CN102025368A - Temperature sensing oscillator and production method thereof as well as temperature frequency correction system - Google Patents
Temperature sensing oscillator and production method thereof as well as temperature frequency correction system Download PDFInfo
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- CN102025368A CN102025368A CN2009101826874A CN200910182687A CN102025368A CN 102025368 A CN102025368 A CN 102025368A CN 2009101826874 A CN2009101826874 A CN 2009101826874A CN 200910182687 A CN200910182687 A CN 200910182687A CN 102025368 A CN102025368 A CN 102025368A
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Abstract
The invention discloses a temperature sensing oscillator and a production method thereof as well as a temperature frequency correction system, wherein the temperature sensing oscillator comprises an oscillator, a temperature sensor and a storage unit in a package and is used for generating a preset frequency signal; the temperature sensor is used for sensing the ambient temperature so as to generate a temperature signal showing the ambient temperature; the ambient temperature sensed by the temperature sensor is basically equal to the work temperature of the oscillator; the storage unit is used for storing temperature frequency characteristic relevant data; the package comprises a frequency output pin, a temperature output pin and a data input/output pin; the preset frequency signal generated by the oscillator is output through the frequency output pin; the temperature signal acquired by the temperature sensor is output through the temperature output pin; and the temperature frequency characteristic relevant data are written or read out of the storage unit through the data input/output pin. Therefore, a user can compensate aiming at the temperature sensing oscillator according to the requirement; meanwhile, the invention can maintain quite-low cost.
Description
Technical field
The present invention relates to electronic circuit design field, particularly have temperature sense oscillator and its production method, and the temperature and frequency correcting system.
Background technology
Can both be normally or synchronous working in order to ensure all electronic devices, it is very important that accurate clock signal is provided in design of electronic circuits.Usually, described clock signal is generally can be produced by crystal oscillator (crystal oscillator, be called for short XO), and wherein said crystal oscillator is to utilize the mechanical resonant of the oscillating crystal of piezoelectric to produce the electronic circuit of the certain frequency signal of telecommunication.This frequency can be used for timing (such as quartz watch) usually, also can be used to digital integrated circuit that clock signal is provided, and can also be used for stablizing the frequency of wireless launcher/receiver.A reason that causes clock signal to be different from design is temperature, and it may influence the running of piezoelectric and crystal oscillator.Please referring to Fig. 3, along with variation of temperature, the frequency of crystal oscillator output can also can change thereupon.In fact, electronic equipment may be used to such as portable computer, mobile phone and electronic instrument therefore guarantee that these electronic equipments can both normally errorless work be very important under all temps environment in the environment of all temps variation.
Crystal oscillator has generally included common crystal oscillator (Simple PackagedCrystal Oscillator in the prior art, be called for short SPXO) and temperature compensating crystal oscillator (temperaturecompensated crystal oscillator is called for short TCXO) etc.
Described SPXO does not provide and suppresses the mechanism that crystal frequency changes with environment temperature, and in whole temperature range, the frequency stability of crystal oscillator depends on the performance of its inner used crystal, is product the most cheap in the crystal oscillator.But the accuracy of SPXO output frequency and stability are not high, generally can not directly be used in the application that frequency accuracy is had relatively high expectations, such as wireless telecommunications system or mobile phone.
Described TCXO needs self-operated thermostatic controller to generate correction voltage to guarantee that oscillator frequency is constant.Voltage-controlled TCXO like this includes a temperature sensor according to the proportional generation linear voltage of temperature, 3 rank linear function voltage generator and VCXOs.The output of three rank linear function voltage generators and temperature sensor is offered VCXO, described VCXO and then can carry out temperature-compensating according to the temperature frequency characteristic of use crystal.Yet so voltage-controlled TCXO at first needs a high-quality crystal to satisfy described three rank linear compensation needs, and so high-quality crystal is very expensive, especially undersized crystal.Secondly, owing to limited the maximum output frequency of crystal oscillator, therefore also be difficult to guarantee high frequency stability and accuracy.In addition, temperature compensating crystal oscillator TCXO can not carry out the temperature frequency compensation according to unique temperature frequency characteristic of the crystal oscillator in it, but adopt fixing temperature frequency feature that all crystals oscillator is carried out the temperature frequency compensation, so not only need high-quality with highly consistent crystal oscillator, and also can not determine unique temperature frequency characteristic of the crystal oscillator of use in it at last.
The front only is that example is introduced with the crystal oscillator, in fact other various types of oscillators, such as mediation oscillator, rail mounted oscillator, voltage controlled oscillator, multivibrator, Kang Shi oscillator, sine-wave oscillator, ring oscillator, RC oscillator or LC oscillator etc., be subjected to the puzzlement of temperature drift too.Therefore, demand proposing the oscillator that a kind of cost is low, compatible by force, be convenient to use urgently.
Summary of the invention
In view of this, one of technical problem of solution of the present invention is to provide a kind of temperature sense oscillator, and it not only can provide frequency output, and temperature output can also be provided, and the temperature frequency characteristic related data of himself can also be provided simultaneously.
Two of the technical problem of solution of the present invention is to provide a kind of chip production method, and the chip that utilizes this method to produce not only can provide frequency output, and temperature output can also be provided, and the temperature frequency characteristic related data of himself can also be provided simultaneously.
Three of the technical problem of solution of the present invention is to provide a kind of temperature and frequency correcting system, and it can generate through the predetermined frequency signal after the temperature-compensating.
In order to solve the problems of the technologies described above, according to an aspect of the present invention, the invention discloses a kind of temperature sense oscillator, it is included in the oscillator in the encapsulation, temperature sensor and memory cell, described oscillator is used to generate predetermined frequency signal, described temperature sensor is used to respond to environment temperature to produce the temperature signal of expression environment temperature, described temperature sensor senses to environment temperature be substantially equal to the working temperature of oscillator, described memory cell is used for storing the temperature frequency characteristic related data of described oscillator, described encapsulation includes the frequency output pin, temperature output pin and data input and output pin, export the predetermined frequency signal that described oscillator generates by described frequency output pin, export the temperature signal that described temperature inductor obtains by described temperature output pin, described temperature frequency characteristic related data is write or read described memory cell by described data input and output pin.
According to a further aspect in the invention, the invention discloses a kind of chip production method, it comprises: chip piece is provided, be packaged with oscillator in the described chip, temperature sensor and memory cell, described chip includes the frequency output pin, temperature output pin and data input and output pin, described oscillator is used to generate predetermined frequency signal and exports described predetermined frequency signal by described frequency output pin, and described temperature sensor is used to respond to environment temperature and exports described temperature signal with the temperature signal of generation expression environment temperature and by described temperature output pin; Frequency output pin by described chip and temperature output pin carry out temperature frequency measure with obtain in the described chip the temperature frequency characteristic related data of uniqueness of oscillator; With by described data input and output pin described temperature frequency characteristic related data is write in the described memory cell.
In accordance with a further aspect of the present invention, the invention discloses a kind of temperature and frequency correcting system, it comprises: a temperature sense oscillator chip, it includes oscillator, temperature sensor, memory cell, the frequency output pin, temperature output pin and data input and output pin, described oscillator is used to generate predetermined frequency signal and exports described predetermined frequency signal by described frequency output pin, described temperature sensor is used to respond to environment temperature and exports described temperature signal with the temperature signal of generation expression environment temperature and by described temperature output pin, and described memory cell is used to store the temperature frequency characteristic related data of described oscillator and exports described temperature frequency characteristic related data by described data input and output pin; One synthesizer chip, its predetermined frequency signal that is used for providing based on described temperature sense oscillator chip generates the expected frequency signal, the temperature and frequency correcting word that Current Temperatures signal that provides according to described temperature sense oscillator chip and temperature frequency characteristic related data obtain Current Temperatures signal correspondence, and described expected frequency is carried out temperature correction according to the temperature and frequency correcting word of Current Temperatures signal correspondence.
So compared with prior art, in the technical scheme that the present invention proposes, because the temperature sense oscillator not only can provide frequency parameter, temperature parameter can also be provided, the temperature frequency correlation properties of this temperature sense oscillator self can also be provided simultaneously, the temperature frequency compensation that can be as required carry out at described temperature sense oscillator of user like this, the present invention simultaneously also can keep low-down production cost.
Description of drawings
Fig. 1 is the temperature sense oscillator functional-block diagram in one embodiment among the present invention;
Fig. 2 is the temperature frequency measuring system functional-block diagram in one embodiment among the present invention;
Fig. 3 is the correlogram of the temperature frequency characteristic of crystal oscillator;
Fig. 4 is the measurement mechanism functional-block diagram in one embodiment among the present invention;
Fig. 5 for the initial temperature correct word among the present invention, initial temperature correct word difference, difference fixed step size calculation flow chart in one embodiment;
Fig. 6 is the fixed step size symbol table calculation flow chart in one embodiment among the present invention;
Fig. 7 A is the temperature and frequency correcting system functional-block diagram in one embodiment among the present invention;
Frequency synthesizer in one embodiment the functional-block diagram of Fig. 7 B for being used with the temperature sense oscillator among Fig. 1; With
Fig. 8 is the decoding unit workflow diagram in one embodiment in the described frequency synthesizer among Fig. 7.
Embodiment
Below in conjunction with Figure of description the specific embodiment of the present invention is described.
An embodiment of the temperature sense oscillator 100 that provides among the present invention is provided Fig. 1.As shown in Figure 1, described temperature sense oscillator 100 comprises oscillator 110, temperature sensor 120 and memory cell 130.Described oscillator 110 can be used to generate predetermined frequency signal, described temperature sensor 120 can be used to respond to environment temperature to produce the temperature signal of expression environment temperature, and described memory cell 130 can be used for storing the temperature frequency characteristic related data of described oscillator 110.Described oscillator 110, described temperature sensor 120 and described memory cell 130 are encapsulated in the encapsulation (being that temperature sense oscillator 100 is an independently chip), the environment temperature that temperature sensor 120 is sensed is substantially equal to the temperature of oscillator 110 like this, described encapsulation can be adopted various packaged types, such as metallic packaging, ceramic packaging etc.
Described encapsulation includes frequency output pin f
Out, temperature output pin T
OutWith data input and output (DATA I/O) pin D
I/O, by described frequency output pin f
OutCan export the predetermined frequency signal that described oscillator 110 generates, by described temperature output pin T
OutCan export the temperature signal that described temperature inductor 120 obtains.By surveying the frequency output pin f of described temperature sense oscillator 100
OutWith temperature output pin T
OutCan carry out the temperature frequency measurement to this temperature sense oscillator 100, thereby can obtain the temperature frequency characteristic related data of the oscillator 110 in this temperature sense oscillator 100, afterwards can be by described data I/O pin D
I/ODescribed temperature frequency characteristic related data is write memory cell 130 in this temperature sense oscillator 100.In the use of described temperature sense oscillator 100, can be by described data I/O pin D
I/OFrom described memory cell 130, read described temperature frequency characteristic related data.In addition, described encapsulation also may include other pin, such as power pin and ground pin etc.
Advantage or characteristics among the present invention are: described temperature sense oscillator 100 is not the frequency signal after temperature-compensating directly is provided, not temperature compensated frequency signal neither only be provided, and provide frequency signal without temperature-compensating, the temperature signal (being that described oscillator 110 is generating described not temperature compensated frequency signal under the described temperature signal) and the temperature frequency characteristic related data of described oscillator 110 in a temperature range of described not temperature compensated frequency signal correspondence, like this can be so that very simple of the structure of described temperature sense oscillator 100, very long low of production cost, simultaneously also make subsequent processes to carry out temperature correction according to the temperature frequency characteristic related data and the described temperature signal of described oscillator 110 in a temperature range to not temperature compensated frequency signal easily, thus the accurate frequency signal after can being compensated.In other words, the user is after having obtained described temperature sense oscillator 100, be not only to have obtained the oscillator that to export preset frequency, also obtained accurately to reflect the temperature inductor of described oscillator working temperature, also obtained the temperature frequency characteristic related data of this oscillator self uniqueness simultaneously, but the production cost of such temperature sense oscillator 100 does not significantly improve still.
In a preferred embodiment, can be with frequency output pin f
OutOr/and temperature output pin T
OutTime division multiplexing is made data I/O pin D
I/OSpecifically, at frequency output pin f
OutOr/and temperature output pin T
OutIn the time of idle, promptly when they are not used for output frequency signal and/or temperature signal, the temperature frequency characteristic related data of described oscillator 110 described memory cell 130 can be write or reads by these pins, pin can be saved like this.
In one embodiment, described oscillator can be any one oscillator in the prior art, such as crystal oscillator, mediation oscillator, rail mounted oscillator, voltage controlled oscillator, multivibrator, Kang Shi oscillator, sine-wave oscillator, ring oscillator, RC oscillator, microelectromechanical systems oscillator (MicroElectro Mechanical Systems Oscillator) or LC oscillator etc.For crystal oscillator, in a preferred embodiment, can adopt the most cheap common crystal oscillator SPXO, can reduce the cost of the temperature sense oscillator among the present invention so as much as possible.Yet, even adopt the most cheap common crystal oscillator SPXO, because temperature sense oscillator of the present invention can provide its temperature frequency characteristic related data, make follow-up temperature-compensating targetedly become very easy, so still can access the very high output frequency of precision afterwards.
In one embodiment, described temperature sensor can adopt any one temperature sensor in the prior art, such as thermistor temperature sensor, thermocouple temperature sensor etc.Described temperature sensor senses be the temperature of oscillator, rather than the temperature of peripheral environment.Temperature sensor among the present invention can not have strict requirement to the linearity, and the most common, the most cheap temperature sensor also goes among the present invention.Yet, even adopt the most cheap ordinary temp transducer, because temperature sense oscillator of the present invention still can obtain the temperature frequency characteristic related data determined whereby, so just can compensate foundation exactly is provided to the temperature frequency of temperature sense oscillator of the present invention.In addition, in follow-up temperature frequency compensation process, be still same temperature sensor the temperature parameter value is provided, so just can well keep the consistency of temperature sense, therefore can not need temperature sensor to have the very high accuracy and the linearity.
In one embodiment, described memory cell 130 can be NAND FLASH memory, NORFlash memory or EEPROM etc.
Compare with common crystal oscillator SPXO of the prior art, temperature sense oscillator 100 among the present invention is owing to can provide the temperature frequency characteristic related data of the oscillator of temperature parameter and Qi Nei, can allow the user just can understand unique temperature frequency characteristic of each oscillator self very easily like this, thereby can carry out different temperature frequency compensation at described oscillator easily, the present invention does not simultaneously significantly raise the cost.Compare with temperature compensating crystal oscillator TCXO of the prior art, temperature sense oscillator of the present invention does not need high-quality crystal, does not need the temperature sensor of high linearity yet.In addition, temperature compensating crystal oscillator TCXO can not carry out the temperature frequency compensation according to unique temperature frequency characteristic of the crystal oscillator in it, but adopt fixing temperature frequency feature that all crystals oscillator is carried out the temperature frequency compensation, so not only need high-quality with highly consistent crystal oscillator, and also can not determine unique temperature frequency characteristic of the crystal oscillator of use in it at last.
An embodiment of the temperature frequency measuring system 200 that provides among the present invention is provided Fig. 2, described temperature frequency measuring system 200 can be used for measuring the temperature frequency characteristic related data of described temperature sense oscillator 100, and the temperature frequency related data that records is write in the described temperature sense oscillator 100.As shown in Figure 2, described temperature frequency measuring system 200 includes sweat box 210 and measurement mechanism 220.
Described sweat box 210 can be used for regulating temperature in it in predetermined temperature range, and described predetermined temperature range can be-50 ℃-130 ℃.When needs carry out the temperature frequency measurement to a temperature sense oscillator 100 to be measured, described temperature sense oscillator 100 to be measured can be positioned in the sweat box 210, afterwards can be from low to high, from high to low or the alternate manner temperature of regulating in the sweat box 210 make whole temperature range of its scanning.Because the variation of temperature in the sweat box 210, thereby cause the variation of the internal temperature (being the internal temperature of the temperature sensor senses in it) of temperature sense oscillator 100 to be measured, it should be noted that the internal temperature of temperature in the sweat box 210 and temperature sense oscillator 100 to be measured can be inconsistent.
Described measurement mechanism 220 can be used for by described output pin T
OutRead the internal temperature values of described temperature sense oscillator 100 to be measured, by output pin F
OutRead the output frequency value of described temperature sense oscillator 100 to be measured, the internal temperature values and the output frequency value of correspondence can be got off as one group of temperature frequency measurement data record afterwards, one of them internal temperature values and corresponding output frequency value can be formed a temperature frequency measurement point.In a specific embodiment,, detect output pin T afterwards with being set under the temperature (such as 20 ℃) of sweat box 210
OutWhether the internal temperature signal of output is stable, if at the fixed time in (such as 60s), the variation of the internal temperature values of described output is less than predetermined temperature change threshold (such as 0.5 ℃), think that then the internal temperature signal is stable, this moment, described measurement mechanism 220 can be noted this internal temperature values and the output frequency value under this internal temperature values.Afterwards, regulate the temperature in the sweat box 210, described measurement mechanism 220 is noted output frequency value and the corresponding internal temperature values of described temperature sense oscillator 100 to be measured under another internal temperature values once more, so constantly carries out repetition abundant discrete internal temperature values and the output frequency value under the respective inner temperature value in noting whole temperature range.These data of record can be used to describe the temperature frequency characteristic or the temperature frequency compensation characteristic of described temperature sense oscillator 100 to be measured, therefore can be called the temperature frequency characteristic related data of described temperature sense oscillator 100 to be measured.For instance, the standard output frequency of the oscillator 110 in temperature sense oscillator 100 is 26Mhz, and described measurement mechanism 220 can obtain following a series of data through after the above-mentioned test: first group of temperature frequency measurement data: 10 ℃, 26.1156Mhz; Second group of temperature frequency measurement data: 12 ℃, 26.1261Mhz; The 3rd group of temperature frequency measurement data: 14 ℃, 26.1281Mhz; The 4th group of temperature frequency measurement data: 16 ℃, 26.1381Mhz.......
Fig. 3 is the temperature frequency characteristic correlogram of crystal oscillator.As shown in Figure 3, the described temperature frequency characteristic related data of record is above inserted coordinate system and connected the temperature frequency characteristic curve that then forms not compensated with curve, wherein the ordinate of coordinate system is not described output frequency value, but the ratio of the expected frequency value of the difference of the expected frequency value of described output frequency value and described temperature sense oscillator 110 or standard frequency value and described crystal oscillator 110 or standard frequency value.As can be seen from Figure 3, the actual output frequency of described temperature sense oscillator 110 can fluctuate near the standard frequency value along with temperature, and this fluctuation causes trouble can for a lot of electronic products of this temperature sense oscillator 110 that use.In order to obtain frequency more accurately, can generate the temperature frequency compensated curve according to the temperature frequency characteristic curve of described not compensated, the temperature frequency characteristic curve of described temperature frequency compensated curve and described not compensated is roughly axisymmetric along the standard frequency value, can obtain the temperature frequency characteristic curve after the very little compensation of fluctuation range after according to described temperature frequency compensation characteristic curve the frequency values of described not compensated being compensated.
In another embodiment, when 220 pairs of described temperature sense oscillators 100 to be measured of described measurement mechanism carry out the temperature frequency feature measurement, also the actual output frequency value of internal temperature values and corresponding described temperature sense oscillator 100 to be measured can be got off as one group of measurement data record with the frequency drift value (being exemplary frequency deviation values) of expected frequency value, promptly at this moment can carry out record with the output frequency value that the frequency drift value substitutes in the foregoing description.In another embodiment, when 220 pairs of described temperature sense oscillators 100 to be measured of described measurement mechanism carry out the temperature frequency feature measurement, also internal temperature values and corresponding frequency compensation value can be got off as one group of measurement data record, promptly can carry out record with the output frequency value that the frequency compensation value substitutes in the foregoing description this moment.In other embodiments, other recording mode can also be arranged.And no matter carry out record in which way, as long as can reflect that from the measurement data of these records the temperature frequency characteristic of oscillator 110 in the described temperature sense oscillator 100 to be measured or temperature frequency compensation characteristic are just passable, so these measurement data can be called as temperature frequency characteristic related data.Here need to prove, the temperature frequency characteristic of oscillator 110 is directly related with the temperature frequency compensation characteristic, as seen in Figure 3, as long as obtained in temperature frequency characteristic and the temperature frequency compensation characteristic one, another also just can utilize the mathematical method direct derivation to come out.
In one embodiment, described measurement mechanism 220 can pass through the temperature frequency characteristic related data of record the I/O pin D of described temperature sense oscillator 100 to be measured
I/OWrite in the described memory cell 130.
Another advantage or characteristics among the present invention are: each temperature sense oscillator chip 100 is before being produced the back, coming into operation, all also need to carry out the temperature frequency characteristic related data of temperature frequency feature measurement with the uniqueness that obtains this temperature sense oscillator chip 100, described temperature frequency characteristic related data can be write in this temperature sense oscillator chip 100 afterwards, thereby obtain the temperature sense oscillator chip 100 that can come into operation.It should be noted that, because the temperature frequency characteristic of each temperature sense oscillator 100 all may be not exclusively the same, therefore the temperature frequency feature measurement that each temperature sense oscillator is carried out and the temperature frequency characteristic related data that obtains also may be not exclusively the same, thus so just be necessary each temperature sense oscillator is all carried out the temperature frequency characteristic related data that temperature frequency feature measurement obtains this temperature sense oscillator.Come from certain angle, the temperature frequency of temperature sense oscillator chip 100 is measured obtaining temperature frequency characteristic related data, and described temperature frequency characteristic related data is imported the production link that temperature sense oscillator chip 100 interior processes can be regarded as described temperature sense oscillator chip 100.
Temperature frequency characteristic related data for storage in the memory cell 130 in the described temperature sense oscillator 100, if adopt the storage mode of measurement data in groups, be that it comprises some groups of measurement data, and every group of measurement data can comprise an internal temperature values and corresponding output frequency value, an internal temperature values and respective frequencies drift value, or an internal temperature values and a respective frequencies offset, will bring some problems.Such as, first, for the meticulous as far as possible temperature frequency characteristic of depicting the oscillator in it, selection measurement point as much as possible may be needed, yet Measuring Time and cost can be increased greatly like this; The second, every group of measurement data all needs to take very big memory space, and storing some groups of measurement data then needs more memory space, and under the situation of the limited storage space of memory cell, it only can support limited group of storage of measuring quantity like this.In order to address these problems, described temperature frequency characteristic related data need be carried out further encoding process, temperature frequency characteristic related data after the further encoding process of process still can reflect the temperature frequency characteristic or the temperature frequency compensation characteristic of oscillator after decoding, these data after the therefore further encoding process still can be called as temperature frequency characteristic related data.
To introduce several encoding process schemes of described temperature frequency characteristic related data below.An embodiment of the measurement mechanism 400 that provides among the present invention is provided Fig. 4, and described measurement mechanism 400 can be as the measurement mechanism 220 among Fig. 2.Described measurement mechanism 400 comprises tape deck 410, match device 420, sampling apparatus 430 and code device 440 again.
Described tape deck 410 is used for record by output pin T
OutAnd F
OutThe output frequency value and the internal temperature values of the temperature sense oscillator 100 described to be measured that reads, the internal temperature values and the output frequency value of correspondence can be got off as one group of measurement data record afterwards, one of them internal temperature values and corresponding output frequency value can be formed a temperature frequency measurement point.By continuous record, described tape deck 410 can obtain discrete internal temperature values abundant in the whole temperature range and the output frequency value under the respective inner temperature value.What need know is, only is to be that example is introduced with record internal temperature values and corresponding output frequency value here, in other embodiments, also can write down internal temperature values and corresponding frequency drift value, or record internal temperature values and corresponding frequency compensation value.
Described match device 420 is used for simulating continuous temperature frequency characteristic curve according to each discrete internal temperature values and corresponding output frequency value.This can obtain by the whole bag of tricks of the prior art, but must will guarantee that the temperature frequency curve of its generation is consistent as far as possible with the temperature frequency curve of actual frequency, and keeps the level and smooth of curve.In one embodiment, when not having the temperature frequency sudden change, can adopt Beckman curve maker (Bechamann curve generator), just can generate more accurate temperature frequency characteristic curve by using a few temperature frequency test point.
Described sampling apparatus again 430 is used at interval the temperature frequency curve that simulates being sampled to obtain each sample temperature value frequency value corresponding again with predetermined sample temperature, and each sample temperature value and corresponding sample frequency value can be regarded as one group of temperature frequency sampled data.Described predetermined sample temperature can arbitrarily be set at interval as required, can be 0.1 ℃, 0.15 ℃ or 0.2 ℃ at interval such as described predetermined sample temperature.
In the present embodiment, why adopt match device 420 to reach sampling apparatus 430 again, be in order to make tape deck 410 measure and write down some temperature frequency measurement points as much as possible less, simultaneously can obtain abundant temperature frequency sample point again, so that the temperature frequency characteristic related data among the present invention is enough accurate.Described tape deck 410 every measurements and write down a temperature frequency measurement point and all need to spend certain hour, the temperature frequency measurement point too much will increase exponentially the measurement cost, by adopt match device 420 and again sampling apparatus 430 can obtain easily at double in or tenfold in the temperature frequency sample point of temperature frequency measurement point.Therefore, described predetermined sample temperature is generally less than or at interval much smaller than the temperature interval of the internal temperature values of measuring.
Described code device 440 is used for each sample temperature value and correspondent frequency value are encoded obtaining the temperature frequency coded data that memory space obviously reduces, and with described temperature frequency coded data by I/O pin D
I/OImport in the memory cell 130 of described temperature sense oscillator.After temperature frequency coded datas in the described memory cell 130 are decoded can serve as to carry out temperature and frequency correcting with reference to the expected frequency signal that generates to the frequency signal with 100 outputs of temperature sense oscillator.
Described code device 440 can have the multiple coded system of employing that each sample temperature value and correspondent frequency value are encoded to obtain temperature frequency coded data not of the same race, in first kind of encoding scheme, described temperature frequency coded data can include difference TCWd (T0), fixed step size TCWds and the fixed step size symbol table of temperature and frequency correcting word TCW (T0) of temperature and frequency correcting word (tempereture frequency correction word) TCW (T0), the initial temperature T0 correspondence of initial temperature T0, initial temperature T0 correspondence.The difference of described temperature and frequency correcting word is meant the difference of two adjacent temperature corresponding temperature frequency correction words, described fixed step size TCWds represents the difference between the difference of temperature and frequency correcting word of adjacent two temperatures correspondence, described fixed step size symbol table is a binary sequence, the sign bit of the difference fixed step size TCWds of each bit wherein is an all corresponding temperature value.Except initial set temperature frequency sampled data, every group of temperature frequency sampled data all can be encoded as 1 bit in the fixed step size symbol table, the great like this memory space that reduced.For instance, every group of temperature frequency sampled data includes a sample temperature value and correspondent frequency value, if described sample temperature value can be represented with the binary number of 8 bits, and the correspondent frequency value need be represented with two system numbers of 32 bits, just need 40 bits in order to store this group temperature frequency sampled data so, and, only need 1 bit just can finish storage through after the above-mentioned encoding process, saved memory space greatly.After described temperature sense oscillator 100 comes into operation, can obtain the temperature and frequency correcting word TCW (T) of arbitrary temp value T correspondence according to T0, TCW (T0), TCWd (T0), TCWds and the decoding of fixed step size symbol table, and then the temperature and frequency correcting word TCW (T) that can utilize temperature value T correspondence serves as to carry out temperature and frequency correcting with reference to the expected frequency signal that generates to the frequency signal of exporting under temperature value T with temperature sense oscillator 100, and detailed content will further describe hereinafter.
Below be example just with first kind of encoding scheme, introducing described code device 440 is how each sample temperature value and correspondent frequency value to be encoded to the temperature frequency coded data.Fig. 5 shows an embodiment of the computational process of T0, TCW (T0) among the present invention, TCWd (T0), TCWds, and Fig. 6 shows an embodiment of the computational process of the fixed step size symbol table among the present invention.
As shown in Figure 5, the computational methods of described T0, TCW (T0), TCWd (T0), TCWds comprise the steps.
The theoretical temperatures frequency correction word TCW of each sample temperature point Tx correspondence
Ideal(Tx) will go on record and be used for determining the value of described each sign bit of fixed step size symbol table.
TCWd
ideal(Tx)＝TCWd
ideal(Tx+S)-TCWd
ideal(Tx)，
Tx belongs to [min (Tx), max (Tx-S)] herein, and S represents described predetermined sample temperature at interval.
TCWdd
ideal(Tx)＝TCWd
ideal(Tx+S)-TCWd
ideal(Tx)，
Tx belongs to [min (Tx), max (Tx-2S)] herein.
Hence one can see that, just can calculate the difference TCWd (T0) and the fixed step size TCWds of temperature and frequency correcting word of temperature and frequency correcting word TCW (T0), the initial temperature correspondence of initial temperature T0 in the described temperature frequency coded data, initial temperature correspondence through execution in step 501-509.
Subsequently, can utilize difference TCWd (T0) and the fixed step size TCWds and the corresponding theoretical temperatures frequency correction word TCW of described each sample temperature point of temperature and frequency correcting word of temperature and frequency correcting word TCW (T0), the initial temperature correspondence of the initial temperature T0 that obtained, initial temperature correspondence
Ideal(Tx) calculate the value that obtains bits per inch certificate in the described fixed step size symbol table.Please referring to shown in Figure 6, the acquisition process of the value of each bit data is as follows in the described fixed step size symbol table.
Tx represents current sample temperature point, the temperature and frequency correcting word of NTCW (Tx-S) expression Tx-S temperature spot correspondence, the difference of the temperature and frequency correcting word of the temperature and frequency correcting word correspondence of NTCWd (Tx-S) expression Tx-S temperature spot correspondence.It should be noted that, the temperature and frequency correcting word NTCW (Tx-S) of Tx-S temperature spot correspondence is not described theoretical temperatures frequency correction word, but the temperature and frequency correcting word that comes out according to the Difference Calculation of initial temperature frequency correction word and initial temperature frequency correction word.
Suppose that at described initial temperature T0 be the minimum that practical application covers temperature range, so described initialization is exactly:
Tx＝T0+S；NTCW(Tx-S)＝TCW(T0)；NTCWd(Tx-S)＝TCWd(T0)。
Here because initial temperature T0 is the minimum temperature value, the temperature spot Tx that therefore need ask for only need equal the value of the corresponding positions in the fixed step size symbol table that T0+S just can realize asking for each temperature spot correspondence.
Step 603 is calculated the temperature and frequency correcting word NTCW (Tx) of current sample temperature point Tx correspondence, is specially:
NTCW(Tx)＝NTCW(Tx-S)+NTCWd(Tx-S)。
Step 605 supposes that the value of sign bit SB (Tx-S) in the fixed step size symbol table of Tx-S temperature spot correspondence is 0, asks for the first accounting temperature frequency correction word NTCW0 (Tx+S) of Tx+S temperature spot correspondence, is specially:
NTCW0(Tx+S)＝NTCW(Tx)+NTCWd(Tx)
＝NTCW(Tx-S)+NTCWd(Tx-S)+NTCWd(Tx-S)+SB(Tx)＊TCWds
＝NTCW(Tx-S)+2＊NTCWd(Tx-S)-TCWds。
DNTCW0(Tx+S)＝Abs(TCW
ideal(Tx+S)-NTCW0(Tx+S))。
Step 609 supposes that the value of sign bit SB (Tx-S) in the fixed step size symbol table of Tx-S temperature spot correspondence is 1, asks for the second accounting temperature frequency correction word NTCW1 (Tx+S) of Tx+S temperature spot correspondence, is specially:
NTCW1(Tx+S)＝NTCW(Tx-S)+2＊NTCWd(Tx-S)+SB(Tx-S)＊TCWds
＝NTCW(Tx-S)+2＊NTCWd(Tx-S)+TCWds。
DNTCW1(Tx+S)＝Abs(TCW
ideal(Tx+S)-NTCW0(Tx+S))。
DNTCW0 (Tx+S)＜DNTCW1 (Tx+S) if then enter step 615, otherwise enters step 617.
NTCWd(Tx)＝NTCWd(Tx-S)-TCWds。
NTCWd(Tx)＝NTCWd(Tx-S)+TCWds。
Step 625 judges that Tx whether smaller or equal to MAX (Tx)-S, if not, then finishes calculation process, otherwise returns step 603, repeats above-mentioned steps.
Carry out above-mentioned steps 601-625, just can calculate the value of each data in the described fixed step size symbol table.
So just obtain whole temperature frequency coded datas, just the initial temperature frequency correction word TCW (T0) that calculates, difference TCWd (T0), fixed step size TCWds and the fixed step size symbol table of initial temperature frequency correction word can have been passed through I/O pin D at last
I/OImport in the memory cell 130 of described temperature sense oscillator.
In second kind of encoding scheme, described temperature frequency coded data can include temperature and frequency correcting word TCW (T0), fixed step size TCWs and the fixed step size symbol table of initial temperature T0, initial temperature T0 correspondence.Described fixed step size TCWs represents the difference between the corresponding temperature and frequency correcting word of adjacent two temperatures point, and described fixed step size symbol table is a binary sequence, the sign bit of the fixed step size TCWs of each bit wherein is an all corresponding temperature value.In this scheme, 440 pairs of each sample temperature values of described code device and correspondent frequency value are encoded also can be with reference to figure 5 and Fig. 6 to obtain the temperature frequency method of coding data, just some areas also need to change, and can be revised as such as the step 505 among Fig. 5: a selected arbitrarily sample temperature is put pairing theoretical temperatures frequency correction word TCW
Ideal(Tx) be described initial temperature frequency correction word TCW (T0), described selected sample temperature point is exactly described initial temperature T0, simultaneously directly with the theoretical temperatures frequency correction word TCW of each sample temperature point Tx correspondence of obtaining in the step 503
Ideal(Tx) difference TCWd
Ideal(Tx) the absolute value maximum in be recorded as described fixed step size TCWs, save step 507 and 509 simultaneously, for another example among Fig. 6:
Step 601 is revised as initialization Tx, NTCW (Tx-S), wherein
Tx＝T0+S；NTCW(Tx-S)＝TCW(T0)。
Step 603 is deleted.
Step 605 is revised as: the value of supposing sign bit SB (Tx-S) in the fixed step size symbol table of Tx-S temperature spot correspondence is 0, asks for the first accounting temperature frequency correction word NTCW0 (Tx) of Tx temperature spot correspondence, is specially:
NTCW0(Tx)＝NTCW(Tx-S)+SB(Tx-S)＊TCWs
＝NTCW(Tx-S)-TCWs。
Step 607 is revised as: the first accounting temperature frequency correction word NTCW0 (Tx) and theoretical temperatures frequency correction word TCW that ask for Tx temperature spot correspondence
Ideal(Tx) Cha the first absolute value DNTCW0 (Tx) is specially:
DNTCW0(Tx)＝Abs(TCW
ideal(Tx)-NTCW0(Tx))。
Step 609 is revised as: the value of supposing sign bit SB (Tx-S) in the fixed step size symbol table of Tx-S temperature spot correspondence is 1, asks for the second accounting temperature frequency correction word NTCW1 (Tx) of Tx temperature spot correspondence, is specially:
NTCW1(Tx)＝NTCW(Tx-S)+SB(Tx-S)＊TCWs
＝NTCW(Tx-S)-TCWs。
Step 611 is revised as: the accounting temperature frequency correction word NTCW1 (Tx+S) and theoretical temperatures frequency correction word TCW that ask for Tx+S temperature spot correspondence
Ideal(the second absolute value DNTCW1 (Tx+S) of Tx+S difference is specially:
DNTCW1(Tx+S)＝Abs(TCW
ideal(Tx+S)-NTCW0(Tx+S))。
Step 613 is revised as: judge that described first absolute value whether less than described second absolute value, promptly judges whether:
DNTCW0 (Tx)＜DNTCW1 (Tx) if then enter step 615, otherwise enters step 617.
Step 619 is revised as: calculate the temperature and frequency correcting word NTCW (Tx) of Tx temperature spot correspondence, promptly
NTCW(Tx)＝NTCW(Tx-S)-TCWs。
Step 621 is revised as: calculate the temperature and frequency correcting word NTCW (Tx) of Tx temperature spot correspondence, promptly
NTCW(Tx)＝NTCW(Tx-S)+TCWs。
In the third encoding scheme, described temperature frequency coded data can include initial temperature T0, the temperature and frequency correcting word TCW (T0) of initial temperature T0 correspondence, the difference TCWd (T0) of the temperature and frequency correcting word TCW (T0) of initial temperature T0 correspondence, the second differnce TCWdd (T0) of the temperature and frequency correcting word TCW (T0) of initial temperature T0 correspondence, fixed step size TCWdds and fixed step size symbol table, the difference of described temperature and frequency correcting word is meant the difference of two adjacent temperature corresponding temperature frequency correction words, the second differnce of described temperature and frequency correcting word is meant the difference of the difference of two adjacent temperature corresponding temperature frequency correction words, described fixed step size TCWdds represents the difference between the second differnce of the temperature and frequency correcting word that adjacent two temperatures point is corresponding, described fixed step size symbol table is a binary sequence, described fixed step size symbol table is a binary sequence, the sign bit of the fixed step size TCWs of a sample temperature value that each bit wherein is all corresponding.In this scheme, 440 pairs of each sample temperature values of described code device and correspondent frequency value are encoded also can be with reference to figure 5 and Fig. 6 to obtain the temperature frequency method of coding data, and just some place also needs corresponding change, has repeated no more herein.
Previously described three kinds of encoding schemes have following common characteristic: the first, utilize the temperature and frequency correcting word of adjacent temperature spot correspondence to have the characteristics of correlation and otherness, adopt the successive approximation coded system that the sample temperature frequency data are encoded; The second, utilize each sample temperature frequency frequency data to be converted to the temperature and frequency correcting data, so just can be in the hope of theoretical temperatures frequency correction word.
In the 4th kind of encoding scheme, can not need to utilize each sample temperature point frequency value corresponding to ask for the theoretical temperatures frequency correction word TCW of each sample temperature point Tx correspondence the step 501 among the Fig. 5 in first kind of encoding scheme
IdealBut directly sample frequency value F (Tx) is replaced theoretical temperatures frequency correction word TCW (Tx),
Ideal(Tx), step 503 so afterwards also is revised as:
Calculate the difference Fd (Tx) of the sample frequency value F (Tx) of each sample temperature point Tx correspondence, wherein
Fd(Tx)＝Fd(Tx+S)-Fd(Tx)。
Step 505 is revised as: it is described original frequency value F (T0) that a selected arbitrarily sample temperature is put pairing sample frequency value F (Tx), should select sample temperature so and put the difference Fd (T0) that the difference Fd (Tx) of pairing sample frequency value F (Tx) will be registered as described original frequency value F (T0).
Step 507 is revised as: calculate the difference Fdd (Tx) of difference Fd (Tx) of the sample frequency value F (Tx) of each sample temperature point Tx correspondence, i.e. and the second differnce of sample frequency value F (Tx), wherein
Fdd(Tx)＝Fd(Tx+S)-Fd(Tx)。
Step 509 is revised as: with the described fixed step size Fds that is recorded as of absolute value maximum in the second differnce of the sample frequency value F (Tx) of each sample temperature point Tx correspondence.
In the 4th encoding scheme, just substituted TCW (T0) like this, substituted TCWd (T0), substituted TCWds with Fds with Fd (T0) with F (T0).Next, each symbol that utilizes method same among Fig. 6 also can calculate in the fixed step size symbol table is only corresponding parameters need be replaced and both can.After described temperature sense oscillator 100 comes into operation, can obtain arbitrary temp value T frequency value corresponding F (T) according to T0, F (T0), Fd (T0), Fds and the decoding of fixed step size symbol table, thereby can obtain the temperature frequency characteristic of described temperature sense oscillator 100, lay the first stone for it being carried out the temperature frequency compensation.
With reference to the modification of the 4th encoding scheme, also described second encoding scheme and the 3rd encoding scheme can be made amendment, to obtain the 5th encoding scheme and the 6th encoding scheme.Certainly, at other embodiment, in the affiliated field the successive approximation coding method that proposes in can also be according to the present invention of those of ordinary skill derives various encoding schemes.
In these codings embodiment, advantage of the present invention or characteristics are: for a temperature spot, described fixed step size symbol table only need be stored the sign bit of 1 bit binary data as the difference fixed step size of this temperature spot correspondence, thereby makes the data volume of described fixed step size symbol table become very little.Simultaneously, also can in the fixed step size symbol table, store the sign bit of more temperature spots, and then S is smaller at interval can to keep predetermined temperature, thereby has improved the precision of temperature frequency compensation.
In the real-time example of other coding, can also carry out some little modifications to the fixed step size symbol table, sign bit such as the fixed step size of the just corresponding temperature value of two bits in the described fixed step size symbol table, such as 00 expression+0.5,01 expression+1.0,10 expressions-0.5,11 expressions-1.0, the sign bit of this moment is more as the coefficient of a fixed step size.
Temperature and frequency correcting system in one embodiment the functional-block diagram of Fig. 7 A for proposing among the present invention.Shown in Fig. 7 A, described temperature and frequency correcting system includes temperature sense oscillator 701 and frequency synthesizer 702, described temperature sense oscillator 701 can be the temperature sense oscillator 100 among Fig. 1, it can provide reference frequency, Current Temperatures and temperature frequency characteristic related data for described frequency synthesizer 702, described frequency synthesizer 702 can generate various expected frequency signals based on the reference frequency that temperature sense oscillator 100 provides, and is that 26MHz, expected frequency are 104MHz such as reference frequency.The temperature and frequency correcting word that Current Temperatures that described frequency synthesizer 702 can also provide according to temperature sense oscillator 100 and temperature frequency characteristic related data obtain the Current Temperatures correspondence, and described expected frequency is carried out temperature correction according to the temperature and frequency correcting word of Current Temperatures correspondence.Described frequency synthesizer 702 belongs to two different chips physically with temperature sense oscillator 701, connects by the corresponding pin of chip separately between the two.
Cell stores with described temperature sense oscillator is an example by the temperature frequency coded data that first kind of encoding scheme obtains below, introduces an embodiment of the concrete application of the frequency synthesizer 702 among the present invention.Frequency synthesizer 702 in one embodiment the functional-block diagram of Fig. 7 B for being used with temperature sense oscillator 701.
See also shown in Fig. 7 B, described frequency synthesizer 702 comprises frequency locking synthesis unit 710, frequency correction unit 730 and decoding unit 750.Described decoding unit 250 is used for the data I/O pin D by temperature sense oscillator 100
I/OReceive the temperature frequency coded data in it, by the output pin T of temperature sense oscillator 701
OUTReceive the Current Temperatures T in it, and generate the temperature and frequency correcting word TCW (T) of Current Temperatures T correspondence according to the temperature frequency coded data.Described frequency correction unit 730 is used to utilize the temperature and frequency correcting word TCW of acquisition to frequency control word (frequency control word, be called for short FCW) proofread and correct/compensate to obtain emending frequency control word (corrected frequency control word is called for short FCW_new).Described frequency locking synthesis unit 710 is used for the output pin F by temperature sense oscillator 701
OUTReceive reference frequency f
R, and with reference frequency f
RFor the basis generates the desired output frequency f according to emending frequency control word FCW_new
OUT
In one embodiment, described frequency locking synthesis unit 710 generates the desired output frequency f according to following formula
OUT:
f
OUT＝K*FCW_new*f
R
Wherein K represents proportionality coefficient, the output frequency signal f that can obtain expecting according to proportionality coefficient K and emending frequency control signal FCW_new
OUT
In one embodiment, described frequency correction unit 730 generates emending frequency control word FCW_new according to following formula:
FCW_new＝FCW+TCW。
Please consult once more shown in Fig. 7 B, described decoding unit 750 (also can be referred to as temperature and frequency correcting word deriving means) also includes temperature comparing unit 752, temperature approaches unit 756, temperature and frequency correcting letter lock order unit 754.Fig. 8 is described decoding unit 750 workflow diagram in one embodiment among Fig. 7 B, sees also shown in Figure 8ly, and the coding/decoding method of temperature frequency coded data comprises the steps.
Tx represents current accounting temperature point, the temperature and frequency correcting word of TCW (Tx) expression accounting temperature point Tx correspondence, the difference of the temperature and frequency correcting word of TCWd (Tx) expression accounting temperature point Tx correspondence.Described initialization can be in addition:
Tx＝T0；TCW(Tx)＝TCW(T0)；TCWd(Tx)＝TCWd(T0)。
TCW (Tx+S)=TCW (Tx)+TCWd (Tx) wherein;
TCWd(Tx+S)＝TCWd(Tx)+SB(Tx)＊TCWds；
This process of asking for the correlation of next accounting temperature point can be called as forward direction and proofread and correct.
TCWd (Tx-S)=TCWd (Tx)-SB (Tx-S) * TCWds wherein
TCW(Tx-S)＝TCW(Tx)-TCWd(Tx-S)，
Proofread and correct with respect to foregoing forward direction, the correlation of asking for an accounting temperature point here gets process and can be called as the back to correction.
Calculate the temperature and frequency correcting word TCW of gained in output after,, enter step 823 afterwards with Tlock=T.
In in this enforcement, characteristics of the acquisition methods of the temperature and frequency correcting word among the present invention, advantage is: utilize initial temperature frequency correction word, the difference of initial temperature frequency correction word starts trace flow, constantly utilize the corresponding temperature and frequency correcting word of current accounting temperature point, the difference of temperature and frequency correcting word, sign bit in the fixed step size symbol table and fixed step size calculate the temperature and frequency correcting word of correspondence of next accounting temperature point of convergence target temperature, be locked to Current Temperatures point T until the accounting temperature point, carry out trying to achieve the temperature and frequency correcting word of Current Temperatures point T correspondence according to interpolation.
By above-mentioned application example as can be known, after the temperature frequency coded data of the cell stores of described temperature sense oscillator 701 is decoded, can calculate the temperature and frequency correcting word TCW (T) of arbitrary temp value T correspondence, and then can to utilize the temperature and frequency correcting word TCW (T) of temperature value T correspondence serve as to carry out temperature and frequency correcting with reference to the expected frequency signal that generates to the frequency signal of exporting with temperature sense oscillator 100 under temperature value T.
The coding/decoding method that passes through the temperature frequency coded data that other encoding scheme obtains of the cell stores of described temperature sense oscillator 701 also can be with reference to figure 7A and Fig. 8, and just partial content needs to revise.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement etc., all should be included within protection scope of the present invention.
Claims (12)
1. temperature sense oscillator, it is characterized in that, it is included in the oscillator in the encapsulation, temperature sensor and memory cell, described oscillator is used to generate predetermined frequency signal, described temperature sensor is used to respond to environment temperature to produce the temperature signal of expression environment temperature, described temperature sensor senses to environment temperature be substantially equal to the working temperature of oscillator, described memory cell is used for storing the temperature frequency characteristic related data of described oscillator, described encapsulation includes the frequency output pin, temperature output pin and data input and output pin, export the predetermined frequency signal that described oscillator generates by described frequency output pin, export the temperature signal that described temperature inductor obtains by described temperature output pin, described temperature frequency characteristic related data is write or read described memory cell by described data input and output pin.
2. temperature sense oscillator as claimed in claim 1, it is characterized in that: described oscillator is carried out temperature frequency measure temperature frequency characteristic related data by surveying described frequency output pin and temperature output pin, described temperature frequency characteristic related data is write described memory cell by described data input and output pin with the uniqueness that obtains described oscillator.
3. temperature sense oscillator as claimed in claim 2 is characterized in that: when using described temperature sense oscillator, read described temperature frequency characteristic related data by described data input and output pin from described memory cell.
4. temperature sense oscillator as claimed in claim 2 is characterized in that: described temperature frequency characteristic related data comprises many group temperature frequency measurement data,
Every group of temperature frequency measurement data comprises a temperature value and corresponding output frequency value;
Every group of temperature frequency measurement data comprises a temperature value and respective frequencies drift value; Or
Every group of temperature frequency measurement data comprises a temperature value and respective frequencies offset.
5. temperature sense oscillator as claimed in claim 1 is characterized in that: described temperature frequency characteristic related data is the temperature frequency coded data,
Described temperature frequency coded data comprises initial temperature, difference, fixed step size and the fixed step size symbol table of the temperature and frequency correcting word of the temperature and frequency correcting word of initial temperature correspondence, initial temperature correspondence.
6. temperature sense oscillator as claimed in claim 1 is characterized in that: described temperature frequency characteristic related data is the temperature frequency coded data,
Described temperature frequency coded data comprises initial temperature, the temperature and frequency correcting word of initial temperature correspondence, fixed step size and fixed step size symbol table.
7. chip production method is characterized in that it comprises:
Chip piece is provided, be packaged with oscillator, temperature sensor and memory cell in the described chip, described chip includes frequency output pin, temperature output pin and data input and output pin, described oscillator is used to generate predetermined frequency signal and exports described predetermined frequency signal by described frequency output pin, and described temperature sensor is used to respond to environment temperature and exports described temperature signal with the temperature signal of generation expression environment temperature and by described temperature output pin;
Frequency output pin by described chip and temperature output pin carry out temperature frequency measure with obtain in the described chip the temperature frequency characteristic related data of uniqueness of oscillator; With
By described data input and output pin described temperature frequency characteristic related data is write in the described memory cell.
8. chip production method as claimed in claim 7 is characterized in that: described by described chip the frequency output pin and the temperature output pin carry out temperature frequency measure with obtain in the described chip the temperature frequency characteristic related data of uniqueness of oscillator comprise:
The some groups of temperature frequency measurement data that record reads by frequency output pin and temperature output pin, every group of temperature frequency measurement data comprises a temperature value and corresponding output frequency value;
Go out continuous temperature frequency characteristic curve according to some groups of temperature frequency measure data fitting;
With predetermined sample temperature at interval to the temperature frequency curve that simulates sample again with obtain each sample temperature value with and frequency value corresponding, each sample temperature value and corresponding sample frequency value all are called as one group of temperature frequency sampled data; With
Each sample temperature value and correspondent frequency value are encoded to obtain the temperature frequency coded data.
9. chip production method as claimed in claim 8 is characterized in that: described temperature frequency coded data comprises initial temperature, difference, fixed step size and the fixed step size symbol table of the temperature and frequency correcting word of the temperature and frequency correcting word of initial temperature correspondence, initial temperature correspondence;
Described temperature frequency coded data comprises initial temperature, the temperature and frequency correcting word of initial temperature correspondence, fixed step size and fixed step size symbol table; Or
Described temperature frequency coded data comprises initial temperature, second differnce, fixed step size and the fixed step size symbol table of the temperature and frequency correcting word of the difference of the temperature and frequency correcting word of the temperature and frequency correcting word of initial temperature correspondence, initial temperature correspondence, initial temperature correspondence.
10. temperature and frequency correcting system is characterized in that it comprises:
One temperature sense oscillator chip, it includes oscillator, temperature sensor, memory cell, the frequency output pin, temperature output pin and data input and output pin, described oscillator is used to generate predetermined frequency signal and exports described predetermined frequency signal by described frequency output pin, described temperature sensor is used to respond to environment temperature and exports described temperature signal with the temperature signal of generation expression environment temperature and by described temperature output pin, and described memory cell is used to store the temperature frequency characteristic related data of described oscillator and exports described temperature frequency characteristic related data by described data input and output pin;
One synthesizer chip, its predetermined frequency signal that is used for providing based on described temperature sense oscillator chip generates the expected frequency signal, the temperature and frequency correcting word that Current Temperatures signal that provides according to described temperature sense oscillator chip and temperature frequency characteristic related data obtain Current Temperatures signal correspondence, and described expected frequency is carried out temperature correction according to the temperature and frequency correcting word of Current Temperatures signal correspondence.
11. temperature and frequency correcting as claimed in claim 10 system is characterized in that: described temperature frequency characteristic related data comprises many group temperature frequency measurement data,
Every group of temperature frequency measurement data comprises a temperature value and corresponding output frequency value;
Every group of temperature frequency measurement data comprises a temperature value and respective frequencies drift value; Or
Every group of temperature frequency measurement data comprises a temperature value and respective frequencies offset.
12. temperature and frequency correcting as claimed in claim 10 system, it is characterized in that: described temperature frequency characteristic related data is the temperature frequency coded data,
Described temperature frequency coded data comprises initial temperature, difference, fixed step size and the fixed step size symbol table of the temperature and frequency correcting word of the temperature and frequency correcting word of initial temperature correspondence, initial temperature correspondence, and described fixed step size symbol table is a binary sequence;
Described temperature frequency coded data comprises initial temperature, the temperature and frequency correcting word of initial temperature correspondence, fixed step size and fixed step size symbol table, and described fixed step size symbol table is a binary sequence; Or
Described temperature frequency coded data comprises initial temperature, second differnce, fixed step size and the fixed step size symbol table of the temperature and frequency correcting word of the difference of the temperature and frequency correcting word of the temperature and frequency correcting word of initial temperature correspondence, initial temperature correspondence, initial temperature correspondence.
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| CN105763159A (en) * | 2014-12-17 | 2016-07-13 | 联芯科技有限公司 | Method and device for adjusting frequency offset of mobile terminal |
| CN103970184B (en) * | 2013-02-06 | 2017-05-17 | 上海东软载波微电子有限公司 | Method and device for adjusting real time clock system |
| CN108151901A (en) * | 2016-12-05 | 2018-06-12 | 瑞萨电子株式会社 | Temperature measuring circuit and method and microcomputer unit |
| CN112684824A (en) * | 2019-10-17 | 2021-04-20 | 旭化成微电子株式会社 | Temperature control circuit, oscillation control circuit, and temperature control method |
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| CN103970184B (en) * | 2013-02-06 | 2017-05-17 | 上海东软载波微电子有限公司 | Method and device for adjusting real time clock system |
| CN105763159A (en) * | 2014-12-17 | 2016-07-13 | 联芯科技有限公司 | Method and device for adjusting frequency offset of mobile terminal |
| CN108151901A (en) * | 2016-12-05 | 2018-06-12 | 瑞萨电子株式会社 | Temperature measuring circuit and method and microcomputer unit |
| CN108151901B (en) * | 2016-12-05 | 2021-10-29 | 瑞萨电子株式会社 | Temperature measuring circuit and method, and microcomputer unit |
| CN112684824A (en) * | 2019-10-17 | 2021-04-20 | 旭化成微电子株式会社 | Temperature control circuit, oscillation control circuit, and temperature control method |
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