CN102102000A - Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process - Google Patents
Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process Download PDFInfo
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- CN102102000A CN102102000A CN2010106175548A CN201010617554A CN102102000A CN 102102000 A CN102102000 A CN 102102000A CN 2010106175548 A CN2010106175548 A CN 2010106175548A CN 201010617554 A CN201010617554 A CN 201010617554A CN 102102000 A CN102102000 A CN 102102000A
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- epoxy resin
- glass cloth
- tackiness agent
- adhesive
- clad laminate
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Abstract
The invention provides an adhesive of a medium glass transition temperature (Tg) epoxy glass cloth-based copper-clad laminate suitable for the lead-free process. The adhesive is prepared from N-containing heterocycle modified polyfunctional epoxy resin, high heat-resistant modified bisphenol A type epoxy resin, novolac curing agent, imidazole promoter, fine silicon powder, silane, propylene glycol methyl ether and butyl ether in a proper ratio. The epoxy glass cloth-based copper-clad laminate prepared by using the adhesive of the invention is characterized by medium glass transition temperature (no less than 150 DEG C), good heat resistance, CAF resistance, dimensional stability, low Z-CTE value and water absorption rate, good machinability, electrofusion resistance, flame resistance and the like; and the copper-clad laminate is completely suitable for the lead-free process and the manufacture and processing of the sandwich plate in the printed circuit board (PCB) industry.
Description
Technical field
The present invention relates to electronic information technology product preparation field, concrete relate to the tackiness agent that a kind of production is applicable to the middle Tg epoxide glass cloth base copper coated foil plate of leadless process.
Background technology
Society is improving now, science and technology is in development, we are more and more higher to the demand of electronic product, electronic service, light, thin, short, the little and digitized demand of electronic product, make miniaturization, multi-functional, high-performance become mainstream development direction with high-reliability, as the base material of electronic product, the demand of copper coated foil plate also inevitably strides forward towards the direction of high reliability day by day.
Electronic product is the industry of world today's maximum, and the pollution problem that huge industry like this is brought is the emphasis that people have to pay close attention to.European Union is in formal promulgation on July 1st, 2006 ROHS (about ban use of some objectionable impurities instruction in electronic and electrical equipment) and two instructions of WEEE (about scrapping the electronic and electrical equipment instruction), and from then on the global electronic industry has entered the unleaded epoch.Traditional plumber's solder can not re-use, and the required welding temperature of alternative solders such as SAC now all increases substantially.The unleaded simultaneous development of high-density installation technology now of carrying out in an all-round way, especially the develop rapidly of surface mounting technology (SMT), during PCB processing is installed with the complete machine accessory, the number of times that material bears thermal shocking repeatedly and temperature are all than conventional need was higher in the past, a series of combined reliabilities such as thermotolerance of copper-clad plate material can all be faced with huge challenge, only rely on the copper-clad plate of traditional technology can't satisfy the demands, we need have a qualitative leap to comply with the development of whole industry on traditional copper-clad plate reliability.
The FR-4 product TG (second-order transition temperature) of traditional technology is all below 140 ℃; Z axle CTE value is about 3.9%; Thermotolerance T260 is about 11 minutes, and T288 was less than 1 minute, and TD (heat decomposition temperature) is about 310 ℃.These very important performances all can't satisfy PCB produce in leadless process even the multi-ply wood demand of producing.
Summary of the invention
Technical problem to be solved by this invention is, overcomes problems of the prior art, provides a kind of production to be applicable to the tackiness agent of the middle TG lead-free compatible epoxide glass cloth base copper coated foil plate that PCB industry multi-ply wood is produced.
In order to address the above problem technical scheme of the present invention is such:
A kind of tackiness agent that is applicable to the middle Tg epoxide glass cloth base copper coated foil plate of leadless process, solidify by modification polyfunctional epoxy resin, high heat resistance modified epoxy and linear phenolic aldehyde, and interpolation auxiliary material, obtain after the proportioning modulation, this tackiness agent can apply gluing on glasscloth, is used to produce copper coated foil plate.
This tackiness agent is as follows by the components in mass portion volume:
Nitrogen heterocyclic ring modification polyfunctional epoxy resin 40～90
Heat resistance modified bisphenol type epoxy 1～20
Linear phenolic curing agent 20～60
Imidazoles promotor 0.05～5.0
Silicon powder 5～60
Silane 0.05～5.0
Butanone 5～50
Propylene glycol monomethyl ether 5～50
This tackiness agent preparation process is as follows:
A. in steel basin, add propylene glycol monomethyl ether, butanone, silane successively by formula ratio, turn on agitator, 500～1500 rev/mins of rotating speeds keep continuing stirring and control flume body temperature degree at 20～50 ℃, add silicon powder again, add the back that finishes and continue to stir 10～50 minutes;
B. in steel basin, add nitrogen heterocyclic ring modification polyfunctional epoxy resin, high heat resistance modified bisphenol type epoxy, linear phenolic curing agent successively by formula ratio, keep stirring in the reinforced process with 1000～1500 rev/mins of rotating speeds, open efficient shearing and emulsification 0.5～4 hour after interpolation finishes, carry out cooling water circulation simultaneously with 20～50 ℃ again of retentive control cell body problems
C. take by weighing imidazoles promotor (for example methylimidazole, diethyl tetramethyl-imidazoles, diphenyl-imidazole etc.) by formula ratio, and adding propylene glycol monomethyl ether, make the dissolving of imidazoles promotor fully, confirm after the no crystallization consoluet imidazoles promotor to be added in the steel basin, and continue keeping 1000～1500 rev/mins to be stirred to gluing and to finish (common 3～15 hours), impregnation is finished.
Described glasscloth, by the quality share, its component is:
SiO
2 55.5％
AL
2O
3 14.6％
CaO 18.5％
MgO 3.5％
Na
2O and K
2O 0.5%
B
2O
3 7.2％
Fe
2O
3 0.3％。
Nitrogen heterocyclic ring modification polyfunctional epoxy resin, chemical constitution:
Nitrogen heterocyclic ring modification polyfunctional epoxy resin 80%
Acetone 20%.
Tackiness agent of the present invention can be used for producing the middle TG lead-free compatible epoxide glass cloth base copper coated foil plate that is applicable to that PCB industry multi-ply wood is produced, this epoxide glass cloth base copper coated foil plate can have various types of specifications, as: 36 * 48, (units: inch) such as 36.5 * 48.5,37 * 49,40 * 48,40.5 * 48.5,41 * 49,42 * 48,42.5 * 48.5,43 * 49.
Use the epoxide glass cloth base copper coated foil plate of the present invention's preparation to have medium second-order transition temperature (〉=150 ℃), excellent heat resistance, anti-CAF and dimensional stability, low Z-CTE value and characteristics such as water-intake rate, favorable mechanical processibility, anti-electrification, flame resistivity, be applicable to that fully the PCB industry is applied to leadless process and multiple-plate manufacturing is processed.
Beneficial effect, of the present invention this in TG point 〉=150 ℃ of the unleaded epoxide glass cloth base copper coated foil plate of TG; Z axle CTE≤3.5%; Thermotolerance aspect TD 〉=325 ℃, T260 was above 60 minutes, T288 is more than 15 minutes, the outstanding general performance of performances such as very little in addition water-intake rate, outstanding anti-CAF and machinability, can satisfy fully PCB produce in leadless process and the multi-ply wood demand of producing.
Embodiment
For technique means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with specific embodiment, further set forth the present invention.
TG lead-free compatible epoxide glass cloth base copper coated foil plate main raw material is in the preparation:
1. nitrogen heterocyclic ring modification polyfunctional epoxy resin
Chemical constitution: nitrogen heterocyclic ring modification polyfunctional epoxy resin (80%)+acetone (20%)
Resinous principle requires:
| Project | Specifications parameter |
| Epoxy equivalent (weight) EEW (g/eq) | 250～280 |
| Hydrolyzable chlorine (p propylene glycol monomethyl ether) | 400MAX |
| Solid (wt%) | 79～81 |
| Bromine content (wt%) | 12～18 |
| Color | Yellow |
TG after nitrogen heterocyclic ring modification polyfunctional epoxy resin solidifies 〉=150 ℃, good toughness is easy to mechanical workout, but cooperative flame retardant is good with the glass fibre impregnation, and the resin kinetic viscosity changes slow, processing temperature wide ranges, easy handling and stay in grade in the hot pressing.
2. high heat resistance modified bisphenol type epoxy
Chemical constitution: high heat resistance modified bisphenol type epoxy (100%)
Resinous principle requires:
| Project | Specifications parameter |
| Epoxy equivalent (weight) EEW (g/eq) | 250～270 |
| Hydrolyzable chlorine (p propylene glycol monomethyl ether) | 400MAX |
| Solid (wt%) | 95～100 |
| Bromine content (wt%) | 12～18 |
| Color | Yellow |
Can significantly promote the thermotolerance after the material cured after high heat resistance modified bisphenol type epoxy adds by a certain percentage, performances such as Td, T260 obviously improve.
The reference formulation of tackiness agent:
| Former material | Formula rate (mass ratio) |
| Nitrogen heterocyclic ring modification polyfunctional epoxy resin | 80 |
| High heat resistance modified bisphenol type epoxy | 10 |
| Linear phenolic curing agent | 25 |
| Imidazoles promotor | 0.3 |
| Silicon powder (is SiO 2Powder, median size＜8 μ m) | 35 |
| Silane | 0.2 |
| Butanone | 15 |
| Propylene glycol monomethyl ether | 20 |
3. glasscloth, electronic-grade, its component is:
| SiO 2 | 55.5％ | ?Na 2O and K 2O | 0.5％ |
| AL 2O 3 | 14.6％ | ?B 2O 3 | 7.2％ |
| CaO | 18.5％ | ?Fe 2O 3 | 0.3％ |
| MgO | 3.5％ |
Performance index (7628):
| The Interventions Requested title | Unit | Technical requirements | Assay |
| Thickness | mm | 0.18±0.018 | 0.186 |
| Weight | g/m 2 | 210±3 | 212 |
| Warp count | Yarns/5cm | 87±2 | 86 |
| Weft count | Yarns/5cm | 67±2 | 68 |
| The warp-wise breaking tenacity | N/2.5cm | ≥295 | 513.2 |
| The broadwise breaking tenacity | N/2.5cm | ≥250 | 332.3 |
| The combustion loss rate | ％ | 0.08±0.03 | 0.10 |
| Alkali metal oxide content | ％ | ≤0.8 | 0.38 |
4. electrolytic copper foil
Performance index (1OZ):
| The Interventions Requested title | Unit (/ condition) | Technical requirements | Assay |
| Indicated weight | g/m 2 | 290±10 | 292 |
| Ra | um | ＜0.43 | 0.26 |
| Rz | um | ＜5.1 | 4.58 |
| Peel strength | N/mm | ＞1.05 | 1.62 |
| Tensile strength | Kg/mm 2 | ＞28 | 34.6 |
| Unit elongation | ％ | ＞10 | 13 |
| Oxidisability | 200℃/0.5h | Pass | Pass |
Give an example with three kinds below and describe the tackiness agent of the middle Tg epoxide glass cloth base copper coated foil plate that how to be applicable to leadless process in detail.
Embodiment 1:
1. impregnation formula rate (weight share meter):
| Former material | Formula rate (mass ratio) |
| Nitrogen heterocyclic ring modification polyfunctional epoxy resin | 68 |
| High heat resistance modified bisphenol type epoxy | 8 |
| Linear phenolic curing agent | 21 |
| Methylimidazole | 0.28 |
| Silicon powder (is SiO 2Powder, median size＜8 μ m) | 32 |
| Silane | 0.3 |
| Butanone | 14 |
| Propylene glycol monomethyl ether | 23 |
2. gluing baking: prepreg gluing speed 10m/min
3. prepreg controlled variable: gel time 72 seconds
Resin content 45.1%
Resin flow 17.8%
Fugitive constituent 0.30%
4. sheet material composing structure: thickness 1.6mm after 8 the 7628 prepreg pressings
5. pressing plate parameter: vacuum tightness-0.088MPa
Pressure 120-500psi
Temperature of heat plate 90-210 ℃
58 minutes set times
6. substrate performance perameter:
Embodiment 2:
1. impregnation formula rate (weight share meter):
| Former material | Formula rate (mass ratio) |
| Nitrogen heterocyclic ring modification polyfunctional epoxy resin | 75 |
| High heat resistance modified bisphenol type epoxy | 5 |
| Linear phenolic curing agent | 24 |
| Dimethyl tetraethyl-imidazoles | 2.5 |
| Silicon powder (is SiO 2Powder, median size＜8 μ m) | 28 |
| Silane | 1.2 |
| Butanone | 18 |
| Propylene glycol monomethyl ether | 19 |
2. gluing baking: prepreg gluing speed 23m/min
3. prepreg controlled variable: gel time 118 seconds
Resin content 44.6%
Resin flow 24.1%
Fugitive constituent 0.41%
4. sheet material composing structure: thickness 1.6mm after 8 the 7628 prepreg pressings
5. pressing plate parameter: vacuum tightness-0.078MPa
Pressure 240-520psi
Temperature of heat plate 100-215 ℃
50 minutes set times
6. substrate performance perameter:
Embodiment 3:
1. impregnation formula rate (weight share meter):
| Former material | Formula rate (mass ratio) |
| Nitrogen heterocyclic ring modification polyfunctional epoxy resin | 55 |
| High heat resistance modified bisphenol type epoxy | 15 |
| Linear phenolic curing agent | 39 |
| Diphenyl-imidazole | 3.3 |
| Silicon powder (is SiO 2Powder, median size＜8 μ m) | 12 |
| Silane | 0.8 |
| Butanone | 13 |
| Propylene glycol monomethyl ether | 15 |
2. gluing baking: prepreg gluing speed 18m/min
3. prepreg controlled variable: gel time 107 seconds
Resin content 46.2%
Resin flow 19.9%
Fugitive constituent 0.36%
4. sheet material composing structure: thickness 1.6mm after 8 the 7628 prepreg pressings
5. pressing plate parameter: vacuum tightness-0.092MPa
Pressure 130-450psi
Temperature of heat plate 80-220 ℃
60 minutes set times
6. substrate performance perameter:
Above-mentioned epoxide glass cloth base copper coated foil plate TG 〉=150 that make ℃, have outstanding thermotolerance and anti-CAF, very low Z-CTE value and water-intake rate, also have good comprehensive performancees such as good dimensional stability and machinability, anti-electrification, flame resistivity, be applicable to the demand that PCB leadless process and multi-ply wood are produced fully.
Claims (3)
1. tackiness agent that is applicable to the middle Tg epoxide glass cloth base copper coated foil plate of leadless process, it is characterized in that, solidify by modification polyfunctional epoxy resin, high heat resistance modified epoxy and linear phenolic aldehyde, and interpolation auxiliary material, obtain after the proportioning modulation, this tackiness agent can apply gluing on glasscloth, is used to produce copper coated foil plate;
This tackiness agent is as follows by the components in mass portion volume:
Nitrogen heterocyclic ring modification polyfunctional epoxy resin 40～90
Heat resistance modified bisphenol type epoxy 1～20
Linear phenolic curing agent 20～60
Imidazoles promotor 0.05～5.0
Silicon powder 5～60
Silane 0.05～5.0
Butanone 5～50
Propylene glycol monomethyl ether 5～50
This tackiness agent preparation process is as follows:
A. in steel basin, add propylene glycol monomethyl ether, butanone, silane successively by formula ratio, turn on agitator, 500～1500 rev/mins of rotating speeds keep continuing stirring and control flume body temperature degree at 20～50 ℃, add silicon powder again, add the back that finishes and continue to stir 10～50 minutes;
B. in steel basin, add nitrogen heterocyclic ring modification polyfunctional epoxy resin, high heat resistance modified bisphenol type epoxy, linear phenolic curing agent successively by formula ratio, keep stirring in the reinforced process with 1000～1500 rev/mins of rotating speeds, open efficient shearing and emulsification 0.5～4 hour after interpolation finishes, carry out cooling water circulation simultaneously with 20～50 ℃ again of retentive control cell body problems
C. take by weighing imidazoles promotor (for example methylimidazole, diethyl tetramethyl-imidazoles, diphenyl-imidazole etc.) by formula ratio, and adding propylene glycol monomethyl ether, make the dissolving of imidazoles promotor fully, confirm after the no crystallization consoluet imidazoles promotor to be added in the steel basin, and continue keeping 1000～1500 rev/mins to be stirred to gluing and to finish (common 3～15 hours), impregnation is finished.
2. a kind of tackiness agent that is applicable to the middle Tg epoxide glass cloth base copper coated foil plate of leadless process according to claim 1 is characterized in that, described glasscloth, and by the quality share, its component is:
SiO
2 55.5％
AL
2O
3 14.6％
CaO 185％
MgO 3.5％
Na
2O and K
2O 0.5%
B
2O
3 7.2％
Fe
2O
3 0.3％。
3. a kind of tackiness agent that is applicable to the middle Tg epoxide glass cloth base copper coated foil plate of leadless process according to claim 1 is characterized in that, nitrogen heterocyclic ring modification polyfunctional epoxy resin, and chemical constitution:
Nitrogen heterocyclic ring modification polyfunctional epoxy resin 80%;
Acetone 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106175548A CN102102000A (en) | 2010-12-30 | 2010-12-30 | Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106175548A CN102102000A (en) | 2010-12-30 | 2010-12-30 | Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102102000A true CN102102000A (en) | 2011-06-22 |
Family
ID=44155073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106175548A Pending CN102102000A (en) | 2010-12-30 | 2010-12-30 | Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102102000A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103360725A (en) * | 2013-07-02 | 2013-10-23 | 广东生益科技股份有限公司 | Thermosetting resin composition with high insulating property, prepreg and metal-clad foil plate |
| CN103642446A (en) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | Lead-free high heat-resisting copper-clad board and preparation method thereof |
| CN106663504A (en) * | 2014-07-14 | 2017-05-10 | 户田工业株式会社 | Method for producing conductive coating film, and conductive coating film |
| CN110239164A (en) * | 2019-06-13 | 2019-09-17 | 重庆德凯实业股份有限公司 | Tg copper-clad plate and preparation method thereof in high-fire resistance |
-
2010
- 2010-12-30 CN CN2010106175548A patent/CN102102000A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103360725A (en) * | 2013-07-02 | 2013-10-23 | 广东生益科技股份有限公司 | Thermosetting resin composition with high insulating property, prepreg and metal-clad foil plate |
| CN103360725B (en) * | 2013-07-02 | 2016-05-25 | 广东生益科技股份有限公司 | A kind of compositions of thermosetting resin, prepreg and clad with metal foil plate of good insulating |
| CN103642446A (en) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | Lead-free high heat-resisting copper-clad board and preparation method thereof |
| CN106663504A (en) * | 2014-07-14 | 2017-05-10 | 户田工业株式会社 | Method for producing conductive coating film, and conductive coating film |
| CN110239164A (en) * | 2019-06-13 | 2019-09-17 | 重庆德凯实业股份有限公司 | Tg copper-clad plate and preparation method thereof in high-fire resistance |
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Application publication date: 20110622 |