CN102139553A - Manufacturing device and manufacturing method for laminated substrate - Google Patents
Manufacturing device and manufacturing method for laminated substrate Download PDFInfo
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- CN102139553A CN102139553A CN2010105260280A CN201010526028A CN102139553A CN 102139553 A CN102139553 A CN 102139553A CN 2010105260280 A CN2010105260280 A CN 2010105260280A CN 201010526028 A CN201010526028 A CN 201010526028A CN 102139553 A CN102139553 A CN 102139553A
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Abstract
The invention provides a manufacturing device (20) for a laminated substrate, which comprises: an attaching mechanism (46) which attaches a photosensitive plate (22) to a glass substrate (24) to obtain an attached substrate (24a); a peeling mechanism (114) which peels a basal film (26) from the attached substrate (24a) to obtain a laminated substrate (112); and a pressing roller mechanism (120) which is pressured on a resin layer surface (124) where the basal film (26) is peeled, and allows the concave-convex shape of the resin layer surface (124) to be flattened through movement relative to the laminated substrate (112).
Description
Technical field
The present invention relates to the manufacturing installation and the manufacture method of following multilayer board, promptly,, described supporting course is peeled off from described resin bed and made multilayer board according to making described resin bed side after the mode and described substrate bonding of substrate at the duplexer of the resin bed that will be laminated with supporting course and at least 1 layer.
Background technology
For example, substrate for liquid crystal panel, printed wiring with substrate, PDP panel with in the substrate, (the photonasty plate photosensitiveweb) is attached to substrate surface and constitutes will to have the photonasty thin slice body of photoresist (photosensitive material) layer.Photonasty thin slice body has stacked gradually photo-sensitive resin and diaphragm on the flexiplast supporting mass.
So; used adhering device as a rule adopts following mode in the attaching of such photonasty thin slice body; promptly; carry the compartment of terrain that substrates such as glass substrate or resin substrate is separated separately regulation; and after from above-mentioned photonasty thin slice body, diaphragm being peeled off, photo-sensitive resin is attached on the aforesaid substrate.
For example, in Japanese kokai publication hei 08-183146 communique in the laminating method of disclosed dry type resist film, as shown in Figure 9, be equipped with on basal plate preheating portion, lamination portion, substrate cooling end, the substrate film cutting part and film successively along the throughput direction of substrate 1 and remove portion.This substrate 1 is sent to lamination portion after the pre-hot heater 2 by basal plate preheating portion is heated to the temperature of regulation.
In lamination portion, dispose a pair of laminating roll 3a, 3b since between above-mentioned laminating roll 3a, 3b conveying substrate 1 and dry type resist film 4, therefore above-mentioned dry type resist film 4 just by thermo-compressed on aforesaid substrate 1.In addition, dry type resist film 4 is peeled off coverlay 5 in advance, with not shown resist layer towards substrate 1 side thermo-compressed.
In addition, thermo-compressed the substrate 1 of dry type resist film 4 be sent to the substrate cooling end by conveying roller 6, utilize 7 coolings of substrate cooling body.By utilizing the substrate cooling end with dry type resist film 4 cooling, the resist layer of this dry type resist film 4 will harden, and improves with the closing force of substrate 1.So, on the substrate of next section, in the film cutting part, can prevent that the stress owing to cutting produces peeling off of resist layer with 4 cuttings of dry type resist film the time.
Then, the dry type resist film 4 that substrate 1 is connected to each other on substrate in the film cutting part by 8 cuttings of film cutting mechanism on the substrate that possesses cutter, and aforesaid substrate 1 is sent to film and removes portion.Remove in the portion at this film, utilize warm-up mill 9 to heat again substrate 1 after, remove from aforesaid substrate 1 by the dry type resist film 4 that film mechanism for stripping 10 will link between the aforesaid substrate 1 and between the cut surface that forms in cutting action.
In the above-mentioned conventional art,, in resist layer, produce overshooting shape thing (setting feather) easily when substrate 1 is peeled off dry type resist film 4.The front and back end of the sheet conveying direction that attaches at 1 quilt of the substrate of having peeled off dry type resist film 4, it is obvious especially that the generation of overshooting shape thing becomes.
But, for example in the proximity printing mode, by at mask and be exposed under the state of the distance (gap) of reserving regulation between substrate, the irradiation directional light, and, resist layer is carried out exposure-processed with the direct projection of mask pattern.The distance of this regulation as a rule is set to 160 μ m.
But during overshooting shape thing when produce 160 μ m in resist layer more than, this overshooting shape thing just is attached on the mask easily, thereby can cause above-mentioned overshooting shape thing to enter in the exposure range and cause ill-exposed problem.
Summary of the invention
The present invention is the invention that solves such problem, and its purpose is, manufacturing installation and the manufacture method that can utilize simple formation and operation will peel off the resin bed smoothing well of supporting course and can make high-quality multilayer board effectively are provided.
The manufacturing installation of multilayer board of the present invention possesses: attach mechanism, its duplexer of resin bed that will be laminated with supporting course and at least 1 layer obtains attaching substrate according to making above-mentioned resin bed side bonding towards the mode and the aforesaid substrate of substrate; Mechanism for stripping, it is peeled off above-mentioned supporting course and obtains multilayer board from above-mentioned resin bed; Crimping roller mechanism, it is crimped on the above-mentioned resin bed that peels off above-mentioned supporting course, by relatively moving with above-mentioned multilayer board, and with the concaveconvex shape planarization of above-mentioned resin bed.
In addition, the manufacture method of multilayer board of the present invention has: the duplexer of resin bed that will be laminated with supporting course and at least 1 layer is according to making above-mentioned resin bed side bonding and obtain attaching the operation of substrate towards the mode of substrate and aforesaid substrate; Above-mentioned supporting course is peeled off from above-mentioned resin bed and obtained the operation of multilayer board; Crimping roller mechanism is crimped on the above-mentioned resin bed that peels off above-mentioned supporting course, relatively moves by making above-mentioned crimping roller mechanism and above-mentioned multilayer board, and with the operation of the concaveconvex shape planarization of above-mentioned resin bed.
Among the present invention, after supporting course is peeled off from resin bed, under the state that crimping roller mechanism is crimped on the above-mentioned resin bed, above-mentioned crimping roller mechanism and multilayer board are relatively moved.Thus, the concaveconvex shape that forms because of peeling off of supporting course of resin bed is just by planarization well, thereby can utilize simple formation and operation, makes high-quality multilayer board effectively.So, when exposure-processed, do not have resin bed and be attached to situation on the mask, can carry out excellent exposure reliably and handle.
Utilize the following preferred embodiment explanation of example collaborative, can further illustrate above-mentioned purpose, feature and advantage with additional accompanying drawing.
Description of drawings
Fig. 1 is the summary pie graph of the manufacturing installation of embodiments of the present invention.
Fig. 2 is the profile of strip photonasty plate used in the above-mentioned manufacturing installation.
Fig. 3 is the key diagram of the state of bonding adhesive labels on above-mentioned strip photonasty plate.
Fig. 4 is the summary perspective illustration that constitutes the crimping roller mechanism of above-mentioned manufacturing installation.
Fig. 5 is that key diagram faced in the summary of above-mentioned crimping roller mechanism.
Fig. 6 is the key diagram that concerns in spring strength and cramping zone.
Fig. 7 is above-mentioned spring strength and the key diagram that concerns that contacts pressure.
Fig. 8 is the key diagram of the variation in altitude before and after the crimping.
Fig. 9 is the key diagram of laminating method of the dry type resist film of Japanese kokai publication hei 08-183146 communique.
The specific embodiment
As shown in Figure 1, the manufacturing installation 20 of the multilayer board of first embodiment of the present invention printed wiring with substrate, liquid crystal, PDP or organic EL production process with colour filter etc. in, carry out the operation of the photo-sensitive resin 29 (back narration) of strip photonasty plate 22 to glass substrate 24 hot transfer printings.
As shown in Figure 2, used photonasty plate (duplexer) the 22nd in the manufacturing installation 20, flexible basement membrane (supporting course) 26, cushion (thermoplastic resin) 27, intermediate layer (oxygen barrier film) 28, photo-sensitive resin 29 and diaphragm 30 is stacked and constitute.And photonasty plate 22 also can be made of basement membrane 26, photo-sensitive resin 29 and diaphragm 30.
As shown in Figure 1, manufacturing installation 20 possesses: plate delivering mechanism 32, and it accommodates the photonasty coiled sheet tube 22a that photonasty plate 22 is reeled with drum, sends above-mentioned photonasty plate 22 from this photonasty coiled sheet tube 22a; Hemisection mechanism 36, its on the diaphragm 30 of the above-mentioned photonasty plate 22 that is sent, the hemisection position 34 that formation can broad ways be cut off; And label bonding agency 40, it is bonded in adhesive labels 38 (with reference to Fig. 3) on the diaphragm 30.
In the downstream of label bonding agency 40, be equipped be used for photonasty plate 22 from intermittent delivery change to reservoir mechanism 42 that approximate continuous carries, the diaphragm mechanism for stripping 44 diaphragm 30 peeled off at interval with the length of regulation from the above-mentioned photonasty plate 22, the heating arrangements 45 that glass substrate 24 is carried to sticking position with the state of the temperature that is heated to regulation, the photo-sensitive resin 29 that will expose because of peeling off of said protection film 30 be attached to the attaching mechanism 46 on the above-mentioned glass substrate 24.In addition, the duplexer (Intermediate substrate) that below will utilize attaching mechanism 46 to attach photonasty plate 22 on glass substrate 24 is called attaching substrate 24a.
In the downstream that attaches mechanism 46, be equipped with plate shut-off mechanism 48 between the substrate that the above-mentioned photonasty plate 22 with 24 of each glass substrates cuts off.The upstream of plate shut-off mechanism 48 between this substrate is provided with when the running beginning and the plate shut-off mechanism 48a that turns round and use when finishing.
Near the downstream of plate delivering mechanism 32, be equipped with bond pad 49, it makes the rear end of the photonasty plate 22 that roughly uses up engage with the head end of the new photonasty plate 22 that uses.In the downstream of this bond pad 49,, be equipped with film end position detector 51 in order to control the skew that is offset the width that causes by the coiling of photonasty coiled sheet tube 22a.
As shown in Figure 2, hemisection position 34 needs diaphragm 30 is cut off at least, in fact, for this diaphragm 30 is cut off reliably, according to the mode that is cut into photo-sensitive resin 29 and even intermediate layer 28, sets the penetraction depth of rotational circle sword 54.
As shown in Figure 1, label bonding agency 40 possesses and maximum 7 adhesive labels 38 can be separated absorption layer 58a～58g that predetermined distance ground separately attaches separately, and at the sticking position of the above-mentioned adhesive labels 38 of utilizing above-mentioned absorption layer 58a～58g, dispose free lifting be used for keeping photonasty plate 22 from the below bear platform 59.
Diaphragm mechanism for stripping 44 is disposed at the downstream of reservoir mechanism 42, and possesses air-breathing roller 62, clamping and photonasty plate 22 and this suctions 62 stripper roll of joining 64.The diaphragm of peeling off with the peel angle of acute angle from the photonasty plate 22 by stripper roll 64 30 is wound onto on the diaphragm wireline reel 66 beyond removing remnant 30b.Diaphragm wireline reel 66 for example is linked to torque motor 68 in order to give the tension force of regulation to diaphragm 30.
In the downstream of diaphragm mechanism for stripping 44, be equipped with the tension control mechanism 76 that to give tension force to photonasty plate 22.Tension control mechanism 76 possesses cylinder 78, and by under the driving effect of this cylinder 78, tension force sensor roll 80 is swung displacements, and can adjust the tension force of the photonasty plate 22 of 80 sliding-contacts of this tension force sensor roll.And tension control mechanism 76 also can be deleted as long as use as required.
Near rubber rollers 90a, be equipped with and be used to the anti-touch roll 96 that prevents that photonasty plate 22 from contacting with above-mentioned rubber rollers 90a.Should can move by not shown actuator by anti-touch roll 96.
Attaching between mechanism 46 and substrate between the plate shut-off mechanism 48, be equipped with film conveying roller 98a and substrate conveying roller 98b.The downstream of plate shut-off mechanism 48 between substrate is provided with the induction system 110 of arranging a plurality of roller 110a.In the end of the arrow C direction (downstream) of induction system 110, be equipped with from attaching substrate 24a and go up and basement membrane 26 peeled off and obtain the mechanism for stripping 114 of multilayer board 112.
Mechanism for stripping 114 possesses can be by driver (not shown) mobile a pair of chuck 116a, 116b.Chuck 116a, 116b can adjust to the position and freely grip from the throughput direction two ends of the glass substrate 24 that constitute to attach substrate 24a to the position of two sidepieces of the outstanding basement membrane 26 in outside.Below chuck 116a, 116b, be equipped with a plurality of absorption layers 118 in order to adsorb the glass substrate 24 that keeps attaching substrate 24a.
In the downstream of mechanism for stripping 114, be equipped with crimping roller mechanism 120.As Fig. 4 and shown in Figure 5, crimping roller mechanism 120 possesses: pair of rolls member 122a, 122b, and it is equipped at least one end side two sides of multilayer board 112; Elastic component, for example spring 126, and it to approaching direction backup mutually, pressurizes with this roller component 122a, 122b above-mentioned roller component 122a, 122b to the resin layer surface (cushion 27 etc.) 124 that peels off basement membrane 26.
At the cephalic par of axial region 130a, 130b, be provided with non-adhesive rubber roller 134a, 134b with rotating freely.Non-adhesive rubber roller 134a, 134b for example are made of the roller of silicone rubber system, have the convex shape of axial central uplift.
Non-adhesive rubber roller 134a, 134b are set to rubber hardness 30～80, more preferably are set at rubber hardness 50～80, and by spring 126, with the crimp force holding sheet laminated substrate 112 more than the 0.4MPa. Non-adhesive rubber roller 134a, 134b and multilayer board 112 relatively move with the speed below the 26cm/sec.
As shown in Figure 1, be divided into the first dust free room 142a and the second dust free room 142b by partition wall 140 in the manufacturing installation 20.In the first dust free room 142a, accommodating slave plate delivering mechanism 32 to tension control mechanism 76, and in the second dust free room 142b, accommodating and attaching later mechanism of mechanism 46.The first dust free room 142a is communicated with by the portion of running through 144 with the second dust free room 142b.
Action for the manufacturing installation 20 of formation like this describes as follows with manufacture method of the present invention explicitly.
At first, as shown in Figure 1, extract photonasty plate 22 among the photonasty coiled sheet tube 22a from be installed on plate delivering mechanism 32 out, this photonasty plate 22 is sent to hemisection mechanism 36.
In the hemisection mechanism 36, in photonasty plate 22, form hemisection position 34 (with reference to Fig. 2) by rotational circle sword 54.After this, carried out photonasty plate 22 that hemisection handles as shown in Figure 1, carried along the arrow A direction accordingly, temporarily stopped then, under the effect of advancing of rotational circle sword 54, formed next hemisection position 34 with the size of the remnant 30b of diaphragm 30.Thus, just in photonasty plate 22, across the mode of remnant 30b the released part 30aa in the place ahead and the released part 30ab at rear (with reference to Fig. 2) are set with folder.
And then photonasty plate 22 is carried to label bonding agency 40, the sticking portion of the regulation of diaphragm 30 is disposed at bears on the platform 59.In label bonding agency 40; utilize absorption layer 58a～58g absorption to keep the adhesive labels 38 of regulation sheet number, each adhesive labels is being striden remnant 30b ground and the released part 30aa in the place ahead and the released part 30ab bonding integratedly (with reference to Fig. 3) at rear of diaphragm 30.
In the diaphragm mechanism for stripping 44, photonasty plate 22 is by air-breathing roller 62 and stripper roll 64 clampings, and the basement membrane 26 of above-mentioned photonasty plate 22 is adsorbed and remains on the above-mentioned air-breathing roller 62.Under this state, air-breathing roller 62 is rotated, and gives the moment of regulation by 68 pairs of diaphragms 30 of torque motor.
So diaphragm 30 is peeled off from photonasty plate 22 in the mode of residual remnant 30b, is wound on the diaphragm wireline reel 66 by stripper roll 64.In addition, preferably blow the electric body that disappears to peeling off the position.
Under the effect of diaphragm mechanism for stripping 44, after diaphragm 30 was peeled off from basement membrane 26 in the mode of residual remnant 30b, photonasty plate 22 carried out tension adjustment by tension control mechanism 76.Photonasty plate 22 when beginning running under the turning effort of film conveying roller 98a, attach under the turning effort of substrate conveying roller 98b of substrate 24a in clamping thereafter, quantitatively carry to attaching mechanism 46.At this moment, anti-touch roll 96 standby up, and rubber rollers 90b is configured in the below.
On the other hand, in the heating arrangements 45, and attach laminating temperature in the mechanism 46 and set heating-up temperature in each heating furnace 86 accordingly.Glass substrate 24 is under the turning effort of the conveying roller 88 that constitutes conveying mechanism 84, and quilt is to each heating furnace 86 intermittent delivery successively.This glass substrate 24 temporarily and the attaching of the photo-sensitive resin 29 of photonasty plate 22 part be disposed at accordingly between rubber rollers 90a, the 90b.
Under this state, rise by make backing roll 92b and rubber rollers 90b by roller clamping part 94, and the stamping pressure of glass substrate 24 with regulation is clamped between rubber rollers 90a, the 90b.And then, under the turning effort of rubber rollers 90a, utilize heating and melting with photo-sensitive resin 29 to these glass substrate 24 transfer printings (lamination).
Here, as lamination, speed is 1.0m/min～10.0m/min, and the temperature of rubber rollers 90a, 90b is 80 ℃～150 ℃, the rubber hardness of above-mentioned rubber rollers 90a, 90b is 40 degree～90 degree, and the stamping pressure (line pressure) of this rubber rollers 90a, 90b is 50N/cm～400N/cm.
When by rubber rollers 90a, 90b during to the EO of 1 photonasty plate 22 of glass substrate 24 laminations, above-mentioned rubber rollers 90a promptly stops the rotation.On the other hand, on glass substrate 24, be pasted with the attaching substrate 24a of photonasty plate 22 by substrate conveying roller 98b clamping.After this, rubber rollers 90b keeps out of the way and removes clamping along the direction of separating with rubber rollers 90a.
Like this, lamination treatment in a slice finishes, thereafter in the time before lamination treatment begins, the glass substrate 24 that is heated to the temperature of regulation by heating arrangements 45 is transferred and is configured between rubber rollers 90a, the 90b, and carries out sliding-contact and carry in the fine motion of the photonasty plate 22 of above-mentioned rubber rollers 90a.
The attaching substrate 24a that is pasted with photonasty plate 22 on glass substrate 24 is quantitatively carried along the arrow C direction.Then, the attaching substrate 24a that has been cut off by plate shut-off mechanism 48 between substrate of the photonasty plate 22 of 24 of each glass substrates carries to mechanism for stripping 114 via induction system 110.
In the mechanism for stripping 114, glass substrate 24 sides that attach substrate 24a are held under the swabbing action of absorption layer 118, on the other hand, each chuck 116a, 116b grip from two ends of throughput direction of the outstanding basement membrane 26 in the throughput direction inward at both ends side of glass substrate 24.And, control by chuck 116a, 116b are driven along the direction of stipulating, and will separate with cushion 27, thereby peel off with attaching substrate 24a by the basement membrane 26 that above-mentioned chuck 116a, 116b grip, obtain multilayer board 112 thus.
In the multilayer board 112, when basement membrane 26 was stripped from, the front and back end of the sheet conveying direction that attaches at 124 quilts of resin layer surface was easy to generate overshooting shape thing (setting feather).This be because; the remnant 30b of diaphragm 30 shrinks; and when glass substrate 24 upper quilt layers were pressed onto unwanted part when lamination, along with peeling off of basement membrane 26, above-mentioned unwanted part will be extended with above-mentioned remnant 30b integratedly and be become the feather state of erectting.
Thus, in the present embodiment, the multilayer board 112 that basement membrane 26 is stripped from is in order to make the concaveconvex shape planarization of resin layer surface 124, and carries to crimping roller mechanism 120 under the effect of induction system 110.
In the crimping roller mechanism 120, as Fig. 4 and shown in Figure 5, pair of rolls member 122a, 122b be crimp force (more than the 4MPa) clamping with regulation of an end side two sides of multilayer board 112, and above-mentioned multilayer board 112 is moved with the speed below the 26cm/sec along the arrow C direction.
Thus, the concaveconvex shape that forms because of peeling off of basement membrane 26 of resin layer surface 124 is just by planarization well, thereby can utilize simple formation and operation, makes high-quality multilayer board 112 effectively.So when the exposure-processed of multilayer board 112, the overshooting shape thing that does not have a resin layer surface 124 is attached to the situation on the mask (not shown), can obtain to carry out the effect that excellent exposure is handled reliably.
Under this situation, the non-adhesive rubber roller 134a, the 134b that constitute roller component 122a, 122b are the roller of silicone rubber system for example, have the convex shape of axial central uplift.So, particularly in roller component 122a, can not adhere to resin layer surface 124, can carry out the planarization of above-mentioned resin layer surface 124 well.
And then the rubber hardness of non-adhesive rubber roller 134a, 134b is set at 30～80, more preferably is set to rubber hardness 50～80, and by spring 126 with the crimp force holding sheet laminated substrate 112 more than the 0.4MPa.
Among Fig. 6, express in rubber hardness 50,70 and 80 3 kind of rubber rollers the relation of spring strength (with the power of rubber rollers) and the pressing width (cramping zone) of each rubber rollers to multilayer board 112 backups.According to this figure, rubber hardness is high more, and spring strength is weak more, and then the pressing width of rubber rollers is just more little.
In addition, express in rubber hardness 50,70 and 80 3 kind of rubber rollers the relation of spring strength and the crimp force (contacting pressure) of each rubber rollers among Fig. 7.So because rubber hardness low more (the cramping zone is big more), the contact area of rubber rollers is just big more, therefore the crimp force of above-mentioned rubber rollers reduces.On the other hand, spring strength is low more, and then the crimp force of rubber rollers just reduces.
Thus, in the present embodiment, non-adhesive rubber roller 134a, 134b are set to rubber hardness 30～80, more preferably are set to rubber hardness 50～80.This be because, if rubber hardness less than 30, then roller is too soft, can't make overshooting shape thing (concaveconvex shape) planarization of resin layer surface 124.In addition, if rubber hardness surpasses 80, then roller is too hard and the cramping zone narrows down, and crimp force increases and shift in position that can't corresponding overshooting shape thing partly.And, also might make glass substrate 24 breakages.
In addition, in the present embodiment, non-adhesive rubber roller 134a, 134b are with the crimp force holding sheet laminated substrate 112 more than the 0.4MPa.This be because, if crimp force less than 0.4MPa, then can't be planarized to required state with the overshooting shape thing (concaveconvex shape) of resin layer surface 124 reliably.
For example in Fig. 8, the rubber rollers of strong (crimp force is 0.4MPa) of the rubber rollers of rubber hardness 50 and spring strength medium (crimp force is less than 0.4MPa) and rubber hardness 50 and spring strength is used in expression, detects the result of height of the resin layer surface 124 of crimping front and back.Need to prove that the good height of resin layer surface 124 is as threshold value with 160.00 μ m of the distance of mask used in the not shown proximity printing machine and multilayer board 112.
Thus, in the rubber rollers of crimp force less than 0.4MPa, the height after the crimping is about 200 μ m, can't be with the overshooting shape thing planarization well of resin layer surface 124.On the other hand, be in the rubber rollers of 0.4MPa at crimp force, the height after the crimping is about 140 μ m, can be with the overshooting shape thing planarization well of resin layer surface 124.
In addition, in the present embodiment, multilayer board 112 is moved with the speed below the 26cm/sec along the arrow C direction with respect to non-adhesive rubber roller 134a, 134b.This be because, when the translational speed of multilayer board 112 surpasses 26cm/sec, just can't be with the overshooting shape thing planarization well of resin layer surface 124.Thus, in the present embodiment, can be easily and carry out the planarization of resin layer surface 124 reliably.
In addition, non-adhesive rubber roller 134a, 134b have the convex shape of axial central uplift.So,, therefore can be easy to adjust the scope of pressing accordingly with the position of above-mentioned overshooting shape thing owing to the size of the scope that the overshooting shape thing of resin layer surface 124 is flattened along with the cramping zone changes.
Need to prove that in the present embodiment, mechanism for stripping 114 uses and attaches the connection that substrate 24a peels off the basement membrane 26 that has cut off in advance and peel off mode from each, yet is not limited thereto.For example also can adopt the following mode of peeling off continuously, that is, utilize take up roll etc. to reel continuously and peel off be attached to the basement membrane 26 that respectively attaches on the substrate 24a integratedly.
Claims (8)
1. the manufacturing installation of a multilayer board is characterized in that, possesses:
Attach mechanism (40), its duplexer (22) of resin bed (29) that will be laminated with supporting course (26) and at least 1 layer obtains attaching substrate (24a) according to making described resin bed (29) side bonding towards the mode and the described substrate (24) of substrate (24);
Mechanism for stripping (114), it is peeled off described supporting course (26) from described resin bed (29), obtain multilayer board (112); And
Crimping roller mechanism (120), it is crimped on the described resin bed (29) that peels off described supporting course (26), by relatively moving with described multilayer board (112), and with the concaveconvex shape planarization of described resin bed (29).
2. the manufacturing installation of multilayer board according to claim 1 is characterized in that, described crimping roller mechanism (120) possesses:
Pair of rolls member (122a, 122b), it is equipped on the two sides of described multilayer board (112); And
Elastic component (126), it to approaching direction backup mutually, pressurizes with this pair of rolls member (122a, 122b) described pair of rolls member (122a, 122b) to described resin bed (29).
3. the manufacturing installation of multilayer board according to claim 2 is characterized in that, described pair of rolls member (122a, 122b) possesses non-adhesive rubber roller (134a, 134b).
4. the manufacturing installation of multilayer board according to claim 2 is characterized in that, described pair of rolls member (122a, 122b) is that rubber hardness is 50～80 rubber rollers.
5. according to the manufacturing installation of any described multilayer board in the claim 2～4, it is characterized in that described pair of rolls member (122a, 122b) has the convex shape of axial central uplift.
6. the manufacturing installation of multilayer board according to claim 2 is characterized in that, described pair of rolls member (122a, 122b) relatively moves with the speed below the 26cm/sec with described multilayer board (112).
7. the manufacturing installation of multilayer board according to claim 2 is characterized in that, described pair of rolls member (122a, 122b) is with the described multilayer board of crimp force clamping (112) more than the 0.4MPa.
8. the manufacture method of a multilayer board is characterized in that, has:
The duplexer (22) of resin bed (29) that will be laminated with supporting course (26) and at least 1 layer is according to making described resin bed side (29) bonding and obtain attaching the operation of substrate (24a) towards the mode of substrate (24) and described substrate (24);
Described supporting course (26) is peeled off from described resin bed (29) and obtained the operation of multilayer board (112); And
Crimping roller mechanism (120) is crimped on the described resin bed (29) that peels off described supporting course (26), by described crimping roller mechanism (120) and described multilayer board (112) are relatively moved, and with the operation of the concaveconvex shape planarization of described resin bed (29).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009246634A JP2011093113A (en) | 2009-10-27 | 2009-10-27 | Device and method for manufacturing laminated substrate |
| JP2009-246634 | 2009-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102139553A true CN102139553A (en) | 2011-08-03 |
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ID=44110591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105260280A Pending CN102139553A (en) | 2009-10-27 | 2010-10-27 | Manufacturing device and manufacturing method for laminated substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011093113A (en) |
| CN (1) | CN102139553A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463385A (en) * | 2014-06-19 | 2017-02-22 | 应用材料公司 | Roll to roll wafer backside particle and contamination removal |
| CN110948888A (en) * | 2018-09-27 | 2020-04-03 | 阿迪达斯股份公司 | Hot pressing system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5539602B1 (en) * | 2012-08-17 | 2014-07-02 | 日本碍子株式会社 | Composite substrate, surface acoustic wave device, and method of manufacturing composite substrate |
-
2009
- 2009-10-27 JP JP2009246634A patent/JP2011093113A/en not_active Withdrawn
-
2010
- 2010-10-27 CN CN2010105260280A patent/CN102139553A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463385A (en) * | 2014-06-19 | 2017-02-22 | 应用材料公司 | Roll to roll wafer backside particle and contamination removal |
| CN106463385B (en) * | 2014-06-19 | 2020-07-14 | 应用材料公司 | Roll-to-roll wafer backside particle and contamination removal |
| CN110948888A (en) * | 2018-09-27 | 2020-04-03 | 阿迪达斯股份公司 | Hot pressing system |
| CN110948888B (en) * | 2018-09-27 | 2022-05-17 | 阿迪达斯股份公司 | Hot pressing system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011093113A (en) | 2011-05-12 |
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Application publication date: 20110803 |