CN102114687A - Molding device, method for forming sealing-adhesive body and molding method - Google Patents
Molding device, method for forming sealing-adhesive body and molding method Download PDFInfo
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- CN102114687A CN102114687A CN2009102607535A CN200910260753A CN102114687A CN 102114687 A CN102114687 A CN 102114687A CN 2009102607535 A CN2009102607535 A CN 2009102607535A CN 200910260753 A CN200910260753 A CN 200910260753A CN 102114687 A CN102114687 A CN 102114687A
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Abstract
The invention provide a molding device, and the molding device comprises a first mold, a second mold and a middle module. The second mold is used to bear a substrate, and the first mold can move relatively to the second mold. The middle module has an opening, is disposed between the first mold and the second mold, and is detachably connected with the first mold or the second mold. when the middle module is tightly connected with the first mold and the substrate on the second mold, an adhesive injection space is formed in the opening of the middle module. The invention also provides a method for forming a sealing-adhesive body by the molding device of the invention, and a molding method. Based on the molding device of the invention, no expensive upper mold is required to replace for the formation of sealing-adhesive bodies with different thicknesses or covers with different heights, and only a middle module with a low price is required to replace, so the production cost is reduced.
Description
Technical field
The present invention relates to the method and the molding method of a kind of casting mold apparatus, formation adhesive body, relate more specifically to a kind of casting mold apparatus and method that forms adhesive body and lid.
Background technology
The wafer card is a kind of card-type IC apparatus, has various purposes, application such as for example numerical digit data storage, identity or article identification.The wafer card is that IC wafer is combined card, and inserts or card overlays and waits the way of contact to reach external electric signal to transmit with card, and according to the difference of kind and function, the wafer card can include the wafer that number does not wait.In general, for the volume that makes the wafer card reduces, the wafer on the wafer card mostly is to be arranged on the substrate in the mode of piling up, and in the mode of sealing, these wafers is coated on the substrate.
For wafer is formed adhesive body, can use mould unavoidably.Yet when the wafer that piles up increases, that is the thickness of the adhesive body that will form according to existing way, certainly will will change one and overlap the mould with different die cavity degree of depth when increasing, and so can cause the increase on the cost.
Except above-mentioned mode with sealing is protected the wafer, industry also can utilize lid to protect wafer.Specifically, exactly wafer is arranged in the lid, and the mode that fuses with ultrasonic, with wafer package in lid.And form the mode of above-mentioned lid, and also be to utilize suitable mold, form in the mode of for example ejection formation.The same with the situation that forms adhesive body, when the wafer that piles up increases, equally also be to change the mould that a cover has the different die cavity degree of depth, this also can cause the increase on the cost.
Summary of the invention
The invention provides a kind of casting mold apparatus, avoid changing expensive mold or master mold by module in introducing, to reduce production costs.
For achieving the above object, the casting mold apparatus of one embodiment of the present invention comprises first mould, second mould and middle module.Second mould is in order to bearing substrate, and wherein first mould and second mould can relatively move.And middle module has opening, and this opening is arranged between first mould and second mould, and is connected with first mould or second mould with tearing formula open.When the substrate on central module and first mould and second mould forms driving fit, form the injecting glue space in the opening of middle module.
The casting mold apparatus of another embodiment of the invention comprises first mould, second mould and middle module.Second mould has jut, and wherein first mould and second mould can relatively move.And middle module has opening, and this opening is arranged between first mould and second mould, and detachably is connected with first mould or second mould.When the central module and first mould and second mould formed driving fit, the jut system of second mould stretched in the opening, and forms mould space in the opening.
The present invention also provides the method for utilizing above-mentioned casting mold apparatus to form adhesive body and carry out mold.
The method of formation adhesive body of the present invention comprises: second mould is set; Above described second mould first mould is set, wherein said first mould and second mould can relatively move; Between described first mould and described second mould middle module is set, and module is connected detachably with described first mould or second mould in described, wherein said middle module has opening; On described second mould, substrate is set; With module in described and described first mould and described second mould formation driving fit, to form the injecting glue space in the opening of module in described; And the glue material injected in the described injecting glue space.
The method of mold of the present invention comprises: first mould is set; Second mould is set, and this second mould has jut, and wherein said first mould and second mould can relatively move; Between described first mould and second mould middle module is set, and module is connected detachably with described first mould or second mould in described, wherein said middle module has opening; The jut of described second mould is stretched in the opening of described middle module, and make described middle module and described first mould and second mould form driving fit, in described opening, to form mould space; And plastics are injected in the described mould space.
In order to allow above and other objects of the present invention, feature and the advantage can be more obvious, hereinafter will cooperate appended diagram, be described in detail below.
Description of drawings
Fig. 1 is the cutaway view of the casting mold apparatus of first embodiment of the present invention;
Fig. 2 be among Fig. 1 the centering module along the cutaway view of line 2-2;
Fig. 3 a to Fig. 3 c seals the method for molded journey for the casting mold apparatus that uses Fig. 1;
Fig. 4 is the cutaway view of the casting mold apparatus of second embodiment of the present invention;
Fig. 5 be among Fig. 4 the centering module along the cutaway view of line 5-5;
Fig. 6 a to Fig. 6 b is the method that the casting mold apparatus of use Fig. 4 carries out the mold processing procedure, formed lid after wherein Fig. 6 b demonstration mold processing procedure is finished;
Fig. 7 is the cutaway view of the casting mold apparatus of the 3rd embodiment of the present invention.
[primary clustering symbol description]
100 casting mold apparatus, 110 molds
112 spring assemblies, 114 guide rods
Module in 116 die cavitys 120
122 openings, 130 bed dies
180 injecting glue spaces, 190 substrates
192 wafers, 194 adhesive bodies
400 casting mold apparatus, 410 molds
412 spring assemblies, 414 guide rods
Module in 416 die cavitys 420
422 openings, 430 bed dies
432 juts, 480 mould space
490 lids
The specific embodiment
With reference to figure 1 and Fig. 2, the casting mold apparatus 100 of first embodiment of the present invention comprises mold 110, middle module 120 and bed die 130, wherein mold 110 has die cavity 116, and middle module 120 is made with steel, have at least one opening 122, and detachably be connected with mold 110 or bed die 130.It should be noted that Fig. 1 shown be that middle module 120 detachably is connected with mold 110.
With reference to figure 3a to Fig. 3 c, when using casting mold apparatus 100 of the present invention to seal molded journey, earlier substrate 190 is placed on the bed die 130, and make on the substrate 190 wafer 192 up (a) referring to Fig. 3.Then mold 110 is pressed down towards substrate 190, module 120 forms driving fit with mold 110 and substrate 190 in making, and forms airtight injecting glue space 180 in opening 122.At this moment the die cavity 116 of mold 110 communicates with the opening 122 of middle module 120, and the wafer 192 on the substrate 190 is disappearance (referring to Fig. 3 b) in injecting glue space 180 then.Then the glue material with fusion injects in the injecting glue space 180, treat that the glue material solidifies after, move on mold 110 and the middle module 120, promptly be formed with the adhesive body 194 (referring to Fig. 3 c) of coating wafer 192 on the substrate 190.
The casting mold apparatus 100 of first embodiment of the invention if desire forms the adhesive body 194 of different-thickness, only needs to change the middle module 120 of different-thickness, and does not need to change whole group mold 110.Because the price of middle module 120 far below the price of mold 110, therefore can reduce production costs.Please refer to Fig. 1 and Fig. 3 a to Fig. 3 c again, separate with middle module 120 easily after adhesive body 194 is formed, the casting mold apparatus 100 of present embodiment also comprises spring assembly 112 and the guide rod 114 in the groove that is arranged on mold 110.Spring assembly 112 telescopicallies connect and are arranged on mold 110 and 114 of guide rods, and middle module 120 is to be spirally connected or mode such as clamping is connected with guide rod 114, and 112 formation detachably are connected with mold 110 with spring assembly to pass through guide rod 114.When mold 110 when substrate 190 presses down, middle module 120 also can move towards substrate 190.With after substrate 190 contacts, spring assembly 112 can begin compression in middle module 120, last in module 120 can and mold 110 and substrate 190 form driving fits.When moving on the mold 110 after injecting glue is finished, spring assembly 112 can begin to stretch and make middle module 120 separate with mold 110, and at this moment adhesive body 194 also can separate with middle module 120 because of the effect of spring assembly 112.
It should be noted that the die cavity 116 of mold 110 can have the contribution of part to the thickness of adhesive body 194, but it will be understood by a person skilled in the art that the die cavity 116 of the mold 110 in the present embodiment is not to be necessary.If die cavity 116 and opening 122 are fully at once, it is to the partial contribution of adhesive body 194 thickness, and the thickness of module 120 replaces in can increasing by equivalent.In addition, for the situation of avoiding excessive glue takes place, the width of opening 122 preferably is slightly larger than the width of die cavity 116.In addition, in order to meet some regulation or needs, the top of adhesive body 194 need have some concaveconvex structures sometimes, and at this moment just needing to have corresponding concaveconvex structure in the die cavity 116 can form.
With reference to figure 4 and Fig. 5, the casting mold apparatus 400 of second embodiment of the present invention comprises mold 410, middle module 420 and bed die 430.Mold 410 has die cavity 416, and middle module 420 is made with steel, has opening 422, and detachably is connected with mold 410.
With reference to figure 6a to Fig. 6 b, when the casting mold apparatus 400 that uses present embodiment carries out the mold processing procedure, mold 410 is pressed to bed die 430, and module 420 forms driving fit with mold 410 and bed die 430 in making, and forms airtight mould space 480 in opening 422.At this moment the die cavity 416 of mold 410 communicates with the opening 422 of middle module 420, during the jut 432 of bed die 430 then stretches in the opening 422 of module 420 (a) referring to Fig. 6.Then the plastics with fusion inject in the mould space 480, treat plastics solidification after, with mold 410 and in module 420 separate with bed die 430, promptly form the lid 490 shown in Fig. 6 b.
Casting mold apparatus 400 second embodiment of the invention if desire forms the lid 490 with differing heights, except changing the bed die 430, only needs to change the middle module 420 of different-thickness, and does not need to change whole group mold 410.Because the price of middle module 420 far below the price of mould 410, therefore can reduce the more needed expense of mold exchange.Similarly, separate with middle module 420 easily after lid 490 is formed, the casting mold apparatus 400 of present embodiment also comprises spring assembly 412 and the guide rod 414 in the groove that is arranged on mold 410.Spring assembly 412 telescopicallies connect also and are arranged between mold 410 and the guide rod 414, and middle module 420 is to be spirally connected or mode such as clamping is connected with guide rod 414, and 412 formation detachably are connected with mold 410 with spring assembly to pass through guide rod 414.Identical with the casting mold apparatus 100 of first embodiment, employed spring assembly 412 can be compressed near the process of bed die 430 at mold 410 in the present embodiment, then can stretch at mold 410, separate with middle module 420 to help lid 490 away from the process of bed die 430.
Similarly, the die cavity 416 of mold 410 can have the contribution of part to the height of lid 490, but those skilled in the art should be appreciated that still the die cavity 416 of the mold 410 in the present embodiment also not necessarily.If die cavity 416 and opening 422 are fully at once, it is to the partial contribution of lid 490 height, and the thickness of module 420 replaces in can increasing by equivalent.In addition, for the situation of avoiding plastics to overflow takes place, the width of opening 422 preferably is slightly larger than the width of die cavity 416.
With reference to figure 7, the casting mold apparatus 400 of casting mold apparatus 700 similar second embodiments of the 3rd embodiment of the present invention indicates identical assembly at this identical label.And different with the casting mold apparatus 400 of second embodiment be that the middle module 420 of the casting mold apparatus 700 of present embodiment detachably is arranged on the bed die 430.Because the employed assembly of present embodiment is all identical with second embodiment with the processing procedure principle, therefore no longer narration.
It should be noted that the removable connection among the present invention can be and is spirally connected, clamping or other connected mode.
According to casting mold apparatus of the present invention, if desire forms the adhesive body of different-thickness or the lid of differing heights, do not need to change expensive mold, only need to change the comparatively cheap middle module of price, can therefore reduce production costs.
Though the present invention discloses with aforementioned embodiments, so it is not in order to qualification the present invention, any persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore protection scope of the present invention should be looked the accompanying Claim person of defining and is as the criterion.
Claims (10)
1. casting mold apparatus, this casting mold apparatus comprises:
First mould;
Second mould, this second mould is used for bearing substrate, and wherein said first mould and second mould can relatively move; And
Middle module, module is arranged between described first mould and described second mould in this, and detachably is connected with described first mould or second mould, and described middle module has opening,
Wherein when the substrate on described middle module and described first mould and described second mould forms driving fit, form the injecting glue space in the opening of described middle module.
2. casting mold apparatus according to claim 1, described casting mold apparatus also comprises guide rod, this guide rod is arranged in described first mould or second mould, is used for detachably being connected with described module.
3. casting mold apparatus according to claim 2, described casting mold apparatus also comprises:
Spring assembly, this spring assembly telescopically connects and is arranged between described guide rod and described first mould or second mould.
4. casting mold apparatus according to claim 1, wherein said first mould or second mould have die cavity, and when described middle module and described first mould formation driving fit, this die cavity communicates with described opening.
5. casting mold apparatus, this casting mold apparatus comprises:
First mould;
Second mould, this second mould has jut, and wherein said first mould and second mould can relatively move; And
Middle module, module is arranged between described first mould and second mould in this, and detachably is connected with described first mould or second mould, and described middle module has opening,
Wherein when described middle module and described first mould and second mould formation driving fit, the jut of described second mould stretches in the described opening, and forms mould space in the described opening.
6. casting mold apparatus according to claim 5, described casting mold apparatus also comprises guide rod, this guide rod is arranged in described first mould or second mould, is used for detachably being connected with described module.
7. casting mold apparatus according to claim 6, described casting mold apparatus also comprises:
Spring assembly, this spring assembly telescopically connects and is arranged between described guide rod and described first mould or second mould.
8. casting mold apparatus according to claim 5, wherein said first mould or second mould have die cavity, and when described middle module and described first mould formation driving fit, described die cavity communicates with described opening.
9. method that forms adhesive body, this method comprises:
Second mould is set;
Above described second mould first mould is set, wherein said first mould and second mould can relatively move;
Between described first mould and described second mould middle module is set, and module is connected detachably with described first mould or second mould in described, wherein said middle module has opening;
On described second mould, substrate is set;
With module in described and described first mould and described second mould formation driving fit, to form the injecting glue space in the opening of module in described; And
The glue material is injected in the described injecting glue space.
10. the method for a mold, this method comprises:
First mould is set;
Second mould is set, and this second mould has jut, and wherein said first mould and second mould can relatively move;
Between described first mould and second mould middle module is set, and module is connected detachably with described first mould or second mould in described, wherein said middle module has opening;
The jut of described second mould is stretched in the opening of described middle module, and make described middle module and described first mould and second mould form driving fit, in described opening, to form mould space; And
Plastics are injected in the described mould space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102607535A CN102114687A (en) | 2009-12-31 | 2009-12-31 | Molding device, method for forming sealing-adhesive body and molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102607535A CN102114687A (en) | 2009-12-31 | 2009-12-31 | Molding device, method for forming sealing-adhesive body and molding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102114687A true CN102114687A (en) | 2011-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102607535A Pending CN102114687A (en) | 2009-12-31 | 2009-12-31 | Molding device, method for forming sealing-adhesive body and molding method |
Country Status (1)
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|---|---|
| CN (1) | CN102114687A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104416832A (en) * | 2013-08-29 | 2015-03-18 | 上海雷博司电气股份有限公司 | Mould for manufacturing vacuum arc-extinguishing chamber seal by encapsulating compound injection process |
-
2009
- 2009-12-31 CN CN2009102607535A patent/CN102114687A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104416832A (en) * | 2013-08-29 | 2015-03-18 | 上海雷博司电气股份有限公司 | Mould for manufacturing vacuum arc-extinguishing chamber seal by encapsulating compound injection process |
| CN104416832B (en) * | 2013-08-29 | 2017-05-10 | 上海雷博司电气股份有限公司 | Mould for manufacturing vacuum arc-extinguishing chamber seal by encapsulating compound injection process |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110706 |