CN102014602A - Design method for improving electromagnetic compatibility performance of high-power element and high-power element module - Google Patents
Design method for improving electromagnetic compatibility performance of high-power element and high-power element module Download PDFInfo
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Abstract
The invention relates to a design method for improving the electromagnetic compatibility performance of a high-power element and a high-power element module. In the method, four parts are used, namely, the printed circuit board (PCB) module of a single high-power element, the PCB modules of a plurality of series high-power elements, a PCB module formed by connecting a plurality of input/output ports in series, and the PCB module formed by input or output ports with one shared end. The structure of a current circuit is used for offsetting a plurality of electromagnetic fields mutually, thus realizing the purpose of high-performance electro magnetic compatibility (EMC).
Description
Technical field
The present invention relates to integrated circuit and board design field, particularly a kind of method for designing that improves high power device or high power device module Electro Magnetic Compatibility.The raising of Electro Magnetic Compatibility is a pair of the sub-loop of cancelling each other to be realized by constructing: sub-loop can be cancelled each other the electromagnetic radiation of self, and when the extraneous interference of electromagnetic field, the induced current equal and opposite in direction that each produces sub-loop, direction is opposite, has reduced the external electromagnetic field interference intensity.
Background technology
Current EMC design, aspect pcb board, mainly the wiring rule by ground wire and holding wire guarantees, as designs independent earth cord network, large-signal and small-signal and separate etc.; In the board design of function complexity, earlier circuit board is carried out subregion, between subregion, adopt cabling to connect, avoid each difference in functionality district that the electromagnetic interference of other subregions is reduced according to function, be not subjected to simultaneously the electromagnetic interference effect of other subregions, guarantee operate as normal.When above design can not meet the demands, then adopt the mode of metallic shield, as shown in Figure 1.
1 is metal shell, is connected with the current potential of fixing, and generally is connected with ground wire; 2 for providing the polylith PCB of properties of product, i.e. electromagnetic radiation source; 3 is the hole of opening on the metal shell, uses for purposes such as heat radiations.
Present mode use for general communication or household electrical appliance circuit board, and method is simple, and cost increases few; But in the occasion that can not use metal material to shield, the method is inapplicable.As illuminating light fixture, particularly large-power lamp and the light fixture that on the naval vessel, uses, owing to bulb need be exposed outside metal shell, and the electric current on the filament of bulb is very big, and the high-power filament of bulb that waits is longer, and the electromagnetic interference that causes is just very big; The LED light fixture of current use, because the aluminium base of LED and power supply is exposed simultaneously outside, the electromagnetic interference that causes can't shield.
The shortcoming of conventional method is:
Use shielding material, increased cost.
Under some occasion, inapplicable, as light fixture.
In extraordinary place, the electromagnetic interference that product breakage causes produces bad interference to miscellaneous part.
Metal shell firmly and for a long time need be connected well with ground wire.
The maximum length at perforate position is less than 5% of electromagnetic wavelength.
Summary of the invention
In view of the defective of said method, the present invention is by the method for a plurality of electromagnetic fields of cancelling each other at each current circuit structure itself, thereby overcomes the defective of said method.
The present invention realizes by the following method.
Identification PCB goes up an interior current circuit;
On each current circuit, the opposite sub-loop of structure electromagnetic field direction;
Calculate, measure or approximate method, separated time in the equivalent current of acquisition device;
The area of the electromagnetic field sub-loop that calculating is cancelled each other, the area of the electromagnetic field sub-loop that assurance is cancelled each other equates;
Sub-loop mask placement device according to design;
Method is used in entire circuit plate and a plurality of circuit board.
Be illustrated in figure 2 as the driving cabling of improved high power device.Comprise 3 parts: power supply module, cabling and high power device.
The power supply module is thought the assembly that keeps electromagnetism to mourn in silence, and its electromagnetic interference is in scope of design.High power device is to need to expose to work outside, can't carry out the electromagnetic shielding of metal material.
Annexation is: the power supply module is from A1 port output current, arrive the positive input terminal of high power device through A2, A3, A4, A5, A6, A7, the electric current high power device of flowing through, high power device is driven, voltage reduces, flow out from the B7 port,, flow back to power supply module port B1 through B6, B5, B4, B3, B2.Wherein S1, S2 are two virtual crosspoints of current circuit, and in fact two cablings are on the different aspects of circuit board; S3 is the virtual crosspoint of counter circuit area, line segment B3B4 is prolonged the intersection point of back and line segment A4A5.
During operate as normal, the current path of high power device inside is assumed to the straight line from port A7 to port B7, then constitutes a current circuit by A6, A7, B7, B6, S2, and the magnetic direction of its initiation comes head-on; B4, B5, S2, A5, S3 constitute the another one current circuit, the magnetic direction of its initiation away from and go.Because the propagation velocity of the signal of telecommunication is very fast, at two current in loop equal and opposite in directions, the size of the electromagnetic field of initiation is relevant with the area in loop, and when the area in two loops equated, the electromagnetic field of two loop generations was cancelled each other.
On current path, can make a plurality of paired current circuits.The current circuit that A1, A2, S1, B2, B1 constitute, the magnetic direction of its initiation comes head-on; The current circuit that B3, B4, S3, A4, A3 constitute, the magnetic direction of its initiation away from and go.When the area equal and opposite in direction in two loops, the electromagnetic field that two loops produce is cancelled each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
Major advantage of the present invention is:
Most of electromagnetic field is cancelled each other, and particularly under the situation of the big electric current of low frequency, need not metallic shield, just can reach the requirement of EMC.
Though separated time can not accurately obtain in the equivalent current of device inside, device by the direction and the angle of placing, can be offset the problem that the separated time error causes in the equivalent current electromagnetic field can not be offset when placing.
Under the occasion that can not use metallic shield, in the design as lighting, can adopting said method; Even circuit board is exposed outside, its Electro Magnetic Compatibility remains unchanged substantially.
Need not to increase cost, do not need to change circuit and product structure.
When the size of circuit board during much smaller than operation wavelength, the method is suitable substantially.
In order to improve performance, can increase a plurality of paired current circuits, the area that dwindles each current circuit gets final product.
Be applicable to the pcb board of multiple material.
Description of drawings
Fig. 1: present electromagnetic compatibility (EMC) structural representation
Fig. 2: at the electromagnetism offset loop-multi-layer PCB structure of single high power device structure;
Fig. 3: at the electromagnetism offset loop-individual layer PCB structure of single high power device structure;
Fig. 4: at the electromagnetism offset loop-multi-layer PCB structure of even number high power device series configuration;
Fig. 5: at the electromagnetism offset loop-individual layer PCB structure of even number high power device series configuration;
Fig. 6: at the electromagnetism offset loop-multi-layer PCB structure of odd number high power device series configuration;
Fig. 7: at the electromagnetism offset loop-individual layer PCB structure of odd number high power device series configuration;
Fig. 8: at the electromagnetism offset loop-multi-layer PCB structure of a plurality of high power device series configuration;
Fig. 9: at the electromagnetism offset loop-individual layer PCB structure of a plurality of high power device series configuration;
Figure 10 A: at the electromagnetism offset loop of multiple-input and multiple-output high power device series configuration;
Figure 10 B: at the operation principle schematic diagram of the electromagnetism offset loop-single series connection device of multiple-input and multiple-output high power device series configuration;
Figure 11: the electromagnetism offset loop that is total to ground wire high power device structure at many inputs;
Figure 12: the application example in high-power LED illumination and backlight.
Embodiment
Below in conjunction with drawings and Examples content of the present invention is described in further detail.
As shown in Figure 3 on the individual layer PCb structure at the electromagnetism offset loop of single high power device structure.Operation principle is identical with Fig. 2 circuit.During operate as normal, the current path of high power device inside is assumed to the straight line from port A7 to port B7, then constitutes a current circuit by A6, A7, B7, B6, S2, and the magnetic direction of its initiation comes head-on; B4, B5, S2, A5, S3 constitute the another one current circuit, the magnetic direction of its initiation away from and go.Because the propagation velocity of the signal of telecommunication is very fast, at two current in loop equal and opposite in directions, the size of the electromagnetic field of initiation is relevant with the area in loop, and when the area in two loops equated, the electromagnetic field of two loop generations was cancelled each other.
On current path, can make a plurality of paired current circuits.The current circuit that A1, A2, S1, B2, B1 constitute, the magnetic direction of its initiation comes head-on; The current circuit that B3, B4, S3, A4, A3 constitute, the magnetic direction of its initiation away from and go.When the area equal and opposite in direction in two loops, the electromagnetic field that two loops produce is cancelled each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
Because on single layer board, the lead R1 that virtual crosspoint S1 and S2 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 3 cabling A2A3 being carried out bridge joint, make cabling B2B3 and cabling A2A3 not in one plane.
The electromagnetism offset loop at even number high power device series configuration of multi-layer PCB structure as shown in Figure 4.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4.
The electric current of high power device 4 outputs is got back to the power supply module through S4, S3, S2, S1, S5, A4, A3, S6, A2, A1.Wherein S4, S3, S2, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S5 is the virtual intersection point of line segment B3B4 extended line and line segment A4S1, and S6 is the virtual intersection point of current path B2B3 and A3A2.
Virtual intersection point is the crosspoint of constructing for the area that counter circuit surrounds, when separated time is high power device work in the electric current of high power device, and the path that electric current flows through in inside.
Operation principle is: by current circuit S4, S3, P3-, the P4+ that two adjacent devices high power devices 3 and high power device 4 surrounds, the magnetic direction of its initiation away from and go; By current circuit P2-, P3+, S3, S2 that high power device 3 and high power device 2 surround, the magnetic direction of its initiation comes head-on.The area of two current circuit S4, S3, P3-, P4+ and P2-, P3+, S3, S2 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S2, S1, P1-, the P2+ that two adjacent devices high power devices 2 and high power device 1 surrounds, the magnetic direction of its initiation away from and go; By cabling current circuit B4, P1+, S1, the S5 of high power device 1 and structure, the magnetic direction of its initiation comes head-on.The area of two current circuit S2, S1, P1-, P2+ and B4, P1+, S1, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
The magnetic direction that current circuit S5, A4, A3, S6, B3, B4 cause comes head-on; The magnetic direction that current circuit B1, B2, S6, A2, A1 cause away from and go; The area of two current circuit S5, A4, A3, S6, B3, B4 and B1, B2, S6, A2, A1 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
The electromagnetism offset loop at even number high power device series configuration of individual layer PCB structure as shown in Figure 5.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4.
The electric current of high power device 4 outputs is got back to the power supply module through S4, S3, S2, S1, S5, A4, A3, S6, A2, A1.Wherein S4, S3, S2, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S5 is the virtual intersection point of line segment B3B4 extended line and line segment A4S1, and S6 is the virtual intersection point of current path B2B3 and A3A2.
Virtual intersection point is the crosspoint of constructing for the area that counter circuit surrounds, when separated time is high power device work in the electric current of high power device, and the path that electric current flows through in inside.
Operation principle is: by current circuit S4, S3, P3-, the P4+ that two adjacent devices high power devices 3 and high power device 4 surrounds, the magnetic direction of its initiation away from and go; By current circuit P2-, P3+, S3, S2 that high power device 3 and high power device 2 surround, the magnetic direction of its initiation comes head-on.The area of two current circuit S4, S3, P3-, P4+ and P2-, P3+, S3, S2 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S2, S1, P1-, the P2+ that two adjacent devices high power devices 2 and high power device 1 surrounds, the magnetic direction of its initiation away from and go; By cabling current circuit B4, P1+, S1, the S5 of high power device 1 and structure, the magnetic direction of its initiation comes head-on.The area of two current circuit S2, S1, P1-, P2+ and B4, P1+, S1, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
The magnetic direction that current circuit S5, A4, A3, S6, B3, B4 cause comes head-on; The magnetic direction that current circuit B1, B2, S6, A2, A1 cause away from and go; The area of two current circuit S5, A4, A3, S6, B3, B4 and B1, B2, S6, A2, A1 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
Because on single layer board, the lead R1 that virtual crosspoint S6 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 5 cabling A2A3 being carried out bridge joint, makes cabling B2B3 and cabling A2A3 not in one plane.
The electromagnetism offset loop at odd number high power device series configuration of multi-layer PCB structure as shown in Figure 6.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4; P4-is connected with the input P5+ of high power device 5, and electric current produces voltage drop through high power device 5, and the output P5-output from high power device drives high power device 5.
The electric current of high power device 5 outputs is got back to the power supply module through V6, V7, S5, S4, S3, S2, S1, S5, A4, A3, S6, A2, A1.Wherein S5, S4, S3, S2, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S6 is the virtual intersection point of line segment B3B4 extended line and line segment A4S1, and S7 is the virtual intersection point of current path B2B3 and A3A2.
Operation principle is: by current circuit P4-, P5+, S5, S4 that two adjacent devices high power devices 4 and high power device 5 surround, the magnetic direction of its initiation comes head-on; By current circuit P5-, V6, V7, the S5 that high power device 5 and structure cabling surround, the magnetic direction of its initiation away from and go.The area of two current circuit P4-, P5+, S5, S4 and P5-, V6, V7, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S4, S3, P3-, the P4+ that two adjacent devices high power devices 3 and high power device 4 surrounds, the magnetic direction of its initiation away from and go; By current circuit P2-, P3+, S3, S2 that high power device 3 and high power device 2 surround, the magnetic direction of its initiation comes head-on.The area of two current circuit S4, S3, P3-, P4+ and P2-, P3+, S3, S2 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S2, S1, P1-, the P2+ that two adjacent devices high power devices 2 and high power device 1 surrounds, the magnetic direction of its initiation away from and go; By cabling current circuit B4, P1+, S1, the S5 of high power device 1 and structure, the magnetic direction of its initiation comes head-on.The area of two current circuit S2, S1, P1-, P2+ and B4, P1+, S1, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
The magnetic direction that current circuit S5, A4, A3, S6, B3, B4 cause comes head-on; The magnetic direction that current circuit B1, B2, S6, A2, A1 cause away from and go; The area of two current circuit S5, A4, A3, S6, B3, B4 and B1, B2, S6, A2, A1 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
The electromagnetism offset loop at odd number high power device series configuration of individual layer PCB structure as shown in Figure 7.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4; P4-is connected with the input P5+ of high power device 5, and electric current produces voltage drop through high power device 5, and the output P5-output from high power device drives high power device 5.
The electric current of high power device 5 outputs is got back to the power supply module through V6, V7, S5, S4, S3, S2, S1, S5, A4, A3, S6, A2, A1.Wherein S5, S4, S3, S2, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S6 is the virtual intersection point of line segment B3B4 extended line and line segment A4S1, and S7 is the virtual intersection point of current path B2B3 and A3A2.
Operation principle is: by current circuit P4-, P5+, S5, S4 that two adjacent devices high power devices 4 and high power device 5 surround, the magnetic direction of its initiation comes head-on; By current circuit P5-, V6, V7, the S5 that high power device 5 and structure cabling surround, the magnetic direction of its initiation away from and go.The area of two current circuit P4-, P5+, S5, S4 and P5-, V6, V7, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S4, S3, P3-, the P4+ that two adjacent devices high power devices 3 and high power device 4 surrounds, the magnetic direction of its initiation away from and go; By current circuit P2-, P3+, S3, S2 that high power device 3 and high power device 2 surround, the magnetic direction of its initiation comes head-on.The area of two current circuit S4, S3, P3-, P4+ and P2-, P3+, S3, S2 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
By current circuit S2, S1, P1-, the P2+ that two adjacent devices high power devices 2 and high power device 1 surrounds, the magnetic direction of its initiation away from and go; By cabling current circuit B4, P1+, S1, the S5 of high power device 1 and structure, the magnetic direction of its initiation comes head-on.The area of two current circuit S2, S1, P1-, P2+ and B4, P1+, S1, S5 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
The magnetic direction that current circuit S5, A4, A3, S6, B3, B4 cause comes head-on; The magnetic direction that current circuit B1, B2, S6, A2, A1 cause away from and go; The area of two current circuit S5, A4, A3, S6, B3, B4 and B1, B2, S6, A2, A1 equates that electric current is identical, and the magnetic field size of initiation is identical, and direction is opposite, cancels each other.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
Because on single layer board, the lead R1 that virtual crosspoint S7 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 7 cabling A2A3 being carried out bridge joint, makes cabling B2B3 and cabling A2A3 not in one plane.
The electromagnetism offset loop of a plurality of high power device series configuration of multi-layer PCB structure as shown in Figure 8, high power device can be an even number, also can be odd number.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2 through B5, B6, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3 through B7, B8, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4 through B9, B10, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4.
The electric current of high power device 4 outputs is got back to the power supply module through B11, S8, A20, A19, S7, A18, A17, S6, A16, A15, S5, A14, A13, S4, A12, A11, S3, A10, A9, S2, A8, A7, S1, A6, A5, S10, A4, A3, S9, A2, A1.Wherein S7, S5, S3, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S8 is the node of the current circuit of structure, and S10 is starting point B4, and the intersection point of the line segment parallel with S1A6 on line segment A4A5, the virtual intersection point of extended line and line segment A4S1, S7 are the virtual intersection point of current path B2B3 and A3A2.S6 is the virtual intersection point of line segment A16A17 and line segment B9B10, and S4 is the virtual intersection point of A12A13 and line segment B7B8, and S4 is the virtual intersection point of A8A9 and line segment B5B6, and S9 is the virtual intersection point of A2A3 and line segment B2B3.
Operation principle is: around high power device 4, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P4-, B11, S8, A20, A19, S7 cause away from and go, the magnetic direction that current circuit S6, B10, P4+, S7, A18, A17 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 3, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P3-, B9, S6, A16, A15, S5 cause away from and go, the magnetic direction that current circuit S4, B8, P3+, S5, A14, A13 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 2, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P2-, B7, S4, A12, A11, S3 cause away from and go, the magnetic direction that current circuit S2, B6, P2+, S3, A10, A9 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 1, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P1-, B5, S2, A8, A7, S1 cause away from and go, the magnetic direction that current circuit S10, B4, P1+, S1, A6, A5 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
The current circuit that the cabling of independent structure partners and cancels each other.The magnetic direction that current circuit B1, B2, S9, A2, A1 cause away from and go, the magnetic direction that current circuit S9, B3, B4, S10, A4, A3 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
The electromagnetism offset loop of a plurality of high power device series configuration of individual layer PCB structure as shown in Figure 9, high power device can be an even number, also can be odd number.Annexation is: electric current is from power supply module B1 output, and the input P1+ through B2, B3, B4 arrival high power device 1 produces the output P1-that voltage drop arrives high power device 1, drives high power device 1 work; P1-is connected with the input P2+ of high power device 2 through B5, B6, and electric current produces voltage drop through high power device 2, and the output P2-output from high power device drives high power device 2; P2-is connected with the input P3+ of high power device 3 through B7, B8, and electric current produces voltage drop through high power device 3, and the output P3-output from high power device drives high power device 3; P3-is connected with the input P4+ of high power device 4 through B9, B10, and electric current produces voltage drop through high power device 4, and the output P4-output from high power device drives high power device 4.
The electric current of high power device 4 outputs is got back to the power supply module through B11, S8, A20, A19, S7, A18, A17, S6, A16, A15, S5, A14, A13, S4, A12, A11, S3, A10, A9, S2, A8, A7, S1, A6, A5, S10, A4, A3, S9, A2, A1.Wherein S7, S5, S3, S1 are the virtual intersection point of separated time in the electric current of back flow current path and each high power device.S8 is the node of the current circuit of structure, and S10 is starting point B4, and the intersection point of the line segment parallel with S1A6 on line segment A4A5, the virtual intersection point of extended line and line segment A4S1, S7 are the virtual intersection point of current path B2B3 and A3A2.S6 is the virtual intersection point of line segment A16A17 and line segment B9B10, and S4 is the virtual intersection point of A12A13 and line segment B7B8, and S4 is the virtual intersection point of A8A9 and line segment B5B6, and S9 is the virtual intersection point of A2A3 and line segment B2B3.
Operation principle is: around high power device 4, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P4-, B11, S8, A20, A19, S7 cause away from and go, the magnetic direction that current circuit S6, B10, P4+, S7, A18, A17 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 3, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P3-, B9, S6, A16, A15, S5 cause away from and go, the magnetic direction that current circuit S4, B8, P3+, S5, A14, A13 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 2, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P2-, B7, S4, A12, A11, S3 cause away from and go, the magnetic direction that current circuit S2, B6, P2+, S3, A10, A9 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
Around high power device 1, constitute a pair of current circuit of cancelling each other separately.The magnetic direction that current circuit P1-, B5, S2, A8, A7, S1 cause away from and go, the magnetic direction that current circuit S10, B4, P1+, S1, A6, A5 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
The current circuit that the cabling of independent structure partners and cancels each other.The magnetic direction that current circuit B1, B2, S9, A2, A1 cause away from and go, the magnetic direction that current circuit S9, B3, B4, S10, A4, A3 cause comes head-on; Two current circuit area equal and opposite in directions, shape is identical, and electric current is the same, and cancel each other in the magnetic field of initiation.
When circuit is subjected to the external electromagnetic field interference, if on a loop, produce an induced current, then on the loop of correspondence, produce an equal and opposite in direction, the induced current that direction is opposite, thereby induced current is cancelled each other, and the work to high power device does not impact.
Because on single layer board, the lead R1 that virtual crosspoint S9 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 9 cabling A2A3 being carried out bridge joint, makes cabling B2B3 and cabling A2A3 not in one plane; The lead R2 that virtual crosspoint S2 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 9 cabling B5B6 being carried out bridge joint, makes cabling B5B6 and cabling A8A9 not in one plane; The lead R3 that virtual crosspoint S4 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 9 cabling B7B8 being carried out bridge joint, makes cabling B7B8 and cabling A12A13 not in one plane; The lead R4 that virtual crosspoint S6 must use 0 Ohmic resistance or solid shape carries out bridge joint to cabling wherein, as among Fig. 9 cabling B9B10 being carried out bridge joint, makes cabling B9B10 and cabling A16A17 not in one plane.
Shown in Figure 10 A, at the electromagnetism offset loop of multiple-input and multiple-output high power device series configuration.High power device module 1 is made of three device package together: port is device R, the device G that port is P1G+ and P1G-, the device B that port is P1B+ and P1B-of P1R+ and P1R-.
Annexation is: power supply module electric current is exported from e1 port, be connected with the device B port P1B+ in the high power device module 1, produce pressure drop through device B in the high power device module 1, P1B-leaves from port, drives device B work in the high power device module 1; P1B-is connected with P2B+, and electric current produces pressure drop through device B in the high power device module 2, and P2B-leaves from port, drives device B work in the high power device module 2; P2B-is connected with P3B+, and electric current produces pressure drop through device B in the high power device module 3, and P3B-leaves from port, drives device B work in the high power device module 3; P3B-is connected with P4B+, and electric current produces pressure drop through device B in the high power device module 4, and P4B-leaves from port, drives device B work in the high power device module 4; After electric current leaves port P4B-, return power supply module port F1 through the current path of setting.
Power supply module electric current is from C1 port output, is connected with device G port P1G+ in the high power device module 1, produces pressure drop through device G in the high power device module 1, and P1G-leaves from port, drives that device G works in the high power device module 1; P1G-is connected with P2G+, and electric current produces pressure drop through device G in the high power device module 2, and P2G-leaves from port, drives device G work in the high power device module 2; P2G-is connected with P3G+, and electric current produces pressure drop through device G in the high power device module 3, and P3G-leaves from port, drives device G work in the high power device module 3; P3G-is connected with P4G+, and electric current produces pressure drop through device G in the high power device module 4, and P4G-leaves from port, drives device G work in the high power device module 4; After electric current leaves port P4G-, return power supply module port D1 through the current path of setting.
The annexation of device R in the high power device module, carry out more careful description by Figure 10 B: power supply module electric current is exported from the A1 port, be connected with device R port P1R+ in the high power device module 1 through A2, A3, A4, A5, A6, produce pressure drop through device R in the high power device module 1, P1R-leaves from port, drives device B work in the high power device module 1; P1R-is connected with P2R+ through A7, A8, and electric current produces pressure drop through device R in the high power device module 2, and P2R-leaves from port, drives device R work in the high power device module 2; P2R-is connected with P3R+ through A9, A10, and electric current produces pressure drop through device R in the high power device module 3, and P3R-leaves from port, drives device R work in the high power device module 3; P3R-is connected with P4B+ through A11, A12, and electric current produces pressure drop through device R in the high power device module 4, and P4R-leaves from port, drives device R work in the high power device module 4; After electric current left port P4R-, the current path of setting through SR4, SR3, SR2, SR1, B4, B3, B2 returned power supply module port B1.
SR4 is the intersection point of the loop current cabling of separated time and setting in the electric current of device R in the high power device module 4, SR3 is the intersection point of the loop current cabling of separated time and setting in the electric current of device R in the high power device module 3, SR2 is the intersection point of the loop current cabling of separated time and setting in the electric current of device R in the high power device module 2, and SR1 is the intersection point of the loop current cabling of separated time and setting in the electric current of device R in the high power device module 1; S1 is the virtual intersection point of line segment A2A3 and line segment B2B3, only defines for the area of counter circuit.
Current circuit P3R-, A11, A12, P4R+, SR4, SR3 that device R in device R in the high power device module 4 and the high power device module 3 constitutes, the magnetic direction of its initiation comes head-on; Current circuit SR2, P2R+, A9, A10, P3R+, SR3 that device R in device R in the high power device module 3 and the high power device module 2 constitutes, the magnetic direction of its initiation away from and go.Size of current equates in two current circuits, and area is identical, the magnetic field equal and opposite in direction of generation, and direction is opposite, cancels each other.
Current circuit P1R-, A7, A8, P2R+, SR2, SR1 that device R in device R in the high power device module 1 and the high power device module 2 constitutes, the magnetic direction of its initiation comes head-on; Current circuit B4, A4, A5, A6, P1R+, SR1 that device R in the high power device module 1 and the cabling of setting constitute, the magnetic direction of its initiation away from and go.Size of current equates in two current circuits, and area is identical, the magnetic field equal and opposite in direction of generation, and direction is opposite, cancels each other.
The cabling of external structure has 2 current circuits: current circuit S1, B3, B4, A4, A3, the magnetic direction of its initiation away from and go; Current circuit A1, A2, S1, B2, B1, the magnetic direction of its initiation comes head-on.Size of current equates in two current circuits, and area is identical, the magnetic field equal and opposite in direction of generation, and direction is opposite, cancels each other.
As shown in figure 11, be total to the electromagnetism offset loop of ground wire high power device structure at many inputs for the multi-layer PCB structure.High power device has 3 input PR+, PG+, PB+ and one output PGND altogether, and be with three high power devices: device R, device G, device B are packaged together, and independently port is adopted in input, and the module of ground configurations is altogether adopted in output.
Annexation is as follows:
Electric current through A2, A3, A4, PR+, enters the device R in the high power device module from power supply module port A1 output, produces voltage drop, and driving element R flows out from A5 (PGND), through A6, A7, returns power supply module port A8; Electric current through B2, B3, B4, PG+, enters the device G in the high power device module from power supply module port B1 output, produces voltage drop, and driving element G flows out from B5 (PGND), through A6, A7, returns power supply module port A8; Electric current through C2, C3, C4, PB+, enters the device B in the high power device module from power supply module port C1 output, produces voltage drop, and driving element B flows out from C5 (PGND), through A6, A7, returns power supply module port A8.
A5 is the intersection point of separated time and PGND output port line in the electric current of device R in the high power device module, B5 is the intersection point of separated time and PGND output port line in the electric current of device G in the high power device module, and C5 is the intersection point of separated time and PGND output port line in the electric current of device B in the high power device module.
S1 is the virtual intersection point of line segment C2C3 and line segment A6A7, and S2 is the virtual intersection point of line segment B2B3 and line segment A6A7, and S3 is the virtual intersection point of line segment A2A3 and line segment A6A7, only uses as the area that calculates current circuit;
Operation principle is as follows: the magnetic direction that current circuit S3, A3, A4, PR+, A5, A6 cause away from and go, the electromagnetic field direction that current circuit A1, A2, S3, A7, A8 cause comes head-on, the area of two current circuits equates, size of current is identical, the magnetic field size that produces is identical, direction is opposite, cancels each other; The magnetic direction that current circuit S2, B3, B4, PG+, B5, B6 cause away from and go, the electromagnetic field direction that current circuit B1, B2, S2, A7, A8 cause comes head-on, the area of two current circuits equates, size of current is identical, the magnetic field size that produces is identical, and direction is opposite, cancels each other; The magnetic direction that current circuit S1, C3, C4, PB+, C5, C6 cause away from and go, the electromagnetic field direction that current circuit C1, C2, S1, A7, A8 cause comes head-on, the area of two current circuits equates, size of current is identical, the magnetic field size that produces is identical, and direction is opposite, cancels each other;
Be the application example in high-power LED illumination as shown in figure 12.Reference standard, 100mA, the electric current loop of the 1cm*1cm of 50MHz, the requirement of FCC B limit value will not be satisfied in its electromagnetic radiation.Present LED street lamp is 250W at power, and when output voltage was 36V, the electric current of output was 7A, calculates with ripple 5%, and then pulsating current is 350mA; In street lamp, the area of current circuit is generally 50cm*40cm, and operating frequency is at 100KHz-1MHZ, and the electromagnetic compatibility of this moment will become the difficult point in the design, and the present invention can address this problem.
Entire circuit comprises the LED string of 3 parallel connections, and each LED string is made of the LED of 6 series connection; In each LED string, there are two adjacent LED to constitute a pair of current circuit of cancelling each other, thereby improve the Electro Magnetic Compatibility of circuit; The cabling that is connected with drive plate, the current circuit of cancelling each other in magnetic field of horizontal and vertical each self-structuring; Owing to use the aluminium base of individual layer wiring, therefore adopt 0 Ohmic resistance that circuit is carried out bridge joint.
In LCD TV dynamic LED backlight, the LED number of use more (about 100), the LCD TV size is big simultaneously, and present best-selling product is generally greater than 37 inches, and then the area of current circuit is generally greater than 100cm*75cm; Simultaneously, the electric current in the dynamic backlight source is the dynamic change of gamut, 0-4A, and promptly pulsating current is 4A, and frequency is according to the requirement of dynamic backlight source, generally at 50KHZ-10MHZ, the electromagnetic compatibility of this moment also is the difficult point of a design.
The present invention also can use the equipment of Alternating Current Power Supply.
Claims (4)
1. method for designing that effectively improves high power device electromagnetic compatibility (EMC), comprise 4 parts: the PCB module of the PCB module of single high power device, the series connection of a plurality of high power device, the PCB module, input or the output that are made of a plurality of input/output port devices series connection have the shared PCB module that constitutes of an end;
The PCB module of single high power device is according to sense of current, and whole loop is designed to the electromagnetic field sub-loop that even number can be cancelled each other on PCB, thereby the electromagnetic radiation of reduction itself effectively improves the resistivity of electromagnetic interference to external world;
The PCB module of a plurality of high power device series connection, a pair of electromagnetic field of cancelling each other of each device self structure is about to device and is placed between 2 electromagnetic field sub-loops of cancelling each other of structure; Perhaps with close on device and constitute a pair of electromagnetic field of cancelling each other, promptly 2 devices are placed on respectively in the electromagnetic field sub-loop of cancelling each other;
By the PCB module that a plurality of input/output port device series connection constitute, input and output independently operate, and each road can be regarded as independent device, construct the electromagnetic field loop of oneself cancelling each other; I.e. corresponding output of input, whole high power device is regarded the independently combination of a plurality of high power devices as;
Input or output have the PCB module of the shared formation of an end, input difference and loop altogether, perhaps input and the loop is different separately altogether can be constructed the electromagnetic field of cancelling each other respectively with input and ground wire; Do not have corresponding relation between the input and output, and input or output the input of a port is only arranged is independently, then will be not independently port link together, as input or output port altogether altogether.
2. according to the described method for designing of claim 1, it is characterized by: the electromagnetic field sub-loop of cancelling each other add up to even number, topological structure can be various geometries.
3. according to the described method for designing of claim 1, it is characterized by: the electromagnetic field sub-loop of cancelling each other closes on mutually, and the area that return line surrounds is identical; Can on individual layer or multilayer circuit board, realize, and the material of circuit board can be various; Can utilize the connection of the via hole realization circuit of 0 Ohmic resistance (the perhaps lead of solid shape) and circuit board, the design of optimizing is in a pair of sub-loop of cancelling each other, and each sub-loop has identical via hole or 0 Ohmic resistance (the perhaps lead of solid shape) structure; And the area that the loop surrounds in three-dimensional scope is identical.
4. according to the described method for designing of claim 1, it is characterized by: the electric current cabling of high power device inside in the electromagnetic field loop of cancelling each other, use separated time in the equivalent current, to calculate area that surrounds and the geometry of confirming sub-loop; Separated time is inspected according to the image of device inside chip and encapsulation and is obtained in the equivalent current, perhaps obtains according to experimental data; Compare with the line length of sub-loop when very little when size of devices, can adopt the straight line of device input port and output port approximate.
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| CN106793647A (en) * | 2016-11-09 | 2017-05-31 | 上海卫星工程研究所 | High current transmission cable layout method on a kind of satellite |
| CN109379839A (en) * | 2018-12-03 | 2019-02-22 | 维沃移动通信有限公司 | A kind of circuit board line structure, circuit board assemblies and electronic equipment |
| CN113075980A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Heat dissipation and power supply module and power supply frame |
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