CN102121126B - Printed circuit board (PCB) electroplating device with guide wheel frame - Google Patents
Printed circuit board (PCB) electroplating device with guide wheel frame Download PDFInfo
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- CN102121126B CN102121126B CN201110021233.6A CN201110021233A CN102121126B CN 102121126 B CN102121126 B CN 102121126B CN 201110021233 A CN201110021233 A CN 201110021233A CN 102121126 B CN102121126 B CN 102121126B
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- guide wheel
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- jet pipe
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Abstract
The invention discloses a printed circuit board (PCB) electroplating device with a guide wheel frame, comprising a spray pipe and a guide wheel set, wherein, the spray pipe is provided with a spray nozzle; a PCB passing port is formed between adjacent guide wheel columns; and the spray pipe is positioned behind the guide wheel set. The electroplating device also comprises at least two guide wheel frames; the guide wheel frame comprises an upper plate, a lower plate and a fixed plate; the guide wheel set is fixed between the upper plate and the lower plate; the fixed plate and the upper plate are fixed in a crossing manner, and the fixed plate is fixed on the frame body of the PCB electroplating device; the lower plate is provided with a spray pipe fixing seat; and the spray pipe is fixed between the upper plate and the lower plate through the spray pipe fixing seat. By adopting the structure, the spray pipes with the different spray nozzles can be arbitrarily changed according to requirements, and one device for two purposes is achieved, thus greatly saving the cost; the guide wheels and the spray pipes are integrated into a plurality of guide wheel units which can be conveniently taken out to change the spray pipe or to be repaired and maintained; and the replacement and maintaining process can not be limited by space, thus improving the working efficiency to a large extent.
Description
Technical field
The present invention relates to PCB field of electroplating, be specifically related to a kind of PCB electroplanting device with wheel frame.
Background technology
PCB field of electroplating there is no at present a set of can simultaneous adaptation through hole blind hole plating and filling perforation electroplate similar devices, producer often needs configuration two to overlap electroplating device, this considerably increases cost and causes waste, be also unfavorable for environmental protection.The industry at present thin plate frame that adopts assists to carry out thin-plate electroplating more, and is clipped in thin plate frame by thin plates pretty troublesome, and be difficult to automatization, have a strong impact on production efficiency, industry generally adopts single jet pipe to extract maintenance, inefficiency out at present.
Current transition guide deflection sheave is by straight line reversed arrangement, gap between upper bottom tumbler is also linearly, and pcb board is in electroplating process, and the water column ejected by both sides jet pipe is easy to PCB is out of shape between the rectilinear clearance of upper bottom tumbler,, easily cause the damage of pcb board.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of PCB electroplanting device with wheel frame, its a set of equipment can simultaneous adaptation through hole blind hole be electroplated and filling perforation plating, as long as change jet pipe, it improves the production efficiency of thin-plate electroplating, improves the maintenance work efficiency to plating tank.
The present invention for solving the problems of the technologies described above adopted technical scheme is:
A kind of PCB electroplanting device with wheel frame, it comprises jet pipe and guiding wheels, described jet pipe there is nozzle, described guiding wheels are made up of at least one pair of guide deflection sheave post, form pcb board between adjacent guide deflection sheave post and pass through mouth, described guide deflection sheave post is made up of cylinder and guide deflection sheave, described cylinder is distributed with the described guide deflection sheave of row, described jet pipe is positioned at described guiding wheels rear, it also comprises at least two wheel frames, described wheel frame comprises upper plate, lower plate and retaining plate, described guiding wheels are fixed between described upper plate and described lower plate, described retaining plate and described upper plate intersect fixing, described retaining plate is fixed on the support body of PCB electroplanting device, described lower plate there is jet pipe permanent seat, described jet pipe is fixed between described upper plate and lower plate by described jet pipe permanent seat.After adopting said structure, the jet pipe of different spray nozzles can be changed arbitrarily as required, accomplish an equipment two kinds of purposes, provide cost savings so greatly.Guide deflection sheave and jet pipe are assembled guide wheel one by one, it can be taken out together very easily and change jet pipe or maintain, this changes or maintenance process by the limitation in space, can not be increased work efficiency significantly.
Guide deflection sheave on described wheel frame is staggered.Guide deflection sheave is staggered to gather, and farthest protects pcb board, and thin PCB (0.1mm ~ 0.2mm) can not be out of shape in operation jet electro-plating, because pcb board contacts with guide deflection sheave to run, therefore runs smooth and easy, can increase work efficiency.
This device can be used for filling perforation and blind hole two kinds of plating modes, and the staggered guide deflection sheave gathered can protect pcb board, and working efficiency improves, guide deflection sheave and jet pipe integrated, be convenient for changing jet pipe and maintaining.
Accompanying drawing explanation
The present invention includes following accompanying drawing:
Fig. 1 is inventive embodiments structural representation;
Fig. 2 is inventive embodiments wheel frame array structure schematic diagram;
Fig. 3 is inventive embodiments wheel frame structural representation;
Fig. 4 is inventive embodiments side-view;
Fig. 5 is inventive embodiments nozzle structure schematic diagram;
Fig. 6 is inventive embodiments guiding wheels structural representations.
Wherein: 1. jet pipe, 2. guide deflection sheave, 3. jet pipe permanent seat, 4. retaining plate, 5. guiding wheels, 6. nozzle, 7. upper plate, 8. lower plate.
Embodiment
According to drawings and embodiments the present invention is described in further detail below:
As shown in the figure, the present embodiment provides a kind of PCB electroplanting device with wheel frame, it comprises jet pipe 1 and guiding wheels 5, described jet pipe 1 there is nozzle 6, described guiding wheels 5 are made up of at least one pair of guide deflection sheave 2 post, form pcb board between adjacent guide deflection sheave 2 post and pass through mouth, described guide deflection sheave 2 post is made up of cylinder and guide deflection sheave 2, described cylinder is distributed with the described guide deflection sheave 2 of row, described jet pipe 1 is positioned at described guide deflection sheave 2 groups of rears, it also comprises at least two wheel frames, described wheel frame comprises upper plate 7, lower plate 8 and retaining plate 4, described guiding wheels 5 are fixed between described upper plate 7 and described lower plate 8, described retaining plate 4 and described upper plate 7 intersect fixing, described retaining plate 4 is fixed on the support body of PCB electroplanting device, described lower plate 8 there is jet pipe permanent seat 3, described jet pipe 1 is fixed between described upper plate 7 and lower plate 8 by described jet pipe permanent seat 3.After adopting said structure, the jet pipe 1 of different spray nozzles 6 can be changed arbitrarily as required, accomplish an equipment two kinds of purposes, provide cost savings so greatly.Guide deflection sheave 2 and jet pipe 1 are assembled unit one by one, it can be taken out together very easily and change jet pipe 1 or maintain, this changes or maintenance process by the limitation in space, can not be increased work efficiency significantly.
Guide deflection sheave 2 on described wheel frame is staggered.Guide deflection sheave 2 is staggered to gather, and farthest protects pcb board, and thin PCB (0.1mm ~ 0.2mm) can not be out of shape in operation jet electro-plating, because pcb board contacts with guide deflection sheave 2 to run, therefore runs smooth and easy, can increase work efficiency.
This device can be used for filling perforation and blind hole two kinds of plating modes, and the staggered guide deflection sheave 2 gathered can protect pcb board, and working efficiency improves, and guide deflection sheave 2 is integrated with jet pipe 1, is convenient for changing jet pipe and maintaining.
Obviously, foregoing just in order to feature of the present invention is described, and is not limitation of the present invention, and the those of ordinary skill of relevant technical field should belong to protection category of the present invention according to the present invention in the change that corresponding technical field is made.
Claims (2)
1. the PCB electroplanting device with wheel frame, it comprises jet pipe and guiding wheels, described jet pipe there is nozzle, described guiding wheels are made up of at least one pair of guide deflection sheave post, form pcb board between adjacent guide deflection sheave post and pass through mouth, described guide deflection sheave post is made up of cylinder and guide deflection sheave, described cylinder is distributed with the described guide deflection sheave of row, described jet pipe is positioned at described guiding wheels rear, it is characterized in that: it also comprises at least two wheel frames, described wheel frame comprises upper plate, lower plate and retaining plate, described guiding wheels are fixed between described upper plate and described lower plate, described retaining plate and described upper plate intersect fixing, described retaining plate is fixed on the support body of PCB electroplanting device, described lower plate there is jet pipe permanent seat, described jet pipe is fixed between described upper plate and lower plate by described jet pipe permanent seat.
2. a kind of PCB electroplanting device with wheel frame according to claim 1, is characterized in that: the guide deflection sheave on described wheel frame is staggered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110021233.6A CN102121126B (en) | 2011-01-19 | 2011-01-19 | Printed circuit board (PCB) electroplating device with guide wheel frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110021233.6A CN102121126B (en) | 2011-01-19 | 2011-01-19 | Printed circuit board (PCB) electroplating device with guide wheel frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102121126A CN102121126A (en) | 2011-07-13 |
| CN102121126B true CN102121126B (en) | 2014-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110021233.6A Active CN102121126B (en) | 2011-01-19 | 2011-01-19 | Printed circuit board (PCB) electroplating device with guide wheel frame |
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| CN (1) | CN102121126B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762652B (en) * | 2015-04-27 | 2017-06-20 | 栾善东 | A kind of compound acid system PCB vertical continuous electroplanting device and method |
| CN105019006B (en) * | 2015-07-17 | 2017-11-21 | 深圳市华祥电路科技有限公司 | Electroplating bath |
| CN107313085B (en) * | 2016-04-26 | 2019-10-22 | 中国科学院金属研究所 | The copper electroplating filling method of fine blind hole in a kind of high density circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| CN1388273A (en) * | 2001-05-25 | 2003-01-01 | 日本爱铝美克斯株式会社 | Surface treating apparatus |
| JP2004332019A (en) * | 2003-05-01 | 2004-11-25 | Atotech Japan Kk | Chemical treatment device |
| CN1746339A (en) * | 2005-09-07 | 2006-03-15 | 沪士电子股份有限公司 | Jetting electroplating method directly of nozzle |
| CN201010701Y (en) * | 2005-09-29 | 2008-01-23 | 亚洲电镀器材有限公司 | Side guide component used for electroplating machine |
| CN201485520U (en) * | 2009-07-17 | 2010-05-26 | 深圳市汇达高机械科技有限公司 | Electroplating spray device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202272975U (en) * | 2011-01-19 | 2012-06-13 | 俊杰机械(深圳)有限公司 | Printed circuit board (PCB) electroplating device with guide wheel carriers |
-
2011
- 2011-01-19 CN CN201110021233.6A patent/CN102121126B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| CN1388273A (en) * | 2001-05-25 | 2003-01-01 | 日本爱铝美克斯株式会社 | Surface treating apparatus |
| JP2004332019A (en) * | 2003-05-01 | 2004-11-25 | Atotech Japan Kk | Chemical treatment device |
| CN1746339A (en) * | 2005-09-07 | 2006-03-15 | 沪士电子股份有限公司 | Jetting electroplating method directly of nozzle |
| CN201010701Y (en) * | 2005-09-29 | 2008-01-23 | 亚洲电镀器材有限公司 | Side guide component used for electroplating machine |
| CN201485520U (en) * | 2009-07-17 | 2010-05-26 | 深圳市汇达高机械科技有限公司 | Electroplating spray device |
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| Publication number | Publication date |
|---|---|
| CN102121126A (en) | 2011-07-13 |
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