CN102051606B - Method for coating copper on surface of iron powder - Google Patents
Method for coating copper on surface of iron powder Download PDFInfo
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- CN102051606B CN102051606B CN201110006460A CN201110006460A CN102051606B CN 102051606 B CN102051606 B CN 102051606B CN 201110006460 A CN201110006460 A CN 201110006460A CN 201110006460 A CN201110006460 A CN 201110006460A CN 102051606 B CN102051606 B CN 102051606B
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- copper
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- coppering
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Abstract
The invention provides a method for coating copper on the surface of iron powder. The method comprise the following steps: under the conditions of room temperature and stirring, taking the iron powder as a core, coating an even, compact and high-bond strength copper layer on the surface of the iron powder by a chemical displacement coppering method, and controlling the thickness of the coppering layer through regulating the composition, acid degree, stirring rate and plating time of a solution. The displacement coppering solution comprises the following components: 7-20g/L of copper phytic acid, 20-80g/L of sulphuric acid (98%) and 3.0-5.0g/L of compound addictive; the plating process parameters are as follows: the temperature is the room temperature, the stirring speed is 30-500rpm, and the time is 10-120 minutes; and the compound addictive comprises the following components by weight: 5% of thiourea, 5% of alylthiourea, 28% of benzotriazole, 12% of 8-oxyquinoline, 15% of sulfosalicylic acid, 1% of po1yoxyethylene octylphenol ether (OP) emulsifier, 2% of sodium dodecyl benzene sulfonate, 8% of saccharin and 24% of polyethylene.
Description
Technical field
The invention belongs to the metal material processing field, especially relate to a kind of iron powder surface and coat copper method, specifically is exactly to coat layer of copper on the iron powder surface through the plating by chemical displacement copper method, with processing characteristics and the application performance that improves iron powder.
Background technology
Iron powder is widely used in fields such as machinery, metallurgy, chemical industry as the important source material of industry, and the shortcoming of iron powder is not corrosion-resistant.It is to improve one of corrosion proof effective ways of iron powder that iron powder coats copper, and the shortcoming that the traditional chemical copper-plating method is used for cladding iron powder is the poor stability of solution, autocatalysis takes place easily decompose.Application number is that 95116704.9 Chinese patent has been introduced a kind of iron-based substitution method copper facing plating agent, and the deficiency of this patent is: have obvious hydrogen evolution phenomenon in 1) the plating process, the bonding strength of copper layer and iron powder is low, and the copper-clad coating comes off easily; 2) thiocarbamide content is high, and the copper laminar surface adheres to one deck white mass, when iron powder is too thin, is easy to the caking of reuniting, thereby influences cleaning and the following process and the application performance of copper-clad iron powder; 3), react wayward, solution composition and change inhomogeneous with the copper-clad coating greatly for superfine iron powder.
Summary of the invention
The present invention is directed to the deficiency of existing iron powder surface coating copper technology, provide the simple and solution-stabilized iron powder surface of a kind of technology to coat copper method.
The present invention implements in the following manner:
A kind of iron powder surface coats copper method; Under room temperature and agitation condition; With the iron powder is core; Adopt the plating by chemical displacement copper method coat on the iron powder surface one deck evenly, densification and the high copper layer of bonding strength, can control thickness of coated copper layer through adjustment solution composition, acidity, stirring velocity and plating time; Replacement copper plating solution composition: phytic acid copper 7-20g/L, sulfuric acid (98%) 20-80g/L, composite additive 3.0-5.0g/L; Composite additive is made up of thiocarbamide, propenyl thiocarbamide, benzotriazole, oxine, sulphosalicylic acid, sim alkylphenol Soxylat A 25-7 (OP) emulsifying agent, X 2073, asccharin and polyoxyethylene glycol, and the mass percent of each component is: thiocarbamide 5%, propenyl thiocarbamide 5%, benzotriazole 28%, oxine 12%, sulphosalicylic acid 15%, sim alkylphenol Soxylat A 25-7 (OP) emulsifying agent 1%, X 2073 2%, asccharin 8% and polyoxyethylene glycol 24%; Plating technology parameter: room temperature, stirring velocity 300-500rpm, plating time 10-120min; Iron powder coats the process for copper flow process: iron powder → oil removing → washing → pickling → washing → replacement copper plating → washing → copper-clad iron powder and phytic acid iron precipitate and separate → washing → dehydration → drying → copper-clad iron powder product.
The advantage that iron powder of the present invention coats copper method is:
Under acidic conditions, the phytic acid radical ion not only can form stable complex compound with cupric ion, and ferric ion is quantitatively precipitated, and can stablize replacement copper plating solution through adding phytic acid copper; Adjust solution acidity with sulfuric acid,, can effectively suppress liberation of hydrogen side reaction and the microtexture and the surface topography that improve the displacement copper coating through adding composite additive; The phytate film that the copper plate surface forms effectively prevents oxidation of copper layer and particle agglomeration; The present invention is used for iron powder and coats copper, and copper layer thickness is controlled, technology is simple and save energy.
Embodiment
Provide three most preferred embodiments of the present invention below:
Embodiment 1
Replacement copper plating solution composition: phytic acid copper 7g/L, sulfuric acid (98%) 20g/L, composite additive 3.0g/L; The composition of composite additive (quality): thiocarbamide 5%, propenyl thiocarbamide 5%, benzotriazole 28%, oxine 12%, sulphosalicylic acid 15%, sim alkylphenol Soxylat A 25-7 emulsifying agent 1%, X 2073 2%, asccharin 8% and polyoxyethylene glycol 24%; At ambient temperature, the adjustment stirring velocity is 500rpm, and adding particle diameter is the iron powder of 20-30um, and plating time 45min, copper clad layer thickness are 0.6-0.8um; Pass through sedimentation, obtain the copper-clad iron powder with phytic acid iron precipitate and separate, washing, drying.Iron powder coats the process for copper flow process:
Iron powder → oil removing → washing → pickling → washing → displacement plating → washing → copper-clad iron powder and phytic acid iron precipitate and separate → washing → dehydration → drying → copper-clad iron powder product.
Embodiment 2
The replacement copper plating solution composition: phytic acid copper 17g/L, sulfuric acid (98%) 60g/L, composite additive 4.5g/L, composite additive form with embodiment 1; At room temperature, the adjustment stirring velocity is 400rpm, and adding particle diameter is the iron powder of 40-50um, and plating time 60min, copper clad layer thickness are 1.0-1.2um; Pass through sedimentation, obtain the copper-clad iron powder with phytic acid iron precipitate and separate, washing, drying.Iron powder coats the process for copper flow process with embodiment 1.
Embodiment 3
The replacement copper plating solution composition: phytic acid copper 20g/L, sulfuric acid (98%) 70g/L, composite additive 5.0g/L, composite additive form with embodiment 1; At room temperature, the adjustment stirring velocity is 300rpm, and adding particle diameter is the iron powder of 60-80um, and plating time 90min, copper clad layer thickness are 1.5-1.7um; Pass through sedimentation, obtain the copper-clad superfine iron powder with phytic acid iron precipitate and separate, washing, drying.Iron powder coats the process for copper flow process with embodiment 1.
Claims (1)
1. an iron powder surface coats copper method; With the iron powder is core; Adopt the plating by chemical displacement copper method coat on the iron powder surface one deck evenly, densification and the high copper layer of bonding strength, through adjustment solution composition, acidity, stirring velocity and plating time control thickness of coated copper layer; It is characterized in that the replacement copper plating solution composition is: phytic acid copper 7-20g/L, 98% sulfuric acid 20-80g/L, composite additive 3.0-5.0g/L; The mass percent of each component of composite additive is: thiocarbamide 5%, propenyl thiocarbamide 5%, benzotriazole 28%, oxine 12%, sulphosalicylic acid 15%, sim alkylphenol Soxylat A 25-7 emulsifying agent 1%, X 2073 2%, asccharin 8% and polyoxyethylene glycol 24%; The plating technology parameter is: room temperature, stirring velocity 300-500rpm, time 10-120min.
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CN201110006460A CN102051606B (en) | 2011-01-13 | 2011-01-13 | Method for coating copper on surface of iron powder |
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CN201110006460A CN102051606B (en) | 2011-01-13 | 2011-01-13 | Method for coating copper on surface of iron powder |
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CN102051606A CN102051606A (en) | 2011-05-11 |
CN102051606B true CN102051606B (en) | 2012-10-10 |
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CN201110006460A Expired - Fee Related CN102051606B (en) | 2011-01-13 | 2011-01-13 | Method for coating copper on surface of iron powder |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111233107A (en) * | 2018-11-29 | 2020-06-05 | 同济大学 | Copper-plated iron, preparation method and application thereof |
Families Citing this family (5)
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CN102531110B (en) * | 2012-03-06 | 2013-11-06 | 山东大学 | Iron-copper microelectrolysis reaction tank and preparation method for copperized iron wire net plate |
CN103422079B (en) * | 2012-05-22 | 2016-04-13 | 比亚迪股份有限公司 | A kind of chemical bronze plating liquid and preparation method thereof |
CN107557767A (en) * | 2017-07-25 | 2018-01-09 | 东莞聚顺环保科技有限公司 | Nickel ecology copper facing water-based process material and its copper electroplating method |
CN107557768A (en) * | 2017-07-25 | 2018-01-09 | 东莞聚顺环保科技有限公司 | Iron ecology copper facing water-based process material and its copper electroplating method |
CN115216757B (en) * | 2022-08-04 | 2023-04-25 | 南昌航空大学 | Copper plating solution and copper plating method for carbon steel overhaul tool in petrochemical industry |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1411971A (en) * | 1972-04-07 | 1975-10-29 | Ici Ltd | Process for the immersion plating of copper on iron or steel |
CN1127307A (en) * | 1995-09-06 | 1996-07-24 | 吉林工学院 | Copper plating assistants of ferrous base replacement method |
CN1817509A (en) * | 2006-03-17 | 2006-08-16 | 金川集团有限公司 | Production of iron composite powder with copper coating |
CN1920074A (en) * | 2006-09-15 | 2007-02-28 | 重庆华浩冶炼有限公司 | Iron bronze composite powder and preparation method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01319684A (en) * | 1988-06-21 | 1989-12-25 | Nec Corp | Replacement copper plating liquid |
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2011
- 2011-01-13 CN CN201110006460A patent/CN102051606B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1411971A (en) * | 1972-04-07 | 1975-10-29 | Ici Ltd | Process for the immersion plating of copper on iron or steel |
CN1127307A (en) * | 1995-09-06 | 1996-07-24 | 吉林工学院 | Copper plating assistants of ferrous base replacement method |
CN1817509A (en) * | 2006-03-17 | 2006-08-16 | 金川集团有限公司 | Production of iron composite powder with copper coating |
CN1920074A (en) * | 2006-09-15 | 2007-02-28 | 重庆华浩冶炼有限公司 | Iron bronze composite powder and preparation method thereof |
Non-Patent Citations (1)
Title |
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JP平1-319684A 1989.12.25 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111233107A (en) * | 2018-11-29 | 2020-06-05 | 同济大学 | Copper-plated iron, preparation method and application thereof |
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