CN102044412B - Substrate liquid handling device and substrate method for treating liquids - Google Patents
Substrate liquid handling device and substrate method for treating liquids Download PDFInfo
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- CN102044412B CN102044412B CN201010513671.XA CN201010513671A CN102044412B CN 102044412 B CN102044412 B CN 102044412B CN 201010513671 A CN201010513671 A CN 201010513671A CN 102044412 B CN102044412 B CN 102044412B
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- treatment fluid
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- 239000000758 substrate Substances 0.000 title claims abstract description 441
- 239000007788 liquid Substances 0.000 title claims abstract description 263
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000012530 fluid Substances 0.000 claims description 162
- 239000007921 spray Substances 0.000 claims description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 238000005755 formation reaction Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 abstract description 10
- 238000004140 cleaning Methods 0.000 description 22
- 239000007789 gas Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 239000000969 carrier Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000003028 elevating Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
The present invention provides a kind of substrate liquid handling device and substrate method for treating liquids.Prevent due to substrate with charge discharge and produce electrostatic breakdown.In the present invention, at the substrate liquid handling device (1) for substrate (2) being implemented liquid handling, substrate method for treating liquids and record have in the record medium (48) of the embodied on computer readable of substrate liquid handler, before utilizing processing substrate medicinal liquid that the circuit of substrate (2) is formed the liquid handling operation that face carries out liquid handling, carry out except electric treatment operation, at this except in electric treatment operation, the opposing face circuit of substrate (2) being formed face except electric treatment liquid is utilized to process, thus make substrate (2) with electric charge discharge.
Description
Technical field
The present invention relates to a kind of for utilizing treatment fluid that substrate is implemented the substrate liquid handling device of liquid handling, substrate
Method for treating liquids and record have the computer-readable recording medium of substrate liquid handler.
Background technology
In the past, in the case of manufacturing semiconductor device, flat faced display etc., substrate liquid handling device is used to utilize
The treatment fluid such as abluent, etchant is carried out process, etch processes to the substrate such as semiconductor crystal wafer, crystal liquid substrate.
In this substrate liquid handling device, due to a variety of causes such as the friction of charged, movable part for the treatment of fluid, sometimes exist
Utilize substrate that substrate liquid handling device carries out processing, constitute in the parts etc. of substrate liquid handling device and carry due to electrostatic
There is electric charge.
Further, when substrate, structure member are with electric charge, when charge discharge likely in the circuit formation face of substrate
(be formed with the electronic component such as transistor, diode, connect the face of their wiring etc.) produces electrostatic breakdown.
Therefore, in conventional substrate liquid handling device, disclose a kind of device with following structure: utilize conduction
Property material forms the circumference with substrate and abuts the electrostatic chuck keeping substrate, the utilization when substrate carries out liquid handling
Electrostatic chuck keep substrate, from electrostatic chuck discharge substrate with electric charge (referring for example to patent documentation 1).
Patent documentation 1: Japanese Unexamined Patent Publication 2004-356593 publication
Summary of the invention
The problem that invention is to be solved
But, the present inventors are found through experiments, and are configured to from guarantor in above-mentioned conventional substrate liquid handling device
Hold the electrostatic chuck of substrate discharge in substrate with electric charge, thus enable that substrate top layer with the part of electric charge release
Be put into outside substrate, but cannot make inside substrate with electric charge be discharged into the most well outside substrate, at the electricity to substrate
During the charge discharge that formation face, road carries out substrate medicinal liquid process and retains, it is possible to make the circuit of substrate form face produce electrostatic
Puncture.
For solving the scheme of problem
Therefore, in the present invention, in the substrate liquid handling device for substrate being implemented liquid handling, have: base
Plate holding unit, it keeps substrate；First treatment fluid spray unit, it is to the circuit shape of the substrate kept by substrate holding unit
One-tenth face ejection treatment fluid；Second treatment fluid spray unit, it forms face to the circuit of the substrate kept by substrate holding unit
Opposing face ejection treatment fluid；And control unit, aforesaid substrate holding unit and the first and second treatment fluids are sprayed single by it
Unit is controlled, and wherein, above-mentioned control unit is controlled such that and carries out following operation: liquid handling operation, from above-mentioned first
Treatment fluid spray unit forms face ejection for substrate carries out the processing substrate medicinal liquid conduct of liquid handling to the circuit of substrate
Treatment fluid, utilizes processing substrate medicinal liquid that the circuit of substrate is formed face and processes；And except electric treatment operation, at aforesaid liquid
Before treatment process, it is used for making substrate from above-mentioned second treatment fluid spray unit to the opposing face ejection in the circuit of substrate formation face
With electric charge discharge except electric treatment liquid is as treatment fluid, utilize except substrate is carried out except electric treatment by electric treatment liquid.
It addition, in aforesaid substrate liquid handling device, above-mentioned control unit is controlled such that above-mentioned except electric treatment
Carry out preliminary treatment operation before operation, in this preliminary treatment operation, rotate aforesaid substrate holding unit from upper
State the first treatment fluid spray unit and above-mentioned second treatment fluid spray unit to come at base as the pure water for the treatment of fluid to substrate ejection
The surface of plate forms the liquid film of pure water.
It addition, in aforesaid substrate liquid handling device, above-mentioned pure electrical conductivity of water is less than above-mentioned except the electricity of electric treatment liquid
Conductance.
It addition, in aforesaid substrate liquid handling device, above-mentioned except electric treatment liquid be electrical conductivity and the circuit shape to substrate
The aforesaid substrate that one-tenth face carries out processing processes the electrical conductivity of medicinal liquid and compares identical or higher treatment fluid.
It addition, in aforesaid substrate liquid handling device, above-mentioned except electric treatment liquid be for the circuit of substrate is formed face
The aforesaid substrate carrying out processing processes medicinal liquid.
It addition, in aforesaid substrate liquid handling device, after aforesaid liquid treatment process, will be used for substrate is carried out
The cleanout fluid of cleaning treatment carries out mixing as treatment fluid with gas, and vaporific to substrate from above-mentioned second treatment fluid spray unit
Ground sprays this treatment fluid.
It addition, in aforesaid substrate liquid handling device, utilize conductive material formed aforesaid substrate holding unit with
Substrate contact keeps the substrate of substrate keep body and this substrate is kept body electrical ground.
It addition, in aforesaid substrate liquid handling device, utilize conductive material to be formed at above-mentioned first and/or second
Manage the treatment fluid bleed pipe of the ejection treatment fluid of liquid spray unit and by this treatment fluid bleed pipe electrical ground.
It addition, in aforesaid substrate liquid handling device, there is the substrate that substrate is transported to aforesaid substrate holding unit
Supply unit, arranges on substrate supply unit and contacts the holding body keeping substrate with substrate, utilize conductive material to be formed
This holding body by this holding body electrical ground.
It addition, in the present invention, carry out liquid handling carrying out utilizing processing substrate medicinal liquid that the circuit of substrate is formed face
Liquid handling operation substrate method for treating liquids in, carried out except electric treatment operation before aforesaid liquid treatment process,
Should be except in electric treatment operation, by utilizing the opposing face circuit of substrate being formed face except electric treatment liquid to be processed to from substrate
Circuit formed face opposing face discharge substrate with electric charge.
It addition, in aforesaid substrate method for treating liquids, above-mentioned except electric treatment operation before carry out preliminary treatment operation,
In this preliminary treatment operation, rotational substrate while forming the contrary of the circuit formation face of face and substrate to the circuit of substrate
Face ejection to be formed the liquid film of pure water on the surface of substrate as the pure water for the treatment of fluid.
It addition, in aforesaid substrate method for treating liquids, above-mentioned pure electrical conductivity of water is less than above-mentioned except the electricity of electric treatment liquid
Conductance.
It addition, in aforesaid substrate method for treating liquids, above-mentioned except electric treatment liquid be electrical conductivity and the circuit shape to substrate
The aforesaid substrate that one-tenth face carries out processing processes the electrical conductivity of medicinal liquid and compares identical or higher treatment fluid.
It addition, in aforesaid substrate method for treating liquids, above-mentioned except electric treatment liquid be for the circuit of substrate is formed face
The aforesaid substrate carrying out processing processes medicinal liquid.
It addition, in aforesaid substrate method for treating liquids, after aforesaid liquid treatment process, will be used for substrate is carried out
The cleanout fluid of cleaning treatment carries out with gas mixing as treatment fluid, and from above-mentioned second treatment fluid spray unit to the electricity of substrate
The opposing face in formation face, road sprays this treatment fluid vaporificly.
The substrate liquid making substrate liquid handling device that substrate to carry out liquid handling is had it addition, the present invention is a kind of record
The record medium of the embodied on computer readable of processing routine, aforesaid substrate liquid handling device has: substrate holding unit, and it keeps
Substrate；First treatment fluid spray unit, it forms face ejection treatment fluid to the circuit of the substrate kept by substrate holding unit；The
Two treatment fluid spray unit, it forms the opposing face ejection treatment fluid in face to the circuit of the substrate kept by substrate holding unit；
And control unit, aforesaid substrate holding unit and the first and second treatment fluid spray unit be controlled by it, this record
Medium has a following operation: liquid handling operation, by above-mentioned control unit from above-mentioned first treatment fluid spray unit to substrate
Circuit form face ejection for substrate being carried out the processing substrate medicinal liquid of liquid handling as treatment fluid, utilize processing substrate medicine
Liquid forms face to the circuit of substrate and processes；And except electric treatment operation, before aforesaid liquid treatment process, by above-mentioned
Control unit from above-mentioned second treatment fluid spray unit to the circuit of substrate formed the opposing face ejection in face be used for making substrate with
Electric charge discharge except electric treatment liquid is as treatment fluid, utilize except substrate is processed by electric treatment liquid.
It addition, in aforementioned recording medium, above-mentioned except electric treatment operation before carry out preliminary treatment operation, in this preparation
In treatment process, rotational substrate while from above-mentioned first treatment fluid spray unit and above-mentioned second treatment fluid spray unit to
Substrate ejection to be formed the liquid film of pure water on the surface of substrate as the pure water for the treatment of fluid.
The effect of invention
Further, in the present invention, carried out except electric treatment operation before carrying out medicinal liquid treatment process, therefore, it is possible to prevent from
Substrate discharges and causes circuit to form face electrostatic breakdown, wherein, in above-mentioned medicinal liquid treatment process, utilizes processing substrate medicinal liquid pair
The circuit of substrate forms face and carries out liquid handling, above-mentioned except in electric treatment operation, by utilizing except electric treatment liquid is to substrate
Circuit formed face opposing face process, it is possible to make substrate with electric charge from circuit formed face opposition side discharge.
Accompanying drawing explanation
Fig. 1 is the top view representing substrate liquid handling device.
Fig. 2 is the schematic diagram representing processing substrate portion.
Fig. 3 is the action specification figure (substrate reception operation) of substrate liquid handling device.
Fig. 4 is the action specification figure (substrate reception operation) of substrate liquid handling device.
Fig. 5 is the action specification figure (preliminary treatment operation) of substrate liquid handling device.
Fig. 6 is the action specification figure (except electric treatment operation) of substrate liquid handling device.
Fig. 7 is the action specification figure (liquid handling operation) of substrate liquid handling device.
Fig. 8 is the action specification figure (cleanout fluid treatment process) of substrate liquid handling device.
Fig. 9 is the action specification figure (spraying treatment operation) of substrate liquid handling device.
Figure 10 is the process chart representing substrate method for treating liquids.
Description of reference numerals
1: substrate liquid handling device；2: substrate；3: carrier；4: substrate carrying-in/carrying-out platform；5: substrate feed chamber；6: substrate
Process chamber；7: antetheca；8: base board delivery device；9: substrate transfer station；10: base board delivery device；11～22: the first～the 12nd
Processing substrate portion；23: substrate holding unit；24: the first treatment fluid spray unit；25: the second treatment fluid spray unit；26: control
Unit processed；27: rotary shaft；28: holding station；29: substrate keeps body；30: base；31: earth terminal；32: anti-splash cup；33: rotate
Driver element；34: the first treatment fluid bleed pipes；35,35 ': pure water supply source；36,36 ': medicinal liquid supply source；37,37 ': switching
Device；38: flow controller；39: mobile unit；40: the second treatment fluid bleed pipes；41: liquid flow path；42: gas flow path；43:
Flow controller；44: gas supply source；45: flow controller；46: keep body；47: lifting unit；48: record medium.
Detailed description of the invention
Substrate liquid handling device involved in the present invention is described with reference to the accompanying drawings, at this substrate liquid handling device
The substrate method for treating liquids of middle use and for making substrate liquid handling device that substrate to carry out the substrate liquid of liquid handling
The concrete structure of body processing routine.
As it is shown in figure 1, form substrate carrying-in/carrying-out platform 4 in the leading section of substrate liquid handling device 1, this substrate is moved into
Putting into effect 4 concentrates multi-disc (such as 25) substrate 2 (being semiconductor crystal wafer here) to move into and take out of by carrier 3, and
Form substrate feed chamber 5 at the rear portion of substrate carrying-in/carrying-out platform 4, this substrate feed chamber 5 is for the substrate being contained on carrier 3
2 carry piecewise, are formed with the substrate processing chamber 6 of monolithic type, the substrate processing chamber of monolithic type at the rear portion of substrate feed chamber 5
6 for implementing, to substrate 2, various process such as cleaning, be dried.
Substrate carrying-in/carrying-out platform 4 is configured to make four carriers 3 antetheca 7 with substrate feed chamber 5 combine closely
Under state, left and right loads four carriers 3 across compartment of terrain.
The inner containment of substrate feed chamber 5 has base board delivery device 8 and substrate transfer station 9, is configured to use substrate conveying
Device 8 conveying substrate 2 piecewise between any one carrier 3 and the substrate transfer station 9 being placed on substrate carrying-in/carrying-out platform 4.
The central part of substrate processing chamber 6 accommodates base board delivery device 10, in the left side of base board delivery device 10 in tandem
Accommodate the first to the 6th processing substrate portion 11～16, and accommodate in tandem on the right side of base board delivery device 10
7th to dodecyl plate process portion 17～22.
Further, in substrate processing chamber 6, use base board delivery device 10 at the substrate transfer station 9 of substrate feed chamber 5 and each base
Conveying substrate 2 piecewise between plate process portion 11～22, and use each processing substrate portion 11～22 to process piecewise substrate
2。
Each processing substrate portion 11～22 has identical structure, illustrates with the structure in processing substrate portion 11 for representative,
As in figure 2 it is shown, processing substrate portion 11 is configured to have: substrate holding unit 23, substrate 2 is remained level by it；First processes
Liquid spray unit 24, it forms face (upper surface) ejection treatment fluid to the circuit of the substrate 2 kept by substrate holding unit 23；With
And the second treatment fluid spray unit 25, its to the circuit of the substrate 2 kept by substrate holding unit 23 formed the opposing face in face (under
Surface) ejection treatment fluid, utilize control unit 26 to spray single to these substrate holding unit 23 and the first and second treatment fluids
Unit 24,25 is controlled.Additionally, control unit 26 is whole to the substrate liquid handling device 1 including base board delivery device 8,10 etc.
Body is controlled.
In substrate holding unit 23, it is horizontally formed circular plate shape in the upper end of the rotary shaft 27 of hollow cylinder shaped
Holding station 28, and multiple substrates holding body 29 is installed in the circumference compartment of terrain spaced apart in the circumferential direction of holding station 28, thus
Constituting rotating base 30, wherein, above-mentioned multiple substrates keep body 29 contact with the circumference of substrate 2 and kept by substrate 2
For level.Here, base 30 utilizes the conductive materials such as the electric conductivity fluororesin containing carbon fiber to form substrate keeps body 29, and
And utilize conductive material formed rotary shaft 27, holding station 28 and by rotation driver element 33 described later by rotary shaft 27,
Holding station 28 electrical ground.
It addition, in substrate holding unit 23, utilize the anti-splash cup 32 of upper opening to surround around base 30 and prevent from processing
The splashing of liquid.
And in substrate holding unit 23, the rotary shaft 27 of base 30 is connected linkedly with rotating driver element 33, profit
The substrate 2 making base 30 and base 30 be kept with rotation driver element 33 rotates.By control unit 26, this rotation is driven
Moving cell 33 carries out rotating control.
In first treatment fluid spray unit 24, configure the first treatment fluid bleed pipe in the top of base 30 (holding station 28)
34, the pure water supply source 35 of pure water will be provided and to the first treatment fluid bleed pipe via switch 37 and flow controller 38
34 provide the medicinal liquid supply source 36 cleaning medicinal liquid to be connected to the first treatment fluid bleed pipe 34, it is possible to from the first treatment fluid bleed pipe 34
To the circuit of substrate 2 formed face (upper surface) using specify flow optionally spray pure water, clean in medicinal liquid any one as
Treatment fluid.Here, switch 37, flow controller 38 are controlled by control unit 26.It addition, the first treatment fluid ejection is single
In unit 24, the conductive materials such as the electric conductivity fluororesin containing carbon fiber are utilized to form the first treatment fluid bleed pipe 34, and will
It is connected to earth terminal 31 and electrical ground.
It addition, in the first treatment fluid spray unit 24, mobile unit 39 is connected linkedly with the first treatment fluid bleed pipe 34
Connect, utilize mobile unit 39 that the first treatment fluid bleed pipe 34 can be made to move to circumference from the central part of substrate 2, and can
The first treatment fluid bleed pipe 34 is made to be withdrawn into the outside of circumference of substrate 2.By control unit 26, this mobile unit 39 is carried out
Control.
In second treatment fluid spray unit 25, configure the second treatment fluid bleed pipe in the lower section of base 30 (holding station 28)
40, the central part at the second treatment fluid bleed pipe 40 is formed with liquid flow path 41, and before the second treatment fluid bleed pipe 40
End (upper end) is formed with the gas flow path 42 connected with liquid flow path 41.On liquid flow path 41 via switch 37 ' and
Flow controller 43 connects has pure water supply source 35 ' (can also be identical with pure water supply source 35) and medicinal liquid supply source 36 ' (also may be used
With identical with medicinal liquid supply source 36).Gas flow path 42 connects via flow controller 45 and is provided with the noble gases such as nitrogen
Gas supply source 44.Further, the second treatment fluid spray unit 25 can be from the liquid flow path 41 of the second treatment fluid bleed pipe 40
The opposing face (lower surface) in face is formed to specify that flow optionally sprays pure water, cleans appointing in medicinal liquid to the circuit of substrate 2
A kind of as treatment fluid, and can be from the liquid flow path 41 of the second treatment fluid bleed pipe 40 and gas flow path 42 to substrate 2
Circuit formed face opposing face (lower surface) with specify flow optionally spray pure water, clean medicinal liquid mix with gas vaporific
Mixture as treatment fluid.Here, flow controller 43,45 is controlled by control unit 26.
In this second treatment fluid spray unit 25, in the hollow part interval of base 30 central authorities of substrate holding unit 23
And liftably accommodate the second treatment fluid bleed pipe 40, at front periphery portion (the upper end periphery of the second treatment fluid bleed pipe 40
Portion) compartment of terrain spaced apart in the circumferential direction is provided with the holding body 46 of multiple overshooting shape, and the second treatment fluid bleed pipe 40 with rise
Fall unit 47 connects linkedly, makes the second treatment fluid bleed pipe 40 lift by lifting unit 47.By control unit 26 to this liter
Fall unit 47 carries out elevating control.
Further, in the second treatment fluid spray unit 25, when receiving substrate 2 from base board delivery device 10 or by substrate 2
When being sent to base board delivery device 10, when making the second treatment fluid bleed pipe 40 rise to above substrate holding unit 23
Utilize the lower surface keeping body 46 to keep substrate 2, utilize substrate to protect when making the second treatment fluid bleed pipe 40 decline
The substrate holding unit 23 keeps body 29 to keep the periphery of substrate 2.Additionally, in the state making the second treatment fluid bleed pipe 40 decline
Under, keep the leading section (upper end) of body 46 to leave the lower surface of substrate 2.
Therefore, the second treatment fluid spray unit 25 has opposing face (lower surface) ejection forming face to the circuit of substrate 2
The function for the treatment of fluid, and also have between base board delivery device 10 and substrate holding unit 23 conveying substrate 2 as base
The function of plate supply unit.Further, in the second treatment fluid spray unit 25, the electric conductivity fluororesin etc. containing carbon fiber is utilized to lead
Electric material forms the second treatment fluid bleed pipe 40 and keeps body 46, and is connected to earth terminal 31 and electrical ground.
Additionally, in aforesaid substrate liquid handling device 1, use and carbon dioxide, ammonia etc. be dissolved into ultra-pure water
In and make electrical conductivity increase above the pure water of ultra-pure water as the pure water supplied from pure water supply source 35, use Conductivity Ratio from pure
The higher medicament of pure water of water supply source 35 supply is as the cleaning medicinal liquid supplied from medicinal liquid supply source 36.Therefore, at above-mentioned base
In plate liquid handling device 1, compared with ultra-pure water, from the pure water of pure water supply source 35 supply be easier to make substrate 2 with electricity
Lotus discharges, and compared with the pure water supplied from pure water supply source 35, from the cleaning medicinal liquid of medicinal liquid supply source 36 supply more
Easily make substrate 2 with electric charge discharge.
Substrate liquid handling device 1 has structure described above, and control unit 26 (computer) is according to recording readable
Substrate liquid handler in the record medium 48 taken, is processed by each processing substrate portion 11～22 pairs of substrates 2.This
Outward, record medium 48 is the medium being able to record that the various programs such as substrate liquid handler, can be ROM, RAM etc. half
Conductor storage-type record medium, it is also possible to be the disc-shaped recording medium such as hard disk, CD-ROM.
In aforesaid substrate liquid handling device 1, by substrate liquid handler, according to the process chart shown in Figure 10 such as
Following description carries out liquid handling (being cleaning treatment at this) like that to substrate 2.
First, substrate liquid handler, as it is shown on figure 3, utilize control unit 26 to be controlled mobile unit 39, makes
First treatment fluid bleed pipe 34 is withdrawn into the outside of the circumference of substrate 2, and utilizes control unit 26 to enter lifting unit 47
Row controls, and makes to rise as the second treatment fluid bleed pipe 40 of substrate supply unit, receives substrate 2 from base board delivery device 10,
Utilize and keep body 46 to carry out supporting substrates 2, the most as shown in Figure 4, utilize control unit 26 to control lifting unit 47, make as base
Second treatment fluid bleed pipe 40 of plate supply unit declines, and the substrate that substrate 2 is sent to substrate holding unit 23 keeps body 29,
Substrate is utilized to keep body 29 to keep substrate 2 (substrate reception operation).
Then, substrate liquid handler, as it is shown in figure 5, utilize control unit 26 to control to rotate driver element 33, makes
The substrate 2 being kept body 29 to keep by the base 30 of substrate holding unit 23 and the substrate of base 30 rotates, and utilizes control
Unit 26 controls mobile unit 39, makes the first treatment fluid bleed pipe 34 move to above the central part of substrate 2, utilizes and controls list
Unit 26 switches over control to switch 37,37 ' makes it be switched to pure water supply source, is controlled by flow controller 45 as closing
State, and flow controller 38,43 is carried out flow-control, by the pure water supplied from pure water supply source 35,35 ' (at this it is
Be dissolved with the pure water of carbon dioxide) as treatment fluid at the first and second of the first and second treatment fluid spray unit 24,25
Reason liquid bleed pipe 34,40 forms central authorities' ejection of face (upper surface) and its opposing face (lower surface) to the circuit of substrate 2, at base
The circuit of plate 2 forms face (upper surface) and its opposing face (lower surface) generally forms pure water liquid film (preliminary treatment operation).
Now, pure electrical conductivity of water is the degree that the circuit of substrate 2 will not be made to form face electrostatic breakdown, and therefore the circuit of substrate 2 is formed
Face will not be by electrostatic breakdown.
So carry out preliminary treatment, by being formed from the first and second treatment fluid spray unit 24,25 to the circuit of substrate 2
Face (upper surface) and opposing face (lower surface) ejection pure water thereof make the electric charge of substrate 2 discharge.
Particularly, the circuit at substrate 2 forms face (upper surface) and opposing face (lower surface) has generally formed conductance
Rate is less than the pure water liquid film of the electrical conductivity of follow-up medicinal liquid when processing circuit formation face, therefore, it is possible to from substrate 2
Circuit forms face (upper surface) and opposing face (lower surface) entirety discharges electric charge equably, and starts ejection in follow-up
It is prevented from medicinal liquid and is directly ejected into substrate 2 due to pure water liquid film, therefore, it is possible to discharge electric charge well during medicinal liquid.
It addition, utilize conductive material formed the first treatment fluid spray unit 24 the first treatment fluid bleed pipe 34 and
By its electrical ground, therefore, it is possible to prevent charged except electric treatment liquid itself from the first treatment fluid bleed pipe 34 ejection, and
And can be by making electric charge be discharged into the first treatment fluid bleed pipe 34 from substrate 2 except electric treatment liquid.
Then, substrate liquid handler as shown in Figure 6, utilizes control unit 26 to control to rotate driver element 33, makes
The substrate 2 being kept body 29 to keep by the base 30 of substrate holding unit 23 and the substrate of base 30 rotates, and utilizes control
Unit 26 switches over control to switch 37 makes it remain switched to pure water supply source, in this case to switch 37 '
Switching over control makes it be switched to medicinal liquid supply source, controls to be closed mode by flow controller 38,45, and to flow
Controller 43 carries out flow-control, will process from second as except electric treatment liquid from the cleaning medicinal liquid that medicinal liquid supply source 36 ' supplies
Second treatment fluid bleed pipe 40 of liquid spray unit 25 forms central authorities' spray of the opposing face (lower surface) in face to the circuit of substrate 2
Go out, carry out the circuit to substrate 2 and form the overall supply of opposing face (lower surface) in face except electric treatment liquid (except electric treatment operation).By
This, it is possible to is by keeping body 29, base 30, rotary shaft from the cleaning medicinal liquid of the second treatment fluid spray unit 25 ejection and substrate
27 opposing faces (lower surface) making residual charged electric charge on a substrate 2 form face from the circuit of substrate 2 discharge.
So, before medicinal liquid is supplied to the circuit formation face of substrate 2, from the second treatment fluid spray unit 25 to substrate
The circuit of 2 forms opposing face (lower surface) ejection in face except electric treatment liquid, thus carries out making what the electric charge of substrate 2 discharged to remove
Electric treatment.Therefore, it is possible to the opposing face (lower surface) from the circuit formation face of substrate 2 discharges more electric charge, it is possible to prevent
The circuit to substrate 2 in subsequent implementation is formed when face provides medicinal liquid and produces electrostatic breakdown in the circuit formation face of substrate 2.This
Time, from the first treatment fluid spray unit 24, the circuit of substrate 2 being formed side, face provides electrical conductivity quiet for circuit will not be made to form face
The pure water of electrical breakdown degree, can make electric charge discharge further.
Particularly, by generally forming except electric treatment liquid at the opposing face (lower surface) in the circuit of substrate 2 formation face
Liquid film, it is possible to opposing face (lower surface) entirety forming face from the circuit of substrate 2 discharges electric charge equably, it is possible to release well
Release electric charge.
It addition, from second treatment fluid spray unit 25 ejection clean medicinal liquid, therefore, it is possible to carry out substrate 2 except electric treatment
While the lower surface of substrate 2 is carried out.
It addition, utilize conductive material keep body 29 to the substrate forming substrate holding unit 23 and be electrically connected with
Ground, therefore, it is possible to by keeping body 29 except electric treatment liquid makes electric charge be discharged into substrate from substrate 2, it is possible to successfully discharge electricity
Lotus.
Further, utilize conductive material formed the second treatment fluid spray unit 25 the second treatment fluid bleed pipe 40 and
By its electrical ground, therefore, it is possible to prevent charged except electric treatment liquid itself from the second treatment fluid bleed pipe 40 ejection, and
Can be by making electric charge be discharged into the second treatment fluid bleed pipe 40 from substrate 2 except electric treatment liquid.
Then, substrate liquid handler, as it is shown in fig. 7, utilize control unit 26 to control to rotate driver element 33, makes
The substrate 2 being kept body 29 to keep by the base 30 of substrate holding unit 23 and the substrate of base 30 maintains rotation, utilizes and controls
Unit 26 controls mobile unit 39, makes the first treatment fluid bleed pipe 34 reciprocate to circumference from the central part of substrate 2, and
And utilize control unit 26 when switch 37 ' switching control makes it remain switched to medicinal liquid supply source to switching
Device 37 switches over control so that it is is switched to medicinal liquid supply source, is controlled by flow controller 45 as closed mode, and convection current
Amount controller 38,43 carries out flow-control, the cleaning medicinal liquid that will supply from medicinal liquid supply source 36,36 ' as processing substrate liquid from
First treatment fluid bleed pipe 34 of the first treatment fluid spray unit 24 forms central authorities' spray in face (upper surface) to the circuit of substrate 2
Go out, utilize processing substrate liquid that the circuit of substrate 2 is formed face (upper surface) and carry out liquid handling (liquid handling (cleaning) operation),
And form central authorities' ejection of the opposing face (lower surface) in face from the second treatment fluid bleed pipe 40 to the circuit of substrate 2, utilize medicine
The lower surface of substrate is also carried out processing by liquid.
So, in substrate liquid handling device 1, utilizing processing substrate liquid to substrate 2 by liquid handling operation
Before circuit forms the liquid handling operation that face (upper surface) carries out liquid handling, by except electric treatment operation and preliminary treatment work
Sequence make substrate 2 with electric charge discharge.
Therefore, in substrate liquid handling device 1, carried out before liquid handling operation except electric treatment operation, preparation
In treatment process can by make substrate 2 with electric charge be discharged into medicinal liquid is supplied to circuit formed face time circuit will not be made to be formed
Face produces the degree of electrostatic breakdown, it is possible to prevent forming face (upper surface) at circuit in liquid handling operation and produces electrostatic
Puncture.
Afterwards, substrate liquid handler as shown in Figure 8, utilizes control unit 26 to control to rotate driver element 33, makes
The substrate 2 being kept body 29 to keep by the base 30 of substrate holding unit 23 and the substrate of base 30 maintains rotation, and by controlling
Unit 26 switches over control to switch 37,37 ' makes it be switched to pure water supply source, is controlled by flow controller 45 as closing
Closed state, and flow controller 38,43 is carried out flow-control, using the pure water that supplies from pure water supply source 35 as cleanout fluid
Form central authorities' spray in face (upper surface) to the circuit of substrate 2 from the first treatment fluid bleed pipe 34 of the first treatment fluid spray unit 24
Going out, (cleaning treatment operation first half is (clear to utilize cleanout fluid that circuit formation face (upper surface) of substrate 2 is carried out process
Washing liquid treatment process)), and the pure water that will supply from pure water supply source 35 ' as cleanout fluid from the second treatment fluid bleed pipe 40
Form central authorities' ejection of the opposing face (lower surface) in face to the circuit of substrate 2, utilize cleanout fluid that the lower surface of substrate 2 is also carried out
Process.
In the latter half of this cleaning treatment operation, substrate liquid handler is as it is shown in figure 9, utilize control unit 26
Control to rotate driver element 33, make the substrate of the base 30 by substrate holding unit 23 and base 30 keep body 29 to keep
Substrate 2 maintains and rotates, control unit 26 switch 37,37 ' is switched over control and make it remain switched to pure water supply source
Side, carries out flow-control to flow controller 38,43,45, the pure water that will supply from pure water supply source 35 ' with from gas supply source
The gas of 44 supplies carries out being obtained by mixing vaporific mixture as cleanout fluid from the second of the second treatment fluid spray unit 25
Treatment fluid bleed pipe 40 forms central authorities' ejection of the opposing face (lower surface) in face to the circuit of substrate 2, makes the circuit of substrate 2 be formed
Vaporific cleanout fluid it is full of (after cleaning treatment operation between opposing face (lower surface) and the base 30 of substrate holding unit 23 in face
Half part (spraying treatment operation)), and clear to central authorities' ejection in the circuit of substrate 2 formation face from the first treatment fluid bleed pipe 34
Washing liquid, utilizes cleanout fluid to be also carried out the upper surface of substrate 2 processing.
Thus, finally by utilizing the second treatment fluid spray unit 25 to make the circuit of substrate 2 form the opposing face (following table in face
Face) and the base 30 of substrate holding unit 23 between be full of vaporific cleanout fluid, carry out discharging the substrate 2 that likely remains
Electric charge except electric treatment, and cleanout fluid can be utilized to carry out the base 30 of moistening substrate holding unit 23, though base 30 with
Electric charge, it is also possible to this electric charge is discharged into outside via vaporific cleanout fluid.Thus, additionally it is possible to prevent electric charge downward from base 30
One substrate 2 carrying out processing shifts and causes next substrate to be processed 2 charged.
So, in substrate liquid handling device 1, utilizing processing substrate liquid to substrate 2 by liquid handling operation
After circuit forms the liquid handling operation that face (upper surface) carries out liquid handling, utilized vaporific clear by cleaning treatment operation
Washing liquid carries out the cleaning treatment operation that substrate 2 is carried out process, and utilizes vaporific cleaning in this cleaning treatment operation
Liquid carry out except electric treatment come release substrate 2, as substrate liquid handling device 1 structure member base 30 with electric charge.
Therefore, in substrate liquid handling device 1, when next substrate 2 being carried out liquid handling at substrate liquid
The structure member of reason device 1 does not has electric charge, it is possible to prevent from producing electrostatic breakdown in next substrate 2.
Afterwards, substrate liquid handler utilizes control unit 26 to control flow controller 38,43,45 for closing shape
State, stops spraying aqueous and vaporific cleanout fluid from the first and second treatment fluid bleed pipes 34,40, and utilizes control unit 26
Control to rotate driver element 33, make the substrate of the base 30 by substrate holding unit 23 and base 30 keep body 29 to keep
Substrate 2 high-speed rotation, thus throws the cleanout fluid adhered on a substrate 2 away and is removed from substrate 2 by cleanout fluid and carry out substrate 2
Dried (dried operation).
Finally, substrate liquid handler, in the same manner as the situation shown in Fig. 3, utilizes control unit 26 to control mobile single
Unit 39, makes the first treatment fluid bleed pipe 34 be withdrawn into the outside of circumference of substrate 2, and utilizes control unit 26 to control to rise
Fall unit 47, makes to rise as the second treatment fluid bleed pipe 40 of substrate supply unit, is passed from substrate holding unit 23 by substrate 2
Deliver to base board delivery device 10 (substrate conveying operation).
As it has been described above, in aforesaid substrate liquid handling device 1, i.e. utilize processing substrate liquid carrying out liquid handling operation
The circuit of substrate 2 is formed before face carries out liquid handling, carry out utilizing except electric treatment liquid forms the phase in face to the circuit of substrate 2
Reverse side be processed to make substrate 2 with electric charge discharge except electric treatment operation, therefore, it is possible to prevent due to substrate 2
Charge discharge and produce electrostatic breakdown such that it is able to improve substrate liquid handling device 1 yield rate.
Additionally, use Conductivity Ratio to the processing substrate liquid (cleaning medicinal liquid) that the circuit formation face of substrate 2 processes
High or the identical treatment fluid of electrical conductivity is as except electric treatment liquid.High in the electrical conductivity using Conductivity Ratio processing substrate liquid or
Identical treatment fluid is as in the case of except electric treatment liquid, it is possible to made electric charge from base before utilizing processing substrate liquid to process
The circuit of plate 2 forms the opposing face in face and discharges well such that it is able to prevent from forming face electric discharge from circuit during processing substrate.
Formed thin it addition, carry out the pure water that preliminary treatment i.e. utilizes electrical conductivity to be less than the electrical conductivity except electric treatment liquid on the surface of substrate 2
Film, it is possible to discharge electric charge lentamente from substrate 2, and thin film as protecting film function such that it is able to prevent
When spraying processing substrate liquid, processing substrate liquid is directly ejected into substrate 2 and produces electric discharge.
Claims (15)
1. a substrate liquid handling device, for substrate is implemented liquid handling, it is characterised in that have:
Substrate holding unit, it keeps substrate；
First treatment fluid spray unit, it forms face ejection treatment fluid to the circuit of the substrate kept by substrate holding unit；
Second treatment fluid spray unit, it forms the substrate of opposing face in face to the circuit of the substrate kept by substrate holding unit
Center ejection treatment fluid；And
Control unit, it is to aforesaid substrate holding unit and above-mentioned first treatment fluid spray unit and above-mentioned second treatment fluid spray
Go out unit to be controlled,
Wherein, above-mentioned control unit is controlled such that and carries out following operation:
Liquid handling operation, forms face ejection for carrying out substrate from above-mentioned first treatment fluid spray unit to the circuit of substrate
The processing substrate medicinal liquid of liquid handling, as treatment fluid, utilizes processing substrate medicinal liquid that the circuit of substrate is formed face and processes；
And
Except electric treatment operation, before aforesaid liquid treatment process, rotate aforesaid substrate holding unit from above-mentioned
Circuit from two treatment fluid spray unit to substrate formed face opposing face substrate center ejection for make inside substrate with
Electric charge discharge except electric treatment liquid is as treatment fluid so that supply except electric treatment liquid time substrate rotate, thus
Circuit at substrate forms the opposing face in face and generally forms except the liquid film of electric treatment liquid, utilizes except substrate is carried out by electric treatment liquid
Process.
Substrate liquid handling device the most according to claim 1, it is characterised in that
Above-mentioned control unit be controlled such that above-mentioned except electric treatment operation before carry out preliminary treatment operation, at this preparation
In science and engineering sequence, rotate aforesaid substrate holding unit from above-mentioned first treatment fluid spray unit and above-mentioned second treatment fluid
Spray unit as treatment fluid, to be formed on the surface of substrate the liquid film of pure water to substrate ejection pure water.
Substrate liquid handling device the most according to claim 2, it is characterised in that
Above-mentioned pure electrical conductivity of water is less than above-mentioned except the electrical conductivity of electric treatment liquid.
4. according to the substrate liquid handling device described in any one in claims 1 to 3, it is characterised in that
Above-mentioned except electric treatment liquid be electrical conductivity and the electricity circuit of substrate is formed the aforesaid substrate that face processes processing medicinal liquid
Conductance compares identical or higher treatment fluid.
Substrate liquid handling device the most according to claim 4, it is characterised in that
Above-mentioned except electric treatment liquid be to process medicinal liquid for the circuit of substrate is formed the aforesaid substrate that processes of face.
6. according to the substrate liquid handling device described in any one in claims 1 to 3, it is characterised in that
After aforesaid liquid treatment process, using be used for substrate is carried out the cleanout fluid that processes and gas mixing as
Treatment fluid, and from above-mentioned second treatment fluid spray unit to substrate vaporific spray this treatment fluid.
7. according to the substrate liquid handling device described in any one in claims 1 to 3, it is characterised in that
Utilizing conductive material to form contacting with substrate of aforesaid substrate holding unit keeps the substrate of substrate to keep body, and will
This substrate keeps body electrical ground.
8. according to the substrate liquid handling device described in any one in claims 1 to 3, it is characterised in that
Utilize conductive material to form above-mentioned first treatment fluid spray unit and/or the spray of above-mentioned second treatment fluid spray unit
Go out the treatment fluid bleed pipe for the treatment of fluid, and by this treatment fluid bleed pipe electrical ground.
9. according to the substrate liquid handling device described in any one in claims 1 to 3, it is characterised in that
Also there is the substrate supply unit that substrate is transported to aforesaid substrate holding unit, substrate supply unit is arranged and base
Plate contact keeps the holding body of substrate, utilizes conductive material to form this holding body, and by this holding body electrical ground.
10. a substrate method for treating liquids, carries out utilizing processing substrate medicinal liquid that the circuit of substrate is formed face and carries out at liquid
The liquid handling operation of reason, this substrate method for treating liquids is characterised by,
Carried out except electric treatment operation before aforesaid liquid treatment process, at this except in electric treatment operation, by rotation base
Plate while to substrate circuit formed face opposing face substrate center ejection for make inside substrate with electric charge discharge
Come except electric treatment liquid so that supply except electric treatment liquid time substrate rotate, thus substrate circuit formed face phase
Reverse side generally forms except the liquid film of electric treatment liquid, utilizes except electric treatment liquid processes, and to form face from the circuit of substrate
Opposing face discharge inside substrate with electric charge.
11. substrate method for treating liquids according to claim 10, it is characterised in that
Above-mentioned except electric treatment operation before carry out preliminary treatment operation, in this preliminary treatment operation, rotational substrate one
While form the opposing face ejection pure water in the circuit formation face of face and substrate to the circuit of substrate as treatment fluid, the next table at substrate
Face forms the liquid film of pure water.
12. substrate method for treating liquids according to claim 11, it is characterised in that
Above-mentioned pure electrical conductivity of water is less than above-mentioned except the electrical conductivity of electric treatment liquid.
13. according to the substrate method for treating liquids described in any one in claim 10 to 12, it is characterised in that
Above-mentioned except electric treatment liquid be electrical conductivity and the electricity circuit of substrate is formed the aforesaid substrate that face processes processing medicinal liquid
Conductance compares identical or higher treatment fluid.
14. substrate method for treating liquids according to claim 13, it is characterised in that
Above-mentioned except electric treatment liquid be to process medicinal liquid for the circuit of substrate is formed the aforesaid substrate that processes of face.
15. according to the substrate method for treating liquids described in any one in claim 10 to 12, it is characterised in that
After aforesaid liquid treatment process, using be used for substrate is carried out the cleanout fluid that processes and gas mixing as
Treatment fluid, and from the second treatment fluid spray unit to the circuit of substrate formed face opposing face vaporific spray this treatment fluid.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-239452 | 2009-10-16 | ||
| JP2009239452 | 2009-10-16 | ||
| JP2010-180668 | 2010-08-12 | ||
| JP2010180668A JP5893823B2 (en) | 2009-10-16 | 2010-08-12 | SUBSTRATE LIQUID TREATMENT DEVICE, SUBSTRATE LIQUID TREATMENT METHOD, AND COMPUTER-READABLE RECORDING MEDIUM CONTAINING SUBSTRATE LIQUID TREATMENT PROGRAM |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102044412A CN102044412A (en) | 2011-05-04 |
| CN102044412B true CN102044412B (en) | 2016-12-14 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493097A (en) * | 2018-03-21 | 2018-09-04 | 上海华力集成电路制造有限公司 | The cleaning method of wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493097A (en) * | 2018-03-21 | 2018-09-04 | 上海华力集成电路制造有限公司 | The cleaning method of wafer |
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