sensor technology rapid development; Big visual field to optical sensor requires also increasingly high; At present focal plane length has reached the order of magnitude of hundreds of millimeter, because that the size of monolithic sensor devices can not be done is too big, often adopts the method for splicing.All be to be arranged on two planes based on sensor devices on the focal plane subassembly of reflecting surface and circuit board at present.It is generally acknowledged, can realize that seamless prerequisite with field stitching is the length of light-sensitive surface on this stitching direction that physical package size on the sensor devices stitching direction is less than this sensor devices of 2 times at least; Physical package size on the sensor devices stitching direction greater than the light-sensitive surface of this sensor devices of 2 times under the length situation on this stitching direction be difficult to realize seamless with field stitching.Because the influence of sensor devices peripheral circuit and encapsulation; The shell size of device is often bigger; Especially the high sensor devices of integrated level such as CMOS; Since integrated many signal processing circuits and multiple function, package dimension easily greater than the length of 2 times light-sensitive surface, cause using conventional methods can't realize seamless spliced.If adopting the people is the method that reduces package dimension, as pin is cut short, may cause the reduction of electric property, especially under the very high situation of channel frequency.Simultaneously also can bring difficulty to Denso.
Summary of the invention
Technology of the present invention is dealt with problems and is: overcome the deficiency of prior art, provide a kind of with the field stitching focal plane subassembly, the mode that adopts reflecting surface to intersect is arranged in sensor devices on 3 planes, can realize the seamless same field stitching of sensor devices.
Technical solution of the present invention is:
A kind of with the field stitching focal plane subassembly, it is characterized in that: comprise first imaging electronics board, second imaging electronics board, the 3rd imaging electronics board, first sensor devices, second sensor devices, the 3rd sensor devices, first catoptron, second catoptron, first boss, second boss and framework;
Framework is the Square barrel formula structure of an open upper end; Middle part, bottom surface at framework has window; Be provided with respectively to the first projecting inward boss and second boss in the relative both sides of this bottom surface window, first catoptron and second catoptron are separately fixed on second boss and first boss and the angle between first catoptron and second catoptron is 90 degree; In the outside of said bottom surface window, the 3rd imaging electronics board is installed, make light shine in from the top of framework, can directly be radiated on the 3rd sensor devices on the 3rd imaging electronics board through said bottom surface window;
Angle between first catoptron and second boss is 45 degree; And on a side of the right framework of first mirror surface, leave window accordingly; Fixing second imaging electronics board in the outside of this side of described framework; Make light shine from the top of framework, through the reflection of first catoptron, the window that leaves on this side through described framework is radiated on second sensor devices on second imaging electronics board;
Angle between second catoptron and first boss is 45 degree; And on a side of the right framework of second mirror surface, leave window accordingly; Fixing first imaging electronics board in the outside of this side of described framework; Make light shine from the top of framework, through the reflection of second catoptron, the window that leaves on this side through described framework is radiated on first sensor devices on first imaging electronics board;
The distance of first sensor devices to the distance of first catoptron and second sensor devices to second catoptron equate, first sensor devices through first virtual image that catoptron is, second sensor devices through second virtual image that catoptron is and the 3rd sensor devices at grade;
Center line and three sensor devices of the light-sensitive surface of the center line of the light-sensitive surface of first sensor devices through first virtual image that catoptron is, second sensor devices through second virtual image that catoptron is the light-sensitive surface center line on same straight line,
The light-sensitive surface of first sensor devices all has the subregion overlapping to guarantee not leak pixel with the light-sensitive surface of the 3rd sensor devices through the virtual image that light-sensitive surface is through second catoptron of first virtual image that catoptron is and second sensor devices.
Window size on the said framework all greater than the size of the corresponding sensor devices of said window, can not stopped by window to guarantee the light that shines on the sensor devices.
The present invention's beneficial effect compared with prior art is:
(1), uses conventional methods and be difficult to realize three seamless same field stitchings that the present invention can realize the seamless same field stitching of three big shell devices, enlarges the focal plane size, thereby enlarges the ground cover width to one type of specific big shell sensor devices.The present invention includes three imaging electronics board, three sensor devices, two catoptrons, two boss, a framework.Three sensor devices lay respectively on three imaging electronics board, are distributed on three planes of framework, intersect through catoptron and realize two reflections, one direct projection; The shortcoming of having leaked pixel for big shell sensor devices splicing when having overcome traditional two sides layout had both avoided on the stitching direction sensor devices or circuit board on physical arrangement, to interfere with each other, and can guarantee that again the light-sensitive surface of three sensor devices is end to end; And the joint has the subregion overlapping, can realize not leaking pixel, thereby realizes seamless spliced; And two small reflectors that adopt among the present invention only work the light path of turning back, and do not contain the lens link; Do not introduce aberration, simple and practical.
(2) the present invention has reasonably carried out space layout; Three sensor devices are distributed in respectively on three separate planes; Adopt this structure; Can relax the restriction of sensor devices shell size, can be in shell integrated more function circuit, improve the integrated level and the functional density of sensor devices.Adopt this structure simultaneously because all sensor devices are distributed on three faces,, can relax the requirement of imaging circuit size with respect to being distributed on two faces; Especially ought need to enlarge the circuit board size under the situation that multi-disc (＞3) sensor devices splices, make the circuit layout wiring become easy; Improve the signal quality and the running frequency performance that improves circuit of circuit; Thereby reduced the difficulty of sensor devices and imaging circuit, improved performance, reduced cost.
Description of drawings
Fig. 1 be physical package size on the sensor devices stitching direction greater than the length of light-sensitive surface on this stitching direction of this sensor devices of 2 times, produce and leak the pixel synoptic diagram;
Fig. 2 is of the present invention seamless with the field stitching front elevational schematic;
Fig. 3 is for of the present invention seamless with looking synoptic diagram in a field stitching left side;
Fig. 4 is of the present invention seamless with the field stitching schematic top plan view.
Embodiment
Further describe in detail below in conjunction with the accompanying drawing specific embodiments of the invention.
As shown in Figure 1, the present invention is directed to physical package size on the sensor devices stitching direction greater than the length of light-sensitive surface on this stitching direction of this sensor devices of 2 times, produce the problem of leaking pixel.Sensor devices is meant a kind of electrooptical device, can be linear array, face battle array etc., comprises light-sensitive surface and its peripheral encapsulation, for example common CMOS sensor devices or CCD sensor devices etc.The photosensitive region of the square or rectangle that the light-sensitive surface of sensor devices is made up of the light-sensitive image unit of one by one independently square or rectangle, its center is positioned at the center of sensor devices generally speaking.The light-sensitive surface 4 of sensor devices 1 and the light-sensitive surface 6 of sensor devices 3, left and right sides adjacent boundary length is 17.66mm.Said light-sensitive surface is meant actual part of carrying out opto-electronic conversion in the sensor devices, rectangle or square.Adopt conventional same field stitching method, guarantee not leak pixel, the size of the light-sensitive surface 5 of sensor devices 2 is greater than 17.66mm at least, and in fact has only 17.4mm.The pixel dimension of sensor devices is 0.0074mm, and this just means and adopt conventional same field stitching mode, and ((17.66mm-17.4mm)/0.0074mm=35) realized not seamless requirement with field stitching will to cause the slit of 35 pixels at least.
Like Fig. 2, Fig. 3, shown in Figure 4, focal plane subassembly of the present invention comprises first imaging electronics board 1, second imaging electronics board 2, the 3rd imaging electronics board 3, first sensor devices 4, second sensor devices 5, the 3rd sensor devices 6, first catoptron 7, second catoptron 8, first boss 9, second boss 10 and framework 11;
Framework 11 is the Square barrel formula structure of an open upper end; Just as a cuboid container that does not have end face; Middle part, bottom surface at framework 11 has window; Be provided with respectively to the first projecting inward boss 9 and second boss 10 in the relative both sides of this bottom surface window; First catoptron 7 and second catoptron 8 are separately fixed on second boss 10 and first boss 9 and the angle between first catoptron 7 and second catoptron 8 is 90 degree, the mode that the fixedly employing of catoptron is gluing or be connected with boss through the structure mirror holder; The outside at said bottom surface window; The 3rd imaging electronics board 3 is installed; Make light shine in, can directly be radiated on the 3rd sensor devices 6 on the 3rd imaging electronics board 3, can not receive any stopping in the process on the 3rd sensor devices 6 on irradiate light to the three imaging electronics board 3 through said bottom surface window from the top of framework 11; Therefore; At first catoptron and boss all can not have the part that is positioned at the 3rd sensor devices 6 tops, and secondly, the window size that the framework bottom surface is left must be greater than the 3rd sensor devices 6.Said imaging electronics board is meant the circuit board that signals such as the required sequential of work, driving, power supply are provided for sensor devices; Be that sensor devices carries out the prerequisite condition of opto-electronic conversion; Be the technology of comparative maturity at present; The imaging electronics board at the various magazine sensor devices place on the market is this type of, and all can use with the present invention in.
Angle between first catoptron 7 and second boss 10 is 45 degree; And on a side of the framework 11 that first catoptron 7 is faced, leave window accordingly; Fixing second imaging electronics board 2 in the outside of this side of described framework 11; Make light shine from the top of framework 11, through the reflection of first catoptron 7, the window that leaves on this side through described framework 11 is radiated on second sensor devices 5 on second imaging electronics board 2; Same, in the light path can not there be any stopping.
Angle between second catoptron 8 and first boss 9 is 45 degree; And on a side of the framework 11 that second catoptron 8 is faced, leave window accordingly; Fixing first imaging electronics board 1 in the outside of this side of described framework 11; Make light shine from the top of framework 11, through the reflection of second catoptron 8, the window that leaves on this side through described framework 11 is radiated on first sensor devices 4 on first imaging electronics board 1; Same, in the light path can not there be any stopping.
The distance of the distance of first sensor devices, 4 to first catoptrons 7 and second sensor devices, 5 to second catoptrons 8 equates, first sensor devices 4 is the virtual image, second sensor devices 5 through 7 of first catoptrons and is the virtual image and the 3rd sensor devices 6 at grade through 8 of second catoptrons;
The light-sensitive surface of first sensor devices 4 is virtual image center line, second sensor devices 5 through 7 of first catoptrons light-sensitive surface is the light-sensitive surface center line of center line and the 3rd sensor devices 6 of the virtual image on same straight line through 8 of second catoptrons, like this can be so that the image after the splicing can not misplace.
The light-sensitive surface of first sensor devices 4 is the virtual image and second sensor devices 5 through 7 of first catoptrons light-sensitive surface is the virtual image through 8 of second catoptrons all has the subregion overlapping to guarantee not leak pixel with the light-sensitive surface of the 3rd sensor devices 6.
Window size on the framework 11 all greater than the size of the corresponding sensor devices of said window, can not stopped by window to guarantee the light that shines on the sensor devices.
Three sensor devices lay respectively on three imaging electronics board; Be distributed on three planes of framework; Realize two reflections, one direct projection through the catoptron intersection; The shortcoming of having leaked pixel for big shell sensor devices splicing when having overcome two sides as shown in Figure 1 layout had both avoided on the stitching direction sensor devices or circuit board on physical arrangement, to interfere with each other, and can guarantee that again the light-sensitive surface (first sensor devices 4 and second sensor devices 5 are the virtual image of light-sensitive surface) of three sensor devices is end to end; And the joint has the subregion overlapping; Can realize not leaking pixel, thereby realize seamless splicedly that said stitching direction is meant the direction that the light-sensitive surface of three sensor devices is end to end.And two small reflectors that adopt among the present invention only work the light path of turning back, and do not contain the lens link, do not introduce aberration, and are simple and practical.
Three sensor devices are distributed in respectively on three separate planes, adopt this structure, can relax the restriction of sensor devices shell size, can be in shell integrated more function circuit, improve the integrated level and the functional density of sensor devices.Adopt this structure simultaneously, owing to all sensor devices are distributed on three faces, with respect to being distributed on two faces; Can relax the requirement of imaging circuit size, especially ought need to enlarge the circuit board size under the situation that multi-disc (＞3) sensor devices splices; Make the circuit-board laying-out wiring become easily, improve the signal quality and the running frequency performance that improves circuit of circuit, thereby reduced the difficulty of sensor devices and imaging circuit; Improve performance, reduced cost.
The content of not doing to describe in detail in the instructions of the present invention belongs to those skilled in the art's known technology.
Claims (1)
1. one kind with the field stitching focal plane subassembly, it is characterized in that: comprise first imaging electronics board (1), second imaging electronics board (2), the 3rd imaging electronics board (3), first sensor devices (4), second sensor devices (5), the 3rd sensor devices (6), first catoptron (7), second catoptron (8), first boss (9), second boss (10) and framework (11);
Framework (11) is the Square barrel formula structure of an open upper end; Middle part, bottom surface at framework (11) has window; Be provided with respectively to projecting inward first boss (9) and second boss (10) in the relative both sides of this bottom surface window, first catoptron (7) and second catoptron (8) are separately fixed on second boss (10) and first boss (9) and the angle between first catoptron (7) and second catoptron (8) is 90 degree; In the outside of said bottom surface window, the 3rd imaging electronics board (3) is installed, make light shine in from the top of framework (11), can directly be radiated on the 3rd sensor devices (6) on the 3rd imaging electronics board (3) through said bottom surface window;
Angle between first catoptron (7) and second boss (10) is 45 degree; And on a side of the framework (11) that first catoptron (7) is faced, leave window accordingly; Fixing second imaging electronics board (2) in the outside of this side of described framework (11); Make light shine from the top of framework (11), through the reflection of first catoptron (7), the window that leaves on this side through described framework (11) is radiated on second sensor devices (5) on second imaging electronics board (2);
Angle between second catoptron (8) and first boss (9) is 45 degree; And on a side of the framework (11) that second catoptron (8) is faced, leave window accordingly; Fixing first imaging electronics board (1) in the outside of this side of described framework (11); Make light shine from the top of framework (11), through the reflection of second catoptron (8), the window that leaves on this side through described framework (11) is radiated on first sensor devices (4) on first imaging electronics board (1);
The distance of first sensor devices (4) to the distance of first catoptron (7) and second sensor devices (5) to second catoptron (8) equate, first sensor devices (4) is the virtual image, second sensor devices (5) through second catoptron (8) and is the virtual image and the 3rd sensor devices (6) at grade through first catoptron (7);
The light-sensitive surface of first sensor devices (4) is center line, second sensor devices (5) of the virtual image through second catoptron (8) light-sensitive surface is the light-sensitive surface center line of center line and the 3rd sensor devices (6) of the virtual image on same straight line through first catoptron (7)
The light-sensitive surface of first sensor devices (4) is the virtual image and second sensor devices (5) through second catoptron (8) light-sensitive surface is the virtual image through first catoptron (7) all has the subregion overlapping guaranteeing not leak pixel with the light-sensitive surface of the 3rd sensor devices (6),
Window size on the said framework (11) all greater than the size of the corresponding sensor devices of said window, can not stopped by window to guarantee the light that shines on the sensor devices.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010558175.6A CN102142432B (en) | 2010-11-22 | 2010-11-22 | Focal plane assembly capable of realizing same viewing field splicing |
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| CN201010558175.6A CN102142432B (en) | 2010-11-22 | 2010-11-22 | Focal plane assembly capable of realizing same viewing field splicing |
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| CN102142432A CN102142432A (en) | 2011-08-03 |
| CN102142432B true CN102142432B (en) | 2012-12-26 |
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| CN103345030B (en) * | 2013-06-28 | 2015-09-09 | 中国科学院长春光学精密机械与物理研究所 | Space camera optical Focal structure |
| CN107576401B (en) * | 2017-09-20 | 2018-11-16 | 中国科学院长春光学精密机械与物理研究所 | A kind of refrigeration mode thermal imaging system |
| CN109031452B (en) * | 2018-06-29 | 2019-11-12 | 北京空间机电研究所 | A kind of the splicing focal plane subassembly and joining method of multispectral section of detector |
Citations (4)
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|---|---|---|---|---|
| CN101201459A (en) * | 2007-12-05 | 2008-06-18 | 浙江大学 | Electro-optical system for implementing multiple CCD seamless concatenation using prismatic decomposition vignetting compensation |
| CN101261557A (en) * | 2008-04-30 | 2008-09-10 | 北京汇冠新技术有限公司 | Image sensing apparatus for touch screen |
| CN101369202A (en) * | 2008-06-02 | 2009-02-18 | 北京汇冠新技术有限公司 | Image sensing apparatus used for touch screen |
| CN101692447A (en) * | 2009-09-30 | 2010-04-07 | 浙江大学 | Multi-CCD super field of view image mosaic photoelectric system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8058602B2 (en) * | 2009-02-25 | 2011-11-15 | Cmos Sensor, Inc. | Long-length industry camera image sensor for flat surface inspection application |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201459A (en) * | 2007-12-05 | 2008-06-18 | 浙江大学 | Electro-optical system for implementing multiple CCD seamless concatenation using prismatic decomposition vignetting compensation |
| CN101261557A (en) * | 2008-04-30 | 2008-09-10 | 北京汇冠新技术有限公司 | Image sensing apparatus for touch screen |
| CN101369202A (en) * | 2008-06-02 | 2009-02-18 | 北京汇冠新技术有限公司 | Image sensing apparatus used for touch screen |
| CN101692447A (en) * | 2009-09-30 | 2010-04-07 | 浙江大学 | Multi-CCD super field of view image mosaic photoelectric system |
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