CN102084503B - Light emitting device having remotely located light scattering material - Google Patents
Light emitting device having remotely located light scattering material Download PDFInfo
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- CN102084503B CN102084503B CN2009800002095A CN200980000209A CN102084503B CN 102084503 B CN102084503 B CN 102084503B CN 2009800002095 A CN2009800002095 A CN 2009800002095A CN 200980000209 A CN200980000209 A CN 200980000209A CN 102084503 B CN102084503 B CN 102084503B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
A light emitting device with a remotely located light scattering material which improves color mixing property is provided. The light emitting device includes a substrate defining a cavity; one or more light emitting elements bonded to the substrate and positioned in the cavity; at least one first layer covering the one or more light emitting elements, at least part of the at least one first layer within the cavity, wherein the at least one first layer has a refractive index less than the refractive index of the one or more light emitting elements; and at least one second layer including light scattering material disposed on the at least one first layer, wherein the refractive index of the first layer is less than or equal to the refractive index of the second layer.
Description
Technical field
The present invention relates to a light-emitting device, particularly the light-emitting device that light-scattering material is set at a distance.
Background of invention
At present, light-emitting diode (LED) is in the industry tool innovation and development one of technology the most rapidly of semiconductor product.Although LED has been used to indicate device and the signal purposes reaches more than ten years, its technical development and improvement are so that it more is widely used for the illumination application.
Use the LED very attractive in illumination is used, reason comprises that the unit watt sends the ability of more light, longer life-span, less size, higher durability, more environmental protection and in color, the control of light type with dim flexibility aspect the light.In addition, aspect the generation white light source many achievements having been arranged also, such as the white light devices of phosphor powder conversion, use dissimilar phosphor powders, such as yellow, green, blueness or red fluorescent powder.The another kind of method that produces white light source is to use redness, blueness and green LED.But these methods are all faced a challenge, namely provide equally distributed light and/or light to mix in the device in a less zone.Equally distributed light being provided and obtaining sufficient light mixing may be unusually difficult, because the light of different colours has different spectrum, and shows separately different optical properties, such as reflection and refraction.Produce uniform light distribution and solve all class problems although attempted at present some known methods, these class methods can not make us being satisfied with fully.
So, needing the light-emitting device that light-scattering material is set at a distance, it can solve above defective.
Summary of the invention
According to one embodiment of the present of invention, disclosed a light-emitting device that light-scattering material is set at a distance.Light-emitting device comprises a substrate that optical cavity is arranged; One or more light-emitting components, it is bonded to substrate, and one or more light-emitting components are positioned at optical cavity, and one or more light-emitting components are configured to send light; At least one ground floor, it covers one or more light-emitting components, at least a portion of at least one ground floor is in optical cavity, and at least one ground floor has a upper surface, and wherein the refractive index of at least one ground floor is less than the refractive index of one or more light-emitting components; And at least one second layer, it is disposed at least one ground floor, at least one second layer comprises light-scattering material, and wherein the refractive index of at least one second layer is less than the refractive index of one or more light-emitting components, and the refractive index of ground floor is less than or equal to the refractive index of the second layer.
According to an alternative embodiment of the invention, disclosed a light-emitting device that light-scattering material is set at a distance.Light-emitting device comprises a substrate; One or more light-emitting components, it is bonded on the substrate; At least one ground floor, it covers the one or more light-emitting components on the substrate, and at least one ground floor has a upper surface and side surface; And at least one second layer, it covers at least one ground floor, at least one second layer comprises light-scattering material, and wherein the refractive index of at least one second layer is less than the refractive index of one or more light-emitting components, and the refractive index of ground floor is less than or equal to the refractive index of the second layer.
From the following detailed description, those skilled in the art are with other embodiments of the invention easier to understand, and wherein the embodiment of the invention is to be described by accompanying drawing.Will recognize that the present invention can be applicable to other and different embodiment, and in the situation that does not break away from the spirit and scope of the present invention, can make amendment to its some details in all fields.
Description of drawings
Fig. 1 is the sectional view of a light-emitting device of first embodiment of the invention;
Fig. 2 is the sectional view of a light-emitting device of second embodiment of the invention;
Fig. 2 A is the part vertical view of the light-emitting device shown in Figure 2 of second embodiment of the invention;
Fig. 2 B is the part side cross-sectional, view of the ground floor shown in Figure 2 of second embodiment of the invention;
Fig. 3 is the sectional view of a light-emitting device of third embodiment of the invention;
Fig. 4 is the sectional view of a light-emitting device of fourth embodiment of the invention;
Fig. 4 A is the part vertical view of the light-emitting device shown in Figure 4 of fourth embodiment of the invention;
Fig. 4 B is the part side cross-sectional, view of the ground floor shown in Figure 4 of fourth embodiment of the invention;
Fig. 5 is the sectional view of a light-emitting device of fifth embodiment of the invention.Detailed Description Of The Invention
In following description, by describing and with reference to accompanying drawing, having shown specific embodiments of the invention.Will be understood that, without departing from the present invention, can make to it change of structure and other side, and as other embodiment.And the various aspects of various embodiment and each different embodiment thereof can be used in combination in any suitable manner.So accompanying drawing and describe in detail is counted as descriptive rather than restrictive in essence.
Usually, the embodiment of the invention relates to a light-emitting device, and it has the light-scattering material of remote setting.
Fig. 1 is the sectional view of a light-emitting device of first embodiment of the invention.Light-emitting device 100 comprises a substrate 102 and a red LED 104, a blue led 106 and a green LED 108, and they are bonded on the cavity 103 of substrate 102 interior formation.Ground floor 110 is filled in the optical cavity 103, and is disposed in above the LED or surrounds red LED 104, blue led 106 and green LED 108 (being referred to as " RBG LEDs ").The second layer 112 is disposed in the top of ground floor 110 or surrounds ground floor 110.According to embodiments of the invention, the second layer 112 comprises light-scattering material.According to one embodiment of the present of invention, this light-scattering material comprises a plurality of particles, and it is used for the light that scattering is sent by RBG LEDs.Connecting conducting wire 114 can be electrically connected each LED among the RBG LEDs to hard contact 116.The first or second optics 118, such as lens or reflector, also may be provided in the second layer 112 above, be used to refer to or reverberation.According to an embodiment, first and second layers is transparent and insulation.But according to other embodiment, first and second layers can be partially transparent or translucent.
According to described embodiment, ground floor 110 changes the light that sends from RGB LEDs, then is launched into the second layer 112.Ground floor 110 can be used for reflecting, reflecting and/or change the light radiation pattern of sending from RBG LEDs.So the light that sends from RGB LEDs is delivered to the second layer 112 that comprises light-scattering material after by premix again.As a result, the mixing of redness, blueness, green and/or other light and spatial color uniformity can be improved by the existence of ground floor 110, particularly do not only have the light-emitting device of the second layer 112 to compare with there being ground floor 110.
According to one embodiment of the present of invention, ground floor 110 and the second layer 112 be without any the wavelength converting attribute, and it is used for transmitting light, and to pass ground floor 110 or the second layer 112 or this two-layer, keeps the original wavelength of light.The refractive index of ground floor 110 is greater than 1.According to another embodiment, the refractive index of ground floor 110 is less than the refractive index of RBG LEDs or other light-emitting component that may use, and is less than or equal to the refractive index of the second layer 112.The refractive index of the second layer 112 also can may be used for the refractive index of the light-emitting component of 100 li of light-emitting devices less than RBGLEDs or other.
Fig. 2 is the sectional view of the light-emitting device of second embodiment of the invention.Light-emitting device 200 comprises that a substrate 102, light-emitting component 106, a ground floor 110 that is bonded on the substrate 102 interior optical cavities 103 are filled in the optical cavity 103, the second layer that comprises light-scattering material 112 that it is disposed in the top of light-emitting component 106 or surrounds light-emitting component 106 and form at ground floor 110.Connecting conducting wire 114 can be electrically connected light-emitting component 106 to hard contact 116.Reflectance coating 130 is applied on the optical cavity 103 of substrate 102 interior formation.According to one embodiment of the present of invention, reflectance coating 130 is used for strengthening and/or improving the reflection of light that sends from light-emitting component 106, and then light is issued through ground floor 110 and the second layer 112.For example, reflectance coating 130 can be silver (Ag) or aluminium (Al) coating, or an alloy that comprises silver, aluminium or other reflecting material.With reference to Fig. 2 to 5 described and shown in the ground floor 110 of each embodiment and the remainder of the attribute of the second layer 112 and light-emitting device be substantially similar to Fig. 1 described those, unless be illustrated especially.
Fig. 2 A is the part vertical view of ground floor of the light-emitting device shown in Figure 2 of second embodiment of the invention.The total surface zone A that has shown the top surface of ground floor 110
0Total surface zone A
0A part of A
1Represented by oblique line.According to an embodiment, pass a part of A in the total surface zone of ground floor from the light of any one light-emitting component
1, and A
1Total surface zone A more than or equal to about 80%
0So most of light was evenly distributed before passing the second layer 112.This situation should all be effective the reflector being arranged or not having under the condition in reflector.According to an embodiment, the light that surpasses half was evenly distributed before passing the second layer 112.According to another embodiment, the light above 75% was evenly distributed before passing the second layer 112.
Fig. 2 B is the part side cross-sectional, view of the ground floor shown in Figure 2 of second embodiment of the invention.The height t, top surface diameter d and the base diameter b that have shown ground floor 110.Base diameter b also is the base diameter of optical cavity.According to an embodiment, select height t and top surface diameter d, so that d/t (being that d is divided by t) is more than or equal to 0, and be less than or equal to 25.5, or approximately be 26, thereby the most of light that sends from any light-emitting component 106 was evenly distributed before passing the second layer 112.According to another embodiment, d/b (being that d is divided by b) is more than or equal to 1, and is less than or equal to 1.2, thereby can effectively be applied to reflectance coating 130 reflections on the optical cavity 103 from most of light that any one or a plurality of light-emitting component send.Although Fig. 2 A and 2B are with reference to Fig. 2, above feature is equally applicable to Fig. 1 and embodiment shown in Figure 3.Moreover, be circular although the vertical view of ground floor 110 is shown, when the top surface of ground floor was not circle, b and d can be counted as hydraulic diameter (hydraulic diameters).
Fig. 3 is the sectional view of the light-emitting device of third embodiment of the invention.Light-emitting device 300 is similar to light-emitting device shown in Figure 2 200.But light-emitting device 300 shown in Figure 3 comprises a plurality of light-emitting components 106.Although the described embodiment of light-emitting device 300 comprises three light-emitting components 106, according to the requirement of special enforcement, can use the light-emitting component of any number in light-emitting device 300.
Fig. 4 is the sectional view of the light-emitting device of fourth embodiment of the invention.Light-emitting device 400 is similar to light-emitting device shown in Figure 2 200.But, the light-emitting device 400 in the 4th embodiment, substrate 102 is without any optical cavity.On the contrary, ground floor 110 and the second layer 112 are to form at substrate 102.Reflectance coating 130 can be formed on substrate 102 above, between substrate 102 and first and second layer 110,112.Ground floor 110 covers also and surrounds light-emitting component 106, and comprises and cover and surround ground floor 110 by the second layer 112 of light-scattering material.Connecting conducting wire 114 can be electrically connected light-emitting component 106 to hard contact 116.Although shown a light-emitting component 106, described embodiment can use two or more light-emitting components.
Fig. 4 A is the part vertical view of ground floor of the light-emitting device shown in Figure 4 of fourth embodiment of the invention.The total surface zone A that has shown the top surface of ground floor 110
0, represented by the circumference of ground floor 110.Total surface zone A
0A part of A
1To be represented by oblique line.According to an embodiment, pass the part A in the total surface zone of ground floor from the light of any one light-emitting component
1, and A
1Equal total surface zone A
0So, A
1Cover A fully
0, and most of light was evenly distributed before passing the second layer 112.This situation be with or without under the condition in reflector all effective.
Fig. 4 B is the part side cross-sectional, view of the ground floor shown in Figure 4 of fourth embodiment of the invention.The height t and the diameter d that have shown ground floor 110.According to an embodiment, select height t and top surface diameter d, so that d/t (being that d is divided by t) is more than or equal to 0, and be less than or equal to 22.8, or approximately be 23, thereby the most of light that sends from any light-emitting component 106 was evenly distributed before passing the second layer 112.Although Fig. 4 A and 4B are with reference to Fig. 4, above feature is equally applicable to embodiment shown in Figure 5.Moreover, be circular although the vertical view of ground floor 110 shows, when the top surface of ground floor was not circle, d can be counted as hydraulic diameter.
Fig. 5 is the partial cross section figure of the light-emitting device of fifth embodiment of the invention.The light-emitting device 500 of the 5th embodiment is similar to light-emitting device shown in Figure 4 400.But in the fifth embodiment of the present invention, light-emitting device 500 comprises at least one fluorescence coating 502, and it surrounds and cover at least a portion light-emitting component 106.Ground floor 110 covers and surrounds fluorescence coating 502.Fluorescence coating 502 can comprise one or more fluorescent materials, such as yellow, red, blue or green luminescent phosphor.Although show a light-emitting component 106, two or more light-emitting components also can be used for described embodiment.
In embodiments of the invention, because the light that sends from light-emitting component was to be pre-mixed at ground floor 110, can reduce the quantity of light-scattering material required on the second layer 112 before arriving the second layer 112.In addition, the quantity that reduces light-scattering material can reduce light loss, and improves the light intensity that is sent by light-emitting device.
Although the described embodiment of reference describes especially and has shown the present invention, it will be understood by those skilled in the art that in the situation that does not break away from the spirit and scope of the present invention, can make change to its form and details.For example, although the shown reflectance coating 130, the embodiment of the invention of comprising of embodiments of the invention can comprise also or not have reflectance coating 130 that this depends primarily on the requirement of particular implementation.Moreover, also can use any appropriate combination of various embodiment.So embodiments of the invention can comprise single light-emitting component or a plurality of light-emitting component.Although LED is a demonstration light-emitting component that is suitable for the embodiment of the invention, also can use other light-emitting component.
So, more than describes and be intended to provide example embodiment of the present invention, but the concrete example that provides at this is provided scope of the present invention.
Claims (10)
1. light-emitting device comprises:
A substrate, it has an optical cavity;
One or more light-emitting components, it is bonded on the substrate, and one or more light-emitting components are positioned at optical cavity, and one or more light-emitting components are arranged for luminous;
At least one ground floor, it covers one or more light-emitting components, at least part of optical cavity that is positioned at of at least one ground floor, at least one ground floor has a upper surface, and wherein the refractive index of at least one ground floor is less than the refractive index of one or more light-emitting components; With
At least one second layer, it is disposed at least one ground floor, at least one second layer comprises light-scattering material, and wherein the refractive index of at least one second layer is less than the refractive index of one or more light-emitting components, and the refractive index of ground floor is less than or equal to the refractive index of the second layer;
Wherein pass the part in total surface zone of a upper surface of ground floor from the light of any one light-emitting component, wherein this part surf zone is regional more than or equal to 80% total surface, the top surface diameter d of described ground floor and the base diameter b of described ground floor are set such that d/b more than or equal to 1 and are less than or equal to 1.2, and the described top surface diameter d of the height t of described ground floor and described ground floor is set such that d/t more than or equal to 0 and is less than or equal to 25.5.
2. light-emitting device according to claim 1, wherein one or more light-emitting components are semiconductor-based devices.
3. light-emitting device according to claim 1, wherein one or more light-emitting components are Organic Light Emitting Diode (OLED).
4. light-emitting device according to claim 1, wherein one or more light-emitting components send one or more dominant wavelengths.
5. light-emitting device according to claim 1, also comprise one or more fluorescence coatings, it covers one or more light-emitting components, and at least a portion light that wherein one or more fluorescence coatings are used for being sent by one or more light-emitting components converts a different wave length to.
6. light-emitting device according to claim 5, wherein one or more fluorescence coatings comprise fluorescent material.
7. light-emitting device according to claim 1, wherein light-scattering material comprises the light that a plurality of equally distributed particles are sent by one or more light-emitting components with scattering.
8. light-emitting device according to claim 1, wherein the particle size of light-scattering material is less than or equal to 10 μ m.
9. light-emitting device according to claim 1, wherein every layer in ground floor and the second layer is insulation and transparent.
10. light-emitting device according to claim 1, wherein ground floor is configured to keep passing the light wavelength of ground floor.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/073947 WO2011032309A1 (en) | 2009-09-15 | 2009-09-15 | Light emitting device having remotely located light scattering material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102084503A CN102084503A (en) | 2011-06-01 |
| CN102084503B true CN102084503B (en) | 2013-03-20 |
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| CN2009800002095A Active CN102084503B (en) | 2009-09-15 | 2009-09-15 | Light emitting device having remotely located light scattering material |
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| WO (1) | WO2011032309A1 (en) |
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| CN114397794A (en) * | 2022-02-10 | 2022-04-26 | 深圳光峰科技股份有限公司 | Optical system and projection apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183727A (en) * | 2003-12-19 | 2005-07-07 | Kyocera Corp | Light emitting apparatus |
| CN101404316A (en) * | 2008-10-30 | 2009-04-08 | 深圳雷曼光电科技有限公司 | LED and its packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2696133Y (en) * | 2004-05-18 | 2005-04-27 | 葛世潮 | Power type light-emitting diod |
| CN1585143A (en) * | 2004-06-01 | 2005-02-23 | 佛山市国星光电科技有限公司 | Power LED and producing method thereof |
| JP2006173182A (en) * | 2004-12-13 | 2006-06-29 | Kyocera Corp | Light emitting device and package for storing same |
| KR100665219B1 (en) * | 2005-07-14 | 2007-01-09 | 삼성전기주식회사 | Wavelengt-converted light emitting diode package |
| CN2874775Y (en) * | 2005-08-30 | 2007-02-28 | 深圳市广社商贸有限公司 | 360 degree light emitting diode |
| CN100470860C (en) * | 2006-02-15 | 2009-03-18 | 深圳市量子光电子有限公司 | Light-emitted diode |
| CN200944171Y (en) * | 2006-07-11 | 2007-09-05 | 深圳帝光电子有限公司 | Backlight module using LED reflective depression |
| TWI375083B (en) * | 2006-09-12 | 2012-10-21 | Mutual Tek Ind Co Ltd | Light emitting apparatus and method for the same |
| CN201044147Y (en) * | 2007-05-18 | 2008-04-02 | 深圳市国冶星光电子有限公司 | Novel improved structure of LED display apparatus |
| GB2448564B (en) * | 2007-11-26 | 2009-04-29 | Iti Scotland Ltd | Light guides |
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2009
- 2009-09-15 WO PCT/CN2009/073947 patent/WO2011032309A1/en active Application Filing
- 2009-09-15 CN CN2009800002095A patent/CN102084503B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183727A (en) * | 2003-12-19 | 2005-07-07 | Kyocera Corp | Light emitting apparatus |
| CN101404316A (en) * | 2008-10-30 | 2009-04-08 | 深圳雷曼光电科技有限公司 | LED and its packaging method |
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| Publication number | Publication date |
|---|---|
| WO2011032309A1 (en) | 2011-03-24 |
| CN102084503A (en) | 2011-06-01 |
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