CN102061795A - Ground heating module - Google Patents
Ground heating module Download PDFInfo
- Publication number
- CN102061795A CN102061795A CN 201010557870 CN201010557870A CN102061795A CN 102061795 A CN102061795 A CN 102061795A CN 201010557870 CN201010557870 CN 201010557870 CN 201010557870 A CN201010557870 A CN 201010557870A CN 102061795 A CN102061795 A CN 102061795A
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- China
- Prior art keywords
- heating module
- water pipe
- ground heating
- floor heating
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Road Paving Structures (AREA)
- Floor Finish (AREA)
Abstract
The invention discloses a ground heating module comprising a water pipe, a metal net, an insulating layer and a concrete layer; wherein the water pipe is paved inside the ground heating module; the insulating layer is paved below the water pipe; the metal net is covered above the water pipe; the concrete layer is arranged at the outmost layer of the ground heating module; and the water pipe, the metal net and the insulating layer are fixed together. The ground heating module provided by the invention realizes a ground heating modular design; ground heating modules are spliced together like paving floor tiles without paving a ground keel firstly when the ground heating modules are used; and during splicing, the adjacent ground heating modules are butted by the water pipes, which is rapid and convenient for installing.
Description
Technical field
The present invention relates to floor heating, be specifically a kind of can the free splicing tissue, lay floor heating module easily.
Background technology
Along with growth in the living standard, the utilization of floor heating more and more widely, from large-scale indoor venue ground to household ground.But floor heating in the market all is disguised engineering, need be layed under the floor, and maintenanceability is poor; And the wood flooring use for a long time that is laid on the floor heating surface can occur dry and cracked.Simultaneously, setting up of floor heating is not easy to secondary decoration, because that the hot channel of ground heating all is laid on is underground, when secondary decoration is transformed ground, damages underground pipeline easily.
Moreover floor heating is used limited in the washroom and since ground heating send the hot channel more complicated, the space is narrow and small the washroom in, is difficult for laying, room temperature does not often reach the heating standard, also need be aided with radiator and do auxiliary.
So, wish to design a kind of floor heating and can lay conveniently as floor tile, be not subjected to spatial constraints, lay simple and fast.
Summary of the invention
Goal of the invention: the objective of the invention is to overcome the deficiencies in the prior art, provide and to lay heating module easily as the assembling of floor tile free splicing.
Technical scheme: to achieve these goals, the invention provides a kind of floor heating module, it comprises water pipe, also comprises: wire lath, insulation layer, layer of concrete; Water pipe floor heating module inside, insulation layer is laid in the water pipe below, and the water pipe top covers wire lath, and layer of concrete is positioned at the outermost layer of floor heating module, and water pipe, wire lath and insulation layer are fixed together.
In order to make the floor heating of the present invention can Homogeneouslly-radiating, wire lath described in the present invention preferably adopts copper mesh.
Beneficial effect: floor heating module of the present invention compared with prior art has following advantage:
1, floor heating module of the present invention has been realized the design of floor heating moduleization, need not to lay earlier the ground keel during use, only needs as laying floor tile floor heating module to be bolted together, and is adjacent to the butt joint of heating module water pipe during assembly unit and gets final product, and is quick for installation, convenient;
2, floor heating module of the present invention can directly be laid use, can not be used in the floor heating surface and re-lay other floors, and the interior decoration cost of saving is specially adapted to the laying of large stadium;
3, floor heating module of the present invention uses simply for making in advance, and weak point consuming time is set up in floor heating.
Description of drawings
Fig. 1 is the structural representation of floor heating module of the present invention.
Fig. 2 is the cross section structure schematic diagram of floor heating module of the present invention.
The specific embodiment
Below in conjunction with specific embodiment, further illustrate the present invention, should understand these embodiment only is used to the present invention is described and is not used in and limit the scope of the invention, after having read the present invention, those skilled in the art all fall within the application's claims to the modification of the various equivalent form of values of the present invention and limit.
Embodiment
A kind of floor heating module, it comprises water pipe 1, wire lath 2, insulation layer 3, layer of concrete 4; Water pipe 1 floor heating module inside, insulation layer 3 is laid in water pipe 1 below, and water pipe 1 top covers wire lath 2, and layer of concrete 4 is positioned at the outermost layer of floor heating module, and water pipe 1, wire lath 2 and insulation layer 3 are fixed together.Described wire lath 2 is a copper mesh.
Claims (2)
1. floor heating module, it comprises water pipe (1), it is characterized in that: described floor heating module also comprises: wire lath (2), insulation layer (3), layer of concrete (4); Water pipe (1) floor heating module inside, insulation layer (3) is laid in water pipe (1) below, water pipe (1) top covers wire lath (2), and layer of concrete (4) is positioned at the outermost layer of floor heating module, and water pipe (1), wire lath (1) and insulation layer (3) are fixed together.
2. floor heating module according to claim 1 is characterized in that: described wire lath (2) is a copper mesh.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010557870 CN102061795A (en) | 2010-11-25 | 2010-11-25 | Ground heating module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010557870 CN102061795A (en) | 2010-11-25 | 2010-11-25 | Ground heating module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102061795A true CN102061795A (en) | 2011-05-18 |
Family
ID=43997274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201010557870 Pending CN102061795A (en) | 2010-11-25 | 2010-11-25 | Ground heating module |
Country Status (1)
Country | Link |
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CN (1) | CN102061795A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102878606A (en) * | 2012-10-29 | 2013-01-16 | 张标 | Improved solar floor heating device |
CN103673043A (en) * | 2012-08-30 | 2014-03-26 | 昆山开思拓节能技术有限公司 | Automatic temperature control floor heating device |
CN104662238A (en) * | 2012-08-21 | 2015-05-27 | 密尔沃基复合材料公司 | Flooring assembly with heat dissipation layer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09101041A (en) * | 1995-10-04 | 1997-04-15 | Nippon Beroo Kk | Floor heating structure |
KR20060003259A (en) * | 2004-07-05 | 2006-01-10 | 주식회사 동양씨엠아이 | Ondol-floor structure |
CN201155167Y (en) * | 2008-01-29 | 2008-11-26 | 山东美亚建材制品有限公司 | Combination type dryly paved ground heating module |
CN101709599A (en) * | 2009-11-11 | 2010-05-19 | 上海航天舒室环境科技有限公司 | Compound dry floor heating module |
CN201531083U (en) * | 2009-11-13 | 2010-07-21 | 上海航天舒室环境科技有限公司 | Multilayer dry-type floor heating module |
CN201883653U (en) * | 2010-11-25 | 2011-06-29 | 苏州新亚科技有限公司 | Floor heating module |
-
2010
- 2010-11-25 CN CN 201010557870 patent/CN102061795A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09101041A (en) * | 1995-10-04 | 1997-04-15 | Nippon Beroo Kk | Floor heating structure |
KR20060003259A (en) * | 2004-07-05 | 2006-01-10 | 주식회사 동양씨엠아이 | Ondol-floor structure |
CN201155167Y (en) * | 2008-01-29 | 2008-11-26 | 山东美亚建材制品有限公司 | Combination type dryly paved ground heating module |
CN101709599A (en) * | 2009-11-11 | 2010-05-19 | 上海航天舒室环境科技有限公司 | Compound dry floor heating module |
CN201531083U (en) * | 2009-11-13 | 2010-07-21 | 上海航天舒室环境科技有限公司 | Multilayer dry-type floor heating module |
CN201883653U (en) * | 2010-11-25 | 2011-06-29 | 苏州新亚科技有限公司 | Floor heating module |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104662238A (en) * | 2012-08-21 | 2015-05-27 | 密尔沃基复合材料公司 | Flooring assembly with heat dissipation layer |
CN104662238B (en) * | 2012-08-21 | 2017-05-10 | 密尔沃基复合材料公司 | Flooring assembly with heat dissipation layer |
CN103673043A (en) * | 2012-08-30 | 2014-03-26 | 昆山开思拓节能技术有限公司 | Automatic temperature control floor heating device |
CN102878606A (en) * | 2012-10-29 | 2013-01-16 | 张标 | Improved solar floor heating device |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |