CN102135249A - Led lamp device - Google Patents
Led lamp device Download PDFInfo
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- CN102135249A CN102135249A CN2011100337524A CN201110033752A CN102135249A CN 102135249 A CN102135249 A CN 102135249A CN 2011100337524 A CN2011100337524 A CN 2011100337524A CN 201110033752 A CN201110033752 A CN 201110033752A CN 102135249 A CN102135249 A CN 102135249A
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- led lamp
- led
- loam cake
- led substrate
- lamp device
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a light-emitting diode (LED) lamp device. The LED lamp device comprises an upper cover (100) made of heat conduction insulation plastic, an LED substrate (300) with an LED lamp (200) and a driving circuit board (400) which is electrically connected with the LED substrate (300) and is used for driving the LED substrate (300); the upper cover (100) and the LED substrate (300) are sealed and fixedly connected to ensure that a closed space is formed in the upper cover (100); the driving circuit board (400) is arranged in the closed space of the upper cover (100); and a thermal conductive filler (500) is filled in the sealing space to transfer heat produced in the working process of the LED substrate (300) to the upper cover (100) as quickly as possible. The LED lamp device has the advantages that: the heat produced in the working process of the LED substrate can be transferred o the heat conduction upper cover as quickly as possible and is then diffused outward by the heat conduction upper cover, so that the heat dissipation effect of the LED device meets the requirement; and the upper cover is made of heat conduction insulation plastic, the specific gravity is low, the weight of the whole lamp can be reduced, a processing technology is simple, and the lamp device is convenient to recover.
Description
Technical field
The present invention relates to a kind of LED lamp device, particularly relate to a kind of LED lamp device of excellent in heat dissipation effect.
Background technology
Existing LED lamp device comprises that an aluminum loam cake, is installed in the LED substrate that dividing plate, that driver circuit plate, in the aluminum loam cake is fixed in the aluminum loam cake fixedly abuts against the band LED lamp under the dividing plate; Cover on the described aluminum and establish the electrode that two energy electricity connect extraneous power supply, described two electrodes are isolated and the aluminum loam cake that all insulate mutually; Described two electrode electricity connect the driver circuit plate; Described driver circuit plate electricity connects the LED substrate.Existing LED lamp device has following deficiency: 1, the proportion of metallic aluminium makes the whole lamp preponderance of existing LED lamp source much larger than the proportion of plastics; 2, loam cake adopts aluminum, the cost height, and processing technology is numerous and diverse; 3, the loam cake that adopts aluminium matter to make is inconvenient to reclaim, and needs specialized company to reclaim.
Summary of the invention
The invention provides a kind of LED lamp device, it has overcome the deficiency that LED lamp device existing whole lamp preponderance in the background technology, processing technology are numerous and diverse, be inconvenient to reclaim.
The technical scheme that is adopted that the present invention solves its technical problem is:
LED lamp device, it comprises that the LED substrate (300) and an electricity of a loam cake (100) of being made by moulded heat-conductive insulated plastics, a band LED lamp (200) connect LED substrate (300) to be used for the driver circuit plate (400) of driving LED substrate (300); Described loam cake (100) and LED substrate (300) sealing are fixed together and make the interior confined space that forms of described loam cake (100); Described driver circuit plate (400) is installed in the confined space of loam cake (100); Fill high heat filling (500) in the described confined space, pass to loam cake (100) as early as possible with the heat that will produce in LED substrate (300) course of work, again by the loam cake (100) of heat conduction with heat to external diffusion.
Among one preferred embodiment: described loam cake (100) comprises that single-revolution body (110) and is fixed in the fixing base (120) of revolution body (110) upper port, and described LED substrate (300) sealing is fixed in revolution body (110) lower port.
Among one preferred embodiment: the outer affixed one metal threaded cover (610) of described revolution body (110), described fixing base (120) sets firmly a conductive cap (620), and two electrodes of described driver circuit plate (400) electricity respectively connect metal threaded cover (610) and conductive cap (620).
Among one preferred embodiment: external affixed the hanging of described revolving sleeve connects conductive pole, and described fixing base sets firmly a conductive cap, and two electrodes of described driver circuit plate electricity respectively connect to hang and connect conductive pole and conductive cap.
Among one preferred embodiment: revolution body (110) lower port of described revolution body (110) is established downstairs face on one day (111), adaptive cascaded surface (111) and the affixed revolution body (110) of abutting against of described LED substrate (300).
Among one preferred embodiment: it also comprises a translucent cover (700), and affixed revolution body of described translucent cover (700) (110) and cover connect LED lamp (200).
Among one preferred embodiment: a kind of material or multiple any combination thereof in described high heat filling (500) material selection carborundum, thermal conductive ceramic powder, bortz powder, silicon nitride, aluminium nitride, aluminium oxide, magnesia, the zinc oxide.
Among one preferred embodiment: described high heat filling (500) material selection insulating heat-conductive slurry.
Among one preferred embodiment: the material of described loam cake (100) comprises PBT resin, fire retardant, fire retarding synergist, heat conduction auxiliary agent, reinforcing agent and antioxidant, at least a material in two kinds of materials of described heat conduction selection of auxiliary carborundum and thermal conductive ceramic powder.
The technical program is compared with background technology, and it has following advantage:
1, loam cake material selection moulded heat-conductive insulated plastics, be filled with high heat filling in the confined space that loam cake and LED substrate are surrounded, therefore can overcome the existing deficiency of background technology, and produce following technique effect: a, the heat that produces in the LED substrate course of work can be passed to the heat conduction loam cake as early as possible, again by the heat conduction loam cake with heat to external diffusion, the LED matrix radiating effect is met the requirements; B, because moulded heat-conductive insulated plastics proportion is little, therefore can reduce whole lamp weight greatly; C, last cover material adopt moulded heat-conductive insulated plastics, and processing technology is simple; D, last cover material adopt moulded heat-conductive insulated plastics, can conveniently reclaim, and loam cake manufacturer can oneself recycle compliance with environmental protection requirements; E, reduce cost, reduce selling price, be convenient to LED lamp device and promote, solve the deficiency that existing LED lamp device can't be promoted because of selling at exorbitant prices;
2, the material of loam cake comprises PBT resin, fire retardant, fire retarding synergist, heat conduction auxiliary agent, reinforcing agent and antioxidant, then can produce following technique effect: a, this material has heat conduction, insulation, high temperature resistant and fire resistance; B, can adopt the Shooting Technique moulding, easy to process, processing cost is low; C, this material cost are low; D, whole lamp are in light weight; E, this material can be recycled compliance with environmental protection requirements;
3, high heat filling material selection carborundum, thermal conductive ceramic powder, then radiating effect is splendid, and cost is low;
4, high heat filling material selection insulating heat-conductive slurry, then radiating effect is splendid, and cost is low.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 has illustrated the schematic perspective view of the LED lamp device of a preferred embodiment.
Fig. 2 has illustrated the generalized section of the LED lamp device of a preferred embodiment.
The specific embodiment
Please refer to Fig. 1 and Fig. 2, LED lamp device, LED substrate 300, the electricity that it comprises the aluminum of a loam cake of being made by moulded heat-conductive insulated plastics 100, a band LED lamp 200 connect LED substrate 300 with the driver circuit plate 400 that is used for driving LED substrate 300 and the translucent cover 700 of a pc material.
Described loam cake 100 comprises that single-revolution body 110 and is fixed in the fixing base 120 of revolution body 110 upper port.Revolution body 110 lower port of described revolution body 110 are established a step, and described step has downstairs face 111 and inwardly a surface of revolution 112 on one day.
Described revolution body 110 outer affixed one metal threaded covers 610, described fixing base 120 sets firmly a conductive cap 620, and described metal threaded cover 610 and conductive cap 620 can conduct electricity two electrodes that are connected extraneous power supply respectively.
Described LED substrate 300 is adaptive to be abutted against cascaded surface 111 and by screw it is fixed in cascaded surface 111 so that LED substrate 300 affixed revolution bodies 110, and make in the described loam cake 100, on the LED substrate 300, form confined space under the fixing base 120.
Described driver circuit plate 400 is installed in the confined space of loam cake 100, and two electrodes of described driver circuit plate 400 electricity respectively connect metal threaded cover 610 and conductive cap 620, and described driver circuit plate 400 electricity connect LED substrate 300 with driving LED substrate 300.
Described translucent cover 700, it is set as revolving body and has upper port, described upper port is provided with a step, the outer surface of revolution sealing of described step abuts against the surface of revolution inwardly 112 of loam cake 100 and is fixed together, and makes the outer surface of revolution of described translucent cover 700 upper port and the outer surface of revolution of loam cake 100 lower port flush.
Fill high heat filling 500 in the confined space of described loam cake 100, with the heat transferred loam cake 100 that will produce in LED substrate 300 courses of work, again by loam cake 100 to external diffusion.
Among the present embodiment, described high heat filling 500 material selection carborundum or thermal conductive ceramic powder or insulating heat-conductive slurry.Among the present embodiment, adopt carborundum to have the low price advantage, can reduce whole lamp cost, reduce whole lamp selling price, be convenient to led light source and promote, this advantage is especially outstanding in existing carbon reduction society.
Among the present embodiment, the material of described loam cake 100 comprises PBT resin, fire retardant, fire retarding synergist, heat conduction auxiliary agent, reinforcing agent, antioxidant, flexibilizer and other auxiliary agent.The parts by weight of described PBT resin, fire retardant, fire retarding synergist, heat conduction auxiliary agent, reinforcing agent, antioxidant, flexibilizer and other auxiliary agent are as follows:
PBT resin: 40-85 part;
Fire retardant: 3-30 part;
Fire retarding synergist: 2-20 part;
Heat conduction auxiliary agent: 1-30 part;
Reinforcing agent: 10-50 part;
Antioxidant: 0.1-4 part;
Flexibilizer: 0-15 part;
Other auxiliary agent: 0-10 part.
In the present embodiment, described fire retardant is selected a kind of material or the multiple any combination thereof in brominated epoxy resin, TDE, brominated Polystyrene, brominated polystyrene, the tetrabromobisphenol a polycarbonate for use.
In the present embodiment, described fire retarding synergist is selected a kind of material or the multiple any combination thereof in antimony oxide, antimony pentoxide, the sodium antimonate for use.
In the present embodiment, a kind of material or multiple any combination thereof in two kinds of materials of described heat conduction selection of auxiliary carborundum and thermal conductive ceramic powder.
In the present embodiment, described reinforcing agent is selected a kind of material or the multiple any combination thereof in alkali-free glass fibre, calcium sulfate crystal whiskers, calcium carbonate crystal whisker and the acicular wollastonite for use.
In the present embodiment, described antioxidant is selected a kind of material or the multiple any combination thereof in phenolic antioxidant, phosphite ester kind antioxidant, the monothioester kind antioxidant for use.Described phenolic antioxidant such as antioxidant 1076, antioxidant 1010; Described monothioester kind antioxidant such as anti-oxidant DLTP, antioxidant DSTP; Described phosphite ester kind antioxidant such as antioxidant 168, antioxidant 626, antioxidant 618 etc.
In the present embodiment, described flexibilizer is selected polypropylene grafted maleic anhydride, vinyl elastomer grafted maleic anhydride, acrylate and the Bifunctionalized vinyl elastomer of ethylene oxidic ester for use.
In the present embodiment, described other auxiliary agent such as UV resistant agent, antistatic additive, nucleator or lubricant etc.
The plastics that the employing PBT that last cover material among the present embodiment is not restricted to above to be mentioned is prepared from as main material, other plastics with heat conductive insulating performance also can be applied to present embodiment, for example adopt PC just can be suitable for present embodiment as the heat-conducting plastic that main material is prepared from.
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process according to this, i.e. the equivalence of doing according to claim of the present invention and description changes and modification, all should still belong in the scope that the present invention contains.
Claims (9)
1.LED the lamp device is characterized in that: it comprises that the LED substrate (300) and an electricity of a loam cake (100) of being made by moulded heat-conductive insulated plastics, a band LED lamp (200) connect LED substrate (300) to be used for the driver circuit plate (400) of driving LED substrate (300); Described loam cake (100) and LED substrate (300) sealing are fixed together and make the interior confined space that forms of described loam cake (100); Described driver circuit plate (400) is installed in the confined space of loam cake (100); Fill high heat filling (500) in the described confined space, pass to loam cake (100) as early as possible with the heat that will produce in LED substrate (300) course of work, again by loam cake (100) with heat to external diffusion.
2. LED lamp device according to claim 1, it is characterized in that: described loam cake (100) comprises that single-revolution body (110) and is fixed in the fixing base (120) of revolution body (110) upper port, and described LED substrate (300) sealing is fixed in revolution body (110) lower port.
3. LED lamp device according to claim 2, it is characterized in that: the outer affixed one metal threaded cover (610) of described revolution body (110), described fixing base (120) sets firmly a conductive cap (620), and two electrodes of described driver circuit plate (400) electricity respectively connect metal threaded cover (610) and conductive cap (620).
4. LED lamp device according to claim 2 is characterized in that: external affixed the hanging of described revolving sleeve connects conductive pole, and described fixing base sets firmly a conductive cap, and two electrodes of described driver circuit plate electricity respectively connect to hang and connect conductive pole and conductive cap.
5. LED lamp device according to claim 2, it is characterized in that: revolution body (110) lower port of described revolution body (110) is established downstairs face on one day (111), adaptive cascaded surface (111) and the affixed revolution body (110) of abutting against of described LED substrate (300).
6. LED lamp device according to claim 2 is characterized in that: it also comprises a translucent cover (700), and affixed revolution body of described translucent cover (700) (110) and cover connect LED lamp (200).
7. according to claim 1 or 2 or 3 or 4 or 5 or 6 described LED lamp devices, it is characterized in that: a kind of material or multiple any combination thereof in described high heat filling (500) material selection carborundum, thermal conductive ceramic powder, bortz powder, silicon nitride, aluminium nitride, aluminium oxide, magnesia, the zinc oxide.
8. according to claim 1 or 2 or 3 or 4 or 5 or 6 described LED lamp devices, it is characterized in that: described high heat filling (500) material selection insulating heat-conductive slurry.
9. according to claim 1 or 2 or 3 or 4 or 5 or 6 described LED lamp devices, it is characterized in that: the material of described loam cake (100) comprises PBT resin, fire retardant, fire retarding synergist, heat conduction auxiliary agent, reinforcing agent and antioxidant, at least a material in two kinds of materials of described heat conduction selection of auxiliary carborundum and thermal conductive ceramic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100337524A CN102135249A (en) | 2011-01-30 | 2011-01-30 | Led lamp device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100337524A CN102135249A (en) | 2011-01-30 | 2011-01-30 | Led lamp device |
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| CN102135249A true CN102135249A (en) | 2011-07-27 |
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| CN2011100337524A Pending CN102135249A (en) | 2011-01-30 | 2011-01-30 | Led lamp device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071608A1 (en) * | 2012-11-09 | 2014-05-15 | Yao Wenbin | Heat dissipation structure of lighting appliance |
| CN109058931A (en) * | 2018-07-03 | 2018-12-21 | 贵州杰芯光电科技有限公司 | A kind of production method of LED ball bubble heat radiation lampshade and manufactured lampshade |
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| CN1733964A (en) * | 2001-08-10 | 2006-02-15 | 三菱丽阳株式会社 | Resin composition for direct vapor deposition, molded articles made by using the same, and surface-metallized lamp housing |
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| CN109058931A (en) * | 2018-07-03 | 2018-12-21 | 贵州杰芯光电科技有限公司 | A kind of production method of LED ball bubble heat radiation lampshade and manufactured lampshade |
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Application publication date: 20110727 |