CN102044537B - Light-emitting diode packaging structure - Google Patents
Light-emitting diode packaging structure Download PDFInfo
- Publication number
- CN102044537B CN102044537B CN 200910209012 CN200910209012A CN102044537B CN 102044537 B CN102044537 B CN 102044537B CN 200910209012 CN200910209012 CN 200910209012 CN 200910209012 A CN200910209012 A CN 200910209012A CN 102044537 B CN102044537 B CN 102044537B
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- CN
- China
- Prior art keywords
- led
- groove
- light
- package structure
- emitting diode
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
The invention provides a light-emitting diode (LED) packaging structure, which comprises a shell, an LED, a transparent assembly and an enclosed wall. The shell is provided with an upper surface, a groove formed on the upper surface, and a surrounding surface surrounding an opening of the groove; the LED is arranged on a bottom surface of the groove; the transparent assembly is arranged on the surrounding surface and seals the opening of the groove; and the enclosed wall is arranged on the upper surface of the shell and surrounds the transparent assembly.
Description
Technical field
(light emitting diode, LED) encapsulating structure relate in particular to a kind of package structure for LED of integrating the opticpath design to the present invention relates to a kind of light-emitting diode.
Background technology
The use of projector popularization and application for example in general meeting bulletin occasion, can use projector to show report content, so that all participants can watch data simultaneously in daily life; Or when viewing and admiring film at home, projector also capable of using projects image frame, lets the user just can have the enjoyment as the theater in oneself parlor.In addition; Progress along with science and technology; Main on the market digital projector kind includes: cathode ray tube (cathode ray tube, CRT) projector, liquid crystal display (liquid crystaldisplay, LCD) projector, digital light processing (digitallight processing; DLP) projector, monocrystalline silicon display panels (liquid crystal on silicon, LCOS) four kinds of digital projectors such as projector.No matter be the projector of above-mentioned which kind of type, all need in its optical system, light source be set.The light source that more often is applied to traditionally in the projector comprises cathode ray tube or metalized lamp, yet these two kinds of light sources have that volume is big, power consumption is high and lack shortcoming such as environmental protection consideration.Compared to above-mentioned conventional light source; Volume is little, power consumption is low, luminous efficiency is high because light emitting diode package assembly has, highly color representation, reaction speed reach advantages such as tool environmental protection characteristic soon; Therefore LED source has certain market advantage, and is widely used in the portable type information products.
Yet; Be applied in the projector light emitting diode package assembly not full-fledged as yet with the technology of being used as projection light source; Because general light emitting diode package assembly has the divergence of beam angle of about 110 to 120 degree; And light emitting diode package assembly does not have special mechanism design to be assembled in the projector with cooperation; Cause light source that light emitting diode package assembly sends can not active set in, light can't accurately be aimed at the lens design of projection machine optical system, so that influences the light path design and the effective usability of light source of optical system.Therefore, the light emitting diode package assembly that is fit to be applied to projector is provided, still needs the problem of solution badly for industry.
Summary of the invention
One of main purpose of the present invention is to provide a kind of package structure for LED, and its special structural design can make package structure for LED of the present invention be applied to expediently in the projector, to solve the light source problem of aforementioned projector.
The present invention provides a kind of package structure for LED, and it comprises housing, light-emitting diode, transparent components and leg.Wherein, said housing has upper surface and is located at the groove on the said upper surface, and said groove has bottom surface and opening, said housing have more around the opening of said groove around face.Light-emitting diode is located on the bottom surface of said groove, and that said transparent components is arranged on is said around on the face and seal the said opening of said groove, and said leg is arranged on the upper surface of housing and around transparent components.
Because package structure for LED of the present invention is not filled with the conventional epoxies isocolloid and is coated light-emitting diode, therefore can avoid divergence of beam that produces because of colloid and the problems such as reliability that reduce encapsulating structure.In addition; Package structure for LED of the present invention includes leg in addition and is located at its surface; It can provide the function of fastener location, so that the light that light-emitting diode produced can penetrate along light-source system institute designed path exactly, better light utilization efficiency is provided.
Description of drawings
Fig. 1 is the upside schematic appearance of the embodiment one of package structure for LED of the present invention.
Fig. 2 is the generalized section of package structure for LED of the present invention shown in Figure 1.
Fig. 3 is the downside schematic appearance of package structure for LED of the present invention shown in Figure 1.
Fig. 4 is the schematic appearance of the embodiment two of package structure for LED of the present invention.
Fig. 5 is the generalized section of package structure for LED of the present invention shown in Figure 4.
Description of reference numerals
10,40 package structure for LED
12 encapsulating housings, 13 upper surfaces
14 light-emitting diode chip for backlight unit, 15 bottom surfaces
16,42 transparent components 17 are around face
18 grooves, 19,44 grooves
20 radiating blocks, 21 leads
23 lower surfaces, 24 legs
25 openings, 28 bonding materials
30 conducting brackets, 32 Zener diodes
34 marks
Embodiment
Please refer to Fig. 1 to Fig. 3, Fig. 1, Fig. 2 and Fig. 3 are respectively upside schematic appearance, generalized section and the downside schematic appearance of the embodiment one of package structure for LED of the present invention.Package structure for LED 10 of the present invention can be applicable in the projector, uses to be used as projection light source.Package structure for LED 10 comprises encapsulating housing 12, at least one light-emitting diode chip for backlight unit 14, transparent components 16 and radiating block 20.Encapsulating housing 12 has upper surface 13 and groove 18, and its further groove 18 is located on the upper surface 13 of encapsulating housing 12, that is groove 18 is located in the encapsulating housing 12 and by upper surface 13 and is exposed.Groove 18 has bottom surface 15 and opening 25.Radiating block 20 is located at the bottom surface 15 of groove 18, and it is to the lower surface 23 that extends below and be exposed to encapsulating housing 12, and radiating block 20 is to be made up of the material with high heat transfer coefficient, for example metal material.Light-emitting diode chip for backlight unit 14 is located on the bottom surface 15 of groove 18, and is positioned at the upper surface of radiating block 20.Because radiating block 20 has smooth upper surface, therefore can place the light-emitting diode chip for backlight unit of different sizes or quantity.In addition, in the present embodiment, transparent components 16 is a flat lenses, for example is plate glass lens.
Package structure for LED 10 comprises that also leg 24 is located at the upper surface 13 of encapsulating housing 12, can be used to transparent components 16 is fastened in its inboard.Package structure for LED 10 comprises around face 17 in addition, is located at the inboard of leg 24, is in order to bear the outer rim of transparent components 16, transparent components 16 is contacted with the madial wall of leg 24 around face 17 surfaces.In addition, bonding material 28 is set, in order to transparent components 16 outer rims being bonding on, with further fixing transparent components 16 effectively around face 17 surfaces around the modes such as surperficial utilisation point glue of face 17.It should be noted that encapsulating housing 12 more can comprise groove 19, be arranged at, can be used to hold bonding material 28 with bonding transparent components 16 and around face 17 around between face 17 and the leg 24.Therefore, according to leg 24 and design around face 17, the eyeglass of different types can be placed in leg 24 inboards, as long as the outer rim of eyeglass meets the shape of leg 24.In the present embodiment, leg 24, around face 17 and encapsulating housing 12 structure that is formed in one, its material is exemplified as plastic materials, can make via injection molding method.It should be noted that and do not fill any solid shape or colloidal materials in the groove 18 below transparent components 16, only be filled with air and be located between light-emitting diode chip for backlight unit 14 and the transparent components 16.Yet in other embodiments, the space in the groove 18 also can be vacuum state.Under this design; Owing to do not have colloidal materials between light-emitting diode chip for backlight unit 14 and the transparent components 16; Therefore the light that is produced by light-emitting diode chip for backlight unit 14 can directly penetrate package structure for LED 10 via transparent components 16; And can not look like traditional light emitting diode package assembly, because of filling epoxy resin causes divergence of beam, has high-hygroscopicity and is prone to shortcomings such as aging, also can significantly improve the radiating efficiency and the reliability of package structure for LED 10 of the present invention.
In addition, package structure for LED 10 comprises that also at least one conducting bracket (lead frame) 30 is coated in the encapsulating housing 12, and light-emitting diode chip for backlight unit 14 can be by at least one lead 21 to be electrically connected at the conducting bracket 30 that is exposed in the groove 18.As shown in the figure, the part of conducting bracket 30 is located in the groove 18, and partially conductive support 30 then exposes to the outside side of encapsulating housing 12, can be in order to be electrically connected at external circuit, to provide package structure for LED 10 luminous required power supplys.In other words, an end of conducting bracket 30 is to the lower surface 23 that extends below and be exposed to encapsulating housing 12, and the other end of conducting bracket 30 then is exposed in the groove 18.In other embodiments, the conducting bracket 30 that is exposed to encapsulating housing 12 outsides also can be located at the bottom of encapsulating housing 12, is not limited to situation shown in Figure 1.Moreover; On connection gasket (pad) part on conducting bracket 30 surfaces in groove 18 or the bottom surface 15 of groove 18 electrical dividing potential drop assembly can be set; For example be Zener diode (zener diode) 32, with the stability of further raising package structure for LED 10.In preferred embodiment, Zener diode 32 is to be electrically connected at light-emitting diode chip for backlight unit 14 with parallel way.On the other hand, the top edges zone of encapsulating housing 12 can be provided with mark 34, is used to provide the function of identification orientation or encapsulating structure model.
Fig. 4 and Fig. 5 show schematic appearance and the generalized section of the embodiment two of package structure for LED of the present invention respectively, and the assembly identical with previous embodiment is to indicate with same numerical chracter among Fig. 4 and Fig. 5.In the present embodiment; Package structure for LED 40 of the present invention also can be applicable in the optical system of projector, and it comprises that encapsulating housing 12, radiating block 20 be located at the bottom surface 15 of groove 18, at least one light-emitting diode chip for backlight unit 14 and be located at the upper surface and the transparent components 42 of radiating block 20 and be located on the light-emitting diode chip for backlight unit 14.The transparent components 42 of present embodiment is lens; Be preferably convex lens; Its light that can light-emitting diode chip for backlight unit 14 be produced is outwards concentrated and is penetrated, for example make light linearly shape vertically penetrate package structure for LED 40, with the optical axis design of the optical system of effective aligning projector.Package structure for LED 40 of the present invention comprises that in addition leg 24 is located at the upper surface of encapsulating housing 12, is used for fixing transparent components 42.The inboard of leg 24 is provided with one around face 17, in order to put the outer rim of transparent components 42.In addition, between around face 17 and leg 24, be provided with groove 44, be positioned at downside around face 17.In the present embodiment, can fill bonding material 28,, and effectively transparent components 42 is being fixed in the leg 24 in order to the outer rim of bonding around face 17 and transparent components 42 around face 17 and groove 44 surfaces.In preferred embodiment, encapsulating housing 12, leg 24, be all integrated formed structure around structural designs such as face 17 and grooves 44.In addition, the surface of encapsulating housing 12 can comprise mark 34, for identification orientation and model.Be similar to previous embodiment, the packing colloid in the conventional package structure such as filling epoxy resin not between light-emitting diode chip for backlight unit 14 and the transparent components 42, that is filling air or be vacuum only in the groove 18.
With respect to prior art; Because package structure for LED of the present invention does not have the packing colloid in the conventional package structure such as filling epoxy resin, therefore can avoid because of fill high-hygroscopicity that colloid causes, be prone to aging, be difficult for shortcomings such as heat radiation and divergence of beam.In other words; Because package structure for LED of the present invention only has air or is vacuum between transparent components such as eyeglass and light-emitting diode chip for backlight unit; Do not fill any solid or colloidal materials; Therefore the light that light-emitting diode chip for backlight unit produced can directly penetrate via the eyeglass above it; Can cooperate type of lenses effectively and reach required light path design, and under the situation of not filling colloidal materials, package structure for LED of the present invention has advantages such as high reliability and good heat radiating efficient.Moreover; Leg can effectively be fixed its inboard transparent components; And have fastener location and the function of aiming at optical axis; The optical system and the mechanism design that for example cooperate projector can directly be utilized the fixedly position of leg, and the light that package structure for LED is produced is aimed at the optical axis ejaculation effectively and do not squinted.In addition, eyeglass or other transparent components that different types can be placed in the leg inboard can conveniently design opticpath, and ray guidance to specific direction, to provide projector required light incident path, is significantly promoted the light utilization ratio.Therefore; Package structure for LED of the present invention can be applicable in the optical system of projector; The light source of usury with efficient is provided; Significantly dwindle simultaneously small product size,, make and use the projector of package structure for LED of the present invention further to be applied in the portable information products to satisfy market demand.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a package structure for LED is characterized in that, comprising:
Housing has upper surface and is arranged at the groove on the said upper surface, and said groove has bottom surface and opening, this housing have more around the said opening of said groove around face, be vacuum in the space in the said groove or fill air;
Light-emitting diode is arranged on the said bottom surface of said groove;
Transparent components is arranged on said around on the face and seal the said opening of said groove; And
Leg is arranged on the said upper surface of said housing and around said transparent components;
Said housing also comprises a groove, and said groove is arranged at said around between face and the said leg.
2. package structure for LED as claimed in claim 1 is characterized in that, it is said around on the face to comprise that also a kind of bonding material is arranged at, and is said around face and said transparent components in order to bind.
3. package structure for LED as claimed in claim 1 is characterized in that, comprises that also a kind of bonding material is arranged in the said groove, in order to bind said housing and said transparent components.
4. package structure for LED as claimed in claim 1 is characterized in that, also comprises the radiating block that is arranged on the said bottom surface, and said radiating block is to the lower surface that extends below and be exposed to said housing, and said light-emitting diode is disposed on the said radiating block.
5. package structure for LED as claimed in claim 1 is characterized in that, said housing and said leg are the structures that is formed in one.
6. package structure for LED as claimed in claim 1; It is characterized in that; Comprise that also at least one conducting bracket is coated in the said housing; One end of said conducting bracket is to extending below and being exposed on the lower surface of said housing, and the other end of said conducting bracket is exposed in the said groove.
7. package structure for LED as claimed in claim 1 is characterized in that, also comprises Zener diode, and said Zener diode is arranged on the said bottom surface of said groove and with said light-emitting diode and electrically connects.
8. package structure for LED as claimed in claim 7 is characterized in that, said Zener diode and said light-emitting diode are connected in parallel.
9. package structure for LED as claimed in claim 1 is characterized in that, said transparent components is flat lenses or convex lens.
10. package structure for LED as claimed in claim 6 is characterized in that, said light-emitting diode is electrically connected by at least one lead and the said conducting bracket that is exposed in the said groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209012 CN102044537B (en) | 2009-10-22 | 2009-10-22 | Light-emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910209012 CN102044537B (en) | 2009-10-22 | 2009-10-22 | Light-emitting diode packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102044537A CN102044537A (en) | 2011-05-04 |
| CN102044537B true CN102044537B (en) | 2012-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910209012 Expired - Fee Related CN102044537B (en) | 2009-10-22 | 2009-10-22 | Light-emitting diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102044537B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057073A (en) * | 2003-08-05 | 2005-03-03 | Nichia Chem Ind Ltd | Light emitting device and manufacturing method thereof |
| CN201038186Y (en) * | 2007-03-08 | 2008-03-19 | 鹤山丽得电子实业有限公司 | Large power LED |
| JP2009099716A (en) * | 2007-10-16 | 2009-05-07 | Kyocera Corp | Light emitting device |
-
2009
- 2009-10-22 CN CN 200910209012 patent/CN102044537B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005057073A (en) * | 2003-08-05 | 2005-03-03 | Nichia Chem Ind Ltd | Light emitting device and manufacturing method thereof |
| CN201038186Y (en) * | 2007-03-08 | 2008-03-19 | 鹤山丽得电子实业有限公司 | Large power LED |
| JP2009099716A (en) * | 2007-10-16 | 2009-05-07 | Kyocera Corp | Light emitting device |
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| Publication number | Publication date |
|---|---|
| CN102044537A (en) | 2011-05-04 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Chinese Taiwan New Taipei City Applicant after: Everlight Electronics Co.,Ltd. Address before: China Taiwan Taipei County Soil City Applicant before: Everlight Electronics Co.,Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20131022 |