CN102086017A - Micro electronmechanical element and micro electronmechanical spring element - Google Patents
Micro electronmechanical element and micro electronmechanical spring element Download PDFInfo
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- CN102086017A CN102086017A CN2009102119387A CN200910211938A CN102086017A CN 102086017 A CN102086017 A CN 102086017A CN 2009102119387 A CN2009102119387 A CN 2009102119387A CN 200910211938 A CN200910211938 A CN 200910211938A CN 102086017 A CN102086017 A CN 102086017A
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Abstract
The invention relates to a micro electronmechanical element and a micro electronmechanical spring element. The micro electronmechanical element comprises a substrate, a fixed part and a movable part, wherein the fixed part is fixed on the substrate; the movable part is provided with a first end connected with the fixed part and a second end suspended above the substrate and comprises a plurality of metal layers and supporting layers connected between adjacent metal layers; and a hollow area is formed between each supporting layer and each connected metal layer. Because the micro electronmechanical spring element is in a hollow structure, the movable part can prevent bending and deforming caused by different thermal expansion coefficients of the metal layers and the film layers between the metal layers when the micro electronmechanical spring element is changed by the environment or the encapsulating temperature so that the micro electronmechanical spring element has favorable working performance.
Description
Technical field
The present invention relates to a kind of microcomputer electric component, particularly relate to a kind of microcomputer electric component and micro electronmechanical spring element of hollow.
Background technology
MEMS (Micro Electromechanical System, MEMS) a brand-new technology field and industry have been opened up in the development of technology, and its application is wide, for example usually is used for micro electro mechanical inertia sensors such as accelerometer or gyroscope.In these sensors, need a micro electronmechanical spring element that one end of its moving structure is fastened in the substrate usually, so that this moving structure can move back and forth on certain direction.And known micro electronmechanical spring element generally is silicon materials or metal level and oxide layer alternately stack constitute.
Yet because metal level is different with the thermal coefficient of expansion of oxide layer, so follow-up when carrying out high temperature process, thermal expansion in various degree can take place in metal level and oxide layer, causes micro electronmechanical spring element flexural deformation, thereby influences its service behaviour.
Therefore, how avoiding the flexural deformation when its residing environment occurrence temperature changes of micro electronmechanical spring element, to guarantee the service behaviour of micro electronmechanical spring element, is one of subject under discussion that personnel paid attention to of association area in fact.
This shows that above-mentioned existing micro electronmechanical spring element obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel microcomputer electric component and micro electronmechanical spring element, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing micro electronmechanical spring element exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel microcomputer electric component and micro electronmechanical spring element, can improve general existing micro electronmechanical spring element, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing micro electronmechanical spring element exists, and provide a kind of novel micro electronmechanical spring element, technical problem to be solved is to make it can be when residing environment produces variations in temperature, still keep original appearance profile, and thereby have good working performance, be very suitable for practicality.
Another object of the present invention is to, a kind of novel microcomputer electric component is provided, technical problem to be solved is to make it avoid taking place influencing the situation of its service behaviour because of element produces thermal deformation, thereby is suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.A kind of micro electronmechanical spring element according to the present invention proposes is disposed in the substrate, and it comprises: a fixed part, be fixed in this substrate, and this fixed part comprises: an insulating barrier is disposed in this substrate; The multiple layer metal fixed bed is disposed at this insulating barrier top; Multilayer support fixation layer is connected between those metal fixed beds; And a movable part, having one first end and one second end, this first end is connected in this fixed part, and this second end is suspended in this substrate top, this movable part comprises: the multiple layer metal layer; And at least one supporting layer, be connected between those adjacent metal levels, and have at least one hollow region between this at least one supporting layer and those metal levels that it is connected.
Purpose of the present invention and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid micro electronmechanical spring element, wherein said metal level at least wherein one have at least one opening, expose this hollow region.
Aforesaid micro electronmechanical spring element, wherein said at least one supporting layer comprises: a plurality of support units are distributed between those adjacent metal levels at each interval; And a plurality of linkage units, be connected to the two ends of those support units respectively, with those support units of contacting.
Aforesaid micro electronmechanical spring element, wherein said support unit at least wherein one have at least one opening, expose this hollow region.
Aforesaid micro electronmechanical spring element, wherein said at least one supporting layer is looped around between those metal levels in the form of a ring, and this supporting layer has at least one opening, exposes this hollow region.
Aforesaid micro electronmechanical spring element, wherein said fixed part more comprises the multilayer oxide layer, lay respectively between those adjacent metal fixed beds, and respectively by those support fixation layers around.
One of them is connected with those metal fixed beds respectively for aforesaid micro electronmechanical spring element, wherein said metal level.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of microcomputer electric component according to the present invention proposes is disposed in the substrate, and it comprises: an insulating barrier is disposed in this substrate; The multiple layer metal layer is disposed on this insulating barrier; And at least one supporting layer, be connected between those adjacent metal levels, and have at least one hollow region between this at least one supporting layer and those metal levels that it is connected.
Purpose of the present invention and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid microcomputer electric component, wherein said metal level at least wherein one have at least one opening, expose this hollow region.
Aforesaid microcomputer electric component, wherein said at least one supporting layer comprises: a plurality of support units are distributed between those adjacent metal levels at each interval; And a plurality of linkage units, be connected to the two ends of those support units respectively, with those support units of contacting.
Aforesaid microcomputer electric component, wherein said supporting layer unit at least wherein one have at least one opening, expose this hollow region.
Aforesaid microcomputer electric component, wherein said at least one supporting layer is looped around between those metal levels in the form of a ring, and this supporting layer has at least one opening, exposes this hollow region.
The present invention compared with prior art has tangible advantage and beneficial effect.Via as can be known above, in order to achieve the above object, the invention provides a kind of micro electronmechanical spring element, it can still be kept original appearance profile, and thereby have and good working performance when residing environment produce variations in temperature.The present invention also proposes a kind of microcomputer electric component, to avoid taking place to influence because of element generation thermal deformation the situation of its service behaviour.
The present invention proposes a kind of micro electronmechanical spring element, and it is disposed in the substrate, and comprises fixed part and movable part.Wherein, fixed part is fixed in the substrate.Movable part has first end and second end, and first end is connected in fixed part, and second end is suspended in the substrate top.Movable part comprises the multiple layer metal layer and is connected in supporting layer between these adjacent metal levels, and has hollow region between supporting layer and these metal levels that it is connected.
The present invention also proposes a kind of microcomputer electric component, it is disposed in the substrate, and comprises insulating barrier, multiple layer metal layer and supporting layer, and wherein insulating barrier is disposed in the substrate, these metal levels are disposed on the insulating barrier, and supporting layer then is connected between these adjacent metal levels.And, have hollow region between supporting layer and these metal levels that it is connected.
By technique scheme, microcomputer electric component of the present invention and micro electronmechanical spring element have following advantage and beneficial effect at least: in microcomputer electric component of the present invention, owing to surround hollow region between supporting layer and the metal level, promptly wherein there is not the other materials of filling, therefore can avoid when the residing environment of microcomputer electric component produces variations in temperature, cause the diastrophic situation of movable part because of metal level is different with the thermal coefficient of expansion of therebetween rete, thereby guarantee that microcomputer electric component has good working performance.
In sum, the invention relates to a kind of microcomputer electric component and micro electronmechanical spring element, wherein this micro electronmechanical spring element comprises substrate, fixed part and movable part.Wherein, fixed part is fixed in the substrate.Movable part has first end that is connected in fixed part and second end that is suspended in the substrate top, and comprises the multiple layer metal layer and be connected in supporting layer between the adjacent metal layer, and has hollow region between supporting layer and these metal levels that it is connected.Because above-mentioned micro electronmechanical spring element adopts hollow structure, therefore can avoid when micro electronmechanical spring element is changed by environment or package temperature, cause movable part flexural deformation because of metal level is different with the thermal coefficient of expansion of therebetween rete, thereby guarantee that micro electronmechanical spring element has good working performance.The present invention has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic top plan view of micro electronmechanical spring element in one embodiment of the invention.
Fig. 2 is a micro electronmechanical spring element shown in Figure 1 generalized section along II-II ' line.
Fig. 3 is the sectional perspective schematic diagram of the movable part of Fig. 2.
Fig. 4 is the generalized section of micro electronmechanical spring element in another embodiment of the present invention.
Fig. 5 is the sectional perspective schematic diagram of the movable part of Fig. 4.
Fig. 6 is the generalized section of micro electronmechanical spring element in another embodiment of the present invention.
Fig. 7 is the sectional perspective schematic diagram of the movable part of Fig. 6.
Fig. 8 is the generalized section of micro electronmechanical spring element in another embodiment of the present invention.
Fig. 9 is the sectional perspective schematic diagram of the movable part of Fig. 8.
Figure 10 is the schematic top plan view of micro electronmechanical accelerometer in the another embodiment of the present invention.
Figure 11 A is the part-structure schematic diagram of micro electronmechanical resonator in one embodiment of the invention.
Figure 11 B is the generalized section of the micro electronmechanical resonator of Figure 11 A along I-I ' line.
Figure 12 is the generalized section of the moving structure of micro electronmechanical resonator in the another embodiment of the present invention.
10,20,30,40: micro electronmechanical spring element
12,51: substrate
14: fixed part
142,522: insulating barrier
144: the metal fixed bed
146: the support fixation layer
148: oxide layer
16,26,36,46: movable part
160: the first ends
161: the second ends
162,262,362,462,524,624: metal level
1622,2622,4643,5262: opening
164,264,364,464,526: supporting layer
1642,2642,5262: support unit
2644: linkage unit
166,266,366,528,628: hollow region
50: micro electronmechanical resonator
52,62: moving structure
54: fixed structure
80: micro electronmechanical accelerometer
82: mass
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to microcomputer electric component and its specific embodiment of micro electronmechanical spring element, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Below will give an actual example illustrates microcomputer electric component of the present invention, but it is not in order to limit the kenel of microcomputer electric component of the present invention.Haveing the knack of this skill person can know, microcomputer electric component of the present invention can be that any meeting is because of being subjected to the microcomputer electric component that the external force effect produces motion.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can clearly present in the following detailed description that cooperates with reference to graphic preferred embodiment.For convenience of description, in following embodiment, components identical is represented with identical numbering.
Fig. 1 illustrates the schematic top plan view into micro electronmechanical spring element in one embodiment of the invention.Fig. 2 illustrates and is micro electronmechanical spring element shown in Figure 1 generalized section along II-II ' line.See also Fig. 1 and Fig. 2, micro electronmechanical spring element 10 is disposed in the substrate 12, and comprises fixed part 14 and movable part 16.Wherein, fixed part 14 is fixed in the substrate 12.Specifically, fixed part 14 comprises insulating barrier 142, multiple layer metal fixed bed 144 and multilayer support fixation layer 146.Wherein, insulating barrier 142 is disposed in the substrate 12, and metal fixed bed 144 is disposed at insulating barrier 142 tops, and support fixation layer 146 then is to be connected between the metal fixed bed 144.In addition, fixed part 14 also comprises multilayer oxide layer 148, lay respectively between the adjacent metal fixed bed 144, and support fixation layer 146 more is looped around oxide layer 148 sides, and oxide layer 148 is sealed between the metal fixed bed 144.
Please continue to consult Fig. 1, movable part 16 has first end 160 and second end, 161, the first ends 160 and is connected in fixed part 14, the second ends 161 and then is suspended in the substrate 12.Movable part 16 comprises multiple layer metal layer 162 and one deck supporting layer 164 at least, and supporting layer 164 is connected between the adjacent metal layer 162, and surrounds hollow region 166 between supporting layer 164 and its metal level that is connected 162.
Specifically, the metal fixed bed 144 of fixed part 14 is finished in same technology with the metal level of movable part 16, and 146 supporting layers 164 with movable part 16 of the support fixation layer of fixed part 14 are finished in same technology.Hence one can see that, and metal level 162 is connected to metal fixed bed 144, and metal fixed bed 144 can be same or similar with the material of metal level 162 and supporting layer 146 respectively with the material of support fixation layer 164, and it for example is respectively aluminium and tungsten.And in the present embodiment, each metal level 162 is continuous structure, and each supporting layer 164 then comprises a plurality of support units 1642 that are arranged at each interval between the adjacent metal layer 162.For instance, the two ends of these support units 1642 for example are to be connected to linkage unit 1644 respectively, thereby form the supporting layer 164 of pectination, as shown in Figure 3.Specifically, though these support units 164 of present embodiment have the opening 1645 that exposes hollow region 166 respectively, the present invention does not limit the quantity of opening 1645.
From the above, because what surrounded between the metal level 162 of movable part 16 and the supporting layer 164 is hollow region 166, promptly wherein there is not the other materials of filling, so the situation that can avoid movable part 16 residing environment (in encapsulation process) when variations in temperature, to cause movable part 16 to occur bending and deformation, thereby guarantee that micro electronmechanical spring element 10 has good working performance.
It is pointed out that the metal level of micro electronmechanical spring element of the present invention or the structure of supporting layer do not exceed with above-mentioned, it also can be other structures.For example, see also Fig. 4 and Fig. 5, metal level 262 can also have opening 2622, and it exposes hollow region 266, and the hollow region 266 that is positioned at different layers more can see through opening 2622 and be connected.Thus, in the technology of micro electronmechanical spring element 20, can and simultaneously the rete (being generally oxide layer) between each metal level 262 be removed through gap between each support unit 2642 and opening 2622 feeding etching gas, to form the hollow region 266 of different layers.And, the metal level 162 that is continuous structure among the metal level 262 with opening 2622 and Fig. 2 in comparison because its rigidity is less, thereby it is preferable flexible to make that micro electronmechanical spring element 20 has.In other words, have the knack of this skill person can decide opening 2622 voluntarily according to needed degree of flexibility on the practice quantity, size, shape and distributing position etc., the present invention does not do any qualification at this.
Though in the aforementioned embodiment, each supporting layer 164 comprises a plurality of support units 1642 at least, and the present invention is not limited to this.In another embodiment, as Figure 6 and Figure 7, supporting layer 364 is a circulus, and is centered around the edge between the metal level 362, and can have at least one opening 3643.In this embodiment, micro electronmechanical spring element 30 promptly is to see through opening 3643 to feed etching gas removing the rete between each metal level 362 in technology, and then forms hollow region 366.
What deserves to be mentioned is that the shape of each layer metal level in the microcomputer electric component of the present invention can be the same or different.Fig. 8 illustrates the generalized section into micro electronmechanical spring element in the another embodiment of the present invention, and Fig. 9 then illustrates the part three-dimensional exploded view into the micro electronmechanical spring element of Fig. 8.Please refer to Fig. 8 and Fig. 9, the movable part 46 of micro electronmechanical spring element 40 comprises multiple layer metal layer 462a, metal level 462b and supporting layer 464, and wherein metal level 462b and supporting layer 464 are interconnected between these metal levels 462a.And metal level 462b is similar to the shape of supporting layer 464.Specifically, metal level 462b and supporting layer 464 are all around the edge between the metal level 462a, and each supporting layer 464 has at least one opening 4643.Certainly, if supporting layer 464 is comb support layer shown in Figure 3, then metal level 462b also can corresponding supporting layer 464 and be pectinate texture, repeats no more herein.
From the above, in the technology of micro electronmechanical spring element 40, opening 4643 can be used as and feeds gas to remove the etched channels of the rete (being generally oxide layer) between metal level 462a and metal level 462b.
Figure 10 illustrates the schematic diagram into micro electronmechanical accelerometer.Please refer to Figure 10, specifically, the structure of the movable part of the micro electronmechanical spring element of aforementioned each embodiment can also be applied in the mass 82 of micro electronmechanical accelerometer 80, and its detailed structure please refer to preamble, repeats no more herein.In other words, in micro electronmechanical accelerometer 80 of the present invention, mass 82 has at least one hollow region, therefore can avoid when operating temperature changes, and the mass 82 inner problems that produce unbalanced stress are so that improve the susceptibility of micro electronmechanical accelerometer 80.
Figure 11 A illustrates the part schematic diagram into micro electronmechanical resonator in one embodiment of the invention.Please refer to Figure 11 A, micro electronmechanical resonator 50 is disposed in the substrate 51, and it is made of moving structure 52 and a plurality of fixed structure 54.Wherein, fixed structure 54 is the both sides that are positioned at moving structure 52.On applying voltages to fixed structure 54 and when moving structure 52 both sides generation electric field, moving structure 52 can be subjected to the electric power effect of electric field and produce reciprocal concussion campaign between the fixed structure 54 of both sides.
Figure 11 B is the generalized section of the micro electronmechanical resonator of Figure 11 A along I-I ' line.Please refer to Figure 11 B, moving structure 52 comprises insulating barrier 522, multiple layer metal layer 524 and supporting layer 526.Insulating barrier 522 is disposed in the substrate 51, and metal level 524 is disposed on the insulating barrier 522, and 526 of supporting layers are to be connected between the adjacent metal layer 524.And, have hollow region 528 between supporting layer 526 and its metal level that is connected 524.Specifically, the supporting layer 526 of present embodiment is made of the support unit 5262 that a plurality of each intervals are arranged.And the material of metal level 524 for example is an aluminium, and the material of supporting layer 526 for example is a tungsten.
From the above, because the moving structure 52 of microcomputer electric component 50 has hollow region 528 between metal level 524 and supporting layer 526, therefore can avoid moving structure 52 when residing environment occurrence temperature changes, to produce thermal deformation, and then make it can keep good operation usefulness (as the concussion frequency).
Figure 12 illustrates the generalized section into the moving structure of micro electronmechanical resonator in the another embodiment of the present invention.Please refer to Figure 12, the metal level 624 of the moving structure 62 of present embodiment also can have the opening 6242 that exposes hollow region 628, with in the technology of moving structure 62, remove the rete (being generally oxide layer) between each metal level 624 simultaneously, to form the hollow region 628 of different layers.And, the metal level 524 that is continuous structure among the metal level 624 with opening 6242 and Figure 11 B in comparison because its rigidity is less, thereby it is preferable flexible to make that moving structure 62 has.Described as preamble, have the knack of this skill person can decide opening 6242 voluntarily according to needed degree of flexibility on the practice quantity, size, shape and distributing position etc., the present invention does not do any qualification at this.
In sum, in microcomputer electric component of the present invention, owing to surround hollow region between supporting layer and the metal level, promptly wherein there is not the other materials of filling, therefore can avoid when the residing environment of microcomputer electric component produces variations in temperature, cause movable part flexural deformation because of the thermal expansion coefficients of metal level and therebetween rete is different, thereby make microcomputer electric component can keep good working performance.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art are not in breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1. a micro electronmechanical spring element is disposed in the substrate, it is characterized in that it comprises:
One fixed part is fixed in this substrate, and this fixed part comprises:
One insulating barrier is disposed in this substrate;
The multiple layer metal fixed bed is disposed at this insulating barrier top;
Multilayer support fixation layer is connected between those metal fixed beds;
And
One movable part has one first end and one second end, and this first end is connected in this fixed part, and this second end is suspended in this substrate top, and this movable part comprises:
The multiple layer metal layer; And
At least one supporting layer is connected between those adjacent metal levels, and has at least one hollow region between this at least one supporting layer and those metal levels that it is connected.
2. micro electronmechanical spring element according to claim 1, it is characterized in that wherein said metal level at least wherein one have at least one opening, expose this hollow region.
3. micro electronmechanical spring element according to claim 1 is characterized in that wherein said at least one supporting layer comprises:
A plurality of support units are distributed between those adjacent metal levels at each interval; And
A plurality of linkage units are connected to the two ends of those support units respectively, with those support units of contacting.
4. micro electronmechanical spring element according to claim 3, it is characterized in that wherein said support unit at least wherein one have at least one opening, expose this hollow region.
5. micro electronmechanical spring element according to claim 1 is characterized in that wherein said at least one supporting layer is looped around between those metal levels in the form of a ring, and this supporting layer has at least one opening, exposes this hollow region.
6. micro electronmechanical spring element according to claim 1 is characterized in that wherein said fixed part more comprises the multilayer oxide layer, lay respectively between those adjacent metal fixed beds, and respectively by those support fixation layers around.
7. micro electronmechanical spring element according to claim 1 is characterized in that one of them is connected wherein said metal level with those metal fixed beds respectively.
8. a microcomputer electric component is disposed in the substrate, it is characterized in that it comprises:
One insulating barrier is disposed in this substrate;
The multiple layer metal layer is disposed on this insulating barrier; And
At least one supporting layer is connected between those adjacent metal levels, and has at least one hollow region between this at least one supporting layer and those metal levels that it is connected.
9. microcomputer electric component according to claim 8, it is characterized in that wherein said metal level at least wherein one have at least one opening, expose this hollow region.
10. microcomputer electric component according to claim 8 is characterized in that wherein said at least one supporting layer comprises:
A plurality of support units are distributed between those adjacent metal levels at each interval; And
A plurality of linkage units are connected to the two ends of those support units respectively, with those support units of contacting.
11. microcomputer electric component according to claim 10, it is characterized in that wherein said supporting layer unit at least wherein one have at least one opening, expose this hollow region.
12. microcomputer electric component according to claim 8 is characterized in that wherein said at least one supporting layer is looped around between those metal levels in the form of a ring, and this supporting layer has at least one opening, exposes this hollow region.
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| CN200910211938.7A CN102086017B (en) | 2009-12-03 | 2009-12-03 | Micro electronmechanical element and micro electronmechanical spring element |
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| CN200910211938.7A CN102086017B (en) | 2009-12-03 | 2009-12-03 | Micro electronmechanical element and micro electronmechanical spring element |
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| CN102086017B CN102086017B (en) | 2014-11-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481820B (en) * | 2013-03-01 | 2015-04-21 | Ind Tech Res Inst | Micro electro mechanical apparatus with interdigiated spring |
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| US20060228873A1 (en) * | 2001-07-26 | 2006-10-12 | The Board Of Trustees Of The University Of Illinois | Electrostatic nanolithography probe actuation device and method |
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| US5610335A (en) * | 1993-05-26 | 1997-03-11 | Cornell Research Foundation | Microelectromechanical lateral accelerometer |
| US20060228873A1 (en) * | 2001-07-26 | 2006-10-12 | The Board Of Trustees Of The University Of Illinois | Electrostatic nanolithography probe actuation device and method |
| US20030042117A1 (en) * | 2001-08-30 | 2003-03-06 | Intel Corporation | High-speed mems switch with high-resonance-frequency beam |
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| TWI481820B (en) * | 2013-03-01 | 2015-04-21 | Ind Tech Res Inst | Micro electro mechanical apparatus with interdigiated spring |
| US9529012B2 (en) | 2013-03-01 | 2016-12-27 | Industrial Technology Research Institute | Micro-electro mechanical apparatus with interdigitated spring |
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| CN102086017B (en) | 2014-11-26 |
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