CN102074449B - Electrode matrix and preparation method thereof - Google Patents

Electrode matrix and preparation method thereof Download PDF

Info

Publication number
CN102074449B
CN102074449B CN201010550180.2A CN201010550180A CN102074449B CN 102074449 B CN102074449 B CN 102074449B CN 201010550180 A CN201010550180 A CN 201010550180A CN 102074449 B CN102074449 B CN 102074449B
Authority
CN
China
Prior art keywords
electrode
support matrix
matrix
conductive electrode
described support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201010550180.2A
Other languages
Chinese (zh)
Other versions
CN102074449A (en
Inventor
陈应
徐国宾
杨芃原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Haike Scientific Instrument Co.,Ltd.
Original Assignee
SHANGHAI HUAZHI BIOTECHNIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI HUAZHI BIOTECHNIC CO Ltd filed Critical SHANGHAI HUAZHI BIOTECHNIC CO Ltd
Priority to CN201010550180.2A priority Critical patent/CN102074449B/en
Publication of CN102074449A publication Critical patent/CN102074449A/en
Application granted granted Critical
Publication of CN102074449B publication Critical patent/CN102074449B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention provides a kind of electrode matrix being applied to time-of-flight mass spectrometer and preparation method thereof, described electrode matrix comprises: support matrix; Conductive electrode, comprises the conductive electrode film of the surfaces externally and internally being located at described support matrix respectively; The number of described conductive electrode is two or more, has dielectric between adjacent two conductive electrodes.Compared to prior art, electrode matrix of the present invention and preparation method thereof has that structure is simple, machining accuracy is higher, more space-efficient, gradient electric field evenly advantage.

Description

Electrode matrix and preparation method thereof
Technical field
The present invention relates to one and be applied to electrode matrix and preparation method thereof in time-of-flight mass spectrometer.
Background technology
Generally, the structure of reflection type flight time mass spectrometer comprises: this several ion optics (consulting Fig. 1) of repelling device, accelerator, field-free region, reflector and detector.Wherein there is no electric-force gradient in field-free region, do not need gradient electric field certainly can regard gradient as yet electric field; Detector operating distance is too short, less demanding to electric field, easily realizes; And the electric field that repulsion district, accelerating region and reflector change to electromotive force Homogeneous linear by being used in one-dimensional square ion is accelerated, deceleration-operation, adjustment and in room and time focused ion.Because ion beam occupies certain volume (spatial dispersion) in time-of-flight mass spectrometer inside, ion in locus corresponding to identical flight time not among same plane.Due to the characteristic of electric field, the electric field built with the discontinuous electrode of dispersion, just must can become the uniform gradient electric field of approaches uniformity change by the transitional region with certain space size; And often the electric field of paraxial space segment is closest to desirable uniform gradient electric field.For high-resolution time-of-flight mass spectrometer, corresponding electric-force gradient stability should be better than one thousandth.
Repelling device, accelerator and reflector are all without ferromagnetism, the metallic plate not easily producing oxide skin(coating) all the time, as stainless steel (304,316 etc. the trade mark), brass, aluminium alloy etc., be processed into the planar metal frame of boring, as annulus, rectangle frame etc., be isolated into equally spaced parallel pole array with insulating material again, and connect electrode at different levels to apply voltage with resistance.Metal framework electrod-array for making repelling device, accelerator and reflector mainly contains thin plate round loop electrode, thick round loop electrode, middle thickness rectangular electrode and integrated PCB electrode, and these are several.
Common thin plate annulus gradient fields electrod-array, as shown in Figure 2.What described thin plate annulus gradient fields electrod-array adopted is one group of thin plate annulus be cut into, thickness 50 ~ 200 μm, and external diameter is less than 100mm usually due to the impact of thin plate rigidity, and ring width is at least more than 2 times of distance between plates, and board plane degree is better than 30 μm.Because the thickness of thin plate electrode is very thin, its ring electrode inner homogeneous gradient electric field almost occupies the three dimensions of whole internal diameter size, and space availability ratio can be expressed as wherein r represents the size of internal effective surface area, and T represents battery lead plate spacing, and R represents the external diameter of thin plate annulus.Such as, for external diameter 100mm, the mechanism of internal diameter 60mm, distance between plates 5mm, its maximum space utilance about 35%.The advantage of thin plate electrode be the useful space close to inner diameter volume, transitional region is little, and inferior position is size because the impact of panel stiffness cannot do large scale electrode.
Separately refer to Fig. 3, which show a kind of thick annulus gradient fields electrod-array.As shown in Figure 3, described thick annulus gradient fields electrod-array is the thick round loop electrode of one group of machined into, and due to good rigidly, its size is unrestricted, precision is high.Common thick round loop electrode thickness is at 8 ~ 10mm, and external diameter 200mm, internal diameter 160mm, distance between plates 1mm ~ 2mm, flatness of electrode is better than 2 μm.But because thickness of electrode increases, its inner transition region is more greatly than thin plate electricity, reaches 2 times of thicknesss of slab.For the thick round loop electrode of aforementioned dimensions, the size of its inner homogeneous field only has diameter 120mm, and space availability ratio is 45% to the maximum.The flexibility of electrode design of such structural limitations.In addition, thick annulus gradient fields electrode weight is very huge, limits the application in the horizontal direction of flight time mass spectrum accelerator, reflector; And this method due to the thickness of electrode excessive, undersized accelerator, reflector cannot be made.
Refer to Fig. 4 again, which show a kind of rectangle frame electrod-array.As shown in Figure 4, described rectangle frame electrod-array, by the steel plate of thickness 0.5mm ~ 3mm, is processed into through Linear cut or Water Cutting, and electrode forms round rectangle frame outward, size is grasped more flexible to (thin plate annulus gradient fields electrod-array and thick annulus gradient fields electrod-array) than the above two, the long 200mm of usual housing, wide 100mm, the long 160mm of inside casing, wide 60mm, thickness of slab 2mm, distance between plates 5mm ~ 8mm, flatness is better than 50 μm.The transitional region of rectangle frame electrode is between thick round loop electrode and thin plate round loop electrode, and for the electrode of above condition, its internal effective surface area is similar to rectangle, long 150mm, wide 50mm, and maximum space utilization ratio is 37.5%.Shape due to rectangle frame electrode is not the circle of full symmetric, so there is larger internal stress distortion, limit the machining accuracy of electrode, in addition, the shortcoming of this rectangle frame electrod-array is also that its manufacturing cost is higher.
Summary of the invention
The object of the present invention is to provide a kind of electrode matrix and preparation method thereof, to provide a kind of gradient electric field forming stable homogeneous, the space of larger applicable ion flight can be provided.
One aspect of the present invention provides a kind of electrode matrix, comprising: support matrix; Conductive electrode, comprises the conductive electrode film of the surfaces externally and internally being located at described support matrix respectively; The number of described conductive electrode is two or more, has dielectric between adjacent two conductive electrodes.
Alternatively, the cross section of described support matrix is annulus, elliptical ring or straight-flanked ring.
Alternatively, when the cross section of described support matrix is annulus, the length of described support matrix is 10mm to 600mm, and outside dimension is 20mm to 300mm, and wall thickness is 1mm to 20mm.
Alternatively, described support matrix is made by pottery, glass or the engineering plastics.
Alternatively, described adjacent two conductive electrode parallel coaxial.
Alternatively, the conductive electrode film in described conductive electrode is correspond to the annulus of described support matrix, elliptical ring or straight-flanked ring.
Alternatively, the width of the conductive electrode film in described conductive electrode is 1mm to 30mm, and the axial distance between adjacent two conductive electrode films is 0.10mm to 10mm.
Alternatively, the conductive area of described conductive electrode film is more than 90% of the overall inner surface area of described support matrix.
Alternatively, described conductive electrode film is made by metal material, and described metal material is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
Alternatively, have arc groove between described adjacent two conductive electrodes, described arc groove comprises dielectric.
The present invention also provides a kind of manufacture method of electrode matrix on the other hand, comprising: provide support matrix; Carry out plating process, the surfaces externally and internally of described support matrix forms the coat of metal; Carry out cutting technology, get rid of the coat of metal of the surfaces externally and internally upper part of described support matrix, the remaining coat of metal is configured for the conductive electrode film forming conductive electrode, and the region of getting rid of the coat of metal then forms the dielectric between adjacent two conductive electrodes.
Alternatively, the cross section of described support matrix is annulus, elliptical ring or straight-flanked ring.
Alternatively, when the cross section of described support matrix is annulus, the length of described support matrix is 10mm to 600mm, and outside dimension is 20mm to 300mm, and wall thickness is 1mm to 20mm.
Alternatively, described support matrix is made by pottery, glass or the engineering plastics.
Alternatively, the material of the described coat of metal is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
Alternatively, in described cutting technology, except getting rid of the coat of metal, also comprise the described support matrix of removal part, form arc groove.
Alternatively, described cutting technology comprises: for the inner surface of described support matrix, adopts thorax cutter to carry out cut, gets rid of the coat of metal of the inner surface upper part of described support matrix; For the outer surface of described support matrix, adopt lathe tool to carry out cut, get rid of the coat of metal of the outer surface upper part of described support matrix.
Alternatively, the width of the conductive electrode film in described conductive electrode is 1mm to 30mm, and the axial distance between adjacent two conductive electrode films is 0.10mm to 10mm.
Alternatively, the conductive area of described conductive electrode film is more than 90% of the overall inner surface area of described support matrix.
Alternatively, described conductive electrode film is made by metal material, and described metal material is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
In sum, tool of the present invention has the following advantages:
The inner conductive electrode slice of the conductive electrode 1, in electrode matrix of the present invention and the spacing of external conductive electrode slice are only the wall thickness of support matrix, both spacing are very little, so can when overall space be certain, it is relatively large that the internal effective surface area of the conductive electrode in described electrode matrix can be done, thus effectively improve space availability ratio.
2, the conductive electrode in electrode matrix of the present invention is made by integration after cutting technology after electroplating technology first in support matrix, compared with the conductive electrode film adopting cutting processing technique to make in prior art, the present invention makes simply, eliminates many procedure of processings, there is larger cost advantage, especially, machining accuracy is higher, and made by the conductive electrode that completes more stable;
The net sectional area of the conductive electrode 3, in electrode matrix of the present invention is comparatively large, thus it is faster to make conductive electrode converge to the speed of uniform gradient field;
4, the conductive electrode machining accuracy in electrode matrix of the present invention is higher, rule and clean and tidy, and the gradient electric field formed stable homogeneous more, is conducive to mass spectrographic resolving power and improves.
5, reflector of the present invention can be supplied to the more effective flight space of ion, uses the time-of-flight mass spectrometer of described reflector can install large scale inspection device, and the size of detector can increase by more than 1 times, and corresponding sensitivity and signal to noise ratio can be improved; And due to the increase of detector diameters, multianode detector can be used, improve counting rate further.
Accompanying drawing explanation
Fig. 1 is the structural representation of reflection type flight time mass spectrometer in prior art;
Fig. 2 is thin plate annulus gradient fields electrode array configurations schematic diagram;
Fig. 3 is thick annulus gradient fields electrode array configurations schematic diagram;
Fig. 4 is rectangle frame electrode array configurations schematic diagram;
Fig. 5 is electrode structure schematic diagram of the present invention;
Fig. 6 is that in Fig. 5, cutting of electrode matrix cuts open schematic diagram and close-up schematic view thereof;
Fig. 7 is the schematic flow sheet of the manufacture method of electrode matrix of the present invention.
Embodiment
The present inventor finds: the electrod-array in the accelerator being applied to time-of-flight mass spectrometer existing or reflector, and Problems existing comprises: problem that space availability ratio is lower, manufacturing dimension is limited and manufacturing cost is higher etc.
Therefore, the present inventor improves prior art, propose a kind of electrode matrix and preparation method thereof, the manufacture craft of integration is adopted to make electrode matrix, manufacture craft is simple and machining accuracy is higher, and the electrode matrix produced has that space availability ratio is high, electric field stable performance, size can the advantage such as multiple choices under different application environment.
By by specific embodiment, electrode matrix of invention and preparation method thereof is described in detail below.
See also Fig. 5 and Fig. 6, Fig. 5 shows the whole structure figure of electrode matrix of the present invention, and Fig. 6 shows cutting of electrode matrix of the present invention and cuts open schematic diagram and close-up schematic view thereof.As shown in Figure 5 and Figure 6, described electrode matrix comprises: support matrix 40 and the conductive electrode 42 be located in support matrix 40.
Support matrix 40, for playing a supporting role.In the present embodiment, support matrix 40 is that employing insulating material is made, the hollow structure of up/down perforation.Described insulating material can Ceramics, glass or engineering plastics, preferably, employing be ceramic material.The cross sectional shape of support matrix can have different changes according to applied environment and processing technology, such as annulus as shown in Figure 5, but not as limit, in other embodiments, described cross sectional shape also can be elliptical ring or straight-flanked ring.For the size of support matrix, can (such as be assemblied in reflector or in accelerator according to applied environment, the factors such as the size of gradient electric field of required generation or the size of described time-of-flight mass spectrometer), such as when support matrix 40 is for cylindrical shape (namely cross sectional shape is annulus) shown in Fig. 5, its length L is 10mm to 600mm, outside dimension OD is 20mm to 300mm, and wall thickness W is 1mm to 20mm, surface finish requirements 0.05mm.
Conductive electrode 42 comprises the conductive electrode film 420,422 of the surfaces externally and internally being located at support matrix 40 respectively.When the number of conductive electrode 42 is two or more, between adjacent two conductive electrodes 42, there is dielectric.
As shown in Figure 5 and Figure 6, in the present embodiment, be laid with multiple conductive electrode films 420,422 respectively at the correspondence position of the surfaces externally and internally of support matrix 40, wherein, on the axial plane of support matrix 40, inside and outside two conductive electrode films 420,422 of correspondence position form a conductive electrode.Specific practice is: can punch in support matrix and lay electrode cable, utilize electrode cable that the conductive electrode film 420,422 on surfaces externally and internally is connected and drawn.Because this portion of techniques is well known to those skilled in the art, therefore do not repeat at this.In addition, being positioned at adjacent two conductive electrode films 420 (or 422) parallel coaxial on same inner surface or same outer surface, is then isolated by the arc groove 44 comprising dielectric between the two.In the present embodiment, conductive electrode film 420,422 is made by metal material, and described metal material is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy; And the width h of conductive electrode film is wherein 1mm to 30mm, and the axial distance H of adjacent two conductive electrode films 420 or 422 (also i.e. adjacent two conductive electrodes 42) is 0.10mm to 10mm.For improving the performance (such as: the speed converging to uniform gradient field is faster, work is more stable) of conductive electrode in electrode matrix, in the present embodiment, the conductive area of conductive electrode film 420 is more than 90% of the overall inner surface area of support matrix 40.
Refer to Fig. 7, which show the schematic flow sheet of the manufacture method of electrode matrix of the present invention.As shown in Figure 7, described manufacture method comprises:
Step S10, provides support matrix;
Step S12, carries out plating process, and the surfaces externally and internally of described support matrix forms the coat of metal;
Step S14, carries out cutting technology, gets rid of the coat of metal of the surfaces externally and internally upper part of described support matrix, and the remaining coat of metal is configured for the conductive electrode film forming conductive electrode.
Below above steps is described in detail.
First perform step S10, provide support matrix.Specifically, support matrix can be that employing insulating material is made, the hollow structure of up/down perforation.Described insulating material can Ceramics, glass or engineering plastics, preferably, employing be ceramic material.The cross sectional shape of support matrix can be annulus, vesica piscis or straight-flanked ring, and when the cross sectional shape of described support matrix is annulus, its length is 10mm to 600mm, and outside dimension is 20mm to 300mm, and wall thickness is 1mm to 20mm.
Then perform step S12, carry out plating process, the surfaces externally and internally of described support matrix forms the coat of metal.In the present embodiment, the material of the described coat of metal is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.Described plating process, because described support matrix is made by insulating material (such as ceramic material), therefore, described support matrix forms the coat of metal and can adopt the various ways such as such as metal powder painting, vacuum coating, sputter coating, chemical plating or plating.Due to the prior art that above-mentioned each plating process has been well known to those skilled in the art, therefore do not repeat them here.
After the plating process performing step S12, just on the surfaces externally and internally of the support matrix of described pottery system, all can be formed with the coat of metal.
Then perform step S14 again, carry out cutting technology, get rid of the coat of metal of the surfaces externally and internally upper part of described support matrix.
In actual applications, different cutting technologies can be taked for the surfaces externally and internally of described support matrix.In the present embodiment, described cutting technology specifically comprises: for the inner surface of described support matrix, and thorax cutter can be adopted to carry out cut, gets rid of the coat of metal of the inner surface upper part of described support matrix; For the outer surface of described support matrix, lathe tool can be adopted to carry out cut, get rid of the coat of metal of the outer surface upper part of described support matrix.
The object of carrying out cutting technology is mainly the coat of metal getting rid of part, for obtaining better cutting effect, at the present embodiment, described in described cutting technology, at cutting position, the coat of metal eliminating flood thickness also eliminates the described support matrix of segment thickness further, thus forms arc groove.By above-mentioned cutting technology, get rid of the coat of metal of the surfaces externally and internally upper part of described support matrix, the remaining coat of metal is configured for the conductive electrode film forming conductive electrode, and the region (i.e. arc groove) of getting rid of the coat of metal then forms the dielectric between adjacent two conductive electrodes.In addition, adjacent two the conductive electrode film parallel coaxial on same inner surface or same outer surface are positioned at.The width of the conductive electrode film in described conductive electrode is 1mm to 30mm, and the axial distance between adjacent two conductive electrode films is 0.10mm to 10mm.For improving the performance (such as: the speed converging to uniform gradient field is faster, work is more stable) of conductive electrode in electrode matrix, in the present embodiment, the conductive area of described conductive electrode film is more than 90% of the overall inner surface area of described support matrix.
In subsequent job, the conductive electrode film place punching that the surfaces externally and internally of described support matrix is corresponding can also be included in, lay electrode cable, utilize electrode cable that the conductive electrode film of surfaces externally and internally on correspondence position is connected and drawn; Follow-uply after machining, carry out Ultrasonic Cleaning again, deoil; Described support matrix surfaces externally and internally is burn-on be of a size of 1206 10M Chip-R, dividing potential drop formed gradient electric field.
Just introducing with instantiation below utilizes above-mentioned manufacture method to produce a kind of electrode matrix.Described example comprises:
First provide the ceramic member that cylindric, the external diameter of described ceramic member is 120mm, and length is 250mm, and wall thickness is 8mm, surface finish requirements 0.05mm.
The surfaces externally and internally of described ceramic member forms the coat of metal, and the described coat of metal is gold, and described metal thickness is about 0.5um.
Carry out cutting technology to the ceramic member of gold-plated surface, respectively process an arc groove every 5mm on the surfaces externally and internally of described ceramic member, the radius 1.5mm of described arc groove, the degree of depth is 1mm.The remaining coat of metal is configured for the conductive electrode film forming conductive electrode, and correspondence two conductive electrode films being positioned at surfaces externally and internally form a conductive electrode, and the quantity of conductive electrode can be 50.The width of each conductive electrode film is 3mm, and the distance between adjacent two conductive electrode films is 2mm.
At the corresponding position of the surfaces externally and internally of described ceramic member, every the punching of 5mm position, make electrode cable and draw.
Through Ultrasonic Cleaning after processing, deoil, described ceramic member surfaces externally and internally is burn-on be of a size of 1206 10M Chip-R, dividing potential drop formed gradient electric field.
Follow-up, in the reflector that the described electrode matrix completed can be applied to time-of-flight mass spectrometer and/or accelerator.Because the operation principle of reflector and accelerator is well known to those skilled in the art, therefore do not repeat at this.
In sum, electrode matrix of the present invention and preparation method thereof tool has the following advantages:
The inner conductive electrode slice of the conductive electrode 1, in electrode matrix of the present invention and the spacing of external conductive electrode slice are only the wall thickness of support matrix, both spacing are very little, so can when overall space be certain, it is relatively large that the internal effective surface area of the conductive electrode in described electrode matrix can be done, thus effectively improve space availability ratio.
2, the conductive electrode in electrode matrix of the present invention is made by integration after cutting technology after electroplating technology first in support matrix, compared with the conductive electrode film adopting cutting processing technique to make in prior art, the present invention makes simply, eliminates many procedure of processings, there is larger cost advantage, especially, machining accuracy is higher, and made by the conductive electrode that completes more stable.
The net sectional area of the conductive electrode 3, in electrode matrix of the present invention is comparatively large, thus it is faster to make conductive electrode converge to the speed of uniform gradient field.
4, the conductive electrode machining accuracy in electrode matrix of the present invention is higher, rule and clean and tidy, and the gradient electric field formed stable homogeneous more, is conducive to mass spectrographic resolving power and improves.
5, reflector of the present invention can be supplied to the more effective flight space of ion, uses the time-of-flight mass spectrometer of described reflector can install large scale inspection device, and the size of detector can increase by more than 1 times, and corresponding sensitivity and signal to noise ratio can be improved; And due to the increase of detector diameters, multianode detector can be used, improve counting rate further.
Above-described embodiment only listing property illustrates principle of the present invention and effect, but not for limiting the present invention.Any person skilled in the art person all can without departing from the spirit and scope of the present invention, modify to above-described embodiment.Therefore, the scope of the present invention, should listed by claims.

Claims (18)

1. an electrode matrix, is characterized in that, comprising:
Support matrix, the cross section of described support matrix is annulus, elliptical ring or straight-flanked ring;
Conductive electrode, comprises the conductive electrode film of the surfaces externally and internally being located at described support matrix respectively; The number of described conductive electrode is two or more, has dielectric between adjacent two conductive electrodes.
2. electrode matrix according to claim 1, is characterized in that, when the cross section of described support matrix is annulus, the length of described support matrix is 10mm to 600mm, and outside dimension is 20mm to 300mm, and wall thickness is 1mm to 20mm.
3. electrode matrix according to claim 1, is characterized in that, described support matrix is made by pottery, glass or the engineering plastics.
4. electrode matrix according to claim 1, is characterized in that, described adjacent two conductive electrode parallel coaxial.
5. electrode matrix according to claim 1, is characterized in that, the conductive electrode film in described conductive electrode is correspond to the annulus of described support matrix, elliptical ring or straight-flanked ring.
6. electrode matrix according to claim 5, is characterized in that, the width of the conductive electrode film in described conductive electrode is 1mm to 30mm, and the axial distance between adjacent two conductive electrode films is 0.10mm to 10mm.
7. electrode matrix according to claim 6, is characterized in that, the conductive area of described conductive electrode film is more than 90% of the overall inner surface area of described support matrix.
8. the electrode matrix according to claim 5,6 or 7, is characterized in that, described conductive electrode film is made by metal material, and described metal material is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
9. electrode matrix according to claim 1, is characterized in that, have arc groove between described adjacent two conductive electrodes, described arc groove comprises dielectric.
10. a manufacture method for electrode matrix, is characterized in that, comprising:
Provide support matrix, the cross section of described support matrix is annulus, elliptical ring or straight-flanked ring;
Carry out plating process, the surfaces externally and internally of described support matrix forms the coat of metal;
Carry out cutting technology, get rid of the coat of metal of the surfaces externally and internally upper part of described support matrix, the remaining coat of metal is configured for the conductive electrode film forming conductive electrode, and the region of getting rid of the coat of metal then forms the dielectric between adjacent two conductive electrodes.
The manufacture method of 11. electrode matrixes according to claim 10, is characterized in that, when the cross section of described support matrix is annulus, the length of described support matrix is 10mm to 600mm, and outside dimension is 20mm to 300mm, and wall thickness is 1mm to 20mm.
The manufacture method of 12. electrode matrixes according to claim 10, is characterized in that, described support matrix is made by pottery, glass or the engineering plastics.
The manufacture method of 13. electrode matrixes according to claim 10, is characterized in that, the material of the described coat of metal is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
The manufacture method of 14. electrode matrixes according to claim 10, is characterized in that, also comprises the described support matrix of removal part in described cutting technology except getting rid of the coat of metal, forms arc groove.
The manufacture method of 15. electrode matrixes according to claim 14, is characterized in that, described cutting technology comprises:
For the inner surface of described support matrix, adopt thorax cutter to carry out cut, get rid of the coat of metal of the inner surface upper part of described support matrix;
For the outer surface of described support matrix, adopt lathe tool to carry out cut, get rid of the coat of metal of the outer surface upper part of described support matrix.
The manufacture method of 16. electrode matrixes according to claim 10, is characterized in that, the width of the conductive electrode film in described conductive electrode is 1mm to 30mm, and the axial distance between adjacent two conductive electrode films is 0.10mm to 10mm.
The manufacture method of 17. electrode matrixes according to claim 16, is characterized in that, the conductive area of described conductive electrode film is more than 90% of the overall inner surface area of described support matrix.
The manufacture method of 18. electrode matrixes according to claim 16 or 17, is characterized in that, described conductive electrode film is made by metal material, and described metal material is selected from the one in a kind of in gold, molybdenum, aluminium, copper, nickel or their alloy.
CN201010550180.2A 2010-11-18 2010-11-18 Electrode matrix and preparation method thereof Active CN102074449B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010550180.2A CN102074449B (en) 2010-11-18 2010-11-18 Electrode matrix and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010550180.2A CN102074449B (en) 2010-11-18 2010-11-18 Electrode matrix and preparation method thereof

Publications (2)

Publication Number Publication Date
CN102074449A CN102074449A (en) 2011-05-25
CN102074449B true CN102074449B (en) 2015-09-02

Family

ID=44032948

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010550180.2A Active CN102074449B (en) 2010-11-18 2010-11-18 Electrode matrix and preparation method thereof

Country Status (1)

Country Link
CN (1) CN102074449B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102568976B (en) * 2011-12-14 2014-07-09 深圳市盛喜路科技有限公司 Manufacturing method of secondary reflector
CN103871830A (en) * 2012-12-12 2014-06-18 中国科学院大连化学物理研究所 Flight time mass spectrum for shortening ion turnround peak time
CN109256323B (en) * 2018-10-19 2020-04-10 中国科学院化学研究所 Metal-coated alumina ceramic electrode plate for time-of-flight mass spectrometer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625112A (en) * 1983-11-30 1986-11-25 Shimadzu Corporation Time of flight mass spectrometer
CN101022076A (en) * 2007-03-21 2007-08-22 上海华质生物技术有限公司 Electrode board
CN101369510A (en) * 2008-09-27 2009-02-18 复旦大学 Annular tube shaped electrode ion trap

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1151535C (en) * 1999-08-16 2004-05-26 约翰霍普金斯大学 Ion reflection comprising flexible printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4625112A (en) * 1983-11-30 1986-11-25 Shimadzu Corporation Time of flight mass spectrometer
CN101022076A (en) * 2007-03-21 2007-08-22 上海华质生物技术有限公司 Electrode board
CN101369510A (en) * 2008-09-27 2009-02-18 复旦大学 Annular tube shaped electrode ion trap

Also Published As

Publication number Publication date
CN102074449A (en) 2011-05-25

Similar Documents

Publication Publication Date Title
Colas et al. Ionic wind generation by a wire-cylinder-plate corona discharge in air at atmospheric pressure
Ye et al. Suppression of secondary electron yield by micro-porous array structure
CN102074449B (en) Electrode matrix and preparation method thereof
JP2006108091A (en) Multipolar device for mass spectrometer
CN101452797B (en) Field emission type electronic source and manufacturing method thereof
US20150099062A1 (en) Method for manufacturing film electrode
Zeinali et al. Fabrication of continuous flow microfluidics device with 3D electrode structures for high throughput DEP applications using mechanical machining
JP2007529085A (en) Virtual ion trap
Eifert et al. Small onset voltages in negative corona discharges using the edges of gold and aluminum foils as nano-structured electrodes
CN108963462A (en) A kind of Terahertz ripple Feed Horn manufacturing method
CN104001998A (en) Array minuteness group electrode manufacturing method and device based on cathode optimization
KR102045058B1 (en) Manufacturing method for linear ICP plasma source and an antenna module for RF plasma source
KR20200019692A (en) New hollow lightweight lens structure
CN103280387A (en) Industrialized thick GEM (Gaseous Electron Multiplier) manufacturing method
Dayton et al. Diamond-studded helical traveling wave tube
Xinchao et al. Compressed air-film encircling jet electrodeposition with high deposition accuracy
US10714758B2 (en) Spinodal-based co-continuous composites for high performance battery electrodes
CN101022076A (en) Electrode board
CN109256323B (en) Metal-coated alumina ceramic electrode plate for time-of-flight mass spectrometer
Mishra et al. Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining
Starodubov et al. Planar slow-wave structures for low-voltage millimeter-band vacuum devices (Novel approach for fabrication, numerical and experimental measurements)
CN206931551U (en) Lead interior crossing type multi-level depressurization collector
US10062555B2 (en) Digital electron amplifier with anode readout devices and methods of fabrication
JP4533499B2 (en) Magnetic neutral wire discharge sputtering equipment
CN102568976A (en) Manufacturing method of secondary reflector

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180424

Address after: 314199 No. 11, No. 568 Jinyang Road, Luo Xing street, Jiashan County, Jiaxing, Zhejiang 1303

Patentee after: ZHEJIANG FUHUA ZHIXIN BIOTECHNOLOGY CO.,LTD.

Address before: 200433 State Road, Yangpu District, Yangpu District, Shanghai, B2001

Patentee before: Shanghai Huazhi Biotechnology Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20211228

Address after: 200085 No. 825, Xinkaihe Road, Xinhe Town, Chongming District, Shanghai (Shanghai Xinhe economic community)

Patentee after: Shanghai Yushan Business Consulting Co.,Ltd.

Address before: 314199 No. 11, No. 568 Jinyang Road, Luo Xing street, Jiashan County, Jiaxing, Zhejiang 1303

Patentee before: ZHEJIANG FUHUA ZHIXIN BIOTECHNOLOGY CO.,LTD.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220915

Address after: Room 401-418, 4th Floor, Building D1, No. 999, Gaolang East Road, Wuxi Economic Development Zone, Wuxi City, Jiangsu Province, 214100

Patentee after: Wuxi Haike Scientific Instrument Co.,Ltd.

Address before: 200085 No. 825, Xinkaihe Road, Xinhe Town, Chongming District, Shanghai (Shanghai Xinhe economic community)

Patentee before: Shanghai Yushan Business Consulting Co.,Ltd.