CN102081047B - Method and system for distinguishing defects of substrate - Google Patents
Method and system for distinguishing defects of substrate Download PDFInfo
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- CN102081047B CN102081047B CN200910246381.0A CN200910246381A CN102081047B CN 102081047 B CN102081047 B CN 102081047B CN 200910246381 A CN200910246381 A CN 200910246381A CN 102081047 B CN102081047 B CN 102081047B
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Abstract
The invention relates to a system and method for distinguishing defects of a substrate. The system comprises an illumination unit, at least one reflector, an imaging unit, an image construction module and an image processing module, wherein the illumination unit is arranged on the outer side of one surface of the substrate and used for irradiating light to the substrate; the reflector is arranged on the outer side of another opposite surface of the substrate and used for reflecting the light irradiated by the illumination unit and emitted to the at least one reflector through the substrate; the imaging unit is arranged on the outer side of another opposite surface of the substrate and used for sensing at least two of the light irradiated by the illumination unit and transmitted through the substrate and the light reflected by the reflector to shoot at least one two-dimensional image, wherein each one of the shot at least one two-dimensional image comprises a first image shot according to one of the two lights and a second image shot according to the other one of the two lights, and the first image and the second image are mutually separated; the image construction module is used for constructing two images of the substrate according to the first image and the second image of each one of the shot at least one two-dimensional image respectively; and the image processing module is used for detecting that the defects are positioned on the surface of the substrate or positioned in the substrate according to the mutual relation of the positions of the defects in the two constructed images. By using the method and the system, whether the defects of the transparent or semitransparent substrate are positioned on the surface of the substrate or positioned in the substrate can be distinguished.
Description
Technical field
The present invention relates to a kind of method and system for distinguishing the defect of substrate.
Background technology
At present, transparent or semitransparent substrate is all applied in many fields, such as, in solar energy module industry, for the patterning in photovoltaic cell or photovoltaic module or structured substrate.In the fabrication process, transparent or semitransparent substrate can produce various defect, such as, be positioned at the scuffing of substrate surface, dirty mark and open bubble etc. and be positioned at remain silent bubble and the calculus (comprising the calculus of black stone, white stone or other colors) etc. of substrate inside.Prior art has proposed the defect that many defects detection schemes are used for detecting transparent or semitransparent substrate.
But, along with the requirement of the quality to transparent or semitransparent substrate is more and more higher, need to take different quality control standards for dissimilar defect.In this case, not only need to detect the defect existing for transparent or semitransparent substrate, but also the defect needing district office to detect is positioned at the defect of substrate surface or is positioned at the defect of substrate inside.
Summary of the invention
Embodiments of the invention provide a kind of method and system for distinguishing the defect of substrate, utilize the method and system, and the defect can distinguishing transparent or semitransparent substrate is positioned at the defect of substrate surface or is positioned at the defect of substrate inside.
According to a kind of system for distinguishing the defect of substrate of the present invention, comprising: lighting unit, be arranged on one of them surface of transparent or semitransparent substrate outside and for irradiating light to described substrate; At least one catoptron, is arranged on the outside of another apparent surface of described substrate, and for reflecting described illumination unit and the light of at least catoptron described in being transmitted through described substrate and inciding; Image-generating unit, be arranged on another apparent surface described of described substrate outside and for sense described illumination unit and wherein two light being transmitted through the light of the light of described substrate and the reflection of described at least catoptron to take at least one two dimensional image, wherein, each two dimensional image at least one two dimensional image of described shooting to comprise described in separated basis the first image that a photo-beat in wherein two light is taken the photograph and the second image taken the photograph according to another photo-beat in described wherein two light; Image construction module, for respectively according to described second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image of described shooting and at least one two dimensional image of described shooting, build two images of described substrate; And, image processing module, for when described substrate existing defects, according to the mutual relationship of the position of described defect in two images of described structure, detect the defect of inside that described defect is positioned at the defect on the surface of described substrate or is positioned at described substrate.
According to a kind of method for distinguishing the defect of substrate of the present invention, comprise step: outside lighting unit being arranged on one of them surface of transparent or semitransparent substrate, wherein said lighting unit is used for irradiating light to described substrate; At least one catoptron is arranged on the outside of another apparent surface of described substrate, wherein, at least one catoptron described is for reflecting described illumination unit and being transmitted through described substrate and inciding the light of at least one catoptron described; Image-generating unit is arranged on the outside of another apparent surface described in described substrate, wherein said image-generating unit for sense described illumination unit and wherein two light being transmitted through the light of the light of described substrate and at least one catoptron described reflection to take at least one two dimensional image, wherein, the second image that each two dimensional image at least one two dimensional image of described shooting to comprise described in separated basis the first image that a photo-beat in wherein two light takes the photograph and takes the photograph according to another photo-beat in wherein two light; Image construction module is set, wherein said image construction module is used for respectively according to described second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image of described shooting and at least one two dimensional image of described shooting, builds two images of described substrate; And, image processing module is set, wherein said image processing module is used for when described substrate existing defects, according to the mutual relationship of the position of described defect in two images of described structure, detect the defect of inside that described defect is positioned at the defect on the surface of described substrate or is positioned at described substrate.
Accompanying drawing explanation
Above and other feature of the present invention, feature and advantage will become more apparent by the detailed description below in conjunction with accompanying drawing.Wherein:
Figure 1A-1K illustrates the schematic diagram of technical scheme for distinguishing the defect of substrate according to one embodiment of the invention;
Fig. 2 illustrates the structural representation of system for distinguishing the defect of substrate according to one embodiment of the invention; And
Fig. 3 is the work schedule schematic diagram that lighting unit according to one embodiment of the invention and image-generating unit are shown.
Embodiment
Below, each embodiment of the present invention will be described by reference to the accompanying drawings in detail.
Figure 1A-1K illustrates the schematic diagram of technical scheme for distinguishing the defect of substrate according to one embodiment of the invention.
First, as shown in Figure 1A, one of them surperficial B 1 of transparent or semitransparent substrate S arranged outside lighting unit L with to substrate S irradiate light, and, at arranged outside catoptron F and the image-generating unit M of another apparent surface B2 of substrate S, wherein, catoptron F to irradiate and the light being transmitted through substrate S and inciding catoptron F reflects to substrate S lighting unit L, the optical axis of image-generating unit M perpendicular to substrate S surperficial B1 and B2 and sense lighting unit L and to irradiate to substrate S and to be transmitted through light that the light of substrate S and catoptron F reflect to take two dimensional image.Wherein, the two dimensional image captured by image-generating unit M comprises separated sensing lighting unit L and irradiates and the second image of taking the photograph of the photo-beat of the first image of taking the photograph of the photo-beat being transmitted through substrate S and sensing catoptron F reflection to substrate S, as shown in Figure 1B.
Wherein, to irradiate to substrate S due to lighting unit L and be transmitted through substrate S and the light inciding catoptron F is not orthogonal to surperficial B1 and B2 of substrate S, so, in the two dimensional image captured by image-generating unit M, to irradiate and compared with the first image of taking the photograph of the photo-beat being transmitted through substrate S, the second image that the photo-beat that sensing catoptron F reflects is taken the photograph has compression deformation to substrate S with sensing lighting unit L.Such as, for the square-shaped patterns shown by Fig. 1 C, in the two dimensional image captured by image-generating unit M, sensing lighting unit L irradiates to substrate S and is transmitted through the first image captured by the light of substrate S as shown in figure ip, and the second image captured by light that sensing catoptron F reflects as referring to figure 1e.In Fig. 1 D, captured by the figure that obtains remain square, and in fig. ie, captured by the figure that obtains but be trapezoidal.Can find out, relative to the figure in Fig. 1 D, the base of the figure in Fig. 1 E does not change, but top margin and highly all being have compressed.After setting reflective mirror F and image-generating unit M relative to substrate S, the compress variation of the second image in the two dimensional image captured by image-generating unit M is just determined.At this moment, such as can be placed on substrate S by the scaling board such as justified or such figure such as square is formed, by calculating the compress variation of the figure in the second image of the two dimensional image captured by image-generating unit M, the compress variation of the second image in the two dimensional image captured by image-generating unit M just can be pre-determined out.
When substrate S moves along z direction, image-generating unit M constantly senses lighting unit L according to certain time interval and to irradiate to substrate S and to be transmitted through light that the light of substrate S and catoptron F reflect to take at least one two dimensional image.According to the compress variation pre-determined out, second image of each two dimensional image at least one two dimensional image captured by stretching image-generating unit M, to eliminate the compression deformation of the second image of each two dimensional image at least one two dimensional image of imaging unit M shooting.Then, utilize the first image of each two dimensional image at least one two dimensional image captured by image-generating unit M can build the image obtaining substrate S, equally, the second stretched image of each two dimensional image at least one two dimensional image captured by image-generating unit M is utilized also can to build the image obtaining substrate S.
As shown in fig. 1f, suppose with the left side of substrate S at a distance of z1 and perpendicular to the position of substrate S, there are two defect D1 and D2 in substrate S, wherein, defect D1 is positioned on the surperficial B2 of image-generating unit M side of substrate S, and defect D2 to be positioned at substrate S inner, the distance of the surperficial B2 of the image-generating unit M side of itself and substrate S is h.
Constantly sense lighting unit L at image-generating unit M according to certain time interval to irradiate to substrate S and to be transmitted through light that the light of substrate S and catoptron F reflect in the process of taking at least one two dimensional image, when substrate S moves to the position shown in Fig. 1 G along z direction, the first image in the two dimensional image captured by image-generating unit M comprises defect D1 and D2; When substrate S moves to the position shown in Fig. 1 H along z direction, the second image in the two dimensional image that image-generating unit M takes comprises defect D2; And when substrate S moves to the position shown in Fig. 1 I along z direction, the second image in the two dimensional image that image-generating unit M takes comprises defect D1.
Utilize the image X1 of the substrate S obtained constructed by the first image in each two dimensional image captured by image-generating unit M as shown in figure ij, and, utilize the image X2 of the substrate S obtained constructed by the second stretched image in each two dimensional image captured by image-generating unit M as shown in figure ik.Can be found by two image X1 and X2 of the substrate S shown in comparison diagram 1J and 1K: in these two image X1 and X2 of substrate S, the position being positioned at the defect D1 on the surperficial B2 of substrate S is identical, and the position being positioned at the defect D2 of the inside of substrate S is not identical but has side-play amount d '.Research shows, along with h increases, side-play amount d ' also increases.In addition, when the distance h of the surperficial B2 of defect D2 and substrate S reaches maximal value, when namely defect D2 is positioned on another apparent surface B1 of substrate S, the position that defect D2 occurs in image X1 with X2 is not identical and its side-play amount d ' is maximum.
Description above discloses following rule: in two images of the substrate S obtained constructed by the first image in each two dimensional image taken utilizing image-generating unit M respectively and the second stretched image, the position being positioned at the defect on the surface of substrate S is identical or its side-play amount is maximum, and the position being arranged in the defect of the inside of substrate S is not identical and its side-play amount is less than the side-play amount of defect in the position of image X1 and X2 on the surperficial B1 of substrate S.
Designing based on rule disclosed above just for the method and system distinguished the defect of substrate according to embodiments of the invention.
Fig. 2 illustrates the structural representation of system for distinguishing the defect of substrate according to one embodiment of the invention.As shown in Figure 2, the system 200 for distinguishing the defect of substrate comprises lighting unit 210, catoptron 220, image-generating unit 230, image construction module 240 and image processing module 250.
Lighting unit 210 is arranged on the outside of one of them surperficial B1 of transparent or semitransparent substrate 260, for irradiating light to substrate 260.Wherein, lighting unit 210 can be non-diffused light or diffused light to the light that substrate 260 irradiates.When the only diffused light that lighting unit 210 irradiates to substrate 260, if substrate 260 is patterning or structurized substrate, then the pattern that can effectively weaken or eliminate in substrate 260 or structure are on the impact of the defects detection of substrate 260.Lighting unit 210 can comprise one or more light source, so that lighting unit 210 can irradiate light to substrate 260 on the whole width range of substrate 260.
Catoptron 220 is arranged on the outside of another apparent surface B2 of substrate 260, to irradiate and be transmitted through substrate 260 and incide the light of catoptron 220 for indirect illumination unit 210 to substrate 260.
Image-generating unit 230 be arranged on the outside of another apparent surface B2 of substrate 260 and the optical axis of image-generating unit 230 perpendicular to surperficial B1 and B2 of substrate 260.Image-generating unit 230 takes two dimensional image for being irradiated by sensing lighting unit 210 to substrate 260 and be transmitted through the light that the light of substrate 260 and catoptron 220 reflect.Two dimensional image captured by image-generating unit 230 comprises sensing lighting unit 210 and irradiates and the second image of taking the photograph of the photo-beat that the first image of taking the photograph of the photo-beat being transmitted through substrate 260 and sensing catoptron 220 reflect to substrate 260, wherein, this first image and this second image are spatially separated.Image-generating unit 230 and lighting unit 210 form first passage, and catoptron 220, image-generating unit 230 and lighting unit 210 form second channel.At system 200 duration of work, when substrate 260 moves along z direction, image-generating unit 230 is irradiated and is transmitted through the light that the light of substrate 260 and catoptron 220 reflect by sensing lighting unit 210 to substrate 260 with predetermined time interval takes at least one two dimensional image.
Image-generating unit 230 can be made up of one or more image-forming component.When the image-forming component forming image-generating unit 230 is multiple, the plurality of image-forming component can arrange according to matrix, according to line spread, is staggered along a straight line on these straight line both sides, or becomes predetermined angle to arrange spaced a predetermined distance with a straight line.
Image construction module 240 is connected with image-generating unit 230, for utilizing the first image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 and the second image to build two images of substrate 260 respectively, namely utilize the first image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 to build one of them image of substrate 260 and to utilize the second image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 to build another image of substrate 260.For the ease of describing, the image of the substrate 260 built by the first image of each two dimensional image at least one two dimensional image utilized captured by image-generating unit 230 is called image T1, and the image of the substrate 260 built by the second image of each two dimensional image at least one two dimensional image utilized captured by image-generating unit 230 is called image T2.
Wherein, utilizing the second image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 to before the image T2 building substrate 260, second image of each two dimensional image in image construction module 240 at least one two dimensional image first captured by stretching image-generating unit 230, the compression deformation had with the second image eliminating each two dimensional image at least one two dimensional image captured by image-generating unit 230.The compress variation that second image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 has can such as pre-determine as follows: be placed on substrate S by the scaling board such as justified or such figure such as square is formed, by calculating the compress variation of the figure in the second image of the two dimensional image captured by image-generating unit 230, calculate the compress variation of the second image of the two dimensional image captured by image-generating unit 230.
Image processing module 250 is connected with image construction module 240, for to the image T1 constructed by image construction module 240 and T2 process to determine substrate 260 whether existing defects, and when determining substrate 260 existing defects Q, according to the mutual relationship of the position of defect Q in image T1 and T2, detect the defect of inside that defect Q is positioned at the defect on the surface of substrate 260 or is positioned at substrate 260.Wherein, when the side-play amount of the position that the position that defect Q occurs in image T1 with T2 is identical or defect Q occurs in image T1 and T2 equals maximum offset ZL, image processing module 250 detects defect Q and is positioned at the defect on the surface of substrate 260, and when the position that defect Q occurs in image T1 with T2 is not identical and its side-play amount is less than maximum offset ZL, detect the defect that defect Q is the inside being positioned at substrate 260.
Here, image procossing 250 both can use that same applicant is that submit on February 27th, 2009, exercise question for " method and system for the defect of check pattern substrate " and the technical scheme of application number disclosed by the Chinese patent application of 200910117993.X are to determine substrate 260 whether existing defects, to image, what also can use existing and later proposition variously processes to determine that the technology of substrate whether existing defects is to determine substrate 260 whether existing defects.
Maximum offset ZL be substrate 260 surperficial B1 on two images of substrate 260 of obtaining at the first image utilized respectively in the two dimensional image captured by image-generating unit 230 and the second stretched picture construction of defect in the bias of position.Here, can the scaling board be made up of such figure such as multiple equally spaced such as circle or polygon etc. be placed on the surperficial B1 of substrate 260, calculate the bias of the position in two images of the substrate 260 that identical figure obtains at the first image utilized respectively in the two dimensional image captured by two-dimensional imaging unit 230 and the second stretched picture construction in scaling board, as maximum offset ZL.Obviously, other technology known in those skilled in the art also can be used to obtain maximum offset ZL.
Being below image processing module 250 detects according to the mutual relationship of the position of defect Q in image T1 and T2 the example of defect of inside that defect Q is positioned at the defect on the surface of substrate 260 or is positioned at substrate 260.First, image processing module 250 calculates the position coordinates WZ1 of defect Q in image T1 and the position coordinates WZ2 in image T2.Then, the absolute value JZ of the difference of position coordinates WZ1 and position coordinates WZ2 is calculated.Then, whether image processing module 250 compares calculated JZ and equals zero or maximum offset ZL.If comparative result shows that calculated JZ equals zero or maximum offset ZL, then image processing module 250 detects defect Q and is positioned at the defect on the surface of substrate 260, and, if comparative result shows that calculated JZ is greater than zero and is less than maximum offset ZL, then image processing module 250 detects the defect that defect Q is the inside being positioned at substrate 260.
Fig. 3 is the work schedule schematic diagram that lighting unit according to one embodiment of the invention and image-generating unit are shown.As shown in Figure 3, each pulse of lighting unit 210 (T1, T2, T3 ..., Tn) irradiate once light to substrate 260, the lasting duration of irradiation is a pulse width, and a two dimensional image is taken in each pulse of two-dimensional imaging unit 230.
Description via embodiment above can be found out, the image of two passages is taken owing to using an image-generating unit, therefore, cost reduces, and take the image of two passages owing to using an image-generating unit, so by the impact of shooting disturbing factor, the deviation that causes the position of the defect of substrate in the image of these two passages to occur is identical, thus the defect that the image captured by utilizing can distinguish substrate is more exactly on a surface of a substrate or in the inside of substrate.
Other modification
Although it will be appreciated by those skilled in the art that in above-described embodiment, the image T1 constructed by image processing module 250 pairs of image construction module 240 and T2 process are to determine substrate 260 whether existing defects, but the present invention is not limited thereto.In some other embodiment of the present invention, also can determine substrate 260 whether existing defects by other module outside system 200 instead of image processing module 250.In this case, image processing module 250 is only for when substrate 260 is determined existing defects Q, according to the mutual relationship of the position of defect Q in image T1 and T2, detect the defect of inside that defect Q is positioned at the defect on the surface of substrate 260 or is positioned at substrate 260.
Although it will be appreciated by those skilled in the art that in above-described embodiment, the optical axis of image-generating unit 230 is perpendicular to surperficial B1 and B2 of substrate 260, but the present invention is not limited thereto.In other embodiments of the invention, the optical axis of image-generating unit 230 also can be not orthogonal to surperficial B1 and B2 of substrate 260.When the optical axis of image-generating unit 230 is not orthogonal to surperficial B1 and B2 of substrate 260, in two dimensional image captured by image-generating unit 230 according to by sensing lighting unit 210 to substrate 260 irradiate and be transmitted through substrate 260 light formed the first image also there is compression deformation, the compress variation of this first image can be determined according to the same way with the compress variation determining the second image.And, utilizing the first image of each two dimensional image at least one two dimensional image captured by image-generating unit 230 to before the image T1 building substrate 260, first image of each two dimensional image in image construction module 240 at least one two dimensional image first captured by stretching image-generating unit 230, the compression deformation had with the first image eliminating each two dimensional image at least one two dimensional image captured by image-generating unit 230.
Those skilled in the art are to be understood that, catoptron 220 can be arranged according to actual needs with the distance of substrate 260, as long as the luminous energy that catoptron 220 reflects receives by image-generating unit 230 and the lighting unit 210 received with image-generating unit 230 to irradiate and the light being transmitted through substrate 260 is separated to substrate 260.
Although it will be appreciated by those skilled in the art that, in each embodiment above-described, a two dimensional image is taken in each pulse of two-dimensional imaging unit 230, but the present invention is not limited thereto.In some other embodiment of the present invention, two-dimensional imaging unit 230 also often two or more pulses can take a two dimensional image.
Those skilled in the art are to be understood that, although in each embodiment above-described, lighting unit 210 each pulse (T1, T2, T3 ..., Tn) irradiate once light to substrate 260, the lasting duration of irradiation is a pulse width, but the present invention is not limited thereto.In some other embodiment of the present invention, also can at system 200 duration of work, lighting unit 210 irradiates light to substrate 260 always constantly.
Although it will be appreciated by those skilled in the art that, in each embodiment above-described, when system 200 works, substrate 260 moves, catoptron 220, image-generating unit 230 and lighting unit 210 transfixion, but the present invention is not limited thereto.In some other embodiment of the present invention, when system 200 works, also can substrate 260 transfixion, catoptron 220, image-generating unit 230 and lighting unit 210 move.
Those skilled in the art are to be understood that, although in each embodiment above-described, a catoptron 220 is only set in system 200, and image-generating unit 230 is irradiated by sensing lighting unit 210 to substrate 260 and is transmitted through the light that the light of substrate 260 and catoptron 220 reflect takes two dimensional image, this two dimensional image comprises separated sensing lighting unit 210 and irradiates and the second image of taking the photograph of the photo-beat that the first image of taking the photograph of the photo-beat being transmitted through substrate 260 and sensing catoptron 220 reflect to substrate 260, but the present invention is not limited thereto.
In some other embodiment of the present invention, also two catoptrons can be set in system 200, i.e. catoptron 220 and the second catoptron SE.The same with catoptron 220, the second catoptron SE is also arranged on the outside of another apparent surface B2 of substrate 260, to irradiate and be transmitted through substrate 260 and incide the light of the second catoptron SE for indirect illumination unit 210 to substrate 260.Image-generating unit 230 is for by sensing light that the second catoptron SE reflects and the light that catoptron 220 reflects takes two dimensional image, and the two dimensional image of this shooting comprises the first image that photo-beat that separated sensing second catoptron SE reflects takes the photograph and the second image that the photo-beat that sensing catoptron 220 reflects is taken the photograph.Wherein, the second catoptron SE, image-generating unit 230 and lighting unit 210 form first passage, and catoptron 220, image-generating unit 230 and lighting unit 210 form second channel.The same with the second image that the photo-beat that sensing catoptron 220 reflects is taken the photograph, the first image that the photo-beat sensing the second catoptron SE reflection is taken the photograph also has compression deformation, so the first image taken the photograph in the photo-beat utilizing sensing second catoptron SE to reflect is to before the image building substrate 260, also the first image needing the photo-beat reflected sensing second catoptron SE to take the photograph carries out stretch processing, the compression deformation of the first image that the photo-beat reflected to eliminate sensing second catoptron SE is taken the photograph.
It will be appreciated by those skilled in the art that the substrate in each embodiment above can be included in solar energy module industry, for the patterning in photovoltaic cell or photovoltaic module or structured substrate.
It will be appreciated by those skilled in the art that image construction module 240 and image processing module 250 can utilize the mode of software, hardware or software and hardware combining to realize.
It will be appreciated by those skilled in the art that each embodiment of the present invention can make various modification and change when not departing from invention essence, and these modification and change all should fall into protection scope of the present invention.Therefore, protection scope of the present invention is defined by appending claims.
Claims (14)
1. the system for distinguishing the defect of substrate, comprising:
Lighting unit, be arranged on one of them surface of transparent or semitransparent substrate outside and for irradiating light to described substrate;
At least one catoptron, is arranged on the outside of another apparent surface of described substrate, and for reflecting described illumination unit and being transmitted through described substrate and inciding the light of at least one catoptron described;
Image-generating unit, be arranged on another apparent surface described of described substrate outside and for sense described illumination unit and wherein two light being transmitted through the light of the light of described substrate and at least one catoptron described reflection to take at least one two dimensional image, wherein, each two dimensional image at least one two dimensional image of described shooting to comprise described in separated basis the first image that a photo-beat in wherein two light is taken the photograph and the second image taken the photograph according to another photo-beat in described wherein two light;
Image construction module, for respectively according to described second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image of described shooting and at least one two dimensional image of described shooting, build two images of described substrate; And
Image processing module, for when described substrate existing defects, according to the mutual relationship of the position of described defect in two images of described structure, detects the defect of inside that described defect is positioned at the defect on the surface of described substrate or is positioned at described substrate.
2. the system as claimed in claim 1, wherein
Described image processing module is further used for when the position in two images of described defect at described structure is identical or its side-play amount equals maximum offset, detecting described defect is be positioned at the defect on the surface of described substrate, wherein, described maximum offset equals the side-play amount of the position of the defect on one of them surface described of described substrate in two images of the described substrate of described structure.
3. the system as claimed in claim 1, wherein
Described image processing module is further used for when the position in two images of described defect at described structure is not identical and its side-play amount is less than maximum offset, detect the defect that described defect is the inside being positioned at described substrate, wherein, described maximum offset equals the side-play amount of the position of the defect on one of them surface described of described substrate in two images of the described substrate of described structure.
4. the system as claimed in claim 1, wherein
The only diffused light that described lighting unit irradiates to described substrate.
5. the system as claimed in claim 1, wherein
Described image-generating unit is further used for each two dimensional image taken with predetermined time interval at least one two dimensional image described.
6. the system as claimed in claim 1, wherein
Described image construction module is further used for when described first image of each two dimensional image at least one two dimensional image described and/or the second image have compression deformation, described first image of each two dimensional image at least one two dimensional image described in stretching and/or the second image, and, after described first image of each two dimensional image at least one two dimensional image described and/or the second image are stretched, respectively according to the second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image described and at least one two dimensional image described, build described two images of described substrate.
7. the system as claimed in claim 1, wherein
Described substrate comprises for the patterning in photovoltaic cell or photovoltaic module or structured substrate.
8. the system as claimed in claim 1, wherein
When at least one catoptron described is a catoptron, described wherein two only described illumination unit be transmitted through the light of described substrate and the light of described catoptron reflection, and, when at least one catoptron described is two catoptrons, the light of described wherein two only described two each self-reflections of catoptron.
9. the method for distinguishing the defect of substrate, comprises step:
Lighting unit is arranged on the outside on one of them surface of transparent or semitransparent substrate, wherein said lighting unit is used for irradiating light to described substrate;
At least one catoptron is arranged on the outside of another apparent surface of described substrate, wherein, at least one catoptron described is for reflecting described illumination unit and being transmitted through described substrate and inciding the light of at least one catoptron described;
Image-generating unit is arranged on the outside of another apparent surface described in described substrate, wherein said image-generating unit for sense described illumination unit and wherein two light being transmitted through the light of the light of described substrate and at least one catoptron described reflection to take at least one two dimensional image, wherein, each two dimensional image at least one two dimensional image of described shooting to comprise described in separated basis the first image that a photo-beat in wherein two light is taken the photograph and the second image taken the photograph according to another photo-beat in described wherein two light;
Image construction module is set, wherein said image construction module is used for respectively according to described second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image of described shooting and at least one two dimensional image of described shooting, builds two images of described substrate; And
Image processing module is set, wherein said image processing module is used for when described substrate existing defects, according to the mutual relationship of the position of described defect in two images of described structure, detect the defect of inside that described defect is positioned at the defect on the surface of described substrate or is positioned at described substrate.
10. method as claimed in claim 9, wherein
Described image processing module is further used for when the position in two images of described defect at described structure is identical or its side-play amount equals maximum offset, detecting described defect is be positioned at the defect on the surface of described substrate, wherein, described maximum offset equals the side-play amount of the position of the defect on one of them surface described of described substrate in two images of the described substrate of described structure.
11. methods as claimed in claim 9, wherein
Described image processing module is further used for when the position in two images of described defect at described structure is not identical and its side-play amount is less than maximum offset, detect the defect that described defect is the inside being positioned at described substrate, wherein, described maximum offset equals the side-play amount of the position of the defect on one of them surface described of described substrate in two images of the described substrate of described structure.
12. methods as claimed in claim 9, wherein
The only diffused light that described lighting unit irradiates to described substrate.
13. methods as claimed in claim 9, wherein
Described image-generating unit is further used for each two dimensional image taken with predetermined time interval at least one two dimensional image described.
14. methods as claimed in claim 9, wherein
Described image construction module is further used for when described first image of each two dimensional image at least one two dimensional image described and/or the second image have compression deformation, described first image of each two dimensional image at least one two dimensional image described in stretching and/or the second image, and, after described first image of each two dimensional image at least one two dimensional image described and/or the second image are stretched, respectively according to the second image of each two dimensional image in described first image of each two dimensional image at least one two dimensional image described and at least one two dimensional image described, build described two images of described substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910246381.0A CN102081047B (en) | 2009-11-27 | 2009-11-27 | Method and system for distinguishing defects of substrate |
| KR1020127005244A KR20120040257A (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
| PCT/CN2010/070791 WO2011011988A1 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
| JP2012521936A JP2013501211A (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects in a substrate |
| US13/384,909 US20120133762A1 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying a defect of a substrate |
| EP10803821.7A EP2459989A4 (en) | 2009-07-31 | 2010-02-26 | Method and system for detecting and classifying defects of substrate |
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| WO2013075331A1 (en) * | 2011-11-25 | 2013-05-30 | Saint-Gobain Glass France | Optical inspection system |
| CN113628212B (en) * | 2021-10-12 | 2022-03-11 | 高视科技(苏州)有限公司 | Defective polarizer identification method, electronic device, and storage medium |
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