CN102059473A - Soft solder composition for electronic information products - Google Patents
Soft solder composition for electronic information products Download PDFInfo
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- CN102059473A CN102059473A CN2009102199362A CN200910219936A CN102059473A CN 102059473 A CN102059473 A CN 102059473A CN 2009102199362 A CN2009102199362 A CN 2009102199362A CN 200910219936 A CN200910219936 A CN 200910219936A CN 102059473 A CN102059473 A CN 102059473A
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- solder composition
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- soft solder
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Abstract
The invention relates to a solder composition, particularly a soft solder composition for electronic information products, belonging to the technical fields of metallurgy and chemical industry. The soft solder composition for electronic information products is prepared from the following raw materials in parts by weight: 30-50 parts of Sn, 5-12 parts of Sb, 5-10 parts of Ni, 0.05-0.25 part of Re and 25-35 parts of Bi. The method for preparing the soft solder composition for electronic information products comprises the following steps: taking Sn, Sb, Ni, Re and Bi according to parts by weight, putting the raw materials into a vacuum induction furnace, reacting at the constant temperature of 800-900 DEG C under atmospheric pressure for 2-2.5 hours, and casting to obtain the soft solder composition for electronic information products. The soft solder composition for electronic information products does not contain lead, mercury or any other harmful substance, does not contain precious metal silver, and is suitable for electronic information products. The soft solder composition for electronic information products has the advantages of favorable high temperature resistance and high strength and is environment-friendly without pollution.
Description
Technical field
The present invention relates to a kind of solder composition, relate in particular to a kind of suitable electronics and IT products soft solder composition.
Background technology
Along with development of times, people's life, work rhythm are accelerated gradually; Electronics and IT products have become the requisite daily necessities of people, and progressive gradually along with science and technology, and the kind of electronics and IT products is also more and more, and the quality of electronics and IT products and environmental protection situation thereof directly affect people's quality of life.A lot of electric elements all need solder to weld in electronics and IT products, and solder whether environmental protection just becomes the technical problem of people's common concern.Lead in the solder is to pollute more serious metal ingredient, therefore clearly stipulated in " the electronics and IT products production prevention and cure of pollution management method " that China is drafted, can not contain harmful substances such as lead, mercury in the electronics and IT products, therefore develop harmful substances such as not containing lead, mercury and be applicable to that again the solder of quoting in the electronics and IT products becomes the technical problem that those skilled in the art are badly in need of solving simultaneously.In order to address this problem, those skilled in the art have have also researched and developed the solder that suitable electronics and IT products are used, but mostly contain silver-colored this precious metal in these solders, this has just increased the production cost of electronics and IT products virtually, this brings burden certainly will for the family of financial difficulties, has also improved the production cost of manufacturer simultaneously.
Summary of the invention
The present invention is exactly in order to solve the problems of the technologies described above, and a kind of harmful substances such as lead, mercury that neither contain are provided, and does not contain silver-colored this precious metal simultaneously again and is fit to electronics and IT products soft solder composition.
In order to solve the problems of the technologies described above, the present invention is achieved through the following technical solutions:
A kind of suitable electronics and IT products soft solder composition, it is to count ratio by following raw materials in parts by weight to be prepared from: Sn30-50 part, Sb5-12 part, Ni5-10 part, Re0.05-0.25 part, Bi25-35 part.
Described suitable electronics and IT products soft solder composition, it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40-45 part, Sb8-10 part, Ni6-8 part, Re0.1-0.2 part, Bi28-32 part.
Described suitable electronics and IT products soft solder composition, it is to count ratio by following raw materials in parts by weight to be prepared from: Sn42 part, Sb8 part, Ni8 part, Re0.1 part, Bi30 part.
Described suitable electronics and IT products soft solder composition, it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb10 part, Ni6 part, Re0.2 part, Bi32 part.
Described suitable electronics and IT products soft solder composition, it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb9 part, Ni7 part, Re0.15 part, Bi30 part.
Described suitable electronics and IT products are as follows with soft solder preparation of compositions method: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 800-900 ℃ of following normal pressure insulation reaction 2-2.5 hour, casting both.
Advantage of the present invention and effect are as follows:
Solder composition of the present invention, it neither contains harmful substances such as lead, mercury, does not contain silver-colored this precious metal simultaneously again, and its also suitable electronics and IT products usefulness, rises to be the soft solder composition.Its resistance to elevated temperatures is good, and the intensity height is the pollution-free solder of environment-friendly type.
The specific embodiment
Below in conjunction with the specific embodiment the present invention is described in further details, but protection scope of the present invention is not limited by embodiment.
Embodiment 1:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn42 part, Sb8 part, Ni8 part, Re0.1 part, Bi30 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 850 ℃ of following normal pressure insulation reaction 2.5 hours, casting both.
Embodiment 2
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb10 part, Ni6 part, Re0.2 part, Bi32 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 900 ℃ of following normal pressure insulation reaction 2 hours, casting both.
Embodiment 3:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb9 part, Ni7 part, Re0.15 part, Bi30 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 850 ℃ of following normal pressure insulation reaction 2 hours, casting both.
Embodiment 4:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb10 part, Ni8 part, Re0.2 part, Bi32 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 820 ℃ of following normal pressure insulation reaction 2.2 hours, casting both.
Embodiment 5:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn45 part, Sb8 part, Ni6 part, Re0.1 part, Bi28 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 800 ℃ of following normal pressure insulation reaction 2 hours, casting both.
Embodiment 6:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn30 part, Sb12 part, Ni10 part, Re0.25 part, Bi35 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 880 ℃ of following normal pressure insulation reaction 2.8 hours, casting both.
Embodiment 7:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn50 part, Sb5 part, Ni5 part, Re0.05 part, Bi25 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 860 ℃ of following normal pressure insulation reaction 2.4 hours, casting both.
Embodiment 8:
The present invention is fit to electronics and IT products soft solder composition, and it is to count ratio by following raw materials in parts by weight to be prepared from: Sn50 part, Sb12 part, Ni5 part, Re0.25 part, Bi35 part.
Its preparation method is as follows: by described parts by weight get Sn, Sb, Ni, Re and Bi will, each raw material is joined in the vaccum sensitive stove, 830 ℃ of following normal pressure insulation reaction 2.7 hours, casting both.
Claims (6)
1. a suitable electronics and IT products soft solder composition is characterized in that it is to count ratio by following raw materials in parts by weight to be prepared from: Sn30-50 part, Sb5-12 part, Ni5-10 part, Re0.05-0.25 part, Bi25-35 part.
2. suitable electronics and IT products soft solder composition according to claim 1 is characterized in that it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40-45 part, Sb8-10 part, Ni6-8 part, Re0.1-0.2 part, Bi28-32 part.
3. suitable electronics and IT products soft solder composition according to claim 1 is characterized in that it is to count ratio by following raw materials in parts by weight to be prepared from: Sn42 part, Sb8 part, Ni8 part, Re0.1 part, Bi30 part.
4. suitable electronics and IT products soft solder composition according to claim 1 is characterized in that it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb10 part, Ni6 part, Re0.2 part, Bi32 part.
5. suitable electronics and IT products soft solder composition according to claim 1 is characterized in that it is to count ratio by following raw materials in parts by weight to be prepared from: Sn40 part, Sb9 part, Ni7 part, Re0.15 part, Bi30 part.
6. the described suitable electronics and IT products of a claim 1 are with soft solder preparation of compositions method, getting Sn, Sb, Ni, Re and Bi by described parts by weight will, each raw material is joined in the vaccum sensitive stove, and 800-900 ℃ of following normal pressure insulation reaction 2-2.5 hour, casting both.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102199362A CN102059473A (en) | 2009-11-17 | 2009-11-17 | Soft solder composition for electronic information products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102199362A CN102059473A (en) | 2009-11-17 | 2009-11-17 | Soft solder composition for electronic information products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102059473A true CN102059473A (en) | 2011-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102199362A Pending CN102059473A (en) | 2009-11-17 | 2009-11-17 | Soft solder composition for electronic information products |
Country Status (1)
| Country | Link |
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| CN (1) | CN102059473A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6477965B1 (en) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, flux cored solder and solder joint |
-
2009
- 2009-11-17 CN CN2009102199362A patent/CN102059473A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6477965B1 (en) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, flux cored solder and solder joint |
| WO2019171978A1 (en) * | 2018-03-08 | 2019-09-12 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, resin-flux cored solder, and solder joint |
| JP2019155471A (en) * | 2018-03-08 | 2019-09-19 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, resin cored solder, and solder joint |
| TWI679078B (en) * | 2018-03-08 | 2019-12-11 | 日商千住金屬工業股份有限公司 | Solder alloy, solder paste, solder ball, turpentine |
| CN111182999A (en) * | 2018-03-08 | 2020-05-19 | 千住金属工业株式会社 | Solder alloy, solder paste, solder ball, cored solder, and solder joint |
| US11241760B2 (en) | 2018-03-08 | 2022-02-08 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |