CN102019630A - Film cutting cutter and film cutting equipment - Google Patents

Film cutting cutter and film cutting equipment Download PDF

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Publication number
CN102019630A
CN102019630A CN 201010516841 CN201010516841A CN102019630A CN 102019630 A CN102019630 A CN 102019630A CN 201010516841 CN201010516841 CN 201010516841 CN 201010516841 A CN201010516841 A CN 201010516841A CN 102019630 A CN102019630 A CN 102019630A
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CN
China
Prior art keywords
support
knife tool
blade
tool according
cutting membrane
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Granted
Application number
CN 201010516841
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Chinese (zh)
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CN102019630B (en
Inventor
张明星
孙耀
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SHANGHAI JIMEI ELECTRNIC TECHNOLOGY CO LTD
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SHANGHAI JIMEI ELECTRNIC TECHNOLOGY CO LTD
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Priority to CN 201010516841 priority Critical patent/CN102019630B/en
Publication of CN102019630A publication Critical patent/CN102019630A/en
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Publication of CN102019630B publication Critical patent/CN102019630B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a film cutting cutter comprising a blade. The film cutting cutter is characterized in that: the blade is mounted on a bracket in an adjustable angle; the film cutting cutter further comprises a first elastic resetting device which can generate an elastic deformation force with the variation of the angle of the blade; and the elastic deformation force can enable the blade to reset to the state of which the angle is unchanged. By adopting the film cutting cutter and the film cutting equipment, the defect of the original cutting cutter device that flash is generated on a straight side boundary of a wafer is changed; for the wafer with any shape or other base bodies needing to cut the thin film, the flash is not generated during cutting; and the quality of the sticking film is improved. The film cutting cutter in the invention has little requirement on operators, improves the production efficiency of the enterprise, saves the production cost and guarantees the safety of the wafer.

Description

Cutting membrane knife tool and cut film device
Technical field
The present invention relates to a kind of cutting membrane knife tool and cut film device.
Background technology
Usually with the wafer circuit face, the side of promptly finishing chip functions is called the front, and one side is the back side in addition.In the wafer fabrication processes, be various uses, often need paste thin film at crystal column surface.A kind of film is arranged at cutting crystal wafer time protection wafer, be called the cutting film, the cutting film pastes at wafer rear.The film that has is to shield in other operation, is to protect wafer in the wafer thinning process as the attenuate film.After the attenuate film is pasted on wafer, the attenuate film need be trimmed to identical with the shape of wafer.And the attenuate film that uses in the prior art is rectangular, and wafer generally is circular or the circle of band straight flange, therefore, pastes the attenuate membranectomy that needs unnecessary at the attenuate film behind crystal column surface.
For guaranteeing that cutting glued membrane edge, back and crystal round fringes suit, periphery no unnecessary glued membrane (being called overlap), cutter need carry out slight contacting with wafer when radial location, cutter radially are being subjected to certain pulling force to center of circle direction simultaneously, make cutter just in time near wafer.Wherein a kind of film device of cutting, the form of cutter adopt the rocking handle design, by manually shaking handle one circle, can make orbiting motion one circle of cutter along circle.When cutting standard circular wafer, this device can be finished the work preferably.But when as shown in Figure 1 the wafer 1 of band straight flange of cutting, not only on the arc limit 11 with straight flange 12 intersections, can produce apparent in view overlap, and all can have overlap along whole piece right-angle side 12.The reason that produces overlap has two, the one, cutter are when move on the arc limit 11 of wafer, its blade towards being to adapt to 11 cutting attenuate films along the arc limit, when blade moves to straight flange 12, the angle of cutter can't be adjusted, cutting along straight flange 12 towards being adjusted into adaptation of blade causes having overlap along straight flange 12; The 2nd, blade moves along arc limit 11 and transfers to when straight flange 12 moves, because the cutting angle of cutter can't in time adapt to the unexpected variation of wafer shape, causes producing overlap at intersection.
For removing unnecessary overlap, after cutting first, also need to reuse cutter and carry out partial trim.Even partial trim can be removed overlap, also make this method have following shortcoming and defect:
1) increases operation, reduced production efficiency, improved cost.The pad pasting that an equipment normal condition can be finished 60 left and right sides wafers in next hour carries out manual rest and reorganization if desired, and per hour production capacity will reduce half, perhaps need to increase operating personnel.This has increased production cost greatly concerning enterprise.
2) increased the fragmentation risk.When manual rest and reorganization overlap, need the people directly wafer to be operated.And the wafer that uses in the prior art is just increasing, and simultaneously also more and more thinner, it is very fragile that wafer itself becomes, and is very easy to break.Therefore, manually rest and reorganization will become very difficult, be easy to cause the wafer fragmentation.
3) overlap of manually resting and reorganizing has proposed higher requirement to operating personnel's level, and glued membrane shape, production efficiency, wafer fragmentation probability after different operating personnel rest and reorganize all have difference, is unfavorable for the automation that enterprise produces and the uniformity of product quality.
Summary of the invention
First purpose of the present invention is in order to overcome deficiency of the prior art, a kind of cutting membrane knife tool that reduces the overlap of cutting in the membrane process to be provided.
For realizing above purpose, the present invention is achieved through the following technical solutions:
The cutting membrane knife tool comprises blade, it is characterized in that, described blade angle is installed on the support adjustablely; Also comprise first elasticity reset device, first elasticity reset device can produce the elastic deformation force along with the variation of blade angle, and this elastic deformation force can make blade return back to the unchanged state of angle.
Preferably, described blade is installed on the swinging mounting, and described swinging mounting is rotatably installed on the support; When swinging mounting rotated, first elasticity reset device produced the elastic deformation force along with the rotation of swinging mounting, and this elastic deformation force can make swinging mounting return back to the preceding state that do not rotate.
Preferably, described first elasticity reset device is selected from a kind of in spring, torsion spring and the volute spring of extension spring, compression.
Preferably, described swinging mounting is shaft-like, and described support is provided with inner groovy; Described swinging mounting passes support, and an end is positioned at inner groovy, and the other end protrudes in support, and blade is installed on the described other end; First volute spring is installed in the described inner groovy, and the described first volute spring outer end is connected on the support, and the inner is connected on the swinging mounting.
Preferably, described blade is installed on the knife rest, is installed on the swinging mounting to described knife rest adjustable angle.
Preferably, described knife rest is set in the swinging mounting end; First holding device is installed on the knife rest, and described first holding device can pass support and withstand swinging mounting, and both are fixedly connected.
Preferably, described support linear position is installed on first frame adjustablely.
Preferably, also comprise second elasticity reset device, described second elasticity reset device produces elastic force along with the variation of backing positions, and this elastic force can make support return back to and not move preceding position.
Preferably, described second elasticity reset device is selected from a kind of in extension spring, compression spring, torsion spring, volute spring and the elastic webbing.
Preferably, on first frame mandrel is installed, runner is rotatably installed on the mandrel; Described second elasticity reset device is second volute spring; Described second volute spring the inner is connected on the mandrel, and the outer end is connected on the runner; Runner is connected by connecting band or connection cord with support.
Preferably, on first frame mandrel is installed, runner is rotatably installed on the mandrel; Runner is connected by elastic webbing with support, and described elastic webbing produces elastic force along with the variation of backing positions, and this elastic force can make support return back to and not move preceding position.
Preferably, also comprise guider, when described backing positions is adjusted along the guider adjustment.
Preferably, described guider is a guide post, and described support is provided with first through hole, and described support casing is contained on the guide post and can moves along guide post.
Preferably, described first frame is installed on second frame movably.
Preferably, described second frame is provided with second through hole, and described first frame is provided with connecting rod, and described connecting rod passes second through hole and can move in second through hole.
Preferably, also comprise jockey, described jockey can insert second frame is connected with connecting rod.
Preferably, described connecting rod is provided with tag line.
First purpose of the present invention is in order to overcome deficiency of the prior art, and a kind of film device of cutting that reduces the overlap cut in the membrane process is provided.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Cut film device, it is characterized in that, comprise aforesaid cutting membrane knife tool, also comprise gripper shoe, described gripper shoe is provided with the groove that can allow blade to insert when blade is cut film.
Preferably described groove is provided with at least one circle according to the shape of wafer.
Preferably, described groove is provided with multi-turn according to the shape of the wafer of different size, and the multi-turn groove is provided with one heart.
The present invention has the following advantages:
1, uses the cutting membrane knife tool among the present invention or cut film device, changed original cutter device can produce overlap at wafer straight flange intersection deficiency, no matter the wafer for which kind of shape still is other matrix that need cut film, when cutting, can not produce overlap, improved the pad pasting quality.
2, use the cutting membrane knife tool among the present invention or cut film device, do not need to carry out again manual rest and reorganization after cutting is finished, reduced production process, can improve enterprises production efficiency, save production cost.
3, use the cutting membrane knife tool among the present invention or cut film device,, do not need staff directly wafer to be operated, and the power that cutter put on the wafer is determined, can guarantee the safety of wafer after debugging is finished than the manual film cutting apparatus of resting and reorganizing of needs.
4, use the cutting membrane knife tool among the present invention or cut film device, than the manual film cutting apparatus of resting and reorganizing of needs, operate simpler, to operating personnel require low, only need simply train the operation of the equipment of can finishing, help improving the ability that enterprise automation is produced.
Description of drawings
Fig. 1 is a kind of wafer shape schematic diagram of the prior art.
Fig. 2 is the structural representation of the embodiment of the invention 1.
Fig. 3 is the front view of Fig. 2.
Fig. 4 is a runner internal structure schematic diagram.
Fig. 5 is support, knife rest and cutter structural representation.
Fig. 6 is the swinging mounting structural representation.
Fig. 7 is the structural representation of embodiment 3.
Analysis chart when Fig. 8 is embodiment 3 uses.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described in detail:
Embodiment 1
Fig. 2 is the structural representation of the embodiment of the invention 1.Fig. 3 is the front view of Fig. 2.As Fig. 2, shown in Figure 3, the cutting membrane knife tool comprises that second frame, 200, the second frames 200 are arranged on the bracing or strutting arrangement (not shown) rotationally, and is provided with the rocking handle (not shown), by rotatable second frame 200 of rocking handle.Second frame 200 is provided with the second through hole (not shown) and the 3rd hole 202.Bolt 201 can penetrate in second through hole by the 3rd hole 202.
First frame 300 is provided with connecting rod 301.Connecting rod 301 passes second through hole and can move in second through hole.Connecting rod 301 is provided with a plurality of along screwed hole arranged in a straight line 303; When first frame 300 is positioned at assigned address, utilize bolt 201 to pass the 3rd hole 202 and be threaded with screwed hole 303, connecting rod 301 can be fixedlyed connected with second frame 200.Adjust the position of first frame 300 as need, turn bolt 201 can be adjusted the position of first frame 300.Connecting rod 301 is provided with tag line 302.The setting of tag line 302 can be decided according to the size of wafer; Purpose is convenient when adjusting the position of connecting rod 301, can determine the wafer size that cutter were fit to easily according to tag line 302.Tag line 302 comprises 8,6,5 and 4, and representative is fit to the size of the wafer of cutting respectively.When which bar tag line is the second through hole left side edge 203 be positioned at, meaning that the cutter among the present invention is fit to the film of the wafer of several inches of cuttings.As shown in Figure 3, at this moment, the second through hole left side edge 203 is positioned at and is designated 4 tag line 302 places, means that cutter among the present invention is fit to the film that pastes on the wafer of 4 inches of cuttings.
On first frame 300 mandrel 310 is installed.Runner 320 is rotatably installed on the mandrel 310.Fig. 4 is a runner internal structure schematic diagram.As shown in Figure 5, runner 320 has cavity volume 321, is provided with second volute spring 322 in the cavity volume 321.Second volute spring, 322 the inners are connected with mandrel 310, and the outer end is connected with runner 320.Mandrel 310 can not rotate, and runner 320 can rotate.When runner 320 rotates, can make 322 tensionings of second volute spring and produce elastic force, this elastic force can make runner 320 return back to state before not rotating.
Fig. 5 is support, knife rest and cutter structural representation.As Fig. 2, Fig. 3 and shown in Figure 5, two parallel guide posts (341,342) are installed also on first frame 300.The mounting means of two guide posts (341,342) is identical.Mounting means with guide post 341 is the example explanation.First frame 300 is provided with two support arms (343,344) that protrude in first frame 300.Two support arms (343,344) are provided with at interval.Support arm 343 is provided with third through-hole 345, and after guide post 341 passed third through-hole 345, an end was connected on the support arm 344.Guide post 341 1 ends are connected on the support arm 344, and the other end is connected on the support arm 343.Its connected mode can adopt known manner to connect, for example, a groove can be set on support arm 344, guide post 341 1 ends insert in this groove, at guide post 341 other ends nut of a diameter greater than third through-hole 345 diameters is installed, nut utilizes nut guide post 341 can be installed on support arm 343 and the support arm 344 between support arm 343 and support arm 344.And guide post 341 and the certain at interval distance of first frame 300.
Support 400 both sides are respectively arranged with a projection (401,402).Projection 401 is provided with first through hole 403.Projection 402 is provided with first through hole 404.Guide post 341 passes first through hole 403; Guide post 342 passes first through hole 404.Guide post 341 is connected support 400 with guide post 342 with first frame 300, and support 400 can move along guide post 341 and guide post 342.
Support 400 and the certain at interval distance of runner 320.Connecting band 350 1 ends are connected on the outer surface of runner 320, make connecting band 350 can be wrapped in runner 320 outer surfaces when runner 320 rotates according to a certain direction; When runner 320 reverse rotations, connecting band 350 again can be around getting off from the runner 320.Runner 320 other ends are connected with support 400.When runner 320 rotates, can spur support 400 and move, that is to say that the axis of runner 320 is vertical with the moving direction of support 400 along guide post (341,342).
Support 400 is provided with inner groovy 405.Be provided with first volute spring 406 in the inner groovy 405.
Fig. 6 is the swinging mounting structural representation.As Fig. 2, shown in Figure 6, swinging mounting 500 is shaft-like.Swinging mounting 500 passes support 400, one ends and is positioned at inner groovy 405, and the other end protrudes in support 400.And swinging mounting 500 is rotatable.Be provided with first volute spring 406 in the inner groovy 405.First volute spring, 406 the inners are connected with swinging mounting 500, and the other end is fixedly connected on the cell wall of inner groovy 405.When swinging mounting 500 rotation, can make 406 tensionings of first volute spring and produce elastic force, this elastic force can make swinging mounting 500 return back to state before not rotating.
As Fig. 2, shown in Figure 3, the other end of swinging mounting 500 is equipped with knife rest 600.Knife rest 600 is sleeved on the swinging mounting 500.First puller bolt 601 is installed on the knife rest 600.After knife rest 600 is sleeved on the swinging mounting 500, can utilize first puller bolt 601 to hold out against swinging mounting 500, make both fixedly connected.Knife rest 600 lower ends are fixedly connected with blade 700, and blade 700 has blade.As need adjust blade towards, rotatable first puller bolt 601 is removed its pressure to swinging mounting 500, rotating turret 600 to blade towards meeting the requirements, turn first puller bolt 601 makes it hold out against swinging mounting 600.With this, can adjust the angle of blade 700.
Described first volute spring of present embodiment and second volute spring can be described as disc spring or plane scroll shape spring again.
Blade in the present embodiment in cutting process, both can utilize first volute spring 406 to adjust the angles of blades 700 automatically after fixing, promptly blade towards; Can utilize second volute spring 322 to adjust the linear position of blade 700 again.
First volute spring 406 in the present embodiment can also use torsion spring, extension spring or compression spring to replace, as long as its structural design can make swinging mounting 500 rotate and swinging mounting 500 is produced elastic force that the state that this elastic force can make swinging mounting 500 return back to before not rotating gets final product.When reality cutting attenuate film, when being cut to wafer arc limit and straight flange intersection, it not is very greatly that angle changes, therefore, when using torsion spring, extension spring or compression spring to replace first volute spring 406, need not to carry out complicated structural adjustment, still can realize purpose of the present invention.
Embodiment 2
The difference of itself and embodiment 1 is that runner 322 is not provided with cavity volume, omits second volute spring 322.Connecting band 350 has elasticity.Along with the rotation of runner 322, connecting band 350 can be stretched and produce elastic force, and this elastic force can make the state before runner 322 returns back to not rotation.Under the situation that connecting band 350 is stretched in advance, the elastic force of its generation can spur support 400 and move along guide post 341 and guide post 342.
All the other structures are identical with embodiment 1.
Embodiment 3
Fig. 7 is the structural representation of embodiment 3.As shown in Figure 7, cut film device, except that the cutting membrane knife tool that comprises embodiment 1.Also comprise wafer support device 800.Wafer support device 80 upper surfaces are provided with two circle grooves (801,802), and two circle grooves (801,802) all have certain degree of depth, so that blade 700 can insert into the inner, and can move along its cell wall in groove 801 or in the groove 802.Two circle grooves (801,802) are all according to the shape and the size setting of wafer.The zone that each groove surrounds is identical with a kind of wafer size of size.Therefore, the wafer support device 800 in the present embodiment is applicable to the wafer cutting attenuate film that is multiple size.
Analysis chart when Fig. 8 is embodiment 3 uses.As shown in Figure 8, during use, wafer is placed on the wafer support device, and its edge is alignd with a circle groove such as groove 801 inner edges.Second frame 200 is rotatably mounted, and is positioned at the top of wafer.Adjust the position of first frame 300, blade 700 can be walked along its inner edge in groove 801.At this moment, first volute spring 406 is in tensioning state, and swinging mounting 500 is had elastic force, because blade 700 is subjected to the restriction of groove 801 walls, blade 700 is close to groove 801.Second volute spring also is in tensioning state and produces elastic force 322 this moments, and this elastic force also can make support 400 drive blade 700 and move along guide post 341 and guide post 342, but because blade 700 is subjected to stopping of groove 801 inwalls, support 400 can't move.Rotate second frame 200 its drive blade 700 is walked in groove 801, constantly cut the attenuate film.When the arc limit of wafer turned to straight flange, because the variation of groove 801 shapes, the barrier force of blade 700 also changed at blade 700, and the elastic force of first volute spring 406 rotates blade 700, to adapt to the straight flange shape of groove 801.Because the distance in the straight flange place and the wafer center of circle shortens, therefore, the elastic force of 322 pairs of supports 400 of second volute spring can make blade 700 be close to the straight flange walking.
Embodiment 4
Cutting membrane knife tool among the present embodiment use embodiment 2 and the wafer support device among the embodiment 3.Using method is identical with embodiment 3.
Embodiment among the present invention only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection domain of the present invention.

Claims (20)

1. the cutting membrane knife tool comprises blade, it is characterized in that, described blade angle is installed on the support adjustablely; Also comprise first elasticity reset device, first elasticity reset device can produce the elastic deformation force along with the variation of blade angle, and this elastic deformation force can make blade return back to the unchanged state of angle.
2. cutting membrane knife tool according to claim 1 is characterized in that described blade is installed on the swinging mounting, and described swinging mounting is rotatably installed on the support; When swinging mounting rotated, first elasticity reset device produced the elastic deformation force along with the rotation of swinging mounting, and this elastic deformation force can make swinging mounting return back to the preceding state that do not rotate.
3. cutting membrane knife tool according to claim 1 is characterized in that, described first elasticity reset device is selected from a kind of in spring, torsion spring and the volute spring of extension spring, compression.
4. cutting membrane knife tool according to claim 1 and 2 is characterized in that, described swinging mounting is shaft-like, and described support is provided with inner groovy; Described swinging mounting passes support, and an end is positioned at inner groovy, and the other end protrudes in support, and blade is installed on the described other end; First volute spring is installed in the described inner groovy, and the described first volute spring outer end is connected on the support, and the inner is connected on the swinging mounting.
5. cutting membrane knife tool according to claim 4 is characterized in that described blade is installed on the knife rest, is installed on the swinging mounting to described knife rest adjustable angle.
6. cutting membrane knife tool according to claim 5 is characterized in that described knife rest is set in the swinging mounting end; First holding device is installed on the knife rest, and described first holding device can pass support and withstand swinging mounting, and both are fixedly connected.
7. cutting membrane knife tool according to claim 1 is characterized in that, described support linear position is installed on first frame adjustablely.
8. cutting membrane knife tool according to claim 7 is characterized in that, also comprises second elasticity reset device, and described second elasticity reset device produces elastic force along with the variation of backing positions, and this elastic force can make support return back to and not move preceding position.
9. cutting membrane knife tool according to claim 8 is characterized in that, described second elasticity reset device is selected from a kind of in extension spring, compression spring, torsion spring, volute spring and the elastic webbing.
10. cutting membrane knife tool according to claim 8 is characterized in that, on first frame mandrel is installed, and runner is rotatably installed on the mandrel; Described second elasticity reset device is second volute spring; Described second volute spring the inner is connected on the mandrel, and the outer end is connected on the runner; Runner is connected by connecting band or connection cord with support.
11. cutting membrane knife tool according to claim 8 is characterized in that, on first frame mandrel is installed, runner is rotatably installed on the mandrel; Runner is connected by elastic webbing with support, and described elastic webbing produces elastic force along with the variation of backing positions, and this elastic force can make support return back to and not move preceding position.
12. cutting membrane knife tool according to claim 7 is characterized in that, also comprises guider, when described backing positions is adjusted along the guider adjustment.
13. cutting membrane knife tool according to claim 12 is characterized in that, described guider is a guide post, and described support is provided with first through hole, and described support casing is contained on the guide post and can moves along guide post.
14. cutting membrane knife tool according to claim 7 is characterized in that, described first frame is installed on second frame movably.
15. cutting membrane knife tool according to claim 14 is characterized in that, described second frame is provided with second through hole, and described first frame is provided with connecting rod, and described connecting rod passes second through hole and can move in second through hole.
16. cutting membrane knife tool according to claim 15 is characterized in that, also comprises jockey, described jockey can insert second frame is connected with connecting rod.
17. cutting membrane knife tool according to claim 15 is characterized in that described connecting rod is provided with tag line.
18. cut film device, it is characterized in that, comprise the described cutting membrane knife tool of aforementioned arbitrary claim, also comprise gripper shoe, described gripper shoe is provided with the groove that can allow blade to insert when blade is cut film.
19. the film device of cutting according to claim 18 is characterized in that, described groove is provided with at least one circle according to the shape of wafer.
20. the film device of cutting according to claim 19 is characterized in that described groove is provided with multi-turn according to the shape of the wafer of different size, the multi-turn groove is provided with one heart.
CN 201010516841 2010-10-22 2010-10-22 Film cutting cutter and film cutting equipment Expired - Fee Related CN102019630B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010516841 CN102019630B (en) 2010-10-22 2010-10-22 Film cutting cutter and film cutting equipment

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Application Number Priority Date Filing Date Title
CN 201010516841 CN102019630B (en) 2010-10-22 2010-10-22 Film cutting cutter and film cutting equipment

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CN102019630B CN102019630B (en) 2013-01-23

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105946026A (en) * 2016-06-17 2016-09-21 浙江钱江摩托股份有限公司 Film cutting machine
TWI631607B (en) * 2017-08-09 2018-08-01 志聖工業股份有限公司 Film cutting device and film cutting method thereof
CN109390248A (en) * 2017-08-09 2019-02-26 志圣科技(广州)有限公司 Film cutting apparatus and its cut film method
CN115384883A (en) * 2022-10-27 2022-11-25 佛山市川东磁电股份有限公司 Film-coated packaging equipment for processing thermopile sensor chip

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CN1663755A (en) * 2004-03-05 2005-09-07 亿丰综合工业股份有限公司 Method and apparatus for automatically defining cutting length by reading window curtain member code
US20050268766A1 (en) * 2004-06-02 2005-12-08 Rexon Industrial Corp. Ltd. Angle indicator for miter saw
CN2822911Y (en) * 2005-08-01 2006-10-04 双喜彬 Machine for cutting special shaped visiting-cards

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1663755A (en) * 2004-03-05 2005-09-07 亿丰综合工业股份有限公司 Method and apparatus for automatically defining cutting length by reading window curtain member code
US20050268766A1 (en) * 2004-06-02 2005-12-08 Rexon Industrial Corp. Ltd. Angle indicator for miter saw
CN2822911Y (en) * 2005-08-01 2006-10-04 双喜彬 Machine for cutting special shaped visiting-cards

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105946026A (en) * 2016-06-17 2016-09-21 浙江钱江摩托股份有限公司 Film cutting machine
CN105946026B (en) * 2016-06-17 2017-12-29 浙江钱江摩托股份有限公司 A kind of film cutting machine
TWI631607B (en) * 2017-08-09 2018-08-01 志聖工業股份有限公司 Film cutting device and film cutting method thereof
CN109390248A (en) * 2017-08-09 2019-02-26 志圣科技(广州)有限公司 Film cutting apparatus and its cut film method
CN115384883A (en) * 2022-10-27 2022-11-25 佛山市川东磁电股份有限公司 Film-coated packaging equipment for processing thermopile sensor chip
CN115384883B (en) * 2022-10-27 2023-02-03 佛山市川东磁电股份有限公司 Film-coated packaging equipment for processing thermopile sensor chip

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