CN102024827B - Photoelectric module for processing image signal and method for manufacturing same - Google Patents
Photoelectric module for processing image signal and method for manufacturing same Download PDFInfo
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- CN102024827B CN102024827B CN2009101690554A CN200910169055A CN102024827B CN 102024827 B CN102024827 B CN 102024827B CN 2009101690554 A CN2009101690554 A CN 2009101690554A CN 200910169055 A CN200910169055 A CN 200910169055A CN 102024827 B CN102024827 B CN 102024827B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Abstract
The invention discloses a photoelectric module for processing an image signal and a method for manufacturing the same. The photoelectric module comprises a wafer, a transparent cover plate, an interstitial and non-light-transmitting sealing glue, wherein the wafer comprises an image signal processing area; the transparent cover plate is arranged above the wafer and comprises a dent, and the dent surrounds the periphery of the transparent cover plate; the interstitial is arranged between the wafer and the transparent cover plate and is used for forming a preset gap between the image signal processing area of the wafer and the transparent cover plate and fixing the transparent cover plate above the wafer; and the non-light-transmitting sealing glue is used for encircling the wafer and the transparent cover plate and filling in the dent, a light-transmitting area is limited to the dent filled with the non-light-transmitting sealing glue, and the light-transmitting area corresponds to the image signal processing area. In the photoelectric module, the transparent cover plate does not obstruct ultraviolet rays to irradiate ultraviolet curing adhesives, so the ultraviolet curing adhesives can be cured into the interstitial to increase the fixing and bond strength between the transparent cover plate and the wafer.
Description
Technical field
The present invention relates to a kind of optical-electric module, relate more specifically to a kind of be used to the handle optical-electric module of signal of video signal and the manufacturing approach of this module, the said optical-electric module that is used to handle signal of video signal can increase the constant intensity between transparent cover plate and the wafer.
Background technology
With reference to figure 1, the numerical digit light source of the optical-electric module of existing projector is handled (digital lightprocessing; DLP) unit 10 comprises wafer 20, clear glass cover plate 30 and gap son (spacer) 40.Said wafer 20 comprises reflection mirror array 22, and has complementary metal oxide semiconductors (CMOS) (CMOS).Said clear glass cover plate 30 is configured in wafer 20 tops, and has dark border 32.This dark border 32 is around around the clear glass cover plate 30, and dark border 32 is limited with a transmission region 34, and this transmission region 34 is corresponding to reflection mirror array 22.Dark border 32 and clear glass cover plate 30 are integrally formed and make.Dark border 32 is positioned at the Lower Half of clear glass cover plate 30, that is to say, but dark border 32 contact gaps 40.Dark border 32 is the semiconductor alloy plated film of about 10 nanometers of thickness.Said gap 40 is configured between wafer 20 and the clear glass cover plate 30; Be used for keeping predetermined gap between the reflection mirror array 22 of wafer 20 and the clear glass cover plate 30; And clear glass cover plate 30 is fixed on wafer 20 tops, so to form said numerical digit light source processing unit 10.Said numerical digit light source processing unit 10 utilizes image strip L1 to be incident to the reflection mirror array 22 of wafer 20 via transmission region 34, reflects via the reflection mirror array 22 of this wafer 20, to produce the projected light beam L2 of different reflection angles again.Yet said dark border 32 is positioned at the Lower Half of clear glass cover plate 30, therefore light leak L3 may take place.
With reference to figure 2, by ultraviolet L4 irradiation ultra-violet curing glue, make this ultra-violet curing glue form gap 40 usually.Yet dark border 32 can hinder ultraviolet L4 irradiation ultra-violet curing glue, so ultra-violet curing glue can't full solidification become gap 40, and then influences the constant intensity between clear glass cover plate 30 and the wafer 20.When over time, in the time of can't keeping predetermined gap between the reflection mirror array 22 of wafer 20 and the clear glass cover plate 20, the function of the reflection mirror array 22 of wafer 20 may lose efficacy.
Summary of the invention
In view of this, just having needs to propose a kind of optical-electric module that is used to handle signal of video signal, to address the above problem.
The present invention provides a kind of optical-electric module that is used to handle signal of video signal, and this optical-electric module comprises wafer, transparent cover plate, gap and non-printing opacity sealing.Said wafer comprises the signal of video signal processing region.Said transparent cover plate is configured in said wafer top, and said transparent cover plate comprises recess, and this recess is around around the said transparent cover plate.Said gap is configured between said wafer and the transparent cover plate, is used for keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top.Said non-printing opacity sealing is used to surround said wafer and transparent cover plate, and fills up said recess, and the said recess that wherein fills up said non-printing opacity sealing is limited with a transmission region, and this transmission region is corresponding to said signal of video signal processing region.
The present invention also provides a kind of optical-electric module that is used to handle signal of video signal, and this optical-electric module comprises: wafer, and this wafer comprises the signal of video signal processing region; Transparent cover plate, this transparent cover plate are configured in said wafer top; Gap son, this gap is configured between said wafer and the transparent cover plate, is used for keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top; Non-transparent material layer, this non-transparent material layer are configured in said transparent cover plate top, and have circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region.
The present invention also provides a kind of manufacturing approach that is used to handle the optical-electric module of signal of video signal; This manufacturing approach comprises the following steps: to provide wafer; This wafer comprises a plurality of vertical and horizontal lines of cut, and those lines of cut are limited with a plurality of wafers, and each wafer comprises the signal of video signal processing region; Above said wafer, dispose clear sheet, wherein said clear sheet comprises a plurality of vertical and horizontal lines of cut, and those lines of cut are limited with a plurality of transparent cover plates, and these a plurality of transparent cover plates correspond respectively to said a plurality of wafer; Between said wafer and transparent cover plate, form gap, with keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top; Above said transparent cover plate, form non-transparent material layer, wherein this non-transparent material layer has circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region; And cut said wafer and clear sheet along said line of cut, so make said wafer and transparent cover plate unification.
The present invention also provides a kind of manufacturing approach that is used to handle the optical-electric module of signal of video signal, and this method comprises the following steps: to provide wafer, and this wafer comprises a plurality of lines of cut, and those lines of cut are limited with a plurality of wafers, and each wafer comprises the signal of video signal processing region; Above said wafer, dispose clear sheet, wherein said clear sheet comprises a plurality of transparent cover plates, and these a plurality of transparent cover plates correspond respectively to said a plurality of wafer; Between said wafer and transparent cover plate, form gap, with keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top; Cut said wafer and clear sheet along said line of cut, so make said wafer and transparent cover plate unification; And above said transparent cover plate, form non-transparent material layer, and wherein said non-transparent material layer has circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region.
Compared to prior art, transparent cover plate of the present invention can not hinder ultraviolet irradiation ultra-violet curing glue, but so ultra-violet curing glue full solidification become gap son, and then increase the fixing and bond strength between transparent cover plate and the wafer.Moreover the recess that the present invention fills up non-printing opacity sealing is positioned at the first half of transparent cover plate, so light leak can not take place.
In order to let above-mentioned and other purposes of the present invention, characteristic and the advantage can be more obvious, hereinafter is special lifts the embodiment of the invention, and cooperates appended diagram, elaborates as follows.
Description of drawings
Fig. 1 is the generalized section of numerical digit light source processing unit of the optical-electric module of existing projector;
Fig. 2 is the generalized section of existing numerical digit light source processing unit, and it shows by ultraviolet irradiation ultra-violet curing glue, makes this ultra-violet curing glue form gap;
Fig. 3 to Figure 11 is the generalized section according to the optical-electric module manufacturing approach of first embodiment of the invention; And
Figure 12 to Figure 21 is the generalized section according to the optical-electric module manufacturing approach of second embodiment of the invention.
The main element symbol description
10 numerical digit light source processing units, 20 wafers
22 reflection mirror arrays, 30 clear glass cover plates
32 dark border, 34 transmission regions
40 gaps son 100 optical-electric modules
110 numerical digit light source processing units, 120 wafers
121 signal of video signal processing regions
122 reflection mirror arrays, 130 clear glass cover plates
132 recesses, 134 transmission regions
136 straight lines, 138 straight lines
140a ultra-violet curing glue 140b gap
142 substrates, 144 housings
146 run through opening 148 non-printing opacity sealings
150 wafers, 152 lines of cut
160 clear sheets, 200 optical-electric modules
210 numerical digit light source processing units, 220 wafers
221 signal of video signal processing regions
222 reflection mirror arrays, 230 clear glass cover plates
232 non-transparent material layer 234 transmission regions
240a ultra-violet curing glue 240b gap
242 substrates, 244 housings
246 run through opening 248 sealings
250 wafers, 252 lines of cut
260 clear sheets
D depth H thickness
L1 image strip L2 projected light beam
L3 ultraviolet ray L4 light leak
Embodiment
To Figure 11, it shows optical-electric module 100 manufacturing approaches according to first embodiment of the invention with reference to figure 3.Said optical-electric module can be handled signal of video signal, and can be applicable to projector.Said optical-electric module manufacturing approach comprises the following steps.With reference to figure 3, wafer 150 is provided, this wafer 150 comprises a plurality of vertical and horizontal lines of cut 152, and those lines of cut 152 are limited with a plurality of wafers 120, and each wafer 120 comprises signal of video signal processing region 121.Said wafer 120 can have complementary metal oxide semiconductors (CMOS) (CMOS), charge coupled cell (charge coupled device; CCD) or contact-type image sensing device (contact image sensor; CIS).With reference to figure 4,140a is coated on each wafer 120 with ultra-violet curing glue (UV glue).
With reference to figure 5; Clear sheet 160 is configured in this wafer 150 tops; Wherein clear sheet 160 comprises a plurality of vertical and horizontal lines of cut 152; Those lines of cut 152 are limited with a plurality of transparent cover plates 130, and these transparent cover plates 130 correspond respectively to said wafer 120, that is said transparent cover plate 130 is configured in wafer 120 tops.It is made that said transparent cover plate 130 can be glass.Each transparent cover plate 130 is formed with recess 132, and this recess 132 is around around the transparent cover plate 130.Recess 132 is positioned at the first half of transparent cover plate 130, that is recess 132 can not contact ultra-violet curing glue 140a.In follow-up step, this recess 132 will fill up non-printing opacity sealing, so recess 132 can be limited with a transmission region 134, and this transmission region 134 is corresponding to signal of video signal processing region 121.
With reference to figure 6,, make this ultra-violet curing glue 140a form gap son (spacer) 140b by ultraviolet L4 irradiation ultra-violet curing glue 140a.The sub-140b in this gap is used for keeping a predetermined gap between the signal of video signal processing region 121 of wafer 120 and the transparent cover plate 130, and transparent cover plate 130 is fixed on wafer 120 tops between wafer 120 and transparent cover plate 130.Compared to prior art, transparent cover plate of the present invention can not hinder ultraviolet irradiation ultra-violet curing glue, but so ultra-violet curing glue full solidification become gap son, and then increase the fixing and bond strength between transparent cover plate and the wafer.
With reference to figure 7; Along line of cut 152; Cutting crystal wafer 150 and clear sheet 160 so make wafer 120 and transparent cover plate 130 unification, and the numerical digit light source that makes wafer 120, the sub-140b in gap and transparent cover plate 130 form optical-electric module is handled (digital light processing; DLP) unit 110.With reference to figure 8, with regard to numerical digit light source processing unit 110, the section of the recess 132 of transparent cover plate 130 is formed with two straight lines 136,138, and the angle of these two straight lines 136,138 can be 90 degree.Said recess 132 has desired depth D, and this desired depth D can be between the thickness H of the thickness H of 1/4th transparent cover plate and 3/4ths transparent cover plate.Preferably, said desired depth D is the thickness H of 1/2nd transparent cover plate.Said signal of video signal processing region 121 comprises reflection mirror array (mirrorarray) 122.The numerical digit light source processing unit 110 of said optical-electric module utilizes image strip L1 to be incident to the reflection mirror array 122 of signal of video signal processing region 121 via transmission region 134; Reflect via the reflection mirror array 122 of signal of video signal processing region 121 again, to produce the projected light beam L2 (that is signal of video signal) of different reflection angles.
In the present embodiment, form the step of the recess 132 of transparent cover plate 130 earlier, and then carry out the step of cutting crystal wafer 150 and clear sheet 160.In another embodiment, also can carry out the step of cutting crystal wafer 150 and clear sheet 160 earlier, and then form the step of the recess 132 of transparent cover plate 130.
With reference to figure 9, wafer 120 and transparent cover plate 130 are fixed on substrate 142 tops, and wafer 120 is electrically connected to substrate 142.Substrate 142 can be circuit board.With reference to Figure 10, housing 144 is configured in transparent cover plate 130 tops, wherein housing 144 comprises and runs through opening 146, this runs through opening 146 corresponding to transmission region 134.It is made that housing 144 can be metal.
With reference to Figure 11, non-printing opacity sealing 148 is provided, be used to surround wafer 120 and transparent cover plate 130, covered substrate 142, and fill up recess 132, so to form optical-electric module 100 of the present invention.Said non-printing opacity sealing 148 can be black liquid state glue.The recess 132 that fills up non-printing opacity sealing 148 is limited with transmission region 134.Compared to prior art, the recess that the present invention fills up non-printing opacity sealing is positioned at the first half of transparent cover plate, so light leak L3 can not take place.
Referring to figs 12 to Figure 21, it has shown the optical-electric module manufacturing approach according to second embodiment of the invention.Optical-electric module can be handled signal of video signal, and can be applicable to projector.The optical-electric module manufacturing approach comprises the following steps.With reference to Figure 12, wafer 250 is provided, this wafer 250 comprises a plurality of vertical and horizontal lines of cut 252, and these lines of cut 252 are limited with a plurality of wafers 220, and each wafer 220 comprises signal of video signal processing region 221.Wafer 220 can have complementary metal oxide semiconductors (CMOS) (CMOS), charge coupled cell (charge coupled device; CCD) or contact-type image sensing device (contact imagesensor; CIS).With reference to Figure 13,240a is coated on each wafer 220 with ultra-violet curing glue (UV glue).
With reference to Figure 14; Clear sheet 260 is configured in wafer 250 tops; Wherein clear sheet 260 comprises a plurality of vertical and horizontal lines of cut 252; Those lines of cut 252 are limited with a plurality of transparent cover plates 230, and these transparent cover plates 230 correspond respectively to wafer 220, that is transparent cover plate 230 is configured in wafer 220 tops.It is made that said transparent cover plate 230 can be glass.
With reference to Figure 15,, make this ultra-violet curing glue 240a form the sub-240b in gap by ultraviolet L4 irradiation ultra-violet curing glue 240a.Sub-240b position, this gap is used for keeping predetermined gap between the signal of video signal processing region 221 of wafer 220 and the transparent cover plate 230, and transparent cover plate 230 is fixed on wafer 220 tops between wafer 220 and transparent cover plate 230.Compared to prior art, transparent cover plate of the present invention can not hinder ultraviolet irradiation ultra-violet curing glue, but so this ultra-violet curing glue full solidification become gap son, and then increase the fixing and bond strength between transparent cover plate and the wafer.
With reference to Figure 16, non-transparent material layer 232 is formed on transparent cover plate 230 tops.Said non-transparent material layer 232 has circular profile, and this circular profile is limited with a transmission region 234 at transparent cover plate 230, and this transmission region 234 is corresponding to signal of video signal processing region 221.Said non-transparent material layer 232 can be formed on transparent cover plate 230 tops by method for printing screen.It is made that said non-transparent material layer 232 can be the printing ink material.
With reference to Figure 17; Along line of cut 252; Cutting crystal wafer 250 and clear sheet 260 so make wafer 220 and transparent cover plate 230 unification, and the numerical digit light source that makes wafer 220, the sub-240b in gap and transparent cover plate 230 form optical-electric module is handled (digital light processing; DLP) unit 210.With reference to Figure 18, with regard to numerical digit light source processing unit 210, signal of video signal processing region 221 comprises reflection mirror array (mirror array) 222.The numerical digit light source processing unit 210 of optical-electric module utilizes image strip L1 to be incident to the reflection mirror array 222 of signal of video signal processing region 221 via transmission region 234; Reflect via the reflection mirror array 222 of signal of video signal processing region 221 again, to produce the projected light beam L2 (that is signal of video signal) of different reflection angles.
In the present embodiment, the advanced person is about to non-transparent material layer 232 and is formed on the step of transparent cover plate 230 tops, and then carries out the step of cutting crystal wafer 250 and clear sheet 260.In another embodiment, also can carry out the step of cutting crystal wafer 250 and clear sheet 260 earlier, and then carry out non-transparent material layer 232 is formed on the step of transparent cover plate 230 tops.
With reference to Figure 19, wafer 220 and transparent cover plate 230 are fixed on substrate 242 tops, and wafer 220 is electrically connected to substrate 242.Substrate 242 can be circuit board.With reference to Figure 20, housing 244 is configured in transparent cover plate 230 tops, wherein housing 244 comprises and runs through opening 246, this runs through opening 246 corresponding to transmission region 234.It is made that housing 244 can be metal.With reference to Figure 21, sealing 248 is provided, be used to surround wafer 220 and transparent cover plate 230, and covered substrate 242, so to form optical-electric module 200 of the present invention.Said sealing 248 can be black liquid state glue.Compared to prior art, therefore light leak L3 can not take place in non-transparent material layer of the present invention position above transparent cover plate.Moreover; Non-transparent material layer viewable design demand of the present invention; And changing the scope of transmission region easily, dark border and the clear glass cover plate that needn't be subject to prior art is integrally formed and make, and the dark border of prior art can't change the scope of transmission region easily.
Though the present invention is disclosed through said preferred embodiment, yet said embodiment is used to limit the present invention, any those skilled in the art are not breaking away from the spirit and scope of the present invention, should do various changes and modification.Therefore protection scope of the present invention should be as the criterion with the scope that appended claims was defined.
Claims (29)
1. optical-electric module that is used to handle signal of video signal, this optical-electric module comprises:
Substrate;
Wafer, this wafer configuration and are electrically connected to said substrate above said substrate, said wafer comprises the signal of video signal processing region;
Transparent cover plate, this transparent cover plate are configured in said wafer top, and said transparent cover plate comprises recess, and this recess is around around the said transparent cover plate;
Gap son, this gap is configured between said wafer and the transparent cover plate, is used for keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top;
Non-printing opacity sealing; This non-printing opacity sealing is used to surround said wafer and transparent cover plate, and covers said substrate, and fills up said recess; The said recess that wherein fills up said non-printing opacity sealing is limited with a transmission region, and this transmission region is corresponding to said signal of video signal processing region; And
Housing, this housing are configured in said transparent cover plate top, and contact with said non-printing opacity sealing, and this housing comprises also and run through opening that this runs through opening corresponding to said transmission region.
2. optical-electric module according to claim 1, wherein, the section of said recess is formed with two straight lines, and the angle of these two straight lines is 90 degree.
3. optical-electric module according to claim 2, wherein, said recess has desired depth, and this desired depth is between the thickness of the thickness of 1/4th said transparent cover plate and 3/4ths said transparent cover plate.
4. optical-electric module according to claim 3, wherein, said desired depth is the thickness of 1/2nd said transparent cover plate.
5. optical-electric module according to claim 1, wherein, said non-printing opacity sealing is a black liquid state glue.
6. optical-electric module according to claim 1, wherein, said signal of video signal processing region comprises reflection mirror array.
7. optical-electric module according to claim 1, wherein, said optical-electric module utilizes image strip to be incident to said signal of video signal processing region via said transmission region, produces signal of video signal via said signal of video signal processing region again.
8. optical-electric module according to claim 1, wherein, said housing is that metal is made.
9. optical-electric module according to claim 1, wherein, said transparent cover plate is that glass is made.
10. optical-electric module according to claim 1, wherein, said gap is that ultra-violet curing glue is made.
11. optical-electric module according to claim 1, wherein, said wafer has complementary metal oxide semiconductors (CMOS), charge coupled cell or contact-type image sensing device.
12. an optical-electric module that is used to handle signal of video signal, this optical-electric module comprises:
Substrate;
Wafer, this wafer configuration and are electrically connected to said substrate above said substrate, said wafer comprises the signal of video signal processing region;
Transparent cover plate, this transparent cover plate are configured in said wafer top;
Gap son, this gap is configured between said wafer and the transparent cover plate, is used for keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top;
Non-transparent material layer, this non-transparent material layer are configured in said transparent cover plate top, and have circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region;
Sealing, this sealing is used to surround said wafer and transparent cover plate, and covers said substrate; And
Housing, this housing are configured in said transparent cover plate top, and contact with said sealing, and this housing comprises also and run through opening that this runs through opening corresponding to said transmission region.
13. optical-electric module according to claim 12, wherein, said non-transparent material layer is that the printing ink material is made.
14. optical-electric module according to claim 12, wherein, said signal of video signal processing region comprises reflection mirror array.
15. optical-electric module according to claim 12, wherein, said optical-electric module utilizes image strip to be incident to said signal of video signal processing region via said transmission region, produces signal of video signal via said signal of video signal processing region again.
16. optical-electric module according to claim 12, wherein, said housing is that metal is made.
17. optical-electric module according to claim 12, wherein, said transparent cover plate is that glass is made.
18. optical-electric module according to claim 12, wherein, said gap is a ultra-violet curing glue.
19. optical-electric module according to claim 12, wherein, said wafer has complementary metal oxide semiconductors (CMOS), charge coupled cell or contact-type image sensing device.
20. a manufacturing approach that is used to handle the optical-electric module of signal of video signal, this manufacturing approach comprises the following steps:
Wafer is provided, and this wafer comprises a plurality of vertical and horizontal lines of cut, and those lines of cut are limited with a plurality of wafers, and each wafer comprises the signal of video signal processing region;
Above said wafer, dispose clear sheet, wherein said clear sheet comprises a plurality of vertical and horizontal lines of cut, and those lines of cut are limited with a plurality of transparent cover plates, and these a plurality of transparent cover plates correspond respectively to said a plurality of wafer;
Between said wafer and transparent cover plate, form gap, with keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top;
Above said transparent cover plate, form non-transparent material layer, wherein this non-transparent material layer has circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region;
Substrate is provided, said wafer and transparent cover plate is fixed on said substrate top, and said wafer is electrically connected to said substrate;
Housing is provided, this housing is configured in said transparent cover plate top, wherein said housing comprises and runs through opening that this runs through opening corresponding to said transmission region;
Sealing is provided, surrounding said wafer and transparent cover plate, and covers said substrate, wherein said housing contacts with said sealing; And
Cut said wafer and clear sheet along said line of cut, so make said wafer and transparent cover plate unification.
21. the manufacturing approach of optical-electric module according to claim 20, wherein, said non-transparent material layer is formed on said transparent cover plate top by method for printing screen.
22. the manufacturing approach of optical-electric module according to claim 21, wherein, said non-transparent material layer is that the printing ink material is made.
23. the manufacturing approach of optical-electric module according to claim 20 wherein, is configured in said transparent cover plate before the step of said wafer top, said manufacturing approach also comprises the following steps:
Ultra-violet curing glue is coated on each wafer.
24. the manufacturing approach of optical-electric module according to claim 23 wherein, by the said ultra-violet curing glue of ultraviolet irradiation, makes said ultra-violet curing glue form said gap.
25. a manufacturing approach that is used to handle the optical-electric module of signal of video signal, this method comprises the following steps:
Wafer is provided, and this wafer comprises a plurality of lines of cut, and those lines of cut are limited with a plurality of wafers, and each wafer comprises the signal of video signal processing region;
Above said wafer, dispose clear sheet, wherein said clear sheet comprises a plurality of transparent cover plates, and these a plurality of transparent cover plates correspond respectively to said a plurality of wafer;
Between said wafer and transparent cover plate, form gap, with keeping predetermined gap between the signal of video signal processing region of said wafer and the transparent cover plate, and said transparent cover plate is fixed on said wafer top;
Cut said wafer and clear sheet along said line of cut, so make said wafer and transparent cover plate unification;
Substrate is provided, said wafer and transparent cover plate is fixed on said substrate top, and said wafer is electrically connected to said substrate;
Housing is provided, this housing is configured in said transparent cover plate top, wherein said housing comprises and runs through opening that this runs through opening corresponding to said transmission region;
Sealing is provided, surrounding said wafer and transparent cover plate, and covers said substrate, wherein said housing contacts with said sealing; And above said transparent cover plate, form non-transparent material layer, and wherein said non-transparent material layer has circular profile, and this circular profile is limited with a transmission region at said transparent cover plate, and this transmission region is corresponding to said signal of video signal processing region.
26. the manufacturing approach of optical-electric module according to claim 25, wherein, said non-transparent material layer is formed on said transparent cover plate top by method for printing screen.
27. the manufacturing approach of optical-electric module according to claim 26, wherein, said non-transparent material layer is that the printing ink material is made.
28. the manufacturing approach of optical-electric module according to claim 25 wherein, is configured in said transparent cover plate before the step of said wafer top, said manufacturing approach also comprises the following steps:
Ultra-violet curing glue is coated on each wafer.
29. the manufacturing approach of optical-electric module according to claim 28 wherein, by the said ultra-violet curing glue of ultraviolet irradiation, makes said ultra-violet curing glue form said gap.
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| CN2009101690554A CN102024827B (en) | 2009-09-17 | 2009-09-17 | Photoelectric module for processing image signal and method for manufacturing same |
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| CN102901921B (en) * | 2012-09-21 | 2015-01-14 | 中国空间技术研究院 | Universal chip protection device for single-particle tests |
| CN106449680A (en) * | 2016-09-21 | 2017-02-22 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
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| CN101261944A (en) * | 2007-03-07 | 2008-09-10 | 矽品精密工业股份有限公司 | Sensing semiconductor encryption part and its making method |
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