CN102126369A - Method for manufacturing object containing functional elements, transfer printing process and object - Google Patents
Method for manufacturing object containing functional elements, transfer printing process and object Download PDFInfo
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- CN102126369A CN102126369A CN2010100046543A CN201010004654A CN102126369A CN 102126369 A CN102126369 A CN 102126369A CN 2010100046543 A CN2010100046543 A CN 2010100046543A CN 201010004654 A CN201010004654 A CN 201010004654A CN 102126369 A CN102126369 A CN 102126369A
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Abstract
The invention relates to a method for manufacturing an object with functional elements which are embedded in the top surface of the object, a transfer printing process and the object. The object is formed by molding, impressing, superposing or a combination of molding, impressing and superposing. The functional elements comprise any electronic or mechanical elements capable of executing a function.
Description
Technical field
The present invention relates to a kind of object, its manufacture method, transfer printing process that is embedded in its surperficial functional element and object of processing through this transfer printing process of comprising.
Background technology
At present, be directed to a kind of object with functional element, this object separates manufacturing with functional element and two members then are assembled together.The element of this kind object needs mechanically integrated or superimposed usually, and therefore it is implemented for pursuing to criticize.In other words, this kind object can't be by a kind of continuation method manufacturing.In addition, mechanically integrated or folding method typically cause between object and functional element big gap and in the gross thickness of object or the increase of volume.As a result, present method is not only consuming time and also be labour-intensive.In addition, in order to meet the expectation specification, such as: style, small and exquisite property, durability, be important further feature for handheld apparatus, present method may be high cost.
Transfer printing process is to utilize pressure transfer to the object of institute's desire printing the picture and text on the bearing bed, and increases the variability of article outward appearance.For protecting the picture and text that are transferred on the object, traditional practice is behind transfer printing process, carries out spraying operation and forms a diaphragm.Yet spraying operation not only can cause the pollution on the environment, and wastes a large amount of sprayed on material, increases to produce required cost.Because traditional transfer printing process has above-mentioned defective, (In-Mold Decoration IMD) becomes the another kind selection technology of the picture and text that form body surface to decoration technique inside mold then.For the object with non-planar surface, if use traditional in-mold transfer printing technology, the picture and text be full of cracks, the transfer film that occur transfer printing in the big corner of object easily produce problems such as there being bubble between gauffer and transfer film and the object.In addition, for example ejection formation, hot forming method, compression forming method, the modes such as the spray method of forming, injection molding method, extrusion modling of blowing combine the object of plastic material with transfer film for traditional in-mold transfer printing technology.Generally need under the process conditions of high temperature and high pressure, carry out, may cause the functional element that is arranged in the transfer film impaired or influence its reliability.
Summary of the invention
First viewpoint of the present invention is the object that has at least one functional element that is embedded in its top surface at a kind of.This object also can have the ornamental design (for example: literal or image) that comes across on the object, display floater or the two.
Second viewpoint of the present invention is at (in-mold) transfer membrane or paper tinsel in a kind of mould.
The 3rd viewpoint of the present invention is at inserting film or paper tinsel in a kind of mould.
The 4th viewpoint of the present invention is the method at the object that is used to make first viewpoint of the present invention.
When a functional element is embedded in an object surfaces, gapless is integrated the outward appearance that produces very attractive.Functional element can be in compliance with the shape of object, even should the surface be crooked.As a result, functional element can be revealed as an integral part of this object.
The present invention also proposes a kind of transfer printing process, comprising: place an object on a manufacturing platform; Place a transfer film on object; With instrument heating pressurization transfer film, make transfer film be subjected to the part of instrument heating pressurization to be attached at object; Transfer film and object are positioned over a reative cell; And bleed, and make transfer film not be subjected to the part of instrument heating pressurization to be attached at object so that reative cell is vacuum state.
In an embodiment of transfer printing process of the present invention, transfer film comprises a temporary transient bearing bed, a releasing layer, a functional element and a following layer.Releasing layer is disposed on the temporary transient bearing bed.Functional element is disposed on the releasing layer.Following layer is disposed on the releasing layer.When transfer film was placed on the object, functional element and following layer were between object and temporary transient bearing bed.In addition, transfer film can also comprise a durable layer.Durable layer is disposed on the releasing layer, and functional element and following layer are disposed on the durable layer.In addition, after making transfer film not be subjected to the part of instrument heating pressurization to be attached at object, transfer printing process can more comprise temporary transient bearing bed and releasing layer are removed, and durable layer, functional element and following layer are remained on the object.Transfer film can also comprise an ink lay, and printing ink is disposed at releasing layer and covering function element, and following layer is disposed on the ink lay.
In an embodiment of transfer printing process of the present invention, placing transfer film before on the object, transfer printing process also is included in and places a functional element on the object.Functional element is between transfer film and object.
In an embodiment of transfer printing process of the present invention, functional element is an integrated circuit.
In an embodiment of transfer printing process of the present invention, the step that heats the pressurization transfer film with instrument is with directed roll extrusion of a roller and heating transfer film.
In an embodiment of transfer printing process of the present invention, the step that heats the pressurization transfer film with instrument is to carry out in 80 ℃ to 250 ℃.
In an embodiment of transfer printing process of the present invention, to bleed so that reative cell when being vacuum state, the temperature of reative cell is 50 ℃ to 300 ℃.
In an embodiment of transfer printing process of the present invention, manufacturing platform has anchor clamps, in order to after the placement transfer film is on object, transfer film is fixed on the object.
In an embodiment of transfer printing process of the present invention, it is a flat surfaces that is attached at object that transfer film is subjected to the part of instrument heating pressurization, and transfer film is not subjected to the part of instrument heating pressurization to be attached at a non-planar surface of object.The angle of the junction of flat surfaces and non-planar surface is spent to 90 degree between 10.
In an embodiment of transfer printing process of the present invention, manufacturing platform has a vacuum pipe, bleeds so that reative cell is the step of vacuum state is to bleed by vacuum pipe.
The present invention also proposes a kind of object, through aforementioned transfer printing process processing.In addition, the material of the part that contacts with transfer film of this object for example is the combination that is selected from Merlon, polypropylene, acryl, styrene methyl methacrylate copolymer, acrylonitrile-butadiene-phenylethylene, polystyrene, PETG, polyacetals or these materials.
The application that has broad variety by the object that the present invention produced.For example, this object can be touch-type or push type panel, colour filter, backlight, loudspeaker, microphone, clock, wrist-watch, the radio panel, mobile phone, the digital camera housing, the personal digital assistant housing, the mobile computer housing, the desktop PC housing, the touch panel housing, television housing, the global positioning system housing, automobile-used display housing, the aviation display housing, the digital frame housing, the DVD player housing, cosmetic container, toy, fascia, the radio housing, credit card or smart card and other case of electronic device.This person of listing is obviously non-to be had no to omit.Other application will be understood by being familiar with this skill personage in view of the following description, and so it is for all being covered by in the category of the present invention.
Description of drawings
Fig. 1 is the vertical view of a kind of object of the present invention.
Fig. 2 a is a kind of mould in-mold transfer films of functional element or cross-sectional view of paper tinsel of comprising.
Fig. 2 b is a kind of interior cross-sectional view that inserts film or paper tinsel of mould that comprises functional element.
Fig. 3 a is a kind of cross-sectional view that relates to the injection molding method of mould in-mold transfer films or paper tinsel.
Fig. 3 b is a kind of cross-sectional view that inserts the injection molding method of film or paper tinsel in the mould that relates to.
Fig. 4 a and Fig. 4 b illustrate a kind of object of the present invention, and it has inner chamber.
Fig. 5 is the flow chart of the transfer printing process of one embodiment of the invention.
Fig. 6 to Fig. 9 shows the part steps of the transfer printing process of Fig. 5.
Figure 10 shows the transfer film of another embodiment of the present invention.
Figure 11 is the flow chart of the transfer printing process of another embodiment of the present invention.
Figure 12 shows the part steps of the transfer printing process of Figure 11.
Wherein, description of reference numerals is as follows:
10 objects
11 functional elements
12 decorative elements
20 mould in-mold transfer films or paper tinsels
21,21a bearing bed
22 releasing layers
23 durable layers
24 functional elements
25 stick together or fasten coating layer
30 moulds
31,31a bearing bed
32 releasing layers
33 durable layers
34 functional elements
35 adhesion layers
36a mold cavity portion
The 36b object
40 objects
41 perforates or groove
42 functional elements
44 deflection cables
45 electric conductivity adhesive agents
46 button plugs
S10～S70 step
50 objects
52 flat surfaces
54 non-planar surface
60 manufacturing platforms
62 anchor clamps
64 vacuum pipes
70 moulds
80 instruments
90 reative cells
100 transfer films
110 temporary transient bearing beds
120 releasing layers
130,132 functional elements
140 following layers
160 durable layers
170 ink laies
The specific embodiment
Term " functional element " mentioned in these application documents broadly comprises any electric or mechanical organ that can carry out a function.The example of described functional element can comprise (and not being subject to): optical component, Optical devices, waveguide, the electronics design (such as: the electric wire of electric conductivity or semiconduction), electronic component (such as: integrated circuit, printed circuit, transistor, diode, resistor, inductor, capacitor, antenna, the RFID transceiver, battery, solar cell, light emitting diode (LED), with other diode that is not limited to LED, Organic Light Emitting Diode (OLED)), display member, member backlight, loudspeaker, microphone, button, touch panel, the touch-type pad, connector and similar member.
In situation of the present invention, being intended to of term " embed (embedded) in top surface " pointed out: when object forms but not after object formed, functional element was integrated into the top surface of object; Functional element is not to be installed within the object.
Fig. 1 shows a kind of object 10 that comprises a functional element 11 that is embedded in its surface.As shown in the figure, this object can be from a side of functional element and is watched.Or this object can be watched from opposition side, and in this kind situation, functional element will be for invisible for the beholder.
Also may there be the decorative element 12 that comes across on the object, a display element (not shown) or the two.
There is multiple different exercisable method, to embed a functional element in an object surfaces.Hereinafter provide two examples.Though utilization term " mould in ", need be appreciated that: the present invention may extend to following method, such as impression, superimposed, heating shaping, injection molding, compression molded, blow a jet mould system or a combination of impression or superimposed and method of moulding.
(I) mould in-mold transfer films or paper tinsel
In a mode, a kind of mould in-mold transfer films that comprises a functional element or paper tinsel are at first preparing.
Fig. 2 a is the cross-sectional view of this kind mould in-mold transfer films or paper tinsel 20, and mould in-mold transfer films or paper tinsel 20 comprise a bearing bed 21, a releasing layer 22, and select for use formula durable layer 23, a functional element 24 and to stick together or fasten coating layer 25.
Releasing layer 22, durable layer 23 (if existence), with adhesion layer 25 coating in regular turn or superimposed in bearing bed 21, and these different layers collective for explanation easily and in these application documents is called " mould in-mold transfer films or paper tinsel ".
Exist when there is no durable layer, functional element 24 is present between releasing layer 22 and the adhesion layer 25.This can be by being reached to releasing layer or to adhesion layer to apply this functional element before forming a mould in-mold transfer films or paper tinsel in each layer coating in regular turn.
When durable layer existence, functional element can be applied to a durable layer coating film.Functional element can be present between releasing layer and the durable layer or between durable layer and adhesion layer.
Substitute, can use to have a kind of composite membrane that is located in the functional element between two adhesion layers, with superimposed in releasing layer or durable-discharge coating film.Need described two adhesion layers, this is because one of them of two adhesion layers guaranteed the tackness between composite membrane and releasing layer or durable-release film, and wherein another guaranteed the tackness between composite membrane and injection molding resin.The latter's adhesion layer is actual to be adhesion layer 25 in Fig. 2 a.Composite membrane reality is as a supporting layer of mould in-mold transfer films or paper tinsel as described.
Functional element to discharge, durable-release film, stick together or fasten coating layer apply can by deposit such as printing, coating, sputter, steam, spray, electroplate, paste, etching, superimposed or similar method reach, also can reach by any combination of these methods.In an embodiment, functional element can form and then be transferred to this layer earlier.In another embodiment, functional element can be formed directly in to this layer.But in arbitrary situation, the flatness of object surfaces and smoothness should not be affected owing to the existence of functional element.
Transfer method in mould, mould in-mold transfer films or paper tinsel are fed to a mould, and make bearing bed 21 be contacted with die surface, as in shown in Fig. 3 a.Bearing bed 21 is generally has thickness from about 3.5 microns extremely about 200 microns thin plastic foils.Polyethylene terephthalate (PET, polyethylene terephthalate), poly-naphthalenedicarboxylic acid ethyl ester (PEN, polyethylene naphthalate) (PC, polycarbonate) film is preferable because of its low cost, the high grade of transparency and thermo-mechanical robust degree with Merlon.
It is that the mode of minimum discharges from this bearing bed with the damage for functional element that releasing layer 22 allows functional elements 24, and can adopt a fully automatic migration volume process during molded.
Releasing layer prepares usually from such as a low surface tension coating of a material of wax, paraffin or poly-silica or prepare the level and smooth impervious coating of doing from such as a material of the multi-functional yl methacrylates of radiation-curable, poly-silica acrylate, epoxides, vinyl esters, pi-allyl and vinylation thing, undersaturated polyester or its mixture of height.Releasing layer can comprise a kind of condensation polymer, co-polymer, mixture or the compound of the group that is selected from epoxides, Polyurethane, polyimides, polyamide, melamino-formaldehyde, ureaformaldehyde, is formed with phenol formaldehyde.
The another kind of releasing layer constituent that is fit to is disclosed in U.S. Patent Publication case 2005-0255314 number, its content with reference pattern integral body include in this paper.In brief, this kind releasing layer comprises a co-polymer or interspersed network (IPN, interpenetration network), and it is formed by a constituent that comprises an amine aldehyde condensate and a free radical mortifier or quencher (quencher).
Durable layer 23 (if existence) is as the protective layer for functional element 24.The raw material that is applicable to durable layer can include, without being limited to: the multi-functional yl methacrylates of radiation-curable, and it comprises epoxy acrylate, Polyurethane acrylate, polyester acrylate, poly-silica acrylate, glycidyl acrylate; Epoxides; Vinyl esters; The diallyl phthalic acid; Vinethene; And composition thereof.Durable layer can comprise a condensation polymer or co-polymer, such as: epoxides, Polyurethane, polyamide, polyimides, melamino-formaldehyde, ureaformaldehyde or phenol formaldehyde.Durable layer can comprise a sol-gel (sol-gel) silicate or titanium ester.
Durable layer can partially or completely solidify.If partly solidified, curing schedule will be used in after molded and/or the transfer step after one, to strengthen durability, particularly: hardness, anti-scratch power and grease resistance.
Desire improvement releasing properties, raw material (the particularly low molecular weight compositions of durable layer) is preferably impermeable to releasing layer.After coating and curing or partly solidified durable layer, it should be inadequate phase and perhaps is not compatible with releasing layer.The additive that binder reaches such as thickener, surfactant, dispersant, UV stabilization agent or antioxidant can use, with control rheological characteristic, wettability, coating character, weatherability and ageing property.Such as silica, Al
2O
3, TiO
2, CaCO
3, microcrystal wax or polyethylene, Teflon or other lubricated particle filler also can add, with the improvement for example anti-scratch power and the hardness of this durable layer.The thickness of durable layer is generally about 2 microns to about 20 microns, and is preferably about 3 microns to about 12 microns.Durable layer (if existence) is preferable to be transparent in window zone.
Except above-mentioned material, be directed to other constituent that is fit to of selecting the formula durable layer for use and be disclosed in U.S. Patent Publication case 2005-0181204,2005-0171292 and 2006-0093813 number, its content with reference pattern integral body include in this paper.For example, the U.S. Patent Publication case discloses a kind of durable layer constituent for 2005-0181204 number, and it comprises: a thermally cross-linkable and photochemistry maybe can connect the multiple functional radical monomer or the oligomer of polymer, a thermal cross-linking agent and a radiation-curable of free radical; The U.S. Patent Publication case discloses a kind of durable layer constituent for 2005-0171292 number, and it comprises: have at least one the carbonyl acid that is used for heat cross-linking or anhydride-functional base and the crosslinked functional group's of at least one UV a polymer or co-polymer; And the U.S. Patent Publication case discloses a kind of durable layer constituent for 2006-0093813 number, and it comprises: an amido crosslinking agent, the UV-curable monomer with at least one functional group who reacts on the amido crosslinking agent or oligomer, an acid catalyst, an and light trigger.
The thickness of adhesion layer can be from about 1 micron to about 20 microns scope, be preferably from about 2 microns to about 6 microns scope.
(II) insert film or paper tinsel in the mould
Fig. 2 b is a schematic cross section of inserting film or paper tinsel in a kind of mould.In this situation, bearing bed 21a will be after impression, a superimposed or method of moulding and become the part of finishing product.Functional element 24 can be applied to bearing bed 21a by the adhesion layer (not shown) of selecting formula for use, and is covered in the opposite side of the functional element adhesive agent 25 with a heat fused or thermal activation.The adhesion layer that is applied to carrier film is not always to need, because functional element can be adhered to carrier film by itself.
For easy explanation, different all layers collective in these application documents is called " inserting film or paper tinsel in the mould ".
Insert film in the mould of the mould in-mold transfer films of above-mentioned paragraph (I) or paper tinsel or paragraph (II) or paper tinsel can be the form of monolithic (sheet) or be the form of a volume (roll).
(III) manufacturing of object
Transfer method in a kind of typical mould has been described in Fig. 3 a.In method of moulding, mould in-mold transfer films or paper tinsel are on a volume that is fed continuously to a molding machine or net (web).Mould 30 can be a kind of injection or the compression mould that is used for object 36b.During molded, the closed and plastics that be used to form the fusing of object of mould are injected into the 36a of mold cavity portion by injecting nozzle and runner.After molded, functional element and durable layer (if existence) are transferred on the molded object.Molded object removes from this mould.Bearing bed 31 is removed simultaneously with releasing layer 32, stays durable layer 33 (if existence) in the top layer of object surfaces, and functional element 34 embeds below it and as the integral part of object.Layer 35 is an adhesion layer.
If durable layer do not exist, functional element will be for exposing and it can be and is connected directly to a power supply or other electronic component.If durable layer exists, on durable layer, may have the hole, functional element is wired to a power supply or other electronic component by each Kong Erke.
Desire to be beneficial to the mould that is aligned to of transfer membrane or paper tinsel, this volume or net can be printed on alignment mark in advance and be fed continuously to mould, and aim at by a for example optical pickocff.
In a kind of mould shown in Fig. 3 b in the insertion method, insert film or paper tinsel in the mould and at first be cut into a suitable size and shape and then be inserted into a mould 30.Insertion film or paper tinsel as shown are the mold wall portion that is placed in the mould, can be selected under the vacuum.Film or paper tinsel can be manual storing and can use static to be beneficial to its insertion, or mechanizable insertion.The insertion of mechanization is particularly conducive to a large amount of productions.
The bearing bed 31a that inserts film or paper tinsel is contacted with the inner wall surface of this mould.Mould is then closed, and the plastics that are used to form the fusing of object 36b are injected into the 36a of mold cavity portion by injecting nozzle and runner.Bearing bed 31a in this situation can become the integral part of finishing product.Select for use, inserting film or paper tinsel can be before being inserted into mould and add certain shape of thermosetting and with die-cut (die cut).
Be applicable to and form object in impression, the example of the plastic material of superimposed or method of moulding can include, without being limited to: thermoplastic, such as polystyrene, polyvinyl chloride, acrylic acid, polysulfones, poly-aryl ester, polypropylene oxide, polyolefin, acrylonitrile-butadiene-styrene (ABS) co-polymer (ABS, acrylonitrile-butadiene-styrene), methacrylate-acrylonitrile-butadiene-styrene (ABS) co-polymer (MABS, methacrylate-acrylonitrile-butadiene-styrene), Merlon, PA polybutyleneterephthalate (PBT, polybutylene terephthalate), polyethylene terephthalate (PET), Polyurethane, with other thermoplastic elastomer (TPE) or its mixture; And thermosets, such as Polyurethane, epoxy resin, unsaturated polyester (UP), vinyl esters or its compound, preimpregnation thing (prepreg) and the mixture of reaction injection molding grade.
Wherein any the mould that applies to the manufacture method of these two kinds of forms must be designed to make functional element to insert or shift.Gate position must allow to be pressed on the functional element mold cavity portion and shift to guarantee suitable heat.Moreover mould must be designed to make the functional element after molded can be connected to a power supply easily.In addition, mould flow and filler analysis should be before mold materials cuttings and carry out.One mold cools down analysis also should be considered, so that the focus in mould is minimum.At last, mold temperature and pressure are set the existence that must consider this functional element.
Fig. 4 a has the cross-sectional view of a kind of solid body that is embedded in its surperficial functional element.Object 40 can have connection chamber portion, and its form is as shown in the figure in the perforate or the groove 41 of body, is connected to a power supply to allow functional element 42.Functional element to being connected to by all holes or groove of power supply arranged route.
The connection fittings of the deflection of one deflection cable 44 or other form can be attached to functional element by the adhesive agent 45 or the mechanical type clamping of electric conductivity, the adhesive agent 45 of electric conductivity is such as being: anisotropic conducting film (ACF, anisotropic conductive film), pressure sensitive adhesive agent of electric conductivity (PSA, pressure sensitive adhesive) or silver coating.
Fig. 4 b has illustrated a kind of button (snap-in) plug 46, and it can and then insert with firm faying face, and strengthens the reliability that is connected between functional element and the power supply.
By blowing that jet mould system or heating be shaped to form object of the present invention also is possible, to set up an inner chamber that holds circuit.Be directed to by blowing jet mould system or heating shaping to make an object, transfer or insertion film or paper tinsel are put to a dozen die sinking tools earlier, and remain in the location by for example vacuum or tension force, and then closing molding.The plastic material that is used to form object is sprayed onto in the mould for heating is shaped or blows.As being same as injection or compression molded method, functional element is embedded in molded body surface.
The body surface that forms can have the feature of anti-dazzle, antireflection or tarnish, gloss or asperities.For example, surface characteristics can be reached by the surface design or the processing of mould itself.Substitute, surface characteristics can be reached by the chemical etching or the sandblast that are rendered in bearing substrate, this be when releasing layer for not existing, this allows this bearing substrate to keep top surface as molded object.During injection molding, surface characteristics is transferred to molded object.
After injection molding and apply surface characteristics to molded object also for may.For example, having coarse and transfer layer glassy surface can be superimposed on molded object, to transmit superficial makings to this object surfaces.In this situation, transfer layer can have by sand paper, non-woven fabric or materials similar or by sandblast or the formed matsurface of chemical etching, and has by printing the formed thereon glassy surface of a resin bed.Substitute, the matsurface of transfer layer can form by printing one printing ink on the plastic foil of gloss.Further substitute, the surface characteristics of molded object can be by coating one roughness transfer membrane thereon to set up rough region, and subsequent section coating one transparent transfer membrane is reached to set up the gloss zone in this rough region.The roughness transfer membrane can have a thin metal film layer so that the texture of expectation to be provided.At first by a thin metal film layer the whole surface of part coating, subsequently form a resist layer in this metal film will reservation place the zone, by acid or alkali and etching should the surface and removes this resist layer at last, the roughness that can also reach expectation is in the surface of a molded object.
(IV) functional element
When utilization, object can remain on this functional element and be seen or invisible mode by the user.
As mentioned above, be applicable to that functional element of the present invention can comprise any electric or mechanical organ that can carry out a function.
By all methods such as superimposed, plating, sputter, vapor deposition, vacuum moulding machine or its combination, can apply releasing layer, durable layer (if existence) or stick together or fasten coating layer such as the electronics design of the electric wiring of electric conductivity or semiconduction, or be applied to the bearing bed that inserts film or paper tinsel in the mould as for mould in-mold transfer films or paper tinsel.
In an embodiment, relate to a kind of utilization of photetching impression method in the pattern of the electric conductivity of substrate layer or semiconduction.This also can reach by direct printing, such as: silk screen, intaglio plate or rubber boat or lithographic printing.
Substitute, the formation of the pattern of electric conductivity or semiconduction can by as reach in the open case 2003-0203101 of United States Patent (USP) bulletin and any method of being disclosed for US 2004-0131779 number, the content of these two bulletins with reference pattern integral body include in this paper.
For example, the formation of the pattern of electric conductivity or semiconduction can be implemented by a kind of " erect image printing " method.In this kind method, one " erect image " builds on the durable layer (if exist) of a mould in-mold transfer films or paper tinsel or in sticking together or fasten the bearing bed that inserts film or paper tinsel in coating layer or the Yu Yimo, and this is by being printed on zone corresponding to an expectation pattern with being difficult to divest material from this layer.But any printing ink or printing material can use, and it has and is characterised in that: the electric conductivity of subsequent deposition or the film of semiconduction compared to its be attached to this layer and more brute force be attached to this printing ink or printing material.Printing can be implemented by any printing technology, such as: rubber boat, dry offset (driographic), electrofax or lithographic printing.Other printing technology is also applicable, such as: impression, serigraphy, intaglio printing, ink jet printing or heating printing.After " erect image " formed, the material of electric conductivity or semiconduction was deposited on the surface of the patterning of this layer.After the deposition of the material of electric conductivity or semiconduction, but do not removing to appear pattern with a kind of process for stripping by printing ink or the electric conductivity of printing material institute overlay area or the material of semiconduction.This divests and can implement by using a kind of solvent (it can be a water-based or organic solvent) that divests, and divests solvent and can remove the electric conductivity that directly is formed at this layer or the material of semiconduction.Substitute, this divests and can implement mechanically.
Also can implement by a kind of " negative-appearing image printing " method, at the durable layer of a mould in-mold transfer films or paper tinsel or stick together or fasten the pattern that the bearing bed that inserts film or paper tinsel in coating layer or the Yu Yimo forms electric conductivity or semiconduction.In this kind method, a shielding coating or printing ink at first are printed in this layer to set up one " negative-appearing image " of desired pattern.In other words, shielding coating or ink printing in this electric conductivity or semiconduction material with non-existent zone.Essence, ink logo is as the shielding at subsequent deposition electric conductivity or semiconduction material.Any suitable printing technology can be used with printed negative image in this layer, such as: rubber boat, dry offset, electrofax or lithographic printing.Use in some, other printing technology is applicable, such as: impression, serigraphy, intaglio printing, ink jet printing or heating printing, decide on desired resolution ratio.After " negative-appearing image " formed, the material of electric conductivity or semiconduction was deposited on the surface of the patterning of this layer.In an embodiment, the utilization vapor deposition with the material of depositing electrically conductive or semiconduction in the patterned side of this layer.In an alternate embodiment, the material of electric conductivity or semiconduction deposition is that material by sputter coating electric conductivity or semiconduction is in the patterned side of this layer.Shielding coating or printing ink divest the patterned side of this layer that the material from this electric conductivity or semiconduction deposited at last.The divesting of coating/printing ink has effect and is: divest formed printed negative image, and divest and be deposited on this layer the electric conductivity in zone of coating/printing ink or the material part of semiconduction are arranged.As a result, divest solvent and can divest this coating/ink logo and be formed at this coating/electric conductivity of ink logo top surface or the material of semiconduction, even strip step is carried out after the material deposition of this electric conductivity or semiconduction.
The pattern of electric conductivity or semiconduction can use as the cross tie part between at least two functional elements, or as the connection line that is directed to a functional element.The function of also practicable antenna of the pattern of electric conductivity or semiconduction or electromagnetic shielding.
Itself can be rigidity functional element, though it is preferably pliability/deformable.
(V) ornamental design applies
Literal and/or graphical design also can come across object surfaces.Modal design comprises: label title, sign or symbol or other ornamental design.
The conventional method that is used for additional decorative design comprises: serigraphy, printing, hot padding, superimposed and be coated with and paint.These methods always are the operation after molded, and it needs extra treatment step.
In recent years, used alternative trailing, such as inserting film or paper tinsel in above-described mould in-mold transfer films or paper tinsel or the mould.Ornamental design and functional element can all be present in this film or the paper tinsel.For example, ornamental design can be printed in a suitable layer that shifts or insert film or paper tinsel in the mould.The material that is fit to that is used for ornamental design can comprise: printing ink, metal, metal oxide, inorganic powder or fellow.Ornamental design can be before or after functional element be attached to this film or paper tinsel and forms/print.
Ornamental design also can form by heating.In this situation, in a mould, an ABS, polystyrene or the heating of PVC sheet are shaped usually.Substitute, decorative layers can form by high-pressure forming, and this relates to the utilization pressure-air to produce ornamental design in a film.Decorative layers also can form by hydroforming, and wherein, a hydraulic pressure capsule (bladder) (and non-air) is as builder.
In a design, ornamental design is not overlapped in object surfaces with functional element.Substitute, ornamental design can be overlapping or overlap with functional element.For example, functional element can be the top that is positioned at a decorative pattern or part in its top, or functional element can be positioned at the below of a decorative pattern or part in its below.In latter's situation, decorative pattern as seen, and the functional element below decorative pattern is connected to wiring or connector.Can use any in these options, decide on desired application or effect.
Also for possible be: decorative pattern is positioned at two films that separate or paper tinsel with functional element.Have the film of decorative pattern or paper tinsel and be preferably and have a durable layer, and be directed to film or the paper tinsel with functional element, durable layer is for selecting formula for use.Before injection process, decorative film or paper tinsel and functional element film or paper tinsel are placed in the diverse location of mould.
(VI) display floater
One display floater also can exist for and be revealed on the object.Though all display forms are contained in the present invention, favourable is the display floater of utilization based on plastics, such as: distribution of polymer formula LCD (PDLC, polymer dispersed liquid crystal display), cholesterin liquid-crystal display (ChLCD, cholesteric liquid crystal display), organic light emitting apparatus (OLED, organic light emittingdevice), electrophoretic display device (EPD) (EPD, electrophoretic display), based on the LCD of plastics or based on the display of other particle.
Display floater can be superimposed in the top of body surface.Substitute, display floater also can be embedded in body surface.Be used to reach and embed a display floater and be disclosed in U.S. Patent Publication case 2005-0163940 number in the method for a body surface, its content with reference pattern integral body include in this paper.
Fig. 5 is the flow chart of the transfer printing process of one embodiment of the invention, and Fig. 6 to Fig. 9 is the part steps of the transfer printing process of Fig. 5.Please refer to Fig. 5 and Fig. 6, the transfer printing process of present embodiment is prior to placing an object 50, step S10 on the manufacturing platform 60.The material of object 50 for example is the combination that is selected from Merlon, polypropylene, acryl, styrene methyl methacrylate copolymer, acrylonitrile-butadiene-phenylethylene, polystyrene, PETG, polyacetals or these materials, also or other material.In addition, object 50 also can be that to have only the material of the follow-up part that will contact with transfer film be the combination that is selected from Merlon, polypropylene, acryl, styrene methyl methacrylate copolymer, acrylonitrile-butadiene-phenylethylene, polystyrene, PETG, polyacetals or these materials.When object 50 is when making with injection molding method, can select the mould 70 of object 50 with part together is positioned on the manufacturing platform 60.
Then, on object 50, place a transfer film 100, step S20 with reference to Fig. 5 and Fig. 7.Optionally, manufacturing platform 60 can have anchor clamps 62, after being placed on the object 50 at transfer film 100, transfer film 100 is fixed on the object 50.
Then,, make transfer film 100 be subjected to the part of instrument 80 heating pressurizations to be attached at object 50, step S40 with an instrument 80 heating pressurization transfer films 100 with reference to Fig. 5 and Fig. 8.The instrument 80 of present embodiment is to be example with a roller, and instrument 80 is with oriented approach roll extrusion and heating transfer film 100 on transfer film 100.Yet instrument 80 also can be other proper implements and be not defined as roller.Step with instrument 80 heating pressurization transfer films 100 in the present embodiment is to carry out in 80 ℃ to 250 ℃.In addition, to be subjected to the part of instrument 80 heating pressurization for example be a flat surfaces 52 that is attached at object 50 to transfer film 100.
Then, transfer film 100 and object 50 are positioned over a reative cell 90, step S50 with reference to Fig. 5 and Fig. 9.Then, bleed, and make transfer film 100 not be subjected to the part of instrument 80 (being illustrated in Fig. 8) heating pressurization to be attached at object 50, step S60 so that reative cell 90 is vacuum state.So far, roughly finish the transfer printing process of present embodiment.Bleeding so that reative cell 90 when being vacuum, the temperature of reative cell 90 for example is 50 ℃ to 300 ℃.This technological temperature is lower than the technological temperature of known decoration technique inside mold, can reduce the possibility of element damage.In addition, not to be subjected to the part of instrument 80 (being illustrated in Fig. 8) heating pressurization for example be a non-planar surface 54 that is attached at object 50 to transfer film 100.Flat surfaces 52 can be between 10 degree to 90 degree with the angle of the junction of non-planar surface 54.In other words, the transfer printing process of present embodiment not only can be transferred to transfer film 100 flat surfaces 52 of object 50, more transfer film 100 can be transferred to the non-planar surface 54 of object 50.Simultaneously, picture and text be full of cracks, the transfer film 100 that also is not prone to transfer printing produces problems such as there being bubble between gauffers and transfer film 100 and the object 50.In addition, manufacturing platform 60 for example has a vacuum pipe 64, makes reative cell 90 be vacuum to bleed by vacuum pipe 64.Manufacturing platform 60 can be to belong to same board with reative cell 90.
In the transfer printing process shown in the 5th figure, transfer film 100 (being shown in Fig. 6) can be illustrated mould in-mold transfer films or a paper tinsel of the embodiment of Fig. 2 a or Fig. 2 b.Perhaps, transfer film 100 also can not comprise the functional element 24 among Fig. 2 a.Or transfer film 100 also can be as shown in figure 10.
The transfer film 100 of Figure 10 comprises a temporary transient bearing bed 110, a releasing layer 120, a functional element 130 and a following layer 140.Optionally, transfer film 100 also can comprise a durable layer 160 and an ink lay 170.The material of temporary transient bearing bed 110, releasing layer 120, functional element 130, durable layer 160 and following layer 140 can be identical with the embodiment of Fig. 2 a.Functional element 130 can be an integrated circuit or other functional element.Releasing layer 120 is disposed on the temporary transient bearing bed 110.Durable layer 160 is disposed on the releasing layer 120, and functional element 130 is disposed on the durable layer 160 with ink lay 170, and functional element 130 can be embedded in ink lay 170.When transfer film 100 was placed on the object 50 (being shown in Fig. 6), temporary transient bearing bed 110 can be positioned at outermost.
Please refer to Fig. 5, Fig. 9 and Figure 10, after making transfer film 100 not be subjected to the part of instrument 80 heating pressurizations to be attached at object 50, temporary transient bearing bed 110 can be removed with releasing layer 120, and durable layer 160, ink lay 170, functional element 130 and following layer 140 remained on the object 50 step S70.
Figure 11 is the flow chart of the transfer printing process of another embodiment of the present invention, and Figure 12 is the part steps of the transfer printing process of Figure 11.Please refer to Figure 11 and Figure 12, the transfer printing process of present embodiment is similar to the transfer printing process of Fig. 5, and difference is in the transfer printing process of present embodiment, placing transfer film 100 before on the object 50, also is included in and places a functional element 132 on the object 50.Functional element 132 is between transfer film 100 and object 50.In other words, functional element 132 is not to be embedded in the transfer film 100, and functional element 132 and transfer film 100 are members independently individually.
Compared to traditional decoration technique inside mold, the object with finished one embodiment of the invention of transfer printing process of Fig. 5 and Figure 11 has better reliability degree and outward appearance.
Although the present invention describes about its specific embodiment, be appreciated that: all variations can make and equivalent can substitute and do not break away from true spirit of the present invention and category.In addition, many modifications can make to be applicable to a particular case.All modifications all is encompassed in the category of the present invention.
Claims (20)
1. an object has a functional element that is embedded in its top surface.
2. object as claimed in claim 1, wherein, this object forms by molded, impression, superimposed or its combination.
3. object as claimed in claim 1, wherein, this object is formed by a material, this material is selected from the group that following material is formed: thermoplastic, thermoplastic elastomer (TPE), thermosets, with its mixture, preimpregnation thing or compound.
4. object as claimed in claim 1, wherein, this functional element is an optical component, Optical devices, waveguide, electronics design, electronic component, display member, member backlight, loudspeaker, microphone, button, touch panel, touch-type pad or connector.
5. object as claimed in claim 4, wherein, this electronic component is integrated circuit, printed circuit, transistor, diode, resistor, inductor, capacitor, antenna, RFID transceiver, battery, solar cell, light emitting diode or Organic Light Emitting Diode.
6. display transfer film or paper tinsel in the mould, it also comprises: a temporary transient bearing bed, a releasing layer, a functional element, sticks together or fasten layer and one select the formula durable layer for use.
7. display transfer film or paper tinsel in the mould as claimed in claim 6, wherein, this selects for use the formula durable layer to be formed by multi-functional yl methacrylates, epoxides, vinyl esters, diallyl phthalic acid, vinethene or its mixture of a radiation-curable.
8. display transfer film or paper tinsel in the mould as claimed in claim 6, wherein, this selects for use the formula durable layer to comprise sol-gel silicate or titanium ester.
9. display transfer film or paper tinsel in the mould as claimed in claim 6, wherein, this film or paper tinsel are the form of volume.
10. display inserts film or paper tinsel in the mould, and it comprises: a bearing bed, a functional element, with an adhesion layer.
11. method that is used to make object, this object has a functional element that is embedded in its top surface, this method comprises: (a) form display transfer film or paper tinsel in the mould, it comprises a temporary transient bearing bed, a releasing layer, a functional element, an adhesion layer and and selects the formula durable layer for use; (b) present in interior display transfer film of this mould or paper tinsel to a mould, this temporary transient bearing bed is contacted with the inner surface of this mould; (c) inject a plastic material to this mould forming this object, or heat shaping by means of the plastic material in this mould, blow jet mould system or this object of compression molding; (d) this mould removes formed object certainly; Reach and (e) remove this temporary transient bearing bed and releasing layer simultaneously.
12. a method that is used to make object, this object have a functional element that is embedded in its surface, this method comprises: form (a) that display inserts film or paper tinsel in the mould, its comprise a bearing bed, a functional element, with an adhesion layer; (b) insert the interior display of this mould and insert in film or paper tinsel to a mould, this bearing bed is contacted with the inner surface of this mould; (c) inject a plastic material to this mould forming this object, or heat shaping by means of the plastic material in this mould, blow jet mould system or this object of compression molding; And (d) certainly this mould remove formed object.
13. a transfer printing process comprises:
On a manufacturing platform, place an object;
On this object, place a transfer film;
With this transfer film of instrument heating pressurization, make this transfer film be subjected to the part of this instrument heating pressurization to be attached at this object;
This transfer film and this object are positioned over a reative cell; And
Bleed so that this reative cell is vacuum state, and make this transfer film not be subjected to the part of this instrument heating pressurization to be attached at this object.
14. transfer printing process as claimed in claim 13, wherein this transfer film comprises:
One temporary transient bearing bed;
One releasing layer is disposed on this temporary transient bearing bed;
One functional element is disposed on this releasing layer; And
One following layer is disposed on this releasing layer, and when wherein this transfer film was placed on this object, this functional element and this following layer were between this object and this temporary transient bearing bed.
15. transfer printing process as claimed in claim 14, wherein this transfer film also comprises a durable layer, and this durable layer is disposed on this releasing layer, and this functional element and this following layer are disposed on this durable layer.
16. transfer printing process as claimed in claim 13, wherein at this before placing this transfer film on this object, also be included in and place a functional element on this object, wherein this functional element is between this transfer film and this object.
17. as claim 14 or 16 described transfer printing process, wherein this functional element is an integrated circuit.
18. transfer printing process as claimed in claim 13 is wherein bled so that this reative cell when being vacuum state, the temperature of this reative cell is 50 ℃ to 300 ℃.
19. transfer printing process as claimed in claim 13, wherein to be subjected to the part of this instrument heating pressurization be a flat surfaces that is attached at this object to this transfer film, and this transfer film is not subjected to the part of this instrument heating pressurization to be attached at a non-planar surface of this object, and the angle of the junction of this flat surfaces and this non-planar surface is spent to 90 degree between 10.
20. the object of each described transfer printing process processing in process such as the claim 13 to 19.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100046543A CN102126369A (en) | 2010-01-20 | 2010-01-20 | Method for manufacturing object containing functional elements, transfer printing process and object |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100046543A CN102126369A (en) | 2010-01-20 | 2010-01-20 | Method for manufacturing object containing functional elements, transfer printing process and object |
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| CN102126369A true CN102126369A (en) | 2011-07-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105694076A (en) * | 2016-03-18 | 2016-06-22 | 苏州万德福尔新材料有限公司 | Matt elastic thermal transfer film and preparation method thereof |
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2010
- 2010-01-20 CN CN2010100046543A patent/CN102126369A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105694076A (en) * | 2016-03-18 | 2016-06-22 | 苏州万德福尔新材料有限公司 | Matt elastic thermal transfer film and preparation method thereof |
| CN105694076B (en) * | 2016-03-18 | 2019-03-12 | 苏州万德福尔新材料有限公司 | A kind of unglazed elastic force thermal transfer film and preparation method thereof |
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Application publication date: 20110720 |