CN102044752A - Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device - Google Patents
Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device Download PDFInfo
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- CN102044752A CN102044752A CN2010105769252A CN201010576925A CN102044752A CN 102044752 A CN102044752 A CN 102044752A CN 2010105769252 A CN2010105769252 A CN 2010105769252A CN 201010576925 A CN201010576925 A CN 201010576925A CN 102044752 A CN102044752 A CN 102044752A
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- bonding jumper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/245—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with means for shaping the antenna pattern, e.g. in order to protect user against rf exposure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
- H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Waveguide Aerials (AREA)
- Support Of Aerials (AREA)
Abstract
The invention discloses an antenna with grounded U-shaped high-impedance surface metal strips and a wireless communication device with the antenna. The antenna is arranged in a housing, and comprises an antenna radiation unit and a grounding plate thereof. A plurality of high-impedance surface units are arranged at intervals on the grounding plate, and each high-impedance surface unit consists of three sections of high-impedance surface metal strips which are connected to form a U shape. High-impedance surface through holes are formed on the bottom edges of the U shapes, and are used for connecting the high-impedance surface metal strips among the high-impedance surface units. Due to the adoption of the plurality of U-shaped high-impedance surface units, the antenna and the wireless communication device suppress or prevent surface waves from being propagated along the surface of the antenna on one hand, and perform same-phase reflection on plane waves incident vertically to the surface of the antenna on the other hand; the antenna and the wireless communication device reduce radiation on a head, reduce radiation energy absorbed by the head and reduce a specific absorption rate by utilizing the surface wave suppression characteristics of the high-impedance surface units arranged around the antenna; and simultaneously, the radiation performance of the antenna may not be reduced, the communication quality may not be influenced, and the antenna and the wireless communication device have universality and universal applicability.
Description
Technical field
The present invention relates to the field of antenna of radio communication device, in particular, what improvement related to is a kind of antenna and wireless communication apparatus thereof with U font high impedance surface bonding jumper ground connection.
Background technology
The radio wave that wireless communication apparatus is launched in communication process is exposed in the gageable radio-frequency electromagnetic radiation user; As use portable terminal such as mobile phone this when conversation, tend to make head to be in the electromagnetic radiation field that mobile phone launches; For this reason, comprise that Chinese national governments have all formulated comprehensive and safe criterion and the beam exposure problem of the energy is frequently managed and made an appointment with to standard; Wherein, specific absorption rate (SAR, Specific Absorption Rate) is exactly a very important evaluate parameter, means electro-magnetic wave absorption ratio, is that the electromagnetic wave energy of mobile phone or radio communication product absorbs ratio; Generally, measure mobile phone radiation exactly to the influence of human body especially head conformance with standard whether.This also is a unit of measuring the quantity of the radio-frequency (RF) energy that human body absorbed when using portable terminal, with the standard of doing protecting human body.
At present, portable terminal has designed to be able in these very strict limits and has used, and the therefore various apparatus and method that are used to reduce SAR just are developed; For example, the electromagnetic material of additional absorption on portable terminal, perhaps pass through the layout optimization radio frequency induction electric current of metalwork, and complicated Antenna Design is used to reduce specific absorption rate or the like, but, the influence that these methods for designing often are subjected to mobile terminal style is very big, does not have versatility and universal applicability.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
The objective of the invention is to, a kind of antenna and wireless communication apparatus thereof with U font high impedance surface bonding jumper ground connection is provided, not only can reduce the radiation that antenna produces human body but also can not exert an influence, also have general applicability communication quality.
Technical scheme of the present invention is as follows: a kind of antenna with U font high impedance surface bonding jumper ground connection comprises antenna radiation unit and ground plate thereof, wherein: be arranged at intervals with a plurality of high impedance surface unit on ground plate; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers; U font base is provided with the high impedance surface via hole; Interconnect via the high impedance surface via hole between the high impedance surface unit.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: ground plate is a printed circuit board (PCB); The high impedance surface unit is positioned at printed circuit board surface; The high impedance surface via hole passes the printed circuit board (PCB) setting.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: the live width of high impedance surface bonding jumper is 1mm; The width of U font high impedance surface unit is 6mm; The height of U font high impedance surface unit is 8mm; Be spaced apart 0.5mm between the high impedance surface unit.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: the setting of on ground plate, embarking on journey of U font high impedance surface unit.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: the high impedance surface bonding jumper on U font base parallels setting with the row that the high impedance surface unit forms.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: U font high impedance surface unit becomes row setting on ground plate.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: the high impedance surface bonding jumper of U font dual-side parallels setting with the row that the high impedance surface unit forms.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: corresponding high impedance bonding jumper be arranged in parallel between the U font high impedance surface unit.
The antenna of described band U font high impedance surface bonding jumper ground connection, wherein: it is characterized in that: antenna radiation unit is a planar inverted F-shape antenna.
A kind of wireless communication apparatus comprises the antenna that shell and communication are used; Antenna is arranged on enclosure, comprises antenna radiation unit and ground plate thereof; Wherein: on ground plate, be arranged at intervals with a plurality of high impedance surface unit; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers; U font base is provided with the high impedance surface via hole; Interconnect via the high impedance surface via hole between the high impedance surface unit.
A kind of antenna and wireless communication apparatus thereof provided by the present invention with U font high impedance surface bonding jumper ground connection, owing to adopted a plurality of that connect via the high impedance surface via hole and connect to form U font high impedance surface unit by three sections high impedance surface bonding jumpers, one side suppresses or has stoped surface wave to be propagated along its surface, and same-phase has reflected the plane wave of vertical its surperficial incident on the other hand; Utilized high impedance surface to suppress the characteristic of surface wave, be positioned over around the antenna, reduced radiation number of people direction, the antenna that has promptly reduced wireless communication apparatus when work to the radiation of human body direction, reduce the emittance that head absorbs, reduced specific absorption rate; Can not weaken simultaneously the energy of plane wave, avoid signal strength signal intensity is exerted an influence, can not reduce antenna radiation performance, can not exert an influence, have versatility and general applicability communication quality.
Description of drawings
Fig. 1 is the schematic perspective view of band U font high impedance surface bonding jumper grounded antenna structure of the present invention.
Fig. 2 is the U font high impedance surface cell schematics that is arranged among the present invention on the ground plate.
Fig. 3 is the schematic side view of band U font high impedance surface bonding jumper grounded antenna structure of the present invention.
Fig. 4 is the operation principle schematic diagram that is arranged on the U font high impedance surface unit on the ground plate among the present invention.
Fig. 5 is the schematic equivalent circuit that is arranged on the U font high impedance surface unit on the ground plate among the present invention.
Fig. 6 is the return loss test curve comparison diagram that the antenna in the wireless communication apparatus of the present invention has or not U font high impedance surface unit.
Fig. 7 is the specific absorption rate test curve comparison diagram that the antenna in the wireless communication apparatus of the present invention has or not U font high impedance surface unit.
Embodiment
Below with reference to accompanying drawing, the specific embodiment of the present invention and embodiment are described in detail, described specific embodiment in order to explain the present invention, is not to be used to limit the specific embodiment of the present invention only.
A kind of antenna of the present invention with U font high impedance surface bonding jumper ground connection, one of its embodiment as shown in Figure 1, comprises antenna radiation unit 120 and ground plate 110 thereof; Wherein, on ground plate 110, be arranged at intervals with a plurality of high impedance surface unit; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers 130; The high impedance surface bonding jumper 130 on U font base is provided with high impedance surface via hole 160; High impedance surface bonding jumper 130 between the high impedance surface unit is interconnected by the high impedance surface via hole 160 on it.
Antenna based on above-mentioned band U font high impedance surface bonding jumper 130 ground connection the invention allows for a kind of wireless communication apparatus, and one of its embodiment comprises the antenna that shell and communication are used; Antenna is arranged on enclosure, comprises antenna radiation unit 120 and ground plate 110 thereof; Wherein, on ground plate 110, be arranged at intervals with a plurality of high impedance surface unit; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers 130; The high impedance surface bonding jumper 130 on U font base is provided with high impedance surface via hole 160; High impedance surface bonding jumper 130 between the high impedance surface unit is interconnected by the high impedance surface via hole 160 on it.
High impedance surface of the present invention refers to the surface texture that can stop electromagnetic wave propagation that makes up on the ground plate 110 of antenna, promptly the surface wave to a certain frequency range has high-impedance behavior; Specifically, the one, the surface wave that frequency that its surface is propagated is positioned within its stopband is inhibited, and band support is not positioned at surperficial wave propagation within its stopband in other words; The 2nd, the plane wave that the frequency perpendicular to its surperficial incident is positioned within its stopband has the effect of same-phase reflection, and promptly the phase place of reflected wave and incident wave does not change.The said ground plate 110 of this paper specifically refers to whole printed circuit board (PCB), and what high impedance surface substituted then is the partial earthing plate 110 that is positioned at the antenna below.
And for the plane wave perpendicular to metal surface incident, the metal surface can make the phase place of this plane wave that 180 ° phase change takes place, if the ground plate of antenna 110 is complete metals, to the surface wave of its surface propagation, no matter whether frequency is positioned within its stopband, its impedance to surface wave is zero; Compare with antenna and the wireless communication apparatus thereof with complete metallic plate ground connection of the prior art, antenna and wireless communication apparatus thereof with high impedance surface unit ground connection provided by the present invention, owing to adopted a plurality of that connect via high impedance surface via hole 160 and connect to form U font high impedance surface unit by three sections high impedance surface bonding jumpers 130, one side suppresses or has stoped surface wave to be propagated along its surface, and same-phase has reflected the plane wave of vertical its surperficial incident on the other hand; Utilized high impedance surface to suppress the characteristic of surface wave, be positioned over around the antenna, reduced radiation number of people direction, the antenna that has promptly reduced wireless communication apparatus when work to the radiation of human body direction, reduce the emittance that head absorbs, reduced specific absorption rate; Can not weaken simultaneously the energy of plane wave, avoid signal strength signal intensity is exerted an influence, can not reduce antenna radiation performance, can not exert an influence, have versatility and general applicability communication quality.
Suppose that antenna radiation unit 120 is a kind of planar inverted F-shape antennas, as shown in Figure 1, the branch of two terminal open circuits is arranged on the antenna radiation unit 120, its operation principle is a quarter-wave resonance; What outside broad length was short is high-frequency branch, and what inboard more long narrow degree was long is low frequency branch.Be connected with the radio-frequency (RF) transmit-receive circuit of printed circuit board (PCB) by the grounding leg 140 of antenna radiation unit 120 and the feed-in pin 150 of antenna radiation unit 120.
In the preferred implementation of the antenna of band U font high impedance surface bonding jumper 130 ground connection of the present invention and wireless communication apparatus thereof, as shown in Figure 2, ground plate 110 is a printed circuit board (PCB); The high impedance surface unit is positioned at printed circuit board surface; High impedance surface via hole 160 passes the printed circuit board (PCB) setting; Utilize the copper layer that covers on the printed circuit board surface to make U font high impedance surface bonding jumper 130, and utilize the through hole on the printed circuit board (PCB) to make high impedance surface via hole 160.
Be preferably, as shown in Figure 3, high impedance surface via hole 160 passes the printed circuit board (PCB) setting, and U font high impedance surface bonding jumper 130 is by the high impedance surface via hole 160 on its base, be electrically connected with the lower surface metal layer formation of printed circuit board (PCB), to realize the ground connection of high impedance surface unit.
Concrete, the high impedance surface bonding jumper 130 of U font is arranged on the upper surface of printed circuit board (PCB), and the lower surface of printed circuit board (PCB) is made up of complete metal level.U font high impedance surface bonding jumper 130 is tiled in the upper surface of metallic circuit as far as possible, the lower zone that covered of antenna radiation unit 120 particularly, to substitute original block of metal layer, promptly realize the ground plane of zero ohm is carried out the transition to the infinitely-great ground plane of impedance as the new ground plane of antenna radiation unit 120.
Preferably, as shown in Figure 2, the live width B of high impedance surface bonding jumper 130 is 1mm; The width W of U font high impedance surface unit is 6mm; The height H of U font high impedance surface unit is 8mm; Interval δ between the high impedance surface unit is 0.5mm.
Further, the U font high impedance surface unit setting of on ground plate 110, embarking on journey; Wherein, the high impedance surface bonding jumper 130 on U font base parallels setting with the row that the high impedance surface unit forms.And U font high impedance surface unit becomes row setting on ground plate 110; Wherein, the high impedance surface bonding jumper 130 of U font dual-side parallels setting with the row that the high impedance surface unit forms.Preferably, corresponding high impedance bonding jumper be arranged in parallel between the U font high impedance surface unit.Certainly, the high impedance surface bonding jumper 130 that is positioned at both sides and/or bottom in the U font high impedance surface unit also can be obliquely installed with the row or column that the high impedance surface unit forms.
Because the dielectric constant of printed circuit board (PCB) and the physical dimension size that thickness will have influence on U font bonding jumper, so can be when design by the gap between length, width and the U font bonding jumper of adjusting U font bonding jumper, optimize the working band of high impedance surface unit, in the send channel scope that is located at communication standard.
The U font high impedance surface bonding jumper 130 that the ground connection of antenna of the present invention and wireless communication apparatus thereof is adopted, the electromagnetic property of this structure can be described with lumped circuit element, electric capacity and inductance.Its equivalent circuit parameter shows as the lc circuit of parallel resonance, and as shown in Figure 5, its effect can be regarded a kind of two-dimentional electrical filter as to stop electric current along its Surface runoff.
As shown in Figure 4, when U font bonding jumper interacts together with ground connection via hole and electromagnetic wave, on U font bonding jumper, will produce induced current, be parallel to the voltage effect of top surface, cause accumulating electric charge, therefore can be equivalent to capacity effect at the two ends of U font bonding jumper.And electric charge flow to form current loop back and forth between the lower surface of metallic vias and printed circuit board (PCB), and what link together with electric current is magnetic field and inductance, the schematic diagram of its electric capacity and inductance as shown in Figure 4, its equivalent resonant circuit is as shown in Figure 5.
Surface impedance presents inductive when being lower than resonance frequency, and when being higher than resonance frequency, surface impedance presents capacitive character, and near resonance frequency, surface impedance is very big value, and equivalence is infinitely great.In the design process, if make U font sheet metal together with the cellular construction resonance of via hole in the frequency band of the wireless transmission channel of communication standard, then this structure will form infinitely-great impedance in this frequency band, stop passing through of radio frequency table surface current, thereby reduce the specific absorption rate in this frequency band.
As shown in Figure 6, dotted line A is the return loss test curve figure that the situation lower plane inverted F shaped antenna of high impedance surface unit ground connection is arranged, and solid line B is the return loss test curve figure of the situation lower plane inverted F shaped antenna of no high impedance surface unit ground connection; On curve A, the influence that loads U font high impedance surface bonding jumper 130 and 160 pairs of return losses of high impedance surface via hole is also little, has guaranteed that thus radiance is unaffected substantially.
As shown in Figure 7, dotted line A is the specific absorption rate test curve figure that the situation lower plane inverted F shaped antenna of high impedance surface unit ground connection is arranged, and solid line B is the specific absorption rate test curve figure of the situation lower plane inverted F shaped antenna of no high impedance surface unit ground connection; From dotted line A, load U font high impedance surface bonding jumper 130 and high impedance surface via hole 160 and reduce specific absorption rate effectively, the specific absorption rate with frequency all can descend about 30%.
Should be understood that; the above only is preferred embodiment of the present invention; be not sufficient to limit technical scheme of the present invention; for those of ordinary skills; within the spirit and principles in the present invention; can be increased and decreased according to the above description, replacement, conversion or improvement; for example; antenna radiation unit 120 comprises that singly being not limited to is the plane inverted F shaped antenna; it also can be multiband aerial etc.; and all these increases and decreases, replacement, conversion or improve after technical scheme, all should belong to the protection range of claims of the present invention.
Claims (10)
1. the antenna with U font high impedance surface bonding jumper ground connection comprises antenna radiation unit and ground plate thereof, it is characterized in that: be arranged at intervals with a plurality of high impedance surface unit on ground plate; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers; U font base is provided with the high impedance surface via hole; Interconnect via the high impedance surface via hole between the high impedance surface unit.
2. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 1, it is characterized in that: ground plate is a printed circuit board (PCB); The high impedance surface unit is positioned at printed circuit board surface; The high impedance surface via hole passes the printed circuit board (PCB) setting.
3. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 1, it is characterized in that: the live width of high impedance surface bonding jumper is 1mm; The width of U font high impedance surface unit is 6mm; The height of U font high impedance surface unit is 8mm; Be spaced apart 0.5mm between the high impedance surface unit.
4. the antenna of band according to claim 1 U font high impedance surface bonding jumper ground connection is characterized in that: the setting of embarking on journey on ground plate of U font high impedance surface unit.
5. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 4, it is characterized in that: the high impedance surface bonding jumper on U font base parallels setting with the row that the high impedance surface unit forms.
6. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 1, it is characterized in that: U font high impedance surface unit becomes row setting on ground plate.
7. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 6, it is characterized in that: the high impedance surface bonding jumper of U font dual-side parallels setting with the row that the high impedance surface unit forms.
8. the antenna of band U font high impedance surface bonding jumper ground connection according to claim 1, it is characterized in that: corresponding high impedance bonding jumper be arranged in parallel between the U font high impedance surface unit.
9. according to the antenna of arbitrary described band U font high impedance surface bonding jumper ground connection in the claim 1 to 8, it is characterized in that: antenna radiation unit is a planar inverted F-shape antenna.
10. a wireless communication apparatus comprises the antenna that shell and communication are used; Antenna is arranged on enclosure, comprises antenna radiation unit and ground plate thereof; It is characterized in that: on ground plate, be arranged at intervals with a plurality of high impedance surface unit; Each high impedance surface unit connects to form the U font by three sections high impedance surface bonding jumpers; U font base is provided with the high impedance surface via hole; Interconnect via the high impedance surface via hole between the high impedance surface unit.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105769252A CN102044752B (en) | 2010-12-07 | 2010-12-07 | Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device |
| EP11847282.8A EP2650968B1 (en) | 2010-12-07 | 2011-11-05 | Grounded antenna having u-shaped high-impedance surface metal strips and wireless communication device having said antenna |
| PCT/CN2011/081837 WO2012075868A1 (en) | 2010-12-07 | 2011-11-05 | Grounded antenna having u-shaped high-impedance surface metal strips and wireless communication device having said antenna |
| ES11847282T ES2733736T3 (en) | 2010-12-07 | 2011-11-05 | Grounding antenna that has U-shaped high-impedance surface metal bands and wireless communication device that has the aforementioned antenna |
| US13/810,795 US9147941B2 (en) | 2010-12-07 | 2011-11-05 | Antenna grounded with U-shaped high-impedance surface metal strips and its wireless communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105769252A CN102044752B (en) | 2010-12-07 | 2010-12-07 | Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102044752A true CN102044752A (en) | 2011-05-04 |
| CN102044752B CN102044752B (en) | 2013-10-23 |
Family
ID=43910673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105769252A Active CN102044752B (en) | 2010-12-07 | 2010-12-07 | Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9147941B2 (en) |
| EP (1) | EP2650968B1 (en) |
| CN (1) | CN102044752B (en) |
| ES (1) | ES2733736T3 (en) |
| WO (1) | WO2012075868A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012075868A1 (en) * | 2010-12-07 | 2012-06-14 | 惠州Tcl移动通信有限公司 | Grounded antenna having u-shaped high-impedance surface metal strips and wireless communication device having said antenna |
| CN103703612A (en) * | 2011-05-26 | 2014-04-02 | 德克萨斯仪器股份有限公司 | High impedance surface |
| CN105720374A (en) * | 2016-04-08 | 2016-06-29 | 东南大学 | Three-polarized half-slot antenna of grating slit and ground coaxial feeding plated through hole stepped-impedance |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015076849A1 (en) * | 2013-11-25 | 2015-05-28 | Hewlett-Packard Development Company, L.P. | Antenna devices |
| TWI621303B (en) * | 2017-01-23 | 2018-04-11 | 廣達電腦股份有限公司 | Mobile device |
| WO2020182311A1 (en) | 2019-03-14 | 2020-09-17 | Huawei Technologies Co., Ltd. | Redirecting structure for electromagnetic waves |
| CN117014923A (en) * | 2022-04-28 | 2023-11-07 | 中兴通讯股份有限公司 | Test equipment and test system |
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| CN101102009A (en) * | 2006-07-03 | 2008-01-09 | 光宝科技股份有限公司 | Ultra-wide frequency antenna structure |
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| US6426722B1 (en) * | 2000-03-08 | 2002-07-30 | Hrl Laboratories, Llc | Polarization converting radio frequency reflecting surface |
| GB0101667D0 (en) * | 2001-01-23 | 2001-03-07 | Koninkl Philips Electronics Nv | Antenna arrangement |
| WO2002087012A1 (en) * | 2001-04-24 | 2002-10-31 | Telefonaktiebolaget Lm Ericsson | Pifa antenna with higp structure |
| TWI249875B (en) * | 2003-09-19 | 2006-02-21 | Univ Nat Taiwan Science Tech | Method and apparatus for improving antenna radiation patterns |
| US7190315B2 (en) * | 2003-12-18 | 2007-03-13 | Intel Corporation | Frequency selective surface to suppress surface currents |
| CN101188329B (en) * | 2007-12-04 | 2011-06-22 | 同济大学 | A dual-frequency ultra-thin highly directional resonance cavity antenna |
| CN101320845B (en) * | 2007-12-24 | 2012-11-21 | 中国科学院光电技术研究所 | Design method of high-directivity antenna adopting combination of electromagnetic band gap structure and metal grid structure |
| CN102044752B (en) * | 2010-12-07 | 2013-10-23 | 惠州Tcl移动通信有限公司 | Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device |
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2010
- 2010-12-07 CN CN2010105769252A patent/CN102044752B/en active Active
-
2011
- 2011-11-05 WO PCT/CN2011/081837 patent/WO2012075868A1/en active Application Filing
- 2011-11-05 ES ES11847282T patent/ES2733736T3/en active Active
- 2011-11-05 EP EP11847282.8A patent/EP2650968B1/en not_active Not-in-force
- 2011-11-05 US US13/810,795 patent/US9147941B2/en not_active Expired - Fee Related
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| US5400041A (en) * | 1991-07-26 | 1995-03-21 | Strickland; Peter C. | Radiating element incorporating impedance transformation capabilities |
| CN101102009A (en) * | 2006-07-03 | 2008-01-09 | 光宝科技股份有限公司 | Ultra-wide frequency antenna structure |
| CN201084827Y (en) * | 2007-09-07 | 2008-07-09 | 达昌电子科技(苏州)有限公司 | A single-pole antenna module |
| CN201946752U (en) * | 2010-12-07 | 2011-08-24 | 惠州Tcl移动通信有限公司 | Antenna with grounded U-shaped high-impedance surface metal strips and wireless communication device adopting same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012075868A1 (en) * | 2010-12-07 | 2012-06-14 | 惠州Tcl移动通信有限公司 | Grounded antenna having u-shaped high-impedance surface metal strips and wireless communication device having said antenna |
| CN103703612A (en) * | 2011-05-26 | 2014-04-02 | 德克萨斯仪器股份有限公司 | High impedance surface |
| CN103703612B (en) * | 2011-05-26 | 2016-05-11 | 德克萨斯仪器股份有限公司 | High impedance surface |
| CN105720374A (en) * | 2016-04-08 | 2016-06-29 | 东南大学 | Three-polarized half-slot antenna of grating slit and ground coaxial feeding plated through hole stepped-impedance |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130120212A1 (en) | 2013-05-16 |
| ES2733736T3 (en) | 2019-12-02 |
| EP2650968A1 (en) | 2013-10-16 |
| EP2650968A4 (en) | 2017-07-19 |
| CN102044752B (en) | 2013-10-23 |
| WO2012075868A1 (en) | 2012-06-14 |
| US9147941B2 (en) | 2015-09-29 |
| EP2650968B1 (en) | 2019-04-10 |
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