CN102008927A - Method for preparing multilayer amorphous alloy based microstructure - Google Patents
Method for preparing multilayer amorphous alloy based microstructure Download PDFInfo
- Publication number
- CN102008927A CN102008927A CN 201010290499 CN201010290499A CN102008927A CN 102008927 A CN102008927 A CN 102008927A CN 201010290499 CN201010290499 CN 201010290499 CN 201010290499 A CN201010290499 A CN 201010290499A CN 102008927 A CN102008927 A CN 102008927A
- Authority
- CN
- China
- Prior art keywords
- structural
- micro
- alloy
- amorphous
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a method for preparing a multilayer amorphous alloy based microstructure, comprising the following steps of: firstly, forming a first layer of microstructure in a multi-groove multi-through hole structure with a micro-processing method and then carrying out mold filling, then sequentially preparing an amorphous alloy layer and a photosensitive resin layer, then forming a microstructure in a multi-groove structure formed by amorphous alloy with a photoetching method of exposure and etching, carrying out mold filling, sequentially and repeatedly preparing a microstructure formed by multi-layer amorphous alloy until the required number of layers is achieved, removing fillers, and finally preparing the multilayer amorphous alloy based microstructure as required. The multilayer amorphous alloy based microstructure prepared with the method has the surface precision meeting the requirement of sub-nanometer precision, the through microstructures can be formed in any place, and mechanics and thermal stability detections prove that the multilayer amorphous alloy based microstructure can be used safely at 700 DEG C under 500MPa.
Description
Technical field
The invention belongs to advanced material and micro-processing technology field thereof, be specifically related to a kind of preparation method of multi-level amorphous alloy-based micro-structural.
Background technology
Reaction and checkout gear based on the micro-nano-scale fluid not only have the reaction time fast, accurate sample size, little volume operating unit, high room and time resolution ratio; And can also optionally align micro Nano material and biomolecule.Since have with the biological cell device in similarly the heat transmission and the reaction environment of homogeneous, we can carry out the control of height to course of reaction.Document [1]: Song, Y.; Kumar, C.S.S.R.; Hormes, J., Microfluidie Synthesis of Nanomaterials.Small 2008,4, (6), 698-711; Document [2]: Park, J.I.; Saffari, A.; Kumar, S.; Gunther, A.; Kumacheva, E., Microfluidic synthesis of polymer and inorganic particulate materials.Annu.Rev.Mater.Res.2010,40,415-443.; Document [3]: deMello, A.J., Control and detection of chemical reactions in microfluidic systems.Nature 2006,442, (27), put down in writing the micro-nano fluid means among the 394-402 in design, preparation and the development of using, with micro-nano fluid reactor and chip, pharmacy industry and biological medicine (drug discovery from the life science industry, medicine is carried and is detected, diagnostic device), being extended to the various reactions of commercial Application and the combination synthesis technique of separation process primitive (synthesizes as stereoselectivity, synthesizing of nano material, the screening of quick in situ chemical analysis and high-flux catalysts).Therefore, press for the method that exploitation one prepares micro-fluid chip and micro-structural fast cheaply, obtain fluid channel and micro-structural rational in infrastructure, as to satisfy environment for use.
From practical significance, in order to realize " chip lab ", must try one's best miniature temperature controller (heat exchanger and T-inductor), micro pressure controller, micrometeor controller, differential on, little detector and other micro devices are integrated in chip piece.Therefore must realize micro-structural and fluid channel are carried out multi-level integrated, particularly prepare the through multi-level micro-structural of each layer as required.But although we can produce the three-dimensional microstructures of various flat shapes and individual layer by all kinds of photoetching techniques, micro-structural of using all kinds of current exposure etching technics to prepare such three-dimensional perforation is not one works easily, is faced with the big challenge of tool.The nearest manufacturing process of the alternative photoetching of exploitation by in the direct mode of " inscriptions " of metal and polymer, still can only be carried out the individual layer plane and prepare, as document [4]: Lehmann, O.; Stuke, M., Laser-Driven Movement of Three-Dimensional Microstructures Generated by Laser Rapid Prototyping.Science 1995,270., 1644-1646, document [5]: Song, Y.; Kumar, C.S.S.R.; Hormes, J., " flexible semi-solid transfer ' is process.J.Micromech.Microeng2004 (FST); 14, has all put down in writing the micro-structural that these methods prepare the individual layer communicate-type among the 932-940. for Fabrication of SU-8based microfluidic reactor on a PEEK substrate sealed by a.What often can produce is the micro-structural of individual layer communicate-type, by the micro-3D pattern of three-dimensional two-dimensional model is converted to this idea of three dimensional pattern, also is the multi-level fluid channel that is difficult to form connection at cylinder symmetry substrate.Therefore present technology has lost the function of setting up complicated multi-layer three-dimension micro-structural on normal planar chip.For obtaining the micro-structural and the fluid channel of the upright structure of multi-layer three-dimension, it makes up material also is very important in addition.Comparing with silicon, glass or stainless steel, is reasonable selection based on the polymer of amorphous and the fluid channel and the micro structural component of metal alloy.The type of polymer of tool different mechanical properties and physical and chemical performance and the selection of amorphous metallic alloy be extremely versatile and flexible, cheap for manufacturing cost, be easy to superplasticity machine-shaping, machining accuracy can reach the atomic size rank, can utilize technologies such as all kinds of photoetching techniques and little mold pressing, little injection moulding, low-grade fever pressure that different types of non-crystalline material is processed.Well-chosen polymer and and the manufacture process of amorphous metallic alloy can obtain the preparation technology of commericially feasible, and such microdevice is applied in the varying environment.In order to obtain higher serviceability temperature (as greater than 200 ℃) and high corrosion resistance and thermal conductivity, amorphous metallic alloy has more advantage than traditional thermoplastic polymer; Simultaneously, the comprehensive mechanical property of non-crystaline amorphous metal is more excellent than traditional thermoplastic polymer and crosslinked photosensitive thermosetting resin, as toughness and fracture strength, is more suitable for constructing firm fluid channel of high strength and micro-structural.Document [6]: Lehmann, O.; Stuke, M., Laser-Driven Movement of Three-Dimensional Microstructures Generated by Laser Rapid Prototyping.Science 1995,270., 1644-1646. document [7] Song, Y.; Kumar, C.S.S.R.; Hormes, J., Fabrication of SU-8based microfluidic reactor on a PEEK substrate sealed by a " flexible semi-solid transfer ' is process.J.Micromech.Microeng 2004 (FST); 14; the current techniques of putting down in writing among the 932-940. prepares the device of amorphous alloy-based fluid channel and micro-structural base, and also have two large problems to need to solve at least: (1) multi-level three-dimensional fluid channel can freely be connected and shutoff at diverse location with micro-structural; (2) how the fluid channel and the micro-structural of large span (as the width greater than 400 microns) low depth (less than 20 microns the degree of depth) are carried out the tight sealing of large tracts of land.
Summary of the invention
At problems of the prior art, the present invention proposes a kind of preparation method of multi-level amorphous alloy-based micro-structural, the surface accuracy of the multi-level amorphous alloy-based micro-structural by the preparation of this method can reach inferior nano-precision requirement, and can form the micro-structural that can connect anywhere, and mechanics and heat stability test show that this multi-level amorphous alloy-based micro-structural can use safely under 700 ℃, 500Mpa.Preparation method's concrete steps of multi-level amorphous alloy-based micro-structural are as follows:
The present invention proposes a kind of preparation method of multi-level amorphous alloy-based micro-structural, and concrete preparation process is as follows:
Step 1: preparation ground floor micro-structural is also filled type:
On substrate, form ground floor micro-structural by micro-processing technology as many grooves of having of basic unit and multi-through hole structure, utilize the liquid-solid phase transformation technology, by the liquefaction that heats up filler is full of the ground floor micro-structural, and closely knit by cooling curing, form the ground floor micro-structural of filling type;
Described baseplate material is multiple materials such as pottery, metal, metal alloy or polymer.
Step 2: preparation second layer micro-structural is also filled type:
(A) by electroplating technology or physical vapor gas phase deposition technology, in the surface construction amorphous alloy layer of the ground floor micro-structural of filling type, thickness is t, and t gets between 2～1000 μ m;
Selectable non-crystaline amorphous metal is amorphous fe-base alloy, Amorphous Al-Based Alloy, amorphous zirconium-base alloy, amorphous acid bronze alloy, amorphous rare earth based alloy, amorphous nickel-base alloy or amorphous titanium-base alloy etc. when constructing amorphous alloy layer.
(B) use the surperficial spin coating one deck photosensitive resin layer of sol evenning machine in amorphous alloy layer, thickness is 2～10 μ m, and dries by the fire 5～20 seconds down at 80～110 ℃.
(C) mask plate is placed the surface of photosensitive resin layer, after in wavelength is 240nm～340nm light wave scope, exposing 3～50 seconds, remove mask plate, and dried by the fire 5～30 seconds down at 80～120 ℃, the photosensitive resin of need being washed off with the photosensitive resin developer solution is washed off then, exposes amorphous alloy layer;
(D) with of the amorphous alloy layer from top to bottom etching removal of non-crystaline amorphous metal etching liquid with exposure, the degree of depth of etching is the thickness t of amorphous alloy layer, (wherein t is 2～1000 μ m), formation has the amorphous alloy layer of many groove structures, the etching depth of each groove of amorphous alloy layer etching is identical, and the amorphous alloy layer that is covered by photosensitive resin is retained.
(E) photosensitive resin layer that will not be exposed is removed by the whole wash-outs of photosensitive resin developer solution, formation has the amorphous alloy layer of many groove structures, the second layer micro-structural that constitutes, each groove location shape can be according to the size Selection given shape of required micro-structural and the mask plate of size by the mask plate decision of being adopted.
(F) in second layer micro-structural, use filler to fill type by the liquid-solid phase conversion techniques, liquefaction is full of filler in the second layer micro-structural by heating up, and solidify closely knitly by cooling, and forming the second layer micro-structural of filling type, used filler is all identical with filler in step 1 and the steps A.
Step 3: judge whether the number of plies of micro-structural reaches the number of plies of the required multi-level amorphous alloy-based micro-structural of preparation, as do not reach number of plies requirement, repeating step two is until reaching number of plies requirement.
All use identical non-crystaline amorphous metal to prepare each layer amorphous alloy layer during the preparation process of repeating step two, and use identical filler to fill type, the filler in the multi-level amorphous alloy-based micro-structural of filling type for preparing guarantees that simultaneously every layer of institute connects between fluted, so that finally can be removed smoothly.
Step 4: remove filler
The multi-level amorphous alloy-based micro-structural that to fill type is warmed up to more than the melting temperature of used filler, uses the method that compressed air blows down to blow out filler, cools to room temperature then;
Preferably, employed filler is the filler that dissolves in certain solvent such as water, diluted acid or organic solvent etc. in the multi-level amorphous alloy-based micro-structural of filling type, the multi-level amorphous alloy-based micro-structural that to fill type is dissolved in the corresponding solvent, and filler dissolving back wash-out is removed.
After described step 3 is finished, can also increase the preparation process of preparation sealant, be specially: adopt identical non-crystaline amorphous metal, by physical vapor gas phase deposition technology or electroplating technology, deposition one layer thickness is that the amorphous alloy layer of 1～2 μ m is as sealant on the last one deck micro-structural in the surface of the multi-level amorphous alloy-based micro-structural of filling type, for strengthening the mechanical property of sealing layer, can further the sealing layer be thickened by electro-plating method, thickness is reached more than the 1000 μ m, finally obtain the multi-level amorphous alloy-based micro-structural of sealing.As do not have this intermediate steps, the multi-level amorphous alloy-based micro-structural of final preparation is opening.
The invention has the advantages that:
1, the preparation method of the multi-level amorphous alloy-based micro-structural of the present invention's proposition, on ground floor micro-structural basis, during preparation higher level time micro-structural, can transform by the liquid-solid phase of temperature height or solvent adjustment filler, form liquid in the solvent by heating up filler liquefaction or being dissolved in, be full of in this layer micro-structural, cooling solidify to form the surface of solids of the homogeneous of patterning, as substrate, on this layer, construct the more amorphous alloy-based micro-structural of the three-dimensional structure of level.
2, adjacent two layers of the amorphous alloy-based micro-structural of preparation method's preparation of the multi-level amorphous alloy-based micro-structural of the present invention's proposition through pressure testing in 24 hours, do not produce layering in the static pressure of 500Mpa.
3, can use safely under the operating temperature more than 200 ℃ of the amorphous alloy-based micro-structural of preparation method's preparation of the multi-level amorphous alloy-based micro-structural of the present invention's proposition, the micro-structural of polymeric material can't reach far away.
4, the surface accuracy of the amorphous alloy-based micro-structural of preparation method's preparation of the multi-level amorphous alloy-based micro-structural of the present invention's proposition can reach inferior nano-precision requirement, and can prepare the very shallow microchannel that is no more than 10 μ m of the sealing degree of depth, make up very shallow microchannel.
5, the amorphous alloy-based micro-structural of preparation method's preparation of the multi-level amorphous alloy-based micro-structural that proposes of the present invention can form the micro-structural that can connect anywhere, and mechanics and heat stability test show that this amorphous alloy-based micro-structural can use safely under 700 ℃, 500Mpa.
Description of drawings
Fig. 1: multi-level amorphous alloy-based micro-structure preparation method flow chart provided by the invention;
Fig. 2: the preparation process schematic diagram of multi-level amorphous alloy-based micro-structural provided by the invention;
Fig. 3: the shape appearance figure of the double-deck Amorphous Al-Based Alloy base micro-structural of sealing provided by the invention;
Fig. 4: the shape appearance figure of three layers of amorphous zirconium base alloy microstructure provided by the invention;
Fig. 5: the shape appearance figure of three layers of amorphous fe-base alloy microstructure provided by the invention;
Fig. 6: the tension and compression during 300 ℃ of the double-deck Amorphous Al-Based Alloy base micro-structural of sealing provided by the invention are strong-graph of a relation of strain.
The specific embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
The present invention proposes a kind of preparation method of multi-level amorphous alloy-based micro-structural, and as depicted in figs. 1 and 2, concrete preparation process is as follows:
Step 1: preparation ground floor micro-structural is also filled type:
On substrate, form ground floor micro-structural by micro-processing technology with many grooves multi-through hole structure as basic unit, utilize the liquid-solid phase transformation technology, by the liquefaction that heats up filler is full of the ground floor micro-structural, and solidifies closely knit by cooling, the ground floor micro-structural of type is filled in formation, as A among Fig. 2
1Shown in;
Described baseplate material is pottery, metal, metal alloy or polymer, and substrate is preferably copper coin, aluminium sheet, corrosion resistant plate, aluminium alloy plate, titanium alloy sheet, high temperature alloy GH4169 plate or high temperature alloy GH3128 plate.When described baseplate material was metal or metal alloy, filler was generally selected low-melting polymer or the fusing point metal or metal alloy material much smaller than the substrate fusing point.
When described baseplate material is polymer, choose vitrification point at the polymer more than 120 ℃, generally not soluble in water, sour or other organic solvents, and selected polymer is different with the composition of filler.
Step 2: preparation second layer micro-structural is also filled type:
(A) adopt physical vapor gas phase deposition technology or electroplating technology deposited amorphous alloy-layer earlier;
Adopt physical vapor gas phase deposition technology or electroplating technology deposited amorphous alloy-layer on the ground floor micro-structural, thickness is t, and t gets 2～1000 μ m.Preferably, when needs non-crystaline amorphous metal layer thickness during greater than 2 μ m, adopting physical gas phase deposition technology or electroplating technology pre-deposition thickness earlier is the amorphous alloy layer of 0.5～1 μ m, and then adopt electroplating technology to continue the deposited amorphous alloy-layer on this basis again, until the amorphous alloy layer thickness t is 2～1000 μ m, as A among Fig. 2
2Shown in.
The non-crystaline amorphous metal that uses when constructing amorphous alloy layer is amorphous fe-base alloy, Amorphous Al-Based Alloy, amorphous zirconium-base alloy, amorphous acid bronze alloy, amorphous rare earth based alloy, amorphous nickel-base alloy or amorphous titanium-base alloy.
Preferred Amorphous Al-Based Alloy is Al
85Ni
xY
y, x+y=15, x=0.1-14.9; Preferred amorphous zirconium-base alloy is Zr
50Al
xNi
40Cu
y, x+y=10, x=0.1-4.9; Preferred amorphous fe-base alloy is Fe
50Al
xNi
20Cu
ySi
5B
3C
2, x+y=20, x=0.1-14.9; Preferred amorphous titanium-base alloy is Ti
70Zr
xNb
5Cu
ySi
2B
2C
1, x+y=20, x=0.1-19.9.
(B) use the surperficial spin coating one deck photosensitive resin layer of sol evenning machine in amorphous alloy layer, thickness is 2～10 μ m, and dries by the fire 5～20 seconds down at 80～110 ℃, shown in B among Fig. 2.
(C) mask plate is placed photosensitive resin layer, after in wavelength is 240nm～340nm light wave scope, exposing 3～50 seconds, remove mask plate, and under 80～120 ℃, dry by the fire 5-30 second, with the photosensitive resin developer solution photosensitive resin of exposure is washed off then, expose inner amorphous alloy layer, shown in C among Fig. 2.
When described photosensitive resin was positive glue photosensitive resin, as the S1816 photosensitive resin, the photosensitive resin developer solution was selected the MF-321 developer solution, and cleaned the back at the MF-321 developer solution and clean with acetone; When described photosensitive resin was anti-glue photosensitive resin, as the SU-8 photosensitive resin, the photosensitive resin developer solution was selected the PG developer solution, and cleaned the back at the PG developer solution and clean during at 80 ℃ with the SU-8 cleaning fluid.
(D) amorphous alloy layer of the inside that will expose with the non-crystaline amorphous metal etching liquid from top to bottom etching remove, the degree of depth of etching is 2～1000 μ m, the etching depth of each position of the need etching of amorphous alloy layer is identical, thickness t for amorphous alloy layer, and be retained by the amorphous alloy layer that photosensitive resin covers, shown in D among Fig. 2.
When non-crystaline amorphous metal was amorphous fe-base alloy, Amorphous Al-Based Alloy, amorphous rare earth based alloy or amorphous nickel-base alloy, the non-crystaline amorphous metal etching liquid was selected Cr-7S etching liquid etching; When non-crystaline amorphous metal was amorphous zirconium-base alloy, amorphous acid bronze alloy or amorphous titanium-base alloy, the non-crystaline amorphous metal etching liquid was that concentration ratio is the phosphoric acid mixed liquor of 0.3mol/L sulfuric acid and 0.5mol/L.
(E) the residual photosensitive resin layer that is not exposed removal is removed by the whole wash-outs of photosensitive resin developer solution, formed the second layer micro-structural of amorphous alloy layer formation with many groove structures; The length surface of the groove that each position of second layer micro-structural forms and width can be according to the size Selection given shape of required micro-structural and the mask plates of size, shown in E among Fig. 2 by the mask plate decision of being adopted.
(F) in second layer micro-structural, use filler to fill type by the liquid-solid phase conversion techniques, liquefaction is full of filler in each groove of second layer micro-structural by heating up, and solidify closely knit by cooling, the second layer micro-structural of type is filled in formation, used filler is identical with filler in step 1 and the steps A, shown in F among Fig. 2.
Step 3: judge whether the number of plies of micro-structural reaches the number of plies of the required multi-level amorphous alloy-based micro-structural of preparation, as do not reach number of plies requirement, repeating step two is until reaching number of plies requirement.
During repeating step two preparations, use identical non-crystaline amorphous metal to prepare each layer micro-structural, and use identical filler to fill type, guarantee simultaneously to connect between every layer of all each groove, so that the filler in the multi-level amorphous alloy-based micro-structural of filling type for preparing finally can be removed smoothly.
Step 4: remove filler:
Fill the filler of the interior employed filler of multi-level amorphous alloy-based micro-structural for liquefying of type, the multi-level amorphous alloy-based micro-structural that to fill type is warmed up to more than the melting temperature of used filler, blow out filler, be blown into compressed air from one of them through hole of many grooves multi-through hole structure of ground floor micro-structural to the inside of micro-structural, because each groove of the inner every layer of micro-structural of micro-structural all connects, compressed air is flowed through after each layer micro-structural, from other through holes of ground floor micro-structural, blow out, filler is all removed, and the micro-structural that will remove filler cool to room temperature.
Preferably, employed filler is the filler that dissolves in certain solvent such as water, diluted acid or organic solvent etc. in the multi-level amorphous alloy-based micro-structural of filling type, the multi-level amorphous alloy-based micro-structural that employing will be filled type is dissolved in the corresponding solvent, and filler dissolving back wash-out is removed.
After described step 3 is finished, adopt with step 2 in identical non-crystaline amorphous metal, can increase the step of step preparation sealant according to actual needs, shown in h and i among Fig. 2, be specially: by physical vapor gas phase deposition technology or electroplating technology, deposition one layer thickness is that the amorphous alloy layer of 1～2 μ m is as sealant on the last one deck micro-structural in the surface of the multi-level amorphous alloy-based micro-structural of filling type, for strengthening the mechanical property of sealing layer, can further the sealing layer be thickened by electro-plating method, thickness is reached more than the 1000 μ m, finally obtain the multi-level amorphous alloy-based micro-structural of sealing.As do not have the step that this increase prepares sealant, the multi-level amorphous alloy-based micro-structural of final preparation is opening.
Described filler is polymer, fusing point less than 1000 ℃ metal or the fusing point metallized metal alloy less than 1000 ℃.Described polymer is under the certain vacuum degree (10
-5Pa) and normal temperature down for solid and volatility is low, and be dissolved in temperature greater than 70 ℃ hot water, diluted acid (as 10% hydrochloric acid) or organic solvent (as oxolane, dimethylbenzene), specifically comprise high melting point paraffin (fusing point is more than or equal to 50 ℃), polyethylene glycol (degree of polymerization is not less than 600), polyvinyl alcohol (PVA, molecular weight is not less than 20000), polyvinylpyrrolidone (PVP, fusing point is greater than 50 ℃), polyacrylic acid (fusing point is greater than 50 ℃), fusing point greater than 50 ℃ polyacrylamide and other fusing point greater than 50 ℃ or dissolve in the polymer of temperature greater than 70 ℃ hot water.Described fusing point is preferably fusing point less than 500 ℃ metal less than 1000 ℃ of metals, and is preferably lead (fusing point is 327.5 ℃), tin (231.9 ℃), zinc (419.5 ℃), antimony, bismuth, mercury, cadmium, gallium, indium or silver; Described fusing point is less than 1000 ℃ metal alloy, is preferably fusing point less than 500 ℃ metal alloy, and is preferably the metal alloy of two or more formation in lead, tin, zinc, antimony, bismuth, mercury, cadmium, gallium, indium or the silver, as Ga
95.0Ag
1.5Sn
3.5
When preparing multi-level amorphous alloy-based micro-structural, each layer micro-structural used mask plate in preparation process can be identical, also can be different structures, preferably, when preparing each layer micro-structural, the different mask plate of pore size is used alternatingly, and what be convenient to filler fills type and removal.
Embodiment 1
Adopt the physical vapor gas phase deposition technology to prepare individual layer Amorphous Al-Based Alloy micro-structural, concrete steps are as follows:
Step 1: preparation ground floor micro-structural is also filled type:
On copper coin, form ground floor micro-structural with many grooves multi-through hole structure by micro-processing technology, utilize the liquid-solid phase transformation technology, adopt filler---metallic tin, the method that liquefies by heating up is with filler---and metallic tin is full of the ground floor micro-structural, and closely knit by cooling curing, form the ground floor micro-structural of filling type.
Step 2: preparation second layer micro-structural is also filled type:
(A) by the physical vapor gas phase deposition technology, constructing the Amorphous Al-Based Alloy layer thickness at the upper surface of the ground floor micro-structural of filling type is 40 μ m; The Amorphous Al-Based Alloy of selecting during preparation Amorphous Al-Based Alloy layer is Al
85Ni
xY
y, x+y=15, x=0.1-14.9.
(B) use sol evenning machine, at upper surface spin coating one deck S1816 of Amorphous Al-Based Alloy layer photosensitive resin layer, thickness is 2 μ m, and dries by the fire 5 seconds down at 80 ℃.
(C) mask plate is placed on the photosensitive resin layer expose: exposure is after 3 seconds in wavelength is 240nm light wave scope, remove mask plate, and under 80 ℃ of temperature, dried by the fire 5 seconds, use the photosensitive resin developer solution then---the MF-321 developer solution will be washed off by photosensitive resin after exposing, and, expose the Amorphous Al-Based Alloy layer with the acetone cleaning.
(D) use the non-crystaline amorphous metal etching liquid---the Cr-7S etching liquid is with the Amorphous Al-Based Alloy layer etching removal from top to bottom that exposes, and the degree of depth of etching is 40 μ m, and the Amorphous Al-Based Alloy layer that is covered by photosensitive resin is retained.
(E) the residual photosensitive resin layer that is not exposed removal is removed by the whole wash-outs of photosensitive resin developer solution, formed the second layer micro-structural that constitutes by amorphous alloy layer with many groove structures.
(F) in second layer micro-structural, fill type by the liquid-solid phase conversion techniques, metallic tin is full of in the groove of second layer micro-structural by the liquefaction that heats up, and closely knit by cooling curing, form the second layer micro-structural of filling type.
Step 3: the surface in the second layer micro-structural of filling type for preparing seals: shown in h position among Fig. 2, by the physical vapor CVD method, surface preparation one layer thickness of second layer micro-structural be the Amorphous Al-Based Alloy layer of 40 μ m as sealant, still selecting Amorphous Al-Based Alloy during preparation is Al
85Ni
xY
y, x+y=15, x=0.1-14.9; The double-deck Amorphous Al-Based Alloy micro-structural of filling type that promptly obtains sealing.
Step 4: remove filler:
To fill metallic tin in the double-deck Amorphous Al-Based Alloy base micro-structural of type by being warmed up to 240 ℃ of liquefaction (melting temperature of metallic tin is 231.9 ℃), and shown in the i position among Fig. 2, use the method for compressed air blowing to blow out filler, again cool to room temperature.
The double-deck Amorphous Al-Based Alloy micro-structural of the sealing for preparing is carried out scanning electron microscopic observation, and as shown in Figure 3, wherein a layer is the ground floor micro-structural, and the b layer is many grooves of second layer micro-structural, and groove is wide to be 80 μ m, is 40 μ m deeply, and the c layer is a sealant.The flow path wall of double-deck Amorphous Al-Based Alloy micro-structural that it can also be seen that preparation from Fig. 3 is very steep, illustrate by the liquid-solid phase transformation technology, filling the filler of type can protect the shape of double-deck Amorphous Al-Based Alloy micro-structural in preparation process, filler blows clean by pressure-air after high temperature liquefaction; Substantially do not have tangible interface between sealant, ground floor micro-structural and the 2nd layer of micro-structural simultaneously, illustrate that the preparation method of multi-level amorphous alloy-based micro-structural provided by the invention can make one with each layer structure, the combination of interlayer is very firm naturally.
With testing of carrying out under 300 ℃ of the double-deck Amorphous Al-Based Alloy micro-structurals that prepare in conjunction with fastness, measure the deflection of this micro-structural and the relation of hot strength by hydraulic way in micro-structural, test result as shown in Figure 6, the tensile yield strength of this bilayer Amorphous Al-Based Alloy micro-structural can reach 700MPa, the deflection of this moment is 4.6%, illustrate that this bilayer Amorphous Al-Based Alloy micro-structural is suitable with high-strength aluminium body hot strength at room temperature under 300 ℃ of temperature, this bilayer Amorphous Al-Based Alloy micro-structural has good intensity and toughness under 300 ℃ of high temperature.
Embodiment 2
Substrate in the step 1 of embodiment 1 is replaced by corrosion resistant plate (316 stainless steel), and the filler that uses when filling type in embodiment 1 each step to be replaced by hot water soluble molecular weight be 3000 polyvinyl alcohol, and the process that step 4 is removed filler changed into: the temperature that places that will fill the double-deck Amorphous Al-Based Alloy base micro-structural of type is 100 ℃ a hot water, refluxed 2 hours, and 2 times repeatedly, make the polyvinyl alcohol dissolving, and clean up, obtain the double-deck Amorphous Al-Based Alloy micro-structural of sealing.The preparation process and the preparation process of embodiment 1 that remain other are identical, finally prepare double-deck Amorphous Al-Based Alloy base micro-structural.
Embodiment 3
Substrate in the step 1 of embodiment 1 is replaced by corrosion resistant plate (314 stainless steel), go up to form ground floor micro-structural at this corrosion resistant plate (314 stainless steel), and the filler that embodiment 1 each step is used is replaced by fusing point is 183 ℃ leypewter---Sn when filling type with many grooves multi-through hole structure
60Pb
40, the intensification temperature when removing filler in the step 4 changes into and is warming up to 190 ℃ simultaneously, and the preparation process of preparation process that other are concrete and embodiment 1 is identical, finally prepares double-deck Amorphous Al-Based Alloy base micro-structural.
Embodiment 4
Substrate in the step 1 of embodiment 1 is replaced by aluminium sheet, on this aluminium sheet, form ground floor micro-structural with many grooves multi-through hole structure, and the filler that embodiment 1 each step is used when filling type is replaced by the water-soluble degree of polymerization is 6000 polyethylene glycol, and step 4 is removed the filler process change to: the temperature that places that will fill in the double-deck Amorphous Al-Based Alloy base micro-structural of type is 100 ℃ a hot water, refluxed 2 hours, and 3 times repeatedly, make the polyethylene glycol dissolving, and clean up, obtain the double-deck Amorphous Al-Based Alloy micro-structural of sealing.The preparation process of preparation process that other are concrete and embodiment 1 is identical, finally prepares double-deck Amorphous Al-Based Alloy base micro-structural.
Substrate in the step 1 of embodiment 1 is replaced by aluminium alloy plate---2024 aluminium alloy plates, on this aluminium alloy plate, form and have the ground floor micro-structural of many groove structures, and the filler that uses when filling type in embodiment 1 each step is replaced by the paraffin of 50 ℃ of fusing points, and the intensification temperature modification when step 4 removed filler is for being warming up to 60 ℃.Other concrete preparation process are identical with the preparation process of embodiment 1, finally prepare double-deck Amorphous Al-Based Alloy base micro-structural.
Embodiment 6
Step 1: preparation ground floor micro-structural is also filled type:
At titanium alloy sheet, composition is that last formation of Ti-6Al-4V (TC4) has the ground floor micro-structural of many grooves multi-through hole, utilizes the liquid-solid phase transformation technology, adopts filler: sn-ag alloy---Sn by micro-processing technology
96.5Ag
3.5, be full of in basic unit's micro-structural by the method for the liquefaction that heats up, and closely knit by cooling curing, form basic unit's micro-structural of filling type, as the A among Fig. 2
1Shown in.
Step 2: preparation second layer micro-structural is also filled type:
(A) method that combines with the physical vapor gas phase deposition technology by electroplating technology is constructed amorphous zirconium base alloy-layer at the upper surface of basic unit's micro-structural of filling type, and thickness is 150 μ m; Select amorphous zirconium-base alloy: Zr during preparation amorphous zirconium base alloy-layer for use
50Al
xNi
40Cu
y(x+y=10, x=0.1-4.9), as the A among Fig. 2
2Shown in.
Adopting with physical vapor gas phase deposition technology deposit thickness earlier is 1 μ m amorphous alloy layer, and the remaining thickness i.e. thickness of 149 μ m adopts electroplating technology to continue deposition.
(B) use sol evenning machine, at upper surface spin coating one deck S1816 of amorphous alloy layer photosensitive resin layer, thickness is 10 μ m, and dries by the fire 20 seconds down at 110 ℃, shown in the B among Fig. 2.
(C) placing on the photosensitive resin layer of mask plate exposed: exposure is after 50 seconds in wavelength is 340nm light wave scope, remove mask plate, and under 120 ℃, dried by the fire 30 seconds, use the photosensitive resin developer solution then---the MF-321 developer solution, the photosensitive resin that need are washed off is washed off, the downward structure of photosensitive resin layer of the exposure of not masked plate covering is fallen by photoetching, exposed inner amorphous alloy layer, shown in the C among Fig. 2.
(D) use the non-crystaline amorphous metal etching liquid---concentration ratio is the phosphoric acid mixed liquor of 0.3mol/L sulfuric acid and 0.5mol/L, with the amorphous alloy layer etching removal from top to bottom that is not covered that exposes by photosensitive resin layer, the degree of depth of etching is 150 μ m, the etching depth of each position of the amorphous alloy layer that is not covered by photosensitive resin layer of each exposure of identical layer is identical, and be retained by the amorphous alloy layer that photosensitive resin covers, shown in the D among Fig. 2.
(E) the residual photosensitive resin layer that is not exposed removal is removed by the whole wash-outs of photosensitive resin developer solution, formed the second layer micro-structural of amorphous alloy layer formation, shown in the E among Fig. 2 with many groove structures.
(F) in second layer micro-structural, use filler by the liquid-solid phase conversion techniques: sn-ag alloy---Sn
96.5Ag
3.5Fill type, liquefy sn-ag alloy by heating up---Sn
96.5Ag
3.5Be full of in the second layer micro-structural, and closely knit by cooling curing, form the second layer micro-structural of filling type, shown in the F among Fig. 2.
Step 3: the process of repeating step two once, shown in the a-f among Fig. 2, three layers of amorphous zirconium base alloy microstructure that type is filled in preparation, reach the required preparation number of plies, and guarantee to connect between each groove of three layers of amorphous zirconium base alloy-based micro-structural of filling type of preparation, with the filler in three layers of amorphous zirconium base alloy microstructure that guarantee to fill type: sn-ag alloy---Sn
96.5Ag
3.5Finally can be removed smoothly.
Step 4: remove filler;
Three layers of amorphous zirconium base alloy microstructure to filling type are warming up to 300 ℃, make filler: sn-ag alloy---Sn
96.5Ag
3.5Fusing adopts the method that compressed air blows down to blow out, again cool to room temperature.
Three layers of amorphous zirconium base alloy microstructure that prepare are utilized scanning electron microscopic observation.As shown in Figure 4, this micro-structural is made of three layers of micro-structural as can be seen, and nethermost a layer is the ground floor micro-structural, base layer structure for copper coin formation, the about 50 μ m of thickness, middle b layer is a second layer micro-structural, has the cavity of large span, the length of cavity is about 1300 μ m, the degree of depth is about 200 μ m, can be used as liquid material mixing chamber or feed liquid storage chamber, this cavity and the 3rd layer of micro-structural on it, be the c layer perforation among Fig. 3, can carry out mass exchange.And it can also be seen that from the section structure of Fig. 4, the junction of each layer micro-structural does not have tangible boundary layer to exist, the similar structure that monoblock cast is come out of three layers of amorphous zirconium base alloy microstructure for preparing in the present embodiment is described, consistent with the intrinsic strength of body alloy between each layer in conjunction with fastness nature.
Embodiment 7
Substrate in the step 1 of embodiment 6 is replaced by titanium alloy sheet, composition is Ti-5Al-2.5Sn (TA7), on the substrate of this titanium alloy (Ti-5Al-2.5Sn (TA7)), form ground floor micro-structural with many grooves multi-through hole structure, and the filler that example 6 each steps are used when filling type is replaced by fusing point is 70 ℃ paraffin, and the rising temperature modification when removing filler in the step 4 is for being warming up on 70 ℃, preparation process that other are concrete and embodiment 6 are identical, finally prepare three layers of amorphous zirconium base alloy microstructure.
Embodiment 8
Employed filler is replaced by the polyacrylic acid of 50 ℃ of fusing points when filling type in each step with example 6, and be warming up to 60 ℃ with removing filler process intensification temperature modification in the step 4, other concrete preparation process are identical with embodiment 6, finally prepare three layers of amorphous zirconium base alloy microstructure.
Embodiment 9
It is 80 ℃ polyacrylamide that the filler that uses when filling type in example 6 each steps changes fusing point into, and will remove filler process intensification temperature modification in the step 4 for being warming up to 90 ℃, other concrete preparation process are identical with embodiment 6, finally prepare three layers of amorphous zirconium base alloy microstructure.
Step 1: preparation has the ground floor micro-structural and fills type:
Go up formation by micro-processing technology at alloy high-temp alloy (GH4169) and have many grooves multi-through hole structure ground floor micro-structural, utilize the liquid-solid phase transformation technology, the filler when filling type is selected the Sn of 230.5 ℃ of fusing points
40Bi
45Ag
2Zn
10La
3Alloy, the method that liquefies by heating up is with this Sn
40Bi
45Ag
2Zn
10La
3Alloy is full of in basic unit's micro-structural, and closely knit by cooling curing, forms the ground floor micro-structural of filling type.
Step 2: preparation second layer micro-structural is also filled type:
(A) by electroplating technology, construct the amorphous fe-base alloy-layer at the upper surface of the ground floor micro-structural of filling type, thickness is 20 μ m; Select the amorphous fe-base alloy during preparation amorphous fe-base alloy-layer for use:---Fe
50Al
xNi
20Cu
ySi
5B
3C
2, x+y=20, x=0.1-14.9.
(B) use sol evenning machine, at upper surface spin coating one deck S1816 of amorphous alloy layer photosensitive resin layer, thickness is 5 μ m, and dries by the fire 20 seconds down at 110 ℃.
(C) placing on the photosensitive resin layer of mask plate exposed: exposure is after 50 seconds in wavelength is 340nm light wave scope, remove mask plate, and under 120 ℃, dried by the fire 30 seconds, use the photosensitive resin developer solution then---the MF-321 developer solution, the photosensitive resin that need are washed off is washed off, the downward structure of photosensitive resin layer of the exposure of not masked plate covering is fallen by photoetching, exposed inner amorphous alloy layer.
(D) use the non-crystaline amorphous metal etching liquid---the amorphous alloy layer etching removal from top to bottom that is not covered that the Cr-7S etching liquid will expose by photosensitive resin layer, the degree of depth of etching is 150 μ m, the etching depth of each groove of the amorphous alloy layer that is not covered by photosensitive resin layer of each exposure of identical layer is identical, and is retained by the amorphous alloy layer that photosensitive resin covers.
(E) the residual photosensitive resin layer that is not exposed removal is removed by the whole wash-outs of photosensitive resin developer solution, formed the second layer micro-structural of amorphous alloy layer formation with many grooves multi-through hole structure.
(F) by the liquid-solid phase conversion techniques in second layer micro-structural, adopt with step 1 in identical filler Sn
40Bi
45Ag
2Zn
10La
3Alloy fills type, liquefies filler Fe-based amorphous alloy---Fe by heating up
50Al
xNi
xCu
ySi
5B
3C
2, x+y=20, x=0.1-14.9 are full of in the second layer micro-structural, and closely knit by cooling curing, form the second layer micro-structural of filling type.
Step 3: the process of repeating step two once prepares the 3rd layer of micro-structural and fills type, reaches the required preparation number of plies, obtains three layers of amorphous fe-base alloy microstructure, and guarantees to connect between each groove of each layer micro-structural, and filler can be removed smoothly.
Step 4: remove filler:
Three layers of amorphous fe-base alloy microstructure to filling type are warming up to 300 ℃, make filler Sn
40Bi
45Ag
2Zn
10La
3Alloy melting adopts the method that compressed air blows down to blow out, again cool to room temperature.
Three layers of amorphous fe-base alloy microstructure that prepare as shown in Figure 5, a layer among the figure is the ground floor micro-structural, the little second layer micro-structural of b layer, this layer has the fluid channel about long 100 μ m, dark 40 μ m; Little the 3rd layer of micro-structural of c layer has the microchannel of two wide 30 μ m, dark 200 μ m, and connects with second layer micro-structural.The junction that it can also be seen that each layer micro-structural among Fig. 5 does not have tangible boundary layer existence substantially, illustrate that three layers of amorphous fe-base alloy microstructure that provide of the present invention can reach the structure shape that a similar monoblock cast is come out, each layer consistent with the intrinsic strength of body alloy in conjunction with fastness nature.
Embodiment 11
Substrate in embodiment 10 step 1 is replaced by high temperature alloy---GH3128, on this substrate, form ground floor micro-structural, and to change fusing point into be 200 ℃ tin pewter---Sn with the type filler that fills that uses in each step in the example 10 with many grooves multi-through hole structure
96Sb
2Ag
1Zn
1, and being warming up to 300 ℃ and changing into and be warming up to 210 ℃ when removing filler in the step 4, preparation process that other are concrete and embodiment 10 are identical.Prepare three layers of amorphous fe-base alloy microstructure.
With testing that these three layers of amorphous fe-base alloy microstructure are carried out under 700 ℃ in conjunction with fastness, measure the relation of the deflection and the hired pressure of these three layers of amorphous fe-base alloy microstructure by hydraulic way in micro-structural, the test back finds that the yield strength of these three layers of amorphous fe-base alloy microstructure can reach 550MPa, the deflection of this moment is 3.1%, illustrates that these three layers of amorphous fe-base alloy microstructure have good intensity and toughness under 700 ℃ of high temperature.
Embodiment 12
Substrate in embodiment 10 step 1 is replaced by high temperature alloy (GH2302), on this substrate, form and have the ground floor micro-structural of many grooves multi-through hole structure, and the filler that uses when filling type in each step with example 10 to be replaced by fusing point be 50 ℃ gallium silver ashbury metal---Ga
95.0Ag
1.5Sn
3.5, and being warming up to more than 70 ℃ when removing filler in the step 4.The preparation process of preparation process that other are concrete and embodiment 10 is identical, finally prepares three layers of amorphous fe-base alloy microstructure.
Embodiment 13
Substrate in embodiment 10 step 1 is replaced by high temperature alloy (GH2130), on this substrate, form ground floor micro-structural, the non-crystaline amorphous metal that uses during the preparation amorphous alloy layer in the steps A of the step 2 of embodiment 10 is adopted amorphous titanium-base alloy---Ti with many grooves multi-through hole structure
70Zr
xNb
5Cu
ySi
2B
2C
1X+y=20, x=0.1-19.9, non-crystaline amorphous metal etching liquid selection concentration ratio was the phosphoric acid mixed liquor of 0.3mol/L sulfuric acid and 0.5mol/L when step D carried out the non-crystaline amorphous metal etching in the corresponding step two, and with the process triplicate of whole steps two, preparation process among other preparation process and the embodiment 10 is identical, shown in the g among Fig. 2, finally prepares five layers of amorphous titanium-base alloy micro-structural.
Claims (10)
1. the preparation method of a multi-level amorphous alloy-based micro-structural is characterized in that, comprises following step:
Step 1: preparation ground floor micro-structural is also filled type;
On substrate, form ground floor micro-structural by micro-processing technology, utilize the liquid-solid phase transformation technology, filler is full of in the ground floor micro-structural, form the ground floor micro-structural of filling type with many grooves multi-through hole structure;
Step 2: preparation second layer micro-structural is also filled type;
A: by electroplating technology or physical vapor gas phase deposition technology, in the surface construction amorphous alloy layer of the ground floor micro-structural of filling type, thickness is t, and t gets 2～1000 μ m;
B: use the surperficial spin coating one deck photosensitive resin layer of sol evenning machine in amorphous alloy layer, thickness is 2～10 μ m;
C: mask plate is placed on the photosensitive resin layer, after the exposure, remove mask plate, clean, the downward structure of photosensitive resin layer that is exposed is removed, expose inner amorphous alloy layer with the photosensitive resin developer solution;
D: with the amorphous alloy layer etching removal from top to bottom that exposes, the degree of depth of etching is t with the non-crystaline amorphous metal etching liquid;
E: the photosensitive resin layer that will not be exposed removal is removed by the whole wash-outs of photosensitive resin developer solution, forms the second layer micro-structural that is made of amorphous alloy layer with many groove structures;
F: in second layer micro-structural, use filler to fill type by the liquid-solid phase conversion techniques, form the second layer micro-structural of filling type;
Step 3: whether the number of plies of judging micro-structural reaches the number of plies of the required multi-level amorphous alloy-based micro-structural of preparation, and when not reaching number of plies requirement, repeating step two until reaching number of plies requirement, and makes between each groove of every layer of micro-structural and connects mutually;
Step 4: remove filler.
2. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1, it is characterized in that: after described step 3 is finished, increase step preparation sealant: adopt with step 2 in identical non-crystaline amorphous metal, by physical vapor gas phase deposition technology or electroplating technology, deposition one deck sealant on last one deck micro-structural of the multi-level amorphous alloy-based micro-structure surface that fills type.
3. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1, it is characterized in that: the non-crystaline amorphous metal in the described step 2 is amorphous fe-base alloy, Amorphous Al-Based Alloy, amorphous zirconium-base alloy, amorphous acid bronze alloy, amorphous rare earth based alloy, amorphous nickel-base alloy or amorphous titanium-base alloy.
4. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1 is characterized in that: described baseplate material is pottery, metal, metal alloy or polymer.
5. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1, it is characterized in that: remove filler in the described step 4 and adopt compressed-air actuated method to blow down filler, be specially, the multi-level amorphous alloy-based micro-structural that to fill type is warming up to more than the melting temperature of used filler, use the method that compressed air blows down to blow out filler, and be cooled to room temperature.
6. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1, it is characterized in that: when removing filler in the described step 4, when the filler that fills type is when dissolving in the filler of solvent, the multi-level amorphous alloy-based micro-structural that to fill type is dissolved in the corresponding solvent, and filler dissolving back wash-out is removed.
7. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1, it is characterized in that: described non-crystaline amorphous metal etching liquid is the Cr-7S etching liquid, concentration ratio is the phosphoric acid mixed liquor of 0.3mol/L sulfuric acid and 0.5mol/L.
8. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 1 is characterized in that: described filler is polymer or fusing point less than 1000 ℃ of metals or the fusing point metal alloy less than 1000 ℃;
9. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 8 is characterized in that: described fusing point is lead, tin, zinc, antimony, bismuth, mercury, cadmium, gallium, indium or silver less than 1000 ℃ of metals;
10. the preparation method of multi-level amorphous alloy-based micro-structural according to claim 8 is characterized in that: described fusing point is meant the metal alloy that the above metal of lead, tin, zinc, antimony, bismuth, mercury, cadmium, gallium, indium or money kind forms less than 1000 ℃ metal alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102904996A CN102008927B (en) | 2010-09-25 | 2010-09-25 | Method for preparing multilayer amorphous alloy based microstructure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102904996A CN102008927B (en) | 2010-09-25 | 2010-09-25 | Method for preparing multilayer amorphous alloy based microstructure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102008927A true CN102008927A (en) | 2011-04-13 |
| CN102008927B CN102008927B (en) | 2011-11-16 |
Family
ID=43839370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102904996A Expired - Fee Related CN102008927B (en) | 2010-09-25 | 2010-09-25 | Method for preparing multilayer amorphous alloy based microstructure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102008927B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102962639A (en) * | 2012-11-10 | 2013-03-13 | 华中科技大学 | Method for manufacturing preparing multilayer amorphous alloy micro part by vacuum diffusion welding |
| CN103752356A (en) * | 2013-11-06 | 2014-04-30 | 山东省科学院海洋仪器仪表研究所 | Novel cadmium column reduction system based on micro-fluidic chip technology and processing method thereof |
| CN105544659A (en) * | 2015-12-09 | 2016-05-04 | 重庆杰鑫直饮水净化设备有限公司 | Work method of water storage device |
| WO2018121315A1 (en) * | 2016-12-30 | 2018-07-05 | 常州世竟液态金属有限公司 | Amorphous flexible plate |
| CN109227036A (en) * | 2018-08-17 | 2019-01-18 | 基准精密工业（惠州）有限公司 | The manufacturing method of amorphous alloy precision component |
| CN110560185A (en) * | 2019-08-27 | 2019-12-13 | 杭州欧光芯科技有限公司 | Self-sealing micro-nano fluidic chip processing method |
| CN110963457A (en) * | 2018-09-29 | 2020-04-07 | 中国科学院微电子研究所 | High-precision micro-channel network manufacturing method |
| CN114682312A (en) * | 2022-03-30 | 2022-07-01 | 北京航空航天大学 | Silicon-based liquid drop self-transporting microstructure and transporting method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681596A (en) * | 2002-09-17 | 2005-10-12 | 英特尔公司 | Microfluidic devices with porous membranes for molecular sieving, metering, and separations |
| WO2007096535A2 (en) * | 2006-02-27 | 2007-08-30 | Commissariat A L'energie Atomique | Method for making a chip capillary network |
| CN101435808A (en) * | 2008-12-22 | 2009-05-20 | 博奥生物有限公司 | Method for preparing three-dimensional micro-pipe or cavity and application thereof |
| WO2009126339A2 (en) * | 2008-01-14 | 2009-10-15 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Metal-based microchannel heat exchangers made by molding replication and assembly |
-
2010
- 2010-09-25 CN CN2010102904996A patent/CN102008927B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681596A (en) * | 2002-09-17 | 2005-10-12 | 英特尔公司 | Microfluidic devices with porous membranes for molecular sieving, metering, and separations |
| WO2007096535A2 (en) * | 2006-02-27 | 2007-08-30 | Commissariat A L'energie Atomique | Method for making a chip capillary network |
| WO2009126339A2 (en) * | 2008-01-14 | 2009-10-15 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Metal-based microchannel heat exchangers made by molding replication and assembly |
| CN101435808A (en) * | 2008-12-22 | 2009-05-20 | 博奥生物有限公司 | Method for preparing three-dimensional micro-pipe or cavity and application thereof |
Non-Patent Citations (2)
| Title |
|---|
| 《journal of microchanics and microengineering》 20040731 Song YJ, et al Fabrication of SU-8 based microfluidic reactor on a PEEK substrate sealed by a flexible semi-solid transfer (FST) process 932-940 1-10 第14卷, 第7期 2 * |
| 《Science》 19951208 Lehmann O, et al Laser-Driven Movement of Three-Dimensional Microstructures Generated by Laser Rapid Prototyping 1644-1646 1-10 第270卷, 第5242期 2 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102962639A (en) * | 2012-11-10 | 2013-03-13 | 华中科技大学 | Method for manufacturing preparing multilayer amorphous alloy micro part by vacuum diffusion welding |
| CN102962639B (en) * | 2012-11-10 | 2015-01-28 | 华中科技大学 | Method for manufacturing preparing multilayer amorphous alloy micro part by vacuum diffusion welding |
| CN103752356A (en) * | 2013-11-06 | 2014-04-30 | 山东省科学院海洋仪器仪表研究所 | Novel cadmium column reduction system based on micro-fluidic chip technology and processing method thereof |
| CN103752356B (en) * | 2013-11-06 | 2015-08-12 | 山东省科学院海洋仪器仪表研究所 | A kind of Cadmium column reduction system novel based on microfluidic chip technology and processing method thereof |
| CN105544659A (en) * | 2015-12-09 | 2016-05-04 | 重庆杰鑫直饮水净化设备有限公司 | Work method of water storage device |
| CN105544659B (en) * | 2015-12-09 | 2019-03-15 | 重庆杰鑫直饮水净化设备有限公司 | A kind of working method of water storage device |
| WO2018121315A1 (en) * | 2016-12-30 | 2018-07-05 | 常州世竟液态金属有限公司 | Amorphous flexible plate |
| CN109227036A (en) * | 2018-08-17 | 2019-01-18 | 基准精密工业（惠州）有限公司 | The manufacturing method of amorphous alloy precision component |
| CN110963457A (en) * | 2018-09-29 | 2020-04-07 | 中国科学院微电子研究所 | High-precision micro-channel network manufacturing method |
| CN110560185A (en) * | 2019-08-27 | 2019-12-13 | 杭州欧光芯科技有限公司 | Self-sealing micro-nano fluidic chip processing method |
| CN110560185B (en) * | 2019-08-27 | 2021-09-24 | 杭州欧光芯科技有限公司 | Self-sealing micro-nano fluidic chip processing method |
| CN114682312A (en) * | 2022-03-30 | 2022-07-01 | 北京航空航天大学 | Silicon-based liquid drop self-transporting microstructure and transporting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102008927B (en) | 2011-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102008927B (en) | Method for preparing multilayer amorphous alloy based microstructure | |
| Zhakeyev et al. | Additive manufacturing: unlocking the evolution of energy materials | |
| Wang et al. | Initiator-integrated 3D printing enables the formation of complex metallic architectures | |
| McCarthy et al. | Materials, fabrication, and manufacturing of micro/nanostructured surfaces for phase-change heat transfer enhancement | |
| Juarez et al. | Nanoporous metals with structural hierarchy: A review | |
| Xu et al. | A review: development of the maskless localized electrochemical deposition technology | |
| Bielinski et al. | Rational design of hyperbranched nanowire systems for tunable superomniphobic surfaces enabled by atomic layer deposition | |
| Lipomi et al. | 7.11: soft lithographic approaches to nanofabrication | |
| Yang et al. | Block copolymer nanopatterning for nonsemiconductor device applications | |
| Silva et al. | High resolution soft and stretchable circuits with PVA/liquid‐metal mediated printing | |
| DE112011104891B4 (en) | 3D microfluidic devices based on openwork thermoplastic elastomer membranes | |
| Kandjani et al. | Candle-soot derived photoactive and superamphiphobic fractal titania electrode | |
| Xu et al. | Large-area stable superhydrophobic poly (dimethylsiloxane) films fabricated by thermal curing via a chemically etched template | |
| Tawfick et al. | Mechanics of capillary forming of aligned carbon nanotube assemblies | |
| Kim et al. | Additive manufacturing of functional microarchitected reactors for energy, environmental, and biological applications | |
| Ulkir | Design and fabrication of an electrothermal MEMS micro-actuator with 3D printing technology | |
| CN107922182A (en) | Nanoscale and micrometric objects are assembled into the method for three-dimensional structure | |
| Tong | Advanced Materials for Printed Flexible Electronics | |
| Du et al. | Self-formation of polymer nanostructures in plasma etching: Mechanisms and applications | |
| Aldhaleai et al. | Fabrication of transparent and microstructured superhydrophobic substrates using additive manufacturing | |
| Ramachandramoorthy et al. | Dual-templated electrodeposition and characterization of regular metallic foam based microarchitectures | |
| Jiang et al. | Interfacial microdroplet evaporative crystallization on 3D printed regular matrix platform | |
| Jurga et al. | Nanostructured origami | |
| Miyata et al. | Combining multi-step imprinting with the in-plane compression method | |
| Chen et al. | Surface-tension-confined droplet microfluidics☆ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20140925 |
|
| EXPY | Termination of patent right or utility model |