CN102086664A - Surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by continuity method - Google Patents
Surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by continuity method Download PDFInfo
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- CN102086664A CN102086664A CN2009101999498A CN200910199949A CN102086664A CN 102086664 A CN102086664 A CN 102086664A CN 2009101999498 A CN2009101999498 A CN 2009101999498A CN 200910199949 A CN200910199949 A CN 200910199949A CN 102086664 A CN102086664 A CN 102086664A
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- insulating board
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- phenol formaldehyde
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Abstract
The invention relates to a surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by a continuity method. A layer of polyurethane adhesive is coated on a surface material by an online rolling painting technology; the polyurethane adhesive is a single-component solvent type end isocyanate group polyurethane prepolymer; and the adhesive can chemically react with phenolic resin, so the bonding strength of the surface of the composite heat preservation plate can be enhanced.
Description
Technical field
The present invention relates to the organic composite material technical field, more particularly relate to a kind of metal faced pnenolic aldehyde foam heat-insulating board.
Technical background
Pnenolic aldehyde foam heat-insulating board has benefited from its distinctive high flame retardant characteristic, and market development is very fast at home in recent years.Especially the phenol formaldehyde foam sheet material of thickness about 20mm, its surface recombination is metal faced, is applied in the air conditioner ventilation pipeline as constructional materials, is subjected to the favorable comment in market.As 02273147.4 1 kinds of composite pnenolic aldehyde foam heat-insulating boards of Chinese patent and the composite board continuous manufacture method of Chinese patent 03106509.0 phenol formaldehyde foam, all applied for the manufacture method of its patent.The manufacture method of conventional phenol formaldehyde foam sheet material generally can be divided into two classes according to its technology: discrete method production and continuity method production.The phenol formaldehyde foam of bulk is normally produced in discrete method production earlier, foam is cut into certain thickness foam sheet again, then surface layer such as surface recombination aluminium foil and become composite insulating board; It then is machine laminated into type by a kind of serialization that continuity method is produced, and direct composite cover material in the process of phenol formaldehyde foam moulding is produced the composite phenol formaldehyde sheet material of specific thicknesses.As everyone knows, phenol formaldehyde foam is a kind of foamed material of fragility, and this fragility is reflected on the composite phenol formaldehyde sheet material, and the adhesive strength that is exactly phenol formaldehyde foam core sheet material and surface layer is not high, at bonding interface composite cover takes place easily and destroys.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, propose a kind of phenolic foam composite insulation board material that has improved the continuity method preparation of surface layer adhesive strength.This phenolic foam composite insulation board material, by be coated with polyurethane adhesive on metal faced material, polyurethane adhesive and phenolic resins generation chemical reaction form the combination of chemical bond, have improved phenol formaldehyde foam core and metal faced adhesive property greatly.As everyone knows, contain a large amount of hydroxy chemical groups in the phenolic resins, easily with polyurethane adhesive in the NCO group carry out chemical reaction, formation carbamic acid ester structure.
The present invention adopts the production technology of continuity method.Its activities is such: after the two-layer up and down surface layer uncoiling, enter the roller coat coating equipment, make surface layer apply one deck polyurethane adhesive, behind the hot blast drying tunnel, the surface layer of adhesive coating enters in the machine laminated into type with certain cavity height continuously, the phenolic resins raw material that mixes in the continuous pouring of subsurface laminar surface, the phenolic resins raw material is the foamed solidification moulding in the cavity of machine laminated into type, become and have certain thickness sheet material, sheet material cuts after going out laminating machine, obtains the phenolic foam composite insulation board material.
Employed phenolic resins raw material comprises: auxiliary agents such as the thermoset phenolic resin that phenol and formaldehyde condensation form, blowing agent, foam stabiliser, acid catalyst, the density of phenol formaldehyde foam is generally between 30～100kg/m3.This phenolic resins and foam process thereof can be with reference to United States Patent (USP) U.S.Pat.No.4,165,413.
The bonding adhesive that the present invention adopts is a kind of solvent-borne type monocomponent polyurethane prepolymer, and it is to be formed through chemical reaction by isocyanates and polyalcohol.Its isocyano-content NCO% is 10%～25%; Its isocyanates is MDI; Its polyalcohol is PPG, aromatic polyester polyol or aliphatic polyester polyols, or their mixture, and the hydroxyl value of polyalcohol (mg KOH/g) is between 28～350.Organic solvent is an ethyl acetate, butyl acetate, carrene, or their mixture.Add curing compound in the bonding adhesive, be trimethylamine class or organic tin curing compound.
The surface layer that the present invention adopts is metal faced, aluminium foil, color steel, galvanized sheet and corrosion resistant plate.The coating processes of adhesive coated surface layer is spraying or roller coat.Adopt the technology of continuous foamed moulding, make phenolic resins continuous foamed moulding in composite molding mechanical floor pressing machine, become target plate.
The specific embodiment
Provide 4 object lessons below in conjunction with content of the present invention, as follows.
Embodiment 1
In a glass reaction flask of having equipped stirring, thermocouple, add polymeric MDI 44V20 (German Bayer company) 500 grams, PPG GMN-3050 (Shanghai Gaoqiao petrochemical industry) 240 grams, PPG GE-210 (Shanghai Gaoqiao petrochemical industry) 140 grams, N,N-Dibenzylamine 2.0 grams.Chemical reaction is carried out in intensification, and 60 ℃ of reaction temperatures after 150 minutes reaction time, are cooled to 40 ℃, adds ethyl acetate 1050 grams, and carrene 1000 grams after mixing, obtain monocomponent polyurethane adhesive.After testing, prepolymer NCO mass contg 15.0%, solid content are 30%.Be polyurethane adhesive APU1.
Embodiment 2
In a glass reaction flask of having equipped stirring, thermocouple, add polymeric MDI 44V20 (German Bayer company) 500 grams, PPG GMN-3050 (Shanghai Gaoqiao petrochemical industry) 100 grams, PPG GE-220 (Shanghai Gaoqiao petrochemical industry) 100 grams, PPG GE-204 (Shanghai Gaoqiao petrochemical industry) 15 grams, N,N-Dibenzylamine 1.0 grams.Chemical reaction is carried out in intensification, and 60 ℃ of reaction temperatures after 150 minutes reaction time, are cooled to 40 ℃, adds ethyl acetate 1080 grams, after mixing, obtains monocomponent polyurethane adhesive.After testing, prepolymer NCO mass contg 20.0%, solid content are 40%.Be polyurethane adhesive APU2.
Embodiment 3
Adopt aluminium top foil, on aluminium top foil, apply polyurethane adhesive APU1 with roller coating technology, behind the hot blast drying tunnel, the surface layer of adhesive coating enters in the machine laminated into type of 20mm cavity height continuously, the phenolic resins raw material that mixes in the continuous pouring of subsurface laminar surface, the phenolic resins raw material is the foamed solidification moulding in the cavity of machine laminated into type, and sheet material cuts after going out laminating machine, obtains the phenolic foam composite insulation board material.
After this phenolic foam composite insulation board material room temperature is placed a week, the bonding peel strength of test aluminium foil and foam core material, intensity is 3.5N.The bonding foil peel strength of uncoated bonding adhesive is 1.1N.
Embodiment 4
Adopt the colored steel surface layer, on color steel, apply polyurethane adhesive APU2 with roller coating technology, behind the hot blast drying tunnel, the color steel of adhesive coating enters in the machine laminated into type of 20mm cavity height continuously, the phenolic resins raw material that mixes in the continuous pouring of subsurface laminar surface, the phenolic resins raw material is the foamed solidification moulding in the cavity of machine laminated into type, and sheet material cuts after going out laminating machine, obtains the phenolic foam composite insulation board material.
After this phenolic foam composite insulation board material room temperature was placed a week, the bonding peel strength of testing color steel and foam core material, intensity were 3.1N.The color steel adhesive strength of uncoated bonding adhesive is 0.8N.
Claims (7)
1. the phenolic foam composite insulation board material of a continuity method preparation that has improved the surface layer adhesive strength, it is characterized in that: the technology that adopts online roller coat, on surface material, apply one deck polyurethane adhesive, this polyurethane adhesive is a kind of terminal isocyanate group polyurethane prepolymer of one-part solvent type, and its composition is: organic solvent A, polyurethane prepolymer B and curing compound C.
2. according to the described composite insulating board of claim 1, it is characterized in that: described organic solvent A is an ethyl acetate, butyl acetate, and carrene, or their mixture, the consumption of organic solvent are 40%～70%.
3. according to the described composite insulating board of claim 1, it is characterized in that: described polyurethane prepolymer B is to be formed through chemical reaction by excessive isocyanates and polyalcohol.Its isocyano-content NCO% is 10%～25%; Its isocyanates is MDI; Its polyalcohol is PPG, aromatic polyester polyol or aliphatic polyester polyols, or their mixture, and the hydroxyl value of polyalcohol (mg KOH/g) is between 28～350.
4. according to the described composite insulating board of claim 1, it is characterized in that: described curing compound C is trimethylamine class or organic tin curing compound, and consumption is 0.05%～0.5%.
5. according to the described composite insulating board of claim 1, it is characterized in that: employed surface layer is metal faced, aluminium foil, color steel, galvanized sheet, corrosion resistant plate or aluminium-plastic panel.
6. according to the described composite insulating board of claim 1, it is characterized in that: the coating processes of adhesive coated surface layer is on-line spray or online roller coat.
7. according to the described composite insulating board of claim 1, it is characterized in that: adopt the technology of continuous foamed moulding, make phenolic resins continuous foamed moulding in composite molding mechanical floor pressing machine, become target plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101999498A CN102086664A (en) | 2009-12-04 | 2009-12-04 | Surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by continuity method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101999498A CN102086664A (en) | 2009-12-04 | 2009-12-04 | Surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by continuity method |
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| Publication Number | Publication Date |
|---|---|
| CN102086664A true CN102086664A (en) | 2011-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101999498A Pending CN102086664A (en) | 2009-12-04 | 2009-12-04 | Surface bonding strength enhanced phenol formaldehyde foam composite heat preservation plate prepared by continuity method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104044306A (en) * | 2013-03-14 | 2014-09-17 | 上海昊海化工有限公司 | Surface bonding strength enhanced phenolic foam composite thermal insulation plate prepared by continuous method |
| CN107097505A (en) * | 2017-03-21 | 2017-08-29 | 佛山市顺德区巴德富实业有限公司 | A kind of rapid link method of building board |
-
2009
- 2009-12-04 CN CN2009101999498A patent/CN102086664A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104044306A (en) * | 2013-03-14 | 2014-09-17 | 上海昊海化工有限公司 | Surface bonding strength enhanced phenolic foam composite thermal insulation plate prepared by continuous method |
| CN107097505A (en) * | 2017-03-21 | 2017-08-29 | 佛山市顺德区巴德富实业有限公司 | A kind of rapid link method of building board |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110608 |