CN102129285B - Temperature control method and electronic device - Google Patents
Temperature control method and electronic device Download PDFInfo
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- CN102129285B CN102129285B CN2010100051359A CN201010005135A CN102129285B CN 102129285 B CN102129285 B CN 102129285B CN 2010100051359 A CN2010100051359 A CN 2010100051359A CN 201010005135 A CN201010005135 A CN 201010005135A CN 102129285 B CN102129285 B CN 102129285B
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000009434 installation Methods 0.000 claims description 63
- 230000008569 process Effects 0.000 claims description 34
- 230000005855 radiation Effects 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 2
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- 238000010586 diagram Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 230000003902 lesion Effects 0.000 description 2
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Abstract
The invention discloses a temperature control method and an electronic device. The method comprises the following steps of: firstly, providing a consumption and temperature corresponding table which records at least two temperature intervals and corresponding consumption budgets; secondly, setting an initial temperature interval value, and querying the initial consumption budget from the consumption and temperature corresponding table according to the initial temperature interval value; and finally, detecting the duty basis of at least two processing units, dynamically adjusting the consumption modes of the at least two processing units according to the duty basis and the initial consumption budget, detecting the temperature of the electronic device, and dynamically changing the consumption budgets according to the temperature and the consumption and temperature corresponding table. According to the temperature control method and the electronic device provided by the invention, temperature and a better effect of a notebook computer are compatible, and the lightening and thinning probability of the notebook computer is improved.
Description
[technical field]
The present invention relates to a kind of temperature-controlled process and electronic installation thereof, particularly relate to the method and the electronic installation of the power consumption pattern of a plurality of electronic packages of a kind of dynamic adjustment.
[background technology]
At present, the temperature control mechanism of computer installation is that the maximum possible power of totalling all component decides the heat radiation grade mostly, for example determines rotation speed of the fan.But this measure is easy because let computer installation let usefulness maintain lower grade for fear of system overheat, or needs larger-size fan in order to keep performance.In recent years; Because user's the demand and the lifting of manufacture of semiconductor; The external form trend of mobile computer is thin design; But also cause mobile computer can't dispose large-sized heat abstractor, so the mobile computer of the frivolous external form of this kind is also for fear of overheated and sacrifice operational performance.In addition, the video vision effect is more and more paid attention to, so graphics processing unit chip (GPU) has become another highly energy-consuming except CPU chip (CPU) in the computer installation and has been easy to generate the assembly of high temperature.In most behaviour in service, CPU and GPU are less to need working at high speed simultaneously, so computer installation need more effectively be adjusted the power consumption of CPU and GPU.Given this, temperature and better performance how to take into account mobile computer have been a problem that urgency is to be solved.
[summary of the invention]
In view of above-mentioned prior art problems, one of the object of the invention just is to provide a kind of temperature-controlled process and electronic installation thereof, with temperature and the better performance of taking into account mobile computer.
Another object of the present invention is to provide a kind of temperature-controlled process and electronic installation thereof, to improve the lightening possibility of mobile computer.
According to the object of the invention; Propose a kind of temperature-controlled process, be applicable to electronic installation, this electronic installation comprises first processing unit, second processing unit, heat-sink unit and temperature detecting unit; This first processing unit and this second processing unit have at least two power consumption pattern respectively; This temperature-controlled process comprises the following step: at first, power consumption temperature correspondence table is provided, its at least two temperature ranges of record and corresponding power consumption estimated value (consumption budget).Then, set the initial temperature interval value, and inquire initial power consumption estimated value from power consumption temperature correspondence table according to the initial temperature interval value.At last, detect the running burden (duty basis) of first processing unit or second processing unit,, dynamically adjust the power consumption pattern of first processing unit or second processing unit again according to running burden and initial power consumption estimated value.The temperature of detection. electronics according to temperature and power consumption temperature correspondence table, dynamically changes the power consumption estimated value.
Wherein, first processing unit is CPU chip (CPU).
Wherein, second processing unit is graphics processing unit chip (GPU).
Wherein, detect the step that operates burden and further comprise number of applications, Application Type or the current sinking amount that detects this first processing unit or the second processing unit current executed.
Wherein, this temperature-controlled process further comprises total power consumption of judging electronic installation and whether surpasses initial power consumption estimated value; If total power consumption of electronic installation surpasses initial power consumption estimated value, readjust the power consumption pattern of first processing unit or second processing unit.
Wherein, After this temperature-controlled process further is contained in the power consumption pattern of this first processing unit of adjustment or this second processing unit; The temperature of detection. electronics, and, dynamically adjust the power consumption pattern of first processing unit or second processing unit more again according to this temperature.
According to the object of the invention, a kind of electronic installation is proposed, it comprises first processing unit, second processing unit, heat-sink unit, temperature detecting unit, storage element and temperature control unit.First processing unit and second processing unit have at least two power consumption patterns respectively.Temperature detecting unit detects a temperature of this electronic installation, and the heat energy of diffusing this electronic installation of heat-sink unit row.Storage unit stores power consumption temperature correspondence table, its at least two temperature ranges of record and corresponding power consumption estimated value (consumption budget).Temperature control unit inquires initial power consumption estimated value according to the initial temperature interval value from this power consumption temperature correspondence table; And (duty basis) born in the running that detects first processing unit or second processing unit; Again according to running burden and initial power consumption estimated value; Dynamically adjust the power consumption pattern of first processing unit or second processing unit, and, dynamically change the power consumption estimated value according to temperature and power consumption temperature correspondence table.
Wherein, first processing unit is CPU chip (CPU).
Wherein, second processing unit is graphics processing unit chip (GPU).
Wherein, the running of this first processing unit or second processing unit burden is number of applications, Application Type or the current sinking amount of this first processing unit or the second processing unit current executed.
Wherein, temperature control unit judges further whether total power consumption of electronic installation surpasses initial power consumption estimated value, if total power consumption of electronic installation surpasses initial power consumption estimated value, readjusts the power consumption pattern of first processing unit or second processing unit.
Wherein, Temperature control unit is after the power consumption pattern of this first processing unit of adjustment or this second processing unit; The temperature of temperature detecting unit detection. electronics, temperature control unit are dynamically adjusted the power consumption pattern of first processing unit or second processing unit more again according to this temperature.
Temperature-controlled process provided by the invention and electronic installation thereof can dynamically be adjusted the power consumption pattern, and dynamically change the power consumption estimated value, therefore can take into account the temperature and the better performance of mobile computer, have improved the lightening possibility of mobile computer.
[description of drawings]
Fig. 1 is the enforcement calcspar of electronic installation of the present invention;
Fig. 2 is the process flow diagram of temperature-controlled process of the present invention;
Fig. 3 is the first embodiment process flow diagram of temperature-controlled process of the present invention;
Fig. 4 is the second embodiment process flow diagram of temperature-controlled process of the present invention.
Symbol description
1: electronic installation
11: the first processing units
12: the second processing units
13: heat-sink unit
14: temperature detecting unit
141: temperature
15: storage element
151: thermometer
152: power consumption temperature correspondence table
16: temperature control unit
161: the power consumption estimated value
162: running burden situation
21～26: steps flow chart
31～38: steps flow chart
41～49: steps flow chart
[embodiment]
Fig. 1 is the calcspar of electronic installation of the present invention.Among the figure, electronic installation 1 comprises first processing unit 11, one second processing unit 12, heat-sink unit 13, temperature detecting unit 14, storage element 15 and temperature control unit 16.First processing unit 11 and second processing unit 12 have at least two power consumption patterns respectively; For example; First processing unit 11 is CPU chip (CPU); And second processing unit 12 is graphics processing unit chip (GPU), and both all can different running performances be arranged so that the different operation frequency operates or the input current that foundation is different is big or small or input different operation voltage operates, and its power consumption is also different certainly; Power consumption is bigger during high frequencies of operation, and low frequency when operation power consumption is less; Or the high time power consumption of input current value is bigger, and input current value when low power consumption less; Or the high time power consumption of operating voltage is bigger, and operating voltage when low power consumption less.Temperature detecting unit 14 is in order to the temperature 141 of detection. electronics 1, in the enforcement, and temperature detecting unit 14 preferred thermistors.And the heat energy of diffusing this electronic installation of heat-sink unit 13 rows, in the enforcement, heat-sink unit 13 preferably has different heat radiation grades.For example with fan during, can see through and improve or reduce rotation speed of the fan and realize different heat radiation grades as heat-sink unit 13.
Storage element 15 (for example internal memory or hard disk) is in order to storage temperature table 151 and power consumption temperature correspondence table 152.Wherein, thermometer 151 record heat-sink units 13 are corresponding to the operator scheme of at least two temperature ranges (thermal zone), and power consumption temperature correspondence table 152 at least two temperature ranges of record and corresponding power consumption estimated values (consumption budget).Tabulating down one is the example of thermometer 151, and table two is the example of power consumption temperature correspondence table 152.In the enforcement, the 1st temperature range can be the 1st beginning temperature and the 1st and stops the temperature difference between the temperature, and the 2nd temperature range can be the 2nd and begins temperature and the 2nd and stop the temperature difference between the temperature.
| Temperature | The 1st stops temperature | The 1st beginning temperature | The 2nd stops temperature | The 2nd beginning temperature | … | N stops temperature | N begins temperature | Critical point |
| Rotation speed of the fan | Stop the 1st rotating speed | Begin the 1st rotating speed | Stop the 2nd rotating speed | Begin the 2nd rotating speed | … | Stop the n rotating speed | Begin the n rotating speed | Carry out security procedure |
Table one
| Temperature range | The 1st temperature range | The 2nd temperature range | … | The n temperature range |
| The power consumption estimated value | The 1st performance number (watt) | The 2nd performance number (watt) | The n performance number (watt) |
Table two
Temperature control unit 16 inquires power consumption estimated value 161 according to the initial temperature interval value from power consumption temperature correspondence table 152, and detects running burden (the duty basis) 162 of first processing unit 11 or second processing unit 12.In the enforcement, so-called running burden 162 can comprise number of applications, Application Type or its current sinking amount of first processing unit 11 or second processing unit, 12 current executed, and for example the quantity of executive utility is got over for a long time, and running burden 162 is big more; Or when carrying out 3D image playing program or animation translator, running burden 162 is bigger; Likewise, the current sinking amount is big more, and expression running burden 162 is big more.
Temperature control unit 16 is dynamically adjusted the power consumption pattern of first processing unit 11 or second processing unit 12 again according to running burden 162 and initial power consumption estimated value 161.If the running of first processing unit 11 burden 162 to the second processing units 12 height then first processing unit 11 is set in higher power consumption pattern, and two processing units 12 are set in lower power consumption pattern.For example; Carrying out 10 application programs if detect present first processing unit 11; And second processing unit 12 is only carried out 2 application programs; Then set first processing unit 11 in higher operating frequency (that is highly energy-consuming pattern), and set second processing unit 12 in low operating frequency (that is low power consuming pattern); Or; Only carry out the fundamental operation system if detect present first processing unit 11; And second processing unit 12 is when carrying out a 3D image playing program; Then set first processing unit 11 in low operating frequency (being the low power consuming pattern), and set second processing unit 12 in higher operating frequency (being the highly energy-consuming pattern).Note that above-mentioned higher or low operating frequency is regarded as the comparison of same processing unit itself, is not the comparison between the different processing units, and promptly low operating frequency of first processing unit 11 might be higher than the higher operating frequency of second processing unit 12.
Temperature control unit 16 can dynamically change power consumption estimated value 161 according to temperature 141 and power consumption temperature correspondence table 152.In the enforcement, adjust the power consumption pattern of first processing unit 11 and second processing unit 12 after, but total power consumption of detection. electronics; And judge that whether this total energy consumption is greater than the power consumption estimated value; If greater than the power consumption estimated value, then the power consumption pattern of the previous adjustment of expression and being not suitable for need be readjusted.In addition; Can then judge the temperature that whether temperature 141 of electronic installation has reached needs to improve the heat radiation grade after the adjustment power consumption pattern according to thermometer 151; If reached the temperature that needs to improve the heat radiation grade, the power consumption pattern that first processing unit 11 and second processing unit 12 are only adjusted in expression still can increase temperature, so need to select new temperature range; And table look-up and obtain new power consumption estimated value 161, then readjust the power consumption pattern of first processing unit 11 and second processing unit 12.
Repeat the power consumption pattern of above-mentioned adjustment first processing unit 11 and second processing unit 12 and the operation of power consumption estimated value 161, reach the heat radiation grade that can reduce heat-sink unit 13 up to temperature 141.
Wherein, electronic installation 1 preferred computer device, for example desktop PC, mobile computer or flat computer.
Fig. 2 is the process flow diagram of temperature-controlled process of the present invention.Among the figure, this temperature-controlled process is applicable to electronic installation, and it comprises first processing unit, second processing unit, heat-sink unit and temperature detecting unit.Wherein, First processing unit and second processing unit have at least two power consumption pattern respectively; For example first processing unit is CPU chip (CPU); And second processing unit is graphics processing unit chip (GPU), and both can change its power consumption pattern by its operating frequency of external control.If with the lower frequency operation, then power consumption is lower; If with higher frequencies of operation, it is higher then to consume energy.Temperature-controlled process comprises the following step: in step 21; Thermometer and power consumption temperature correspondence table are provided; This thermometer record heat-sink unit is corresponding to the operator scheme of at least two temperature ranges, power consumption temperature correspondence table at least two temperature ranges of record and corresponding power consumption estimated value (consumption budget); In step 22, set the initial temperature interval value; Then inquire initial power consumption estimated value according to the initial temperature interval value from power consumption temperature correspondence table in step 23.
In step 24, detect the running burden (dutybasis) of first processing unit or second processing unit.In the enforcement, can detect number of applications, Application Type or the current sinking amount of first processing unit or the second processing unit current executed, as the running burden.According to running burden and initial power consumption estimated value, dynamically adjust the power consumption pattern of first processing unit or second processing unit in step 25.In the temperature of step 26 detection. electronics,, dynamically change the power consumption estimated value according to temperature, thermometer and power consumption temperature correspondence table.
Fig. 3 is the first embodiment process flow diagram of temperature-controlled process of the present invention.Among the figure; This temperature-controlled process is applicable to computer installation; It comprises CPU chip, graphics processing unit chip, fan and temperature inductor, and the method comprises the following step: in step 31, judge whether present computer installation has reached system's critical point; For example whether the temperature of computer installation has been higher than critical temperature at present, and so-called critical temperature is the temperature that computer installation can receive permanent lesion.If reached system's critical point, then produce warning message, and the system effectiveness of computer installation is dropped to minimum in step 38, receive permanent lesion to avoid computer installation; If do not reach system's critical point, then, then judge that in step 33 whether detected temperature is greater than current heat radiation bearing temperature in the temperature of step 32 detection computations machine.If greater than current heat radiation bearing temperature, represent that present radiating rate produces the speed of heat energy not as good as computer installation, so, for example improve rotation speed of the fan in step 34 raising heat radiation grade; If, for example reduce rotation speed of the fan in step 35 a reduction heat radiation grade.
Then, judge whether to need to carry out temperature control mechanism, let computer installation can obtain best balance in temperature and usefulness in step 36; If need not carry out temperature control mechanism, then get back to step 31; If need to carry out temperature control mechanism, carry out temperature control mechanism in step 37, get back to step 31 after the end.
Fig. 4 is the second embodiment process flow diagram of temperature-controlled process of the present invention.Among the figure, this temperature-controlled process is applicable to electronic installation as shown in Figure 1.Step 41 obtains the power consumption estimated value with lookup table mode.For example, preset initial temperature is interval, finds the interval power consumption estimated value of corresponding this initial temperature from power consumption temperature correspondence table 152 (for example tables two) again.Then, detect the running burden of first processing unit 11 and second processing unit 12 in step 42.In the power consumption pattern of step 43 according to detected running burden adjustment first processing unit 11 and second processing unit 12.
Whether total power consumption of step 44 detection. electronics is greater than the power consumption estimated value; If greater than the power consumption estimated value; Represent that then the power consumption mode adjustment that step 43 is carried out is not preferable as yet; So execution in step 43 is readjusted the power consumption pattern of first processing unit 11 and second processing unit 12 again, be lower than the power consumption estimated value up to total power consumption of electronic installation 1.Then, judge in step 45 whether the temperature of electronic installation has reached need and improved the heat radiation grade.In this step, observe step 43 adjustment result and whether cause temperature to rise.If judge and need not improve the heat radiation grade, then execution in step 47; If judgement needs raising heat radiation grade, then execution in step 46 is selected higher temperature range, and execution in step 41 is tabled look-up and obtained new power consumption estimated value again again, further dynamically to adjust the power consumption pattern of first processing unit 11 or second processing unit 12.
Judge in step 47 whether the temperature of electronic installation 1 has reached and need to reduce the heat radiation grade,, then postpone behind the Preset Time execution in step 45 again if judge and need not reduce the heat radiation grade; If judgement needs to reduce the heat radiation grade; Then taken into account the usefulness and the temperature of electronic installation 1 effectively after the power consumption pattern of expression adjustment first processing unit 11 and second processing unit 12,, then judged whether to need to continue this temperature control in step 49 so select lower temperature range in step 48; For example can first preset temperature control start threshold value; If temperature still starts threshold value greater than temperature control at present, then judge and continue this temperature control, execution in step 41; Otherwise, then finish this temperature control.
The above is merely for example, but not limitation of the present invention.Anyly do not break away from spirit of the present invention and category and, all should be contained in the scope of the present invention its equivalent modifications of carrying out or change.
Claims (14)
1. temperature-controlled process; Be applicable to electronic installation; It is characterized in that; This electronic installation comprises first processing unit, second processing unit and temperature detecting unit, and this first processing unit and this second processing unit have at least two power consumption pattern respectively, and described temperature-controlled process comprises following steps:
Power consumption temperature correspondence table is provided, this power consumption temperature correspondence table at least two temperature ranges of record and corresponding power consumption estimated value;
Set the initial temperature interval value;
Inquire initial power consumption estimated value according to this initial temperature interval value from this power consumption temperature correspondence table;
Detect the running burden of this first processing unit or this second processing unit;
According to this running burden and should initial power consumption estimated value,, be lower than the power consumption estimated value until total power consumption of electronic installation if total power consumption of electronic installation greater than the power consumption estimated value, is dynamically adjusted the power consumption pattern of this first processing unit or this second processing unit; And
Detect a temperature of this electronic installation, according to this temperature and the temperature correspondence table that should consume energy, dynamically changing should the power consumption estimated value.
2. temperature-controlled process as claimed in claim 1 is characterized in that, wherein this first processing unit is the CPU chip.
3. temperature-controlled process as claimed in claim 1 is characterized in that, wherein this second processing unit is the graphics processing unit chip.
4. temperature-controlled process as claimed in claim 1 is characterized in that, the step that wherein detects the running burden of this first processing unit or this second processing unit comprises:
Detect number of applications, Application Type or the current sinking amount of this first processing unit or this second processing unit current executed.
5. temperature-controlled process as claimed in claim 1 is characterized in that, it further comprises following steps:
Whether total power consumption of judging this electronic installation surpasses initial power consumption estimated value; If total power consumption of this electronic installation surpasses the estimated value that should initially consume energy, readjust the power consumption pattern of this first processing unit or this second processing unit.
6. temperature-controlled process as claimed in claim 1 is characterized in that wherein this electronic installation further comprises heat-sink unit, and this temperature-controlled process further comprises the step of the heat radiation grade of controlling this heat-sink unit.
7. temperature-controlled process as claimed in claim 1 is characterized in that, it further comprises following steps:
After the power consumption pattern of this first processing unit of adjustment or this second processing unit, detect the temperature of this electronic installation; And
According to this temperature, dynamically adjust the power consumption pattern of this first processing unit or this second processing unit again.
8. an electronic installation is characterized in that, comprises:
First processing unit has at least two power consumption patterns;
Second processing unit has at least two power consumption patterns;
Heat-sink unit, the heat energy of diffusing this electronic installation of row;
Temperature detecting unit detects the temperature of this electronic installation;
Storage element stores power consumption temperature correspondence table, this power consumption temperature correspondence table at least two temperature ranges of record and corresponding power consumption estimated value; And
Temperature control unit; Inquire initial power consumption estimated value according to the initial temperature interval value from this power consumption temperature correspondence table; And detect the running burden of this first processing unit or this second processing unit, again according to this running burden and should initial power consumption estimated value, if total power consumption of electronic installation is greater than the power consumption estimated value; Dynamically adjust the power consumption pattern of this first processing unit or this second processing unit; Total power consumption until electronic installation is lower than the power consumption estimated value, and according to this temperature and the temperature correspondence table that should consume energy, dynamically changing should the power consumption estimated value.
9. electronic installation as claimed in claim 8 is characterized in that, wherein this first processing unit is the CPU chip.
10. electronic installation as claimed in claim 8 is characterized in that, wherein this second processing unit is the graphics processing unit chip.
11. electronic installation as claimed in claim 8; It is characterized in that wherein the running of this first processing unit or this second processing unit burden comprises number of applications, Application Type or the current sinking amount of this first processing unit or this second processing unit current executed.
12. electronic installation as claimed in claim 8; It is characterized in that; Wherein this temperature control unit judges further whether total power consumption of this electronic installation surpasses initial power consumption estimated value; If total power consumption of this electronic installation surpasses the estimated value that should initially consume energy, readjust the power consumption pattern of this first processing unit or this second processing unit.
13. electronic installation as claimed in claim 8 is characterized in that, this heat-sink unit is a fan.
14. electronic installation as claimed in claim 8; It is characterized in that; Described temperature control unit is after the power consumption pattern of this first processing unit of adjustment or this second processing unit; The temperature of temperature detecting unit detection. electronics, and said temperature control unit is dynamically adjusted the power consumption pattern of this first processing unit or this second processing unit again according to the temperature of this electronic installation of this temperature detecting unit detection.
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| CN2010100051359A CN102129285B (en) | 2010-01-14 | 2010-01-14 | Temperature control method and electronic device |
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| CN2010100051359A CN102129285B (en) | 2010-01-14 | 2010-01-14 | Temperature control method and electronic device |
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| CN102129285A CN102129285A (en) | 2011-07-20 |
| CN102129285B true CN102129285B (en) | 2012-11-28 |
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| CN104182015B (en) * | 2013-05-23 | 2018-04-27 | 联想(北京)有限公司 | The method and a kind of electronic equipment of a kind of information processing |
| US20150148981A1 (en) * | 2013-11-24 | 2015-05-28 | Qualcomm Incorporated | System and method for multi-correlative learning thermal management of a system on a chip in a portable computing device |
| CN106959628B (en) * | 2016-01-08 | 2021-04-02 | 中兴通讯股份有限公司 | Method and terminal for realizing heating control |
| CN106803791B (en) * | 2016-12-21 | 2019-09-17 | 瑞斯康达科技发展股份有限公司 | A kind of temperature controlled method and apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6014611A (en) * | 1995-05-30 | 2000-01-11 | Kabushiki Kaisha Toshiba | Cooling mode switching system for CPU |
| CN1369759A (en) * | 2001-02-12 | 2002-09-18 | 英业达股份有限公司 | System and method for instantaneously controlling temp of CPU for notebook computer |
| TW201001157A (en) * | 2008-06-30 | 2010-01-01 | Acer Inc | Power management device and method thereof for saving power consumption of electronic device |
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2010
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6014611A (en) * | 1995-05-30 | 2000-01-11 | Kabushiki Kaisha Toshiba | Cooling mode switching system for CPU |
| CN1369759A (en) * | 2001-02-12 | 2002-09-18 | 英业达股份有限公司 | System and method for instantaneously controlling temp of CPU for notebook computer |
| TW201001157A (en) * | 2008-06-30 | 2010-01-01 | Acer Inc | Power management device and method thereof for saving power consumption of electronic device |
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