CN102059016B - Filtration device and method recyclable sand of lapping machine - Google Patents
Filtration device and method recyclable sand of lapping machine Download PDFInfo
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- CN102059016B CN102059016B CN 201010585222 CN201010585222A CN102059016B CN 102059016 B CN102059016 B CN 102059016B CN 201010585222 CN201010585222 CN 201010585222 CN 201010585222 A CN201010585222 A CN 201010585222A CN 102059016 B CN102059016 B CN 102059016B
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- filter
- sand
- hod
- mortar
- lapping machine
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- 239000004576 sand Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000001914 filtration Methods 0.000 title claims abstract description 13
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims description 22
- 230000008929 regeneration Effects 0.000 claims description 21
- 238000011069 regeneration method Methods 0.000 claims description 21
- 238000000926 separation method Methods 0.000 claims description 10
- 239000011440 grout Substances 0.000 claims description 9
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000284 extract Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 230000002706 hydrostatic effect Effects 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910001651 emery Inorganic materials 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention relates to a filtration device and method for the recyclable sand of a lapping machine. In the invention, the recyclable sand satisfying the production requirement is filtered by using a filtration device; the mortar of the recyclable sand is extracted by a circulating pump; the mortar enters into a filter to be filtered from top to bottom; as the mortar at a filtration layer is increased gradually so that the pressure of the filtration layer is increased; the small-grained mortar is filtered and the large-grained emery is intercepted; and the mortar continuously impacts the filtration layer so that the recyclable sand with grain diameter in a certain range is filtered. When products are processed by replacing the new sand by the recyclable sand, the auxiliary materials are substantially utilized, the processing cost is reduced and the quality of silicon wafer products is ensured at the same time.
Description
Technical field
The present invention relates to the processing technique field of semi-conductor silicon chip, particularly the filter of wafer lapping machine circular regeneration sand and method.
Technical background
In recent years, because the develop rapidly of electron trade, the diversification of product demand, the initial raw material wafer that is used for electronic product also has new raising, and series of parameters such as the technical parameter of silicon chip itself such as surface roughness Ra/Rz, TTV, warp also are more and more higher to the requirement of silicon chip.And the cost that is used for the supplementary material of silicon chip processing also is the development along with market, become to increase progressively trend growth, therefore, utilize the circular regeneration sand pocket to replace new sand to come converted products, not only can utilize auxiliary material substantially, cut down finished cost, and guarantee the quality of silicon chip product simultaneously.
Use the difficult point of circular regeneration sand converted products to be, the particle diameter that how to guarantee circular regeneration sand evenly, particle diameter is in allowed band, controls the scuffing rate of product to be processed with this.
Because the size ratio fresh sand particle diameter of circular regeneration sand is little, can not be directly used in converted products, therefore adopt the method for interpolation fresh sand in the circular regeneration sand.And the circular regeneration sand that can be used for converted products need could guarantee that its particle size range meets standard-required through filtering, so develops and a kind ofly can guarantee that the filter of recirculation system sand particle size range is imperative.
Summary of the invention
Purpose of the present invention very to the filtration requirement of circular regeneration sand, provides a kind of technical scheme exactly for overcoming the deficiencies in the prior art, thereby guarantees that particle diameter is controlled in the standard-required scope.
The present invention realizes by such technical scheme: the filter of wafer lapping machine circular regeneration sand, it is characterized in that, and comprise two hods and two filters that structure is identical that structure is identical; Described hod main body is a hydrostatic column, vertical submerged pump of interior installation and a stirring pump; Described hod bottom is provided with sand inlet and sand-returning hole; Described hod inside is provided with water-cooling system; Water-cooling system comprises water inlet and delivery port; Described filter body is a cylindrical pressure vessel, and the top is provided with pressure lock, and the filter inner chamber is provided with filter course, and filter course is one bag of type filter screen; Described filter upper inside wall is installed special clip; Described special clip) be made up of the identical concentric iron hoop of two plate shapes, the outer shroud of special clip is fixed on the filter inwall, and its bore diameter of outer ring matches with outside diameter of inner ring, and the suitable for reading of filter screen is clamped between interior ring of special clip and the outer shroud;
The filter pulp-inlet pipe that is connected with the pressure vessel inwall is located at the top of filter screen; The filter grout outlet that is connected with the pressure vessel inwall is located at the below of filter screen; The main body pressure vessel intracavity bottom of described filter is provided with the high separation layer of 5cm, is distributed with 4 vents on the separation layer, and 4 vents are open-works, communicate with separation layer; The pumping hole of described vertical submerged pump connects the filter pulp-inlet pipe of filter by pulp piping; The filter grout outlet of filter constitutes lateral by pulp piping through threeway, and lateral connects the mortar import of wafer lapping machine and the sand inlet of hod bottom respectively; The mortar outlet of wafer lapping machine connects the sand-returning hole of two hod bottoms respectively through threeway by pulp piping; Form the mortar closed circuit.
The filter method of wafer lapping machine circular regeneration sand is characterized in that, comprises the steps:
(1) filter of wafer lapping machine circular regeneration sand adopts the identical hod of two structures and two identical filters of structure to realize the filtration of circular regeneration sand;
(2) one of them hod preparation fresh sand, diamond dust PWA-15 D50 particle diameter: 10.2um;
(3) another hod preparation reclaimed sand, in wafer lapping machine abrasive disc process, need to give additional slurries in the reclaimed sand hod with the mortar in the fresh sand hod, judge whether that according to the slurry density size needs add fresh sand, regulation reclaimed sand density is at 1.2-1.3
G/cm 3
(4) the reclaimed sand hod needs to replenish new particle loaded fluid in the abrasive disc process, and replenishing new particle loaded fluid process is to finish by the control of the valve in the pipeline;
(5) mortar in the fresh sand hod is that the submerged pump of 5m extracts by lift, filters out particle diameter in the diamond dust greater than the particle of 10.2um through the pulp-inlet pipe of filter; Branch's pulp piping that mortar constitutes through threeway from the grout outlet of filter, the one tunnel to enter wafer lapping machine equipment through sand-feeding tube be that abrasive disc processing is used, another road comes back to hod through sand-returning pipe, forms the mortar self-loopa;
(6) mortar in the reclaimed sand hod is that the submerged pump of 5m extracts by lift, filters out particle diameter in the diamond dust greater than 10.2 particle through the pulp-inlet pipe of filter; Branch's pulp piping that mortar constitutes through threeway from the grout outlet of filter, the one tunnel to enter wafer lapping machine equipment through sand-feeding tube be that abrasive disc processing is used, another road comes back to hod through sand-returning pipe, forms the mortar self-loopa.
The circular regeneration sand that the present invention utilizes filter to filter out to satisfy production requirement, the filter circulation theory: recirculation system sand extracts mortar through circulating pump, enters filter, and from top to down filters.Because the mortar of filter course increases gradually, filter course self pressure is increased, filter out short grained mortar, hold back bulky grain diamond dust, mortar is the impact filtration layer continuously, filters out the recirculation system sand of certain limit particle diameter; Therefore, utilize the circular regeneration sand pocket to replace new sand to come converted products, not only can utilize auxiliary material substantially, cut down finished cost, and guarantee the quality of silicon chip product simultaneously.
Description of drawings
Fig. 1. the filter of wafer lapping machine circular regeneration sand is for the sand flow chart.
Fig. 2. filter structure schematic representation.
Among the figure: 1. wafer lapping machine, 2. filter, 3. hod 4. stirs pump, 5. submerged pump; 6. sand-feeding tube, 7. sand-returning pipe, 8. cooling water pipe, 9. valve, 21. special clips, 22. the filter pulp-inlet pipe, 23. Pressure gauges, 24. filter grout outlets, 25. separation layers, 26. filter screens (filter course), 27. pressure lock, 31. sand inlets, 32. sand-returning holes, 51. submerged pump pumping holes.
The specific embodiment
For a more clear understanding of the present invention, describe the present invention in conjunction with the accompanying drawings and embodiments in detail:
As depicted in figs. 1 and 2, the filter of wafer lapping machine circular regeneration sand comprises two hods 3 and two filters 2 that structure is identical that structure is identical; Hod 3 main bodys are hydrostatic column, vertical submerged pump 5 of interior installation and a stirring pump 4; Hod 3 bottoms are provided with sand inlet 31 and sand-returning hole 32; Hod 3 inside are provided with water-cooling system; Water-cooling system comprises water inlet and delivery port; Filter 2 main bodys are cylindrical pressure vessel, and the top is provided with pressure lock 27, and filter 2 inner chambers are provided with filter course, and filter course is one bag of type filter screen 26; Special clip 21 is installed on described filter 2 upper inside wall; Special clip 21 is made up of the identical concentric iron hoop of two plate shapes, and the outer shroud of special clip 21 is fixed on filtering container 2 inwalls, and its bore diameter of outer ring matches with outside diameter of inner ring, and the suitable for reading of filter screen 26 is clamped between special clip 21 interior rings and the outer shroud; The filter pulp-inlet pipe 22 that is connected with the pressure vessel inwall is located at the top of filter screen 26; The filter that is connected with the pressure vessel inwall goes out the below that sandpipe 24 is located at filter screen 26; The main body pressure vessel intracavity bottom of filter 2 is provided with the high separation layer of 5cm 25, be distributed with 4 vents on the separation layer 25,4 vents are open-works, communicate with separation layer, and the pumping hole 51 of vertical submerged pump 5 connects the filter pulp-inlet pipe 22 of filter 2 by pulp piping; The filter of filter 2 goes out sandpipe 24 and constitutes lateral by pulp piping through threeway, and lateral connects the mortar import of wafer lapping machine 1 and the sand inlet 31 of hod bottom respectively; The mortar outlet of wafer lapping machine 1 connects the sand-returning hole 32 of two hod bottoms respectively through threeway by pulp piping; Form the mortar closed circuit.
Usually, it is big more to flow through filter mortar speed, and the migration velocity of suspended particulate in filter bed is also just fast more in the mortar, the easy more filter course that penetrates of mortar correspondingly, and filter cycle is also just short more.Therefore, the filter circulation theory: recirculation system sand extracts mortar through circulating pump, enters filter, and from top to down filters.Because the mortar of filter course increases gradually, filter course self pressure is increased, filter out short grained mortar, hold back bulky grain diamond dust, mortar is the impact filtration layer continuously, filters out the recirculation system sand of certain limit particle diameter.
Claims (2)
1. the filter of wafer lapping machine circular regeneration sand is characterized in that, comprises two hods (3) and two filters (2) that structure is identical that structure is identical; Described hod (3) main body is a hydrostatic column, a vertical submerged pump of interior installation (5) and a stirring pump (4); Described hod (3) bottom is provided with sand inlet (31) and sand-returning hole (32); Described hod (3) inside is provided with water-cooling system; Water-cooling system comprises water inlet and delivery port; Described filter (2) main body is a cylindrical pressure vessel, and the top is provided with pressure lock (27), and filter (2) inner chamber is provided with filter course, and filter course is one bag of type filter screen (26); Described filter (2) upper inside wall is installed special clip (21); Described special clip (21) is made up of the identical concentric iron hoop of two plate shapes, the outer shroud of special clip (21) is fixed on filter (2) inwall, its bore diameter of outer ring matches with outside diameter of inner ring, and the suitable for reading of filter screen (26) is clamped between interior ring of special clip (21) and the outer shroud; The filter pulp-inlet pipe (22) that is connected with the pressure vessel inwall is located at the top of filter screen (26); The filter grout outlet (24) that is connected with the pressure vessel inwall is located at the below of filter screen (26); The main body pressure vessel intracavity bottom of described filter (2) is provided with the high separation layer of 5cm (25), is distributed with 4 vents on the separation layer (25), and 4 vents are open-works, communicate with separation layer; The pumping hole (51) of described vertical submerged pump (5) connects the filter pulp-inlet pipe (22) of filter (2) by pulp piping; The filter grout outlet (24) of filter (2) constitutes lateral by pulp piping through threeway, and lateral connects the mortar import of wafer lapping machine (1) and the sand inlet (31) of hod bottom respectively; The mortar outlet of wafer lapping machine (1) connects the sand-returning hole (32) of two hod bottoms respectively through threeway by pulp piping; Form the mortar closed circuit.
2. the filter method of wafer lapping machine circular regeneration sand is characterized in that, comprises the steps:
(1) filter of wafer lapping machine circular regeneration sand adopts the identical hod of two structures and two identical filters of structure to realize the filtration of circular regeneration sand;
(2) one of them hod preparation fresh sand, diamond dust PWA-15 D50 particle diameter: 10.2 μ m;
(3) another hod preparation reclaimed sand, in wafer lapping machine abrasive disc process, need to give additional slurries in the reclaimed sand hod with the mortar in the fresh sand sand bucket, judge whether that according to the slurry density size needs add fresh sand, regulation reclaimed sand density is at 1.2-1.3g/cm
3
(4) the reclaimed sand hod needs to replenish new particle loaded fluid in the abrasive disc process, and replenishing new particle loaded fluid process is to finish by the control of the valve in the pipeline;
(5) mortar in the fresh sand hod is that the submerged pump of 5m extracts by lift, filters out particle diameter in the diamond dust greater than the particle of 10.2 μ m through the pulp-inlet pipe of filter; Branch's pulp piping that mortar constitutes through threeway from the grout outlet of filter, the one tunnel to enter wafer lapping machine equipment through sand-feeding tube be that abrasive disc processing is used, another road comes back to hod through sand-returning pipe, forms the mortar self-loopa;
(6) mortar in the reclaimed sand hod is that the submerged pump of 5m extracts by lift, filters out particle diameter in the diamond dust greater than the particle of 10.2 μ m through the pulp-inlet pipe of filter; Branch's pulp piping that mortar constitutes through threeway from the grout outlet of filter, the one tunnel to enter wafer lapping machine equipment through sand-feeding tube be that abrasive disc processing is used, another road comes back to hod through sand-returning pipe, forms the mortar self-loopa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010585222 CN102059016B (en) | 2010-12-13 | 2010-12-13 | Filtration device and method recyclable sand of lapping machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010585222 CN102059016B (en) | 2010-12-13 | 2010-12-13 | Filtration device and method recyclable sand of lapping machine |
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| Publication Number | Publication Date |
|---|---|
| CN102059016A CN102059016A (en) | 2011-05-18 |
| CN102059016B true CN102059016B (en) | 2011-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010585222 Active CN102059016B (en) | 2010-12-13 | 2010-12-13 | Filtration device and method recyclable sand of lapping machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104001356A (en) * | 2014-05-19 | 2014-08-27 | 中煤科工集团武汉设计研究院有限公司 | Self-cleaning washing-free basket-type slurry filter |
| CN117138898B (en) * | 2022-12-20 | 2024-04-16 | 宿州学院 | Grinding equipment and online bead replacement method for grinding beads thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1113931A (en) * | 1994-06-11 | 1995-12-27 | 王魁久 | Processing technology for ceramic balls and its equipment |
| WO2008020507A1 (en) * | 2006-08-16 | 2008-02-21 | Asahi Glass Company, Limited | Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor |
| WO2010007862A1 (en) * | 2008-07-14 | 2010-01-21 | 株式会社 フジミインコーポレーテッド | Filtration method, method of purifying abrasive composition using the same, method of regenerating filter for use in filtration, and apparatus for regenerating filter |
| CN101829759A (en) * | 2010-05-10 | 2010-09-15 | 江阴市光泰机械有限公司 | Sodium silicate waste sand rotary vibration grinding wet-type regenerator |
-
2010
- 2010-12-13 CN CN 201010585222 patent/CN102059016B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1113931A (en) * | 1994-06-11 | 1995-12-27 | 王魁久 | Processing technology for ceramic balls and its equipment |
| WO2008020507A1 (en) * | 2006-08-16 | 2008-02-21 | Asahi Glass Company, Limited | Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor |
| WO2010007862A1 (en) * | 2008-07-14 | 2010-01-21 | 株式会社 フジミインコーポレーテッド | Filtration method, method of purifying abrasive composition using the same, method of regenerating filter for use in filtration, and apparatus for regenerating filter |
| CN101829759A (en) * | 2010-05-10 | 2010-09-15 | 江阴市光泰机械有限公司 | Sodium silicate waste sand rotary vibration grinding wet-type regenerator |
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|---|---|
| CN102059016A (en) | 2011-05-18 |
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Effective date of registration: 20180703 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Tianjin Nankai District Huayuan Industrial Park (outside the ring) 12 East Hai Tai Road Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20191211 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring road No. 12 in Haitai) Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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