CN102064460A - Method for measuring and controlling power of frequency double laser in laser heat treatment - Google Patents
Method for measuring and controlling power of frequency double laser in laser heat treatment Download PDFInfo
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- CN102064460A CN102064460A CN 201010515025 CN201010515025A CN102064460A CN 102064460 A CN102064460 A CN 102064460A CN 201010515025 CN201010515025 CN 201010515025 CN 201010515025 A CN201010515025 A CN 201010515025A CN 102064460 A CN102064460 A CN 102064460A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 title claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 239000013078 crystal Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 6
- 241000931526 Acer campestre Species 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000005086 pumping Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005224 laser annealing Methods 0.000 claims description 3
- 230000007774 longterm Effects 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 claims description 2
- 230000008025 crystallization Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000007791 liquid phase Substances 0.000 claims description 2
- 239000007790 solid phase Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 238000013532 laser treatment Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000002178 crystalline material Substances 0.000 description 1
- 230000023077 detection of light stimulus Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
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- RIUWBIIVUYSTCN-UHFFFAOYSA-N trilithium borate Chemical class [Li+].[Li+].[Li+].[O-]B([O-])[O-] RIUWBIIVUYSTCN-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a method for measuring and controlling a frequency double laser applied to semiconductor wafer laser heat treatment, belonging to the technical field of measurement in semiconductor manufacturing. One laser beam is separated from a laser light before frequency doubling, and light intensity and power are measured and controlled by a detector. The optical element is required to be adaptive to longer laser wavelength in visible light wave band before frequency doubling, compared with the traditional method for only measuring and controlling the power of a final output laser, when the wavelength of the output laser is in ultraviolet and deep ultraviolet wave band, the traditional method is difficult to implement; by adopting the invention, implementation is easier, thus being simple and convenient to realize an optical system used for measurement and control, not only well monitoring the actual output power, greatly reducing implementation cost, but also fully considering and utilizing the characteristics of a frequency doubling laser source and better achieving the aim of measuring and controlling the stable output power of a laser.
Description
Technical field
The invention belongs to the detection technique scope in the semiconductor manufacturing, particularly be applied to the power investigating method of a kind of frequency double laser of semiconductor crystal wafer Laser Heat Treating in China.
Background technology
LASER HEAT TREATMENT processing comprises the laser annealing that is used for semiconductor crystal wafer fusibleness or insolubility, laser-assisted film growth, non-crystalline material phase transformation under the laser action (being used to make the polycrystal film device, solar cell) or the like.Use for all LASER HEAT TREATMENT, in the process of implementing laser processing, all need very accurately to control process conditions, make that each time processing all is to carry out under the controlled condition of strictness, technical process can repeat, between the variant disk and between the different batches disk, the effect unanimity of processing.
In order to realize basic demand to above-mentioned technical process, not only need carry out intelligentized control for the complete machine processing procedure of laser processing apparatus, also to carry out the observing and controlling of Key Performance Indicator for each different composition module of constitution equipment.Here, also comprised the power output of the laser of handling light source is measured and controlled.
Power output for laser is carried out real-time measurement and control, and basic requirement is the stability of power output, both has been included in sometime the stability in the section, is also included within effectively work long-time stability in period of laser.General investigating method is, utilize photo-detector Laser Measurement device power output in real time, and feed back to computer control system, remove to regulate particularly the power of the pumping source of excitation laser beam by computer control system, make laser power stability that stimulated radiation exports on the desired set point of process treatment process.This traditional method makes the optical system relevant with light intensity/power measurement, just need be at shorter wavelength, minimal wave length can reach the deep ultraviolet wave band, not only the material requirements of processing optical element is very high, and this type of optical component difficulty of processing that works in short wavelength more is also higher, and the cost realized of increase system.
Summary of the invention
The power investigating method that the purpose of this invention is to provide the frequency double laser in a kind of LASER HEAT TREATMENT, described Laser Heat Treating in China main application fields comprises the laser annealing to material, the laser assisted film deposition, or utilize the liquid phase and the solid phase crystallization again of laser action, it is characterized in that, at first will be used for the Laser Heat Treating in China lasing light emitter and adopt optical crystal, the laser long for original wavelength carries out once, or double conversion, obtain the laser of required shorter wavelength, go to carry out the surface treatment of laser wafer sheet; The concrete frequency conversion laser device that is adopted, pass through beam splitter, laser before the frequency multiplication is told a branch of next, carry out the measurement and the control of light intensity/power by detector, because this class optical element only need be adapted to frequency multiplication longer optical maser wavelength before, that be in visible light wave range, handle than being easier to, thereby make the optical system of observing and controlling implement more simple and convenient.
Described beam splitter carries out part transmission and part catadioptric to incident beam, and the light beam of transmission becomes the final output laser beam of laser through after the effect of frequency-doubling crystal; And catadioptric light beam then by detector measurement light intensity and performance number, according to the occurrence that detection obtains, is removed the power supply of laser again by computer control system, changes the power of pumping, and the feasible emitting laser beam power of being excited is stabilized on the set point.
The invention has the beneficial effects as follows, for the wafer heat treatment laser of ultraviolet, deep ultraviolet, because to the material requirements height of the optical element that is operated in this wave band, difficulty of processing is big.The cost of realizing is very high.But change into the laser before the frequency multiplication is sampled and measured, then optical system and Sensor section can be realized more easily, can either play the effect of monitoring real output well, and the cost of Shi Xianing also reduces greatly simultaneously.The present invention program has taken into full account and has utilized the characteristics in frequency double laser source, can realize the observing and controlling purpose of laser firm power better.
Description of drawings
The schematic diagram that Fig. 1 disposes for the optical element that laser power before the frequency multiplication is detected.
Among Fig. 1,1. are the Laser Heat Treating in China lasing light emitters before the frequency multiplication; 2. be the laser beam before the frequency multiplication; 3. be the detector of exploring laser light light intensity and power; 4. be beam splitter, divide taking-up sub-fraction light beam to come to measure the laser before the frequency multiplication for detector; 5. be nonlinear optical crystal to laser freuqency doubling; 6. be the final output laser beam of frequency double laser, promptly implemented the laser beam of the power stability of observing and controlling.
Embodiment
The invention provides the power investigating method of the frequency double laser in a kind of LASER HEAT TREATMENT.Figure 1 shows that the schematic diagram of the optical element configuration that laser power before the frequency multiplication is detected.Measure control for described laser source power, traditional way is after final shoot laser light beam 6 is told beam of laser, to measure and control.In the present invention, then be that the inside of the laser 1 before frequency multiplication not is provided with beam splitter 4, the laser beam 2 before the frequency multiplication is not told a part of light after, measure light intensity/performance numbers by detector 3.
In Fig. 1, as Laser Heat Treating in China laser beam 6, wavelength is specially wavelength less than 350nm at ultraviolet, deep ultraviolet wave band.This wavelength by once or twice frequency multiplication obtain.For instance, for example the original laser wavelength is 1024nm, frequency multiplication once after, optical maser wavelength becomes 532nm, passes through first overtone again, then can obtain the laser of 266nm wavelength, is used for the processing of the super shallow junction annealing of wafer.
Beam splitter 4 among Fig. 1, its optical function are to see through a part of laser beam, and the remainder laser beam is by catadioptric; For example, 98% sees through, and 2% catadioptric is carried out the detection of light intensity and power to the detector 3 of top.Beam splitter is one of basic optical component in optical system, by the variation of institute's coatings on the surface, can accurately regulate its beam split optical function.
Nonlinear optical crystal 5 among Fig. 1 can play the effect of frequency multiplication to incident light.For example, three lithium borates (being called for short LBO) crystal promptly can be used for nd yag doubled-frequency laser (Nd:YAG laser) is carried out frequency-doubled conversion.
Real-time control about power, mainly be that the optical power value that will record feeds back to computer system, by computer system whether judge with respect to set point or in, fluctuation taken place and changed in the mean value of long-term work, increase when changing, after surpassing certain threshold range, then take control measure, increase or reduce the power of laser pumping, thereby the laser beam power of reality output is locked on the set point.Certainly, if the numerical value that measures is undergone mutation, it is far away perhaps to drift about with respect to stationary value, and then computer system is carried out equipment inspection with the prompt facility engineer, after remover apparatus fault and the hidden danger, exercises and uses.
Claims (4)
1. the power investigating method of the frequency double laser in the LASER HEAT TREATMENT, described Laser Heat Treating in China main application fields comprises the laser annealing to material, the laser assisted film deposition, or utilize the liquid phase and the solid phase crystallization again of laser action, it is characterized in that, at first the Laser Heat Treating in China lasing light emitter is adopted optical crystal, the laser long for original wavelength carries out once, or double conversion, obtain the light source of the laser treatment of required shorter wavelength, go to carry out the surface treatment of laser wafer sheet; The concrete frequency conversion laser device that is adopted, pass through beam splitter, laser before the frequency multiplication is told a branch of next, carry out the measurement and the control of light intensity/power by detector, because this class optical element only need be adapted to the longer optical maser wavelength that is in visible light wave range before the frequency multiplication, handle than being easier to, thereby make the optical system of observing and controlling implement more simple and convenient
The function of described beam splitter is for to carry out part transmission and part catadioptric to incident beam, and the light beam of transmission becomes the final output laser beam of laser through after the effect of frequency-doubling crystal; And catadioptric light beam then by detector measurement light intensity and performance number, according to the occurrence that detection obtains, is removed the power supply of laser again by computer control system, changes the power of pumping, and the feasible emitting laser beam power of being excited is stabilized on the set point.
2. according to the power investigating method of the frequency double laser in the described a kind of LASER HEAT TREATMENT of claim 1, it is characterized in that 98% of the incident laser light beam of described beam splitter before to frequency multiplication is transmitted through optical crystal and carries out frequency multiplication; The detector of catadioptric to the top takes place in 2% of incident laser light beam, carries out the measurement of light intensity and power.
3. according to the power investigating method of the frequency double laser in the described a kind of LASER HEAT TREATMENT of claim 1, it is characterized in that, the power observing and controlling of the frequency double laser in described a kind of LASER HEAT TREATMENT, the hardware system that is used to test and control is to be integrated in frequency double laser inside, the data that record is sent to outer computer handled.
4. according to the power investigating method of the frequency double laser in the described a kind of LASER HEAT TREATMENT of claim 3, it is characterized in that, describedly the data that record are sent to handle to outer computer be by the optical power value that records is exported to computer system, handled and regulate and control by computer system; Specifically, computer control system judge measured value whether with respect to the technique initialization value or in, fluctuation taken place and changed in the mean value of long-term work, if change increase and surpassed certain threshold range, then will take control measure, increase or reduce the power of laser pumping, thus be stabilized in the laser beam power of reality output on the set point or the mean value of long-term work near.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557937A (en) * | 2013-10-31 | 2014-02-05 | 中国科学院半导体研究所 | Laser power monitoring assembly, laser emission module with laser power monitoring assembly used and optical amplifier with laser power monitoring assembly used |
| CN104772568A (en) * | 2014-01-15 | 2015-07-15 | 宝山钢铁股份有限公司 | Laser surface treatment quality control method and on-line monitoring system thereof |
| CN106949961A (en) * | 2017-03-22 | 2017-07-14 | 精微视达医疗科技（武汉）有限公司 | Luminous power monitoring in real time and feedback method and device |
| CN111801190A (en) * | 2018-03-13 | 2020-10-20 | 住友重机械工业株式会社 | Laser power control device, laser processing device, and laser power control method |
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| CN1916747A (en) * | 2006-09-08 | 2007-02-21 | 中国科学院光电技术研究所 | Nonlinear optical device damage detection device |
| US20080002745A1 (en) * | 2004-05-12 | 2008-01-03 | Canon Kabushiki Kaisha | Control method of distributed Bragg reflection semiconductor laser, and image projecting apparatus |
| CN201408163Y (en) * | 2009-05-20 | 2010-02-17 | 宁波大学 | Device for measuring clock multiplier factor of nonlinear material |
| CN101673919A (en) * | 2008-09-11 | 2010-03-17 | 宏瞻科技股份有限公司 | Micro solid-state laser module |
| CN201503386U (en) * | 2009-07-10 | 2010-06-09 | 安徽师范大学 | Nonlinear coefficient measuring device of irradiation sample |
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2010
- 2010-10-14 CN CN 201010515025 patent/CN102064460A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080002745A1 (en) * | 2004-05-12 | 2008-01-03 | Canon Kabushiki Kaisha | Control method of distributed Bragg reflection semiconductor laser, and image projecting apparatus |
| CN1916747A (en) * | 2006-09-08 | 2007-02-21 | 中国科学院光电技术研究所 | Nonlinear optical device damage detection device |
| CN101673919A (en) * | 2008-09-11 | 2010-03-17 | 宏瞻科技股份有限公司 | Micro solid-state laser module |
| CN201408163Y (en) * | 2009-05-20 | 2010-02-17 | 宁波大学 | Device for measuring clock multiplier factor of nonlinear material |
| CN201503386U (en) * | 2009-07-10 | 2010-06-09 | 安徽师范大学 | Nonlinear coefficient measuring device of irradiation sample |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557937A (en) * | 2013-10-31 | 2014-02-05 | 中国科学院半导体研究所 | Laser power monitoring assembly, laser emission module with laser power monitoring assembly used and optical amplifier with laser power monitoring assembly used |
| CN104772568A (en) * | 2014-01-15 | 2015-07-15 | 宝山钢铁股份有限公司 | Laser surface treatment quality control method and on-line monitoring system thereof |
| CN104772568B (en) * | 2014-01-15 | 2016-10-05 | 宝山钢铁股份有限公司 | Laser Surface Treatment method of quality control |
| CN106949961A (en) * | 2017-03-22 | 2017-07-14 | 精微视达医疗科技（武汉）有限公司 | Luminous power monitoring in real time and feedback method and device |
| CN111801190A (en) * | 2018-03-13 | 2020-10-20 | 住友重机械工业株式会社 | Laser power control device, laser processing device, and laser power control method |
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Application publication date: 20110518 |