CN101988856A - Temperature sensor - Google Patents
Temperature sensor Download PDFInfo
- Publication number
- CN101988856A CN101988856A CN2010102407279A CN201010240727A CN101988856A CN 101988856 A CN101988856 A CN 101988856A CN 2010102407279 A CN2010102407279 A CN 2010102407279A CN 201010240727 A CN201010240727 A CN 201010240727A CN 101988856 A CN101988856 A CN 101988856A
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- Prior art keywords
- temperature
- temperature survey
- signal wire
- temperature sensor
- resonant frequency
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention provides a temperature sensor which easily performs setting and wiring for the measured object and can realize temperature measurement for a plurality of parts and can measure the temperature arrangement. The temperature sensor comprises a plurality of temperature measurement parts (3a-3f) which are connected in series by a signal wire (2). The temperature measurement parts (3a-3f) are composed of thermistor components (4) and parallel-connected resonance circuits (5) which are connected with the thermistor components (4) in the signal wire (2). The plurality of temperature measuring parts (3a-3f) are set to resonance frequencies which are different from one another through the parallel-connected resonance circuits (5).
Description
Technical field
The present invention relates in a plurality of positions of determinand, to measure the temperature sensor that temperature also can obtain Temperature Distribution.
Background technology
When the surface temperature of determinand being measured in the past, thermistor element equitemperature sensor for example is set on the surface of determinand carries out temperature survey.At this moment, owing to be that the temperature on the point (Port ィ Application ト) that is provided with temperature sensor is measured, therefore carry out temperature survey for whole surface or certain regional Temperature Distribution to determinand, just need be at a plurality of temperature sensors of surperficial decentralized configuration of determinand.
For example, proposed a kind of temperature distributing measuring wafer in patent documentation 1, made the temperature-sensitive plate between two pieces of wafers, so that obtain the temperature information of wafer, described temperature-sensitive plate is to be inserted with thermistor in being printed with the polyester sheet of electrode part.
Patent documentation 1: Japanese kokai publication hei 10-313032 communique
Above-mentioned prior art has been left over following problem.
That is, there is following improper part, when the Temperature Distribution of determinand is measured, need on determinand, disperses to be provided with a plurality of temperature sensors such as thermistor, need connect up according to the quantity of set temperature sensor simultaneously.Therefore exist the setting and the man-hour of wiring and the problem that cost increases that cause temperature sensor because of decentralized configuration.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of being easy to that determinand is provided with and connects up, and can realize the temperature survey at a plurality of positions and the temperature sensor that Temperature Distribution is measured.
The present invention adopts following structure in order to address the above problem.Promptly, temperature sensor of the present invention, it is characterized in that, comprise a plurality of temperature survey portion that is connected in series by signal wire, described temperature survey portion constitutes by thermistor element and with tank circuit portion that this thermistor element is connected in parallel on the described signal wire, and a plurality of described temperature survey portion is set to mutually different resonant frequency by described tank circuit portion.
In this temperature sensor, a plurality of temperature survey portion that is connected in series by signal wire constitutes by thermistor element and with tank circuit portion that this thermistor element is connected in parallel on the signal wire.Because a plurality of temperature survey portion is set to mutually different resonant frequency by tank circuit portion, therefore when causing the change in impedance value of thermistor element because of the temperature variation in any one temperature survey portion, the Q value that comprises this temperature survey portion of tank circuit portion changes.So,, the impedance magnitude under the resonant frequency corresponding with each temperature survey portion is measured, thereby can be measured the temperature of each temperature survey portion according to the damping capacity of the signal that is input to a signal line under each resonant frequency.
That is,,, comprise the Q value reduction of resonant circuit of the temperature survey portion of tank circuit portion along with the resistance value of the thermistor element of this temperature survey portion descends for example when temperature in place temperature survey portion is local when raising.So the signal attenuation under the specific resonant frequency corresponding with this temperature survey portion reduces, the impedance under this resonant frequency simultaneously reduces.In addition, on the contrary, when temperature in place temperature survey portion is local when reducing,, comprise the Q value rising of resonant circuit of the temperature survey portion of tank circuit portion along with the resistance value of the thermistor element of this temperature survey portion rises.So the signal attenuation under the specific resonant frequency corresponding with this temperature survey portion increases, the impedance under this resonant frequency simultaneously increases.So, can according to temperature survey portion in the corresponding impedance magnitude of signal attenuation under resonant frequency, detect local temperature variation.Therefore, the only wiring by a signal line just can realize the temperature survey in a plurality of temperature survey portion, can easily obtain Temperature Distribution, while can avoid the connecting up increase of man-hour and wiring cost.
In addition, temperature sensor of the present invention is characterised in that, described tank circuit portion is a lc circuit portion, and described lc circuit portion is made of the inductor portion and the capacitor department that are connected in parallel on the described signal wire with described thermistor element.
Promptly, in this temperature sensor, because tank circuit portion serves as reasons and thermistor element is connected in the lc circuit portion that inductor portion on the signal wire and capacitor department constitute in parallel, therefore can easily obtain to set constant and the mutually different tank circuit of resonant frequency portion with simple structure.
In addition, temperature sensor of the present invention is characterised in that, a plurality of described temperature survey portion is set on the flexible base, board, is connected by the pattern wiring that is formed on the described flexible base, board as described signal wire.
Promptly, in this temperature sensor, because a plurality of temperature survey portion is set on the flexible base, board, be connected by the pattern wiring that is formed on the flexible base, board as signal wire, therefore by it is attached on the determinand, can be simultaneously and easily disperse to be provided with a plurality of temperature survey portion that connects by pattern wiring, can easily obtain the Temperature Distribution of attach area simultaneously.
According to the present invention, realize following effect.
Promptly, according to temperature sensor of the present invention, the a plurality of temperature survey portion that is connected in series by signal wire constitutes by thermistor element and with tank circuit portion that this thermistor element is connected in parallel on the signal wire, because a plurality of temperature survey portion is set to mutually different resonant frequency by tank circuit portion, therefore only pass through the simple wiring of a signal line, just can carry out temperature survey according to the impedance variation under resonant frequency in a plurality of temperature survey portion.Therefore, can easily obtain the temperature survey and the Temperature Distribution at a plurality of positions, the increase of can avoid simultaneously connecting up man-hour and wiring cost.
Description of drawings
Fig. 1 is the equivalent circuit diagram that first embodiment of temperature sensor of the present invention is shown;
Fig. 2 is the vertical view that the temperature sensor in first embodiment is shown;
Fig. 3 is the synoptic diagram of the impedance under each resonant frequency when each temperature survey portion is uniform temp in first embodiment;
Fig. 4 is the synoptic diagram of the impedance under each resonant frequency when part temperature survey portion and other temperature survey portions have different temperatures in first embodiment;
Fig. 5 is the equivalent circuit diagram that is used for illustrating other thermometries of first embodiment.
Symbol description
1 temperature sensor
2 signal wires
3a～3f temperature survey portion
4 thermistor elements
5 tank circuit portions
6 flexible base, boards
The C capacitor department
The L inductor portion
The S determinand
Embodiment
Below, referring to figs. 1 to Fig. 5, an embodiment of temperature sensor of the present invention is described.In addition, being used for each accompanying drawing of following explanation,, suitably changed engineer's scale in order to make each parts for can discern or size easy to identify.
As depicted in figs. 1 and 2, the temperature sensor 1 of present embodiment uses under the state that is attached at determinand S, temperature sensor 1 comprises a plurality of temperature survey 3a～3f of portion that are connected in series by signal wire 2, and the 3a～3f of temperature survey portion constitutes by thermistor element 4 and with tank circuit portion 5 that this thermistor element 4 is connected in parallel on the signal wire 2.
A plurality of said temperature measurement section 3a～3f are set on the flexible base, board 6, are connected by the pattern wirings such as Copper Foil that are formed on the flexible base, board 6 as signal wire 2.
Above-mentioned tank circuit portion 5 is by being connected in the lc circuit portion that inductor portion L on the signal wire 2 and capacitor department C constitute in parallel with thermistor element 4.
In addition, a plurality of temperature survey 3a～3f of portion set by the constant of tank circuit portion 5, are set to mutually different resonant frequency.
For example, as shown in Figure 2, a plurality of temperature survey 3a～3f of portion press 2 * 3 row on flexible base, board 6 arrays are by decentralized configuration, and the both ends of synchronous signal line 2 are configured in the left end among Fig. 2.That is, signal wire 2 begin to be linked in sequence from the left side three 3a～3c of temperature survey portion on the upper strata that is arranged in Fig. 2, and then three 3d～3f of temperature survey portion that begin to be linked in sequence and be positioned at lower floor from the right side, thus six 3a～3f of temperature survey portion are connected in series.
Above-mentioned thermistor element 4 can adopt such as slice heat sensitive resistor.As this thermistor, thermistors such as NTC type, PTC type and CTR type are arranged, in the present embodiment, the thermistor that adopts NTC type for example is as thermistor element 4.This thermistor is formed by thermistor materials such as Mn-Co-Cu based material, Mn-Co-Fe based materials.
In addition, the thermistor element among each 3a～3f of temperature survey portion 4 adopts the material with uniform temp resistance characteristic.
The chip inductor of above-mentioned inductor portion L employing such as hollow etc., above-mentioned capacitor department C employing such as chip capacitor etc.
Below, with reference to figure 3 and Fig. 4, the measuring method of the temperature among each 3a～3f of temperature survey portion of the temperature sensor 1 that utilizes present embodiment is described.
At first, on determinand S, want to measure in the zone of Temperature Distribution, attach and be provided with temperature sensor 1.In addition, the resonant frequency of supposing each 3a～3f of temperature survey portion is set to resonant frequency f by the order of connection
1～f
6
Temperature sensor 1 is being attached under the state of determinand S, is importing the signal of certain waveform from the end of signal wire 2, detecting each resonant frequency f corresponding with each 3a～3f of temperature survey portion
1～f
6Under signal attenuation, thereby measure impedance among each 3a～3f of temperature survey portion.
For example, when the temperature among each 3a～3f of temperature survey portion during identical and uniformity of temperature profile, the resistance value of the thermistor element 4 among each 3a～3f of temperature survey portion is also identical, the Q value of resonant circuit of the 3a～3f of temperature survey portion that comprises tank circuit portion 5 is identical, as shown in Figure 3, at each resonant frequency f
1～f
6It is down same impedance.
In addition, for example when temperature in the 3b of place temperature survey portion is local when raising,, comprise the Q value reduction of resonant circuit of the 3b of temperature survey portion of tank circuit portion 5 along with the resistance value of the thermistor element 4 of this temperature survey portion descends.So, as shown in Figure 4, the specific resonant frequency f corresponding with the 3b of this temperature survey portion
2Under signal attenuation reduce this resonant frequency f simultaneously
2Under impedance reduce.
In addition, on the contrary, when temperature in the 3d of place temperature survey portion is local when reducing,, comprise the Q value rising of resonant circuit of the 3d of temperature survey portion of tank circuit portion 5 along with the resistance value of the thermistor element 4 of the 3d of this temperature survey portion rises.So, the specific resonant frequency f corresponding with the 3d of this temperature survey portion
4Under signal attenuation increase this resonant frequency f simultaneously
4Under impedance increase.
So, can according to each 3a～3f of temperature survey portion at resonant frequency f
1～f
5Under the corresponding impedance magnitude of signal attenuation, detect local temperature variation.
In addition, in the thermometry of the temperature sensor 1 that utilizes present embodiment, as the additive method of measuring impedance, as shown in Figure 5, the transmission line that also can be used as in the S parameter measurement etc. is measured.
That is, an end of signal wire 2 is connected with network analyzer etc., by importing each resonant frequency f from an end of signal wire 2
1～f
6Multi-carrier signal as high-frequency signal S
11Thereby, the S parameter that is called as scattering matrix (s-matrix) or scattering parameter of expression high-frequency circuit characteristic is measured.This measured S parametric representation is because of each resonant frequency f
1～f
6Impedance variation and the reflectivity of the high-frequency circuit that causes can detect the impedance variation among each 3a～3f of temperature survey portion.In addition, the other end of signal wire 2 is connected with ground via the resistance R such as 50 Ω etc.
In this measuring method,, therefore can use high-frequency owing between the 3a～3f of temperature survey portion, can constitute by transmission line such as coplane etc.
In addition, owing to can use the capacitor department C and the inductor portion L of low capacity, therefore can realize the miniaturization of tank circuit portion 5.
And then, owing to can enlarge each resonant frequency f corresponding with each 3a～3f of temperature survey portion
1～f
6The interval, so the constant of tank circuit portion 5 is set and to be become easy.
In view of the above, in the temperature sensor 1 of present embodiment, the a plurality of temperature survey 3a～3f of portion that are connected in series by signal wire 2 constitute by thermistor element 4 and with tank circuit portion 5 that this thermistor element 4 is connected in parallel on the signal wire 2, because a plurality of temperature survey 3a～3f of portion are set to mutually different resonant frequency by tank circuit portion 5, therefore when causing the change in impedance value of thermistor element 4 because of the temperature variation among any one 3a～3f of temperature survey portion, the Q value that comprises the 3a～3f of temperature survey portion of tank circuit portion 5 changes.
So, according to the signal that is input to a signal line 2 at each resonant frequency f
1～f
6Under damping capacity, measure the resonant frequency f corresponding with each 3a～3f of temperature survey portion
1～f
6Under impedance magnitude, thereby can measure the temperature of each 3a～3f of temperature survey portion.
Therefore, only the wiring by a signal line 2 just can realize the temperature survey among a plurality of temperature survey 3a～3f of portion, can easily obtain Temperature Distribution, while can avoid the connecting up increase of man-hour and wiring cost.
In addition, because tank circuit portion 5 is by being connected in the lc circuit portion that inductor portion L on the signal wire 2 and capacitor department C constitute in parallel with thermistor element 4, therefore can easily obtaining to set constant and resonant frequency f with simple structure
1～f
6Mutually different tank circuit portion 5.
And then, because a plurality of temperature survey 3a～3f of portion are set on the flexible base, board 6, be connected by the pattern wiring that is formed on the flexible base, board 6 as signal wire 2, therefore by it being attached on the determinand S, can be simultaneously and easily disperse to be provided with a plurality of temperature survey 3a～3f of portion that connected by pattern wiring, can easily obtain the Temperature Distribution of attach area simultaneously.
In addition, technical scope of the present invention is not limited to above-mentioned embodiment, can apply various changes without departing from the spirit and scope of the present invention.
For example, in the above-described embodiment, on flexible base, board, disperse to be provided with a plurality of temperature survey portion, but also can adopt other configuration or global shape with the arrays of 2 * 3 row, such as a plurality of temperature survey portion is formed a line so that wholely be wire or band shape etc.
Claims (3)
1. a temperature sensor is characterized in that,
Comprise a plurality of temperature survey portion that is connected in series by signal wire,
Described temperature survey portion constitutes by thermistor element and with tank circuit portion that this thermistor element is connected in parallel on the described signal wire,
A plurality of described temperature survey portion is set to mutually different resonant frequency by described tank circuit portion.
2. temperature sensor according to claim 1 is characterized in that,
Described tank circuit portion is a lc circuit portion, and described lc circuit portion is made of the inductor portion and the capacitor department that are connected in parallel on the described signal wire with described thermistor element.
3. temperature sensor according to claim 1 and 2 is characterized in that,
A plurality of described temperature survey portion is set on the flexible base, board, is connected by the pattern wiring that is formed on the described flexible base, board as described signal wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-177118 | 2009-07-29 | ||
| JP2009177118A JP2011033359A (en) | 2009-07-29 | 2009-07-29 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101988856A true CN101988856A (en) | 2011-03-23 |
Family
ID=43745521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102407279A Pending CN101988856A (en) | 2009-07-29 | 2010-07-28 | Temperature sensor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011033359A (en) |
| CN (1) | CN101988856A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102998012A (en) * | 2012-11-30 | 2013-03-27 | 上海宏力半导体制造有限公司 | Pipeline monitoring device |
| CN103090989A (en) * | 2013-01-18 | 2013-05-08 | 北京瑞恒超高压电器研究所(普通合伙) | Contact type rotor temperature measuring method and device |
| WO2014176784A1 (en) * | 2013-05-03 | 2014-11-06 | 3M Innovative Properties Company | System for monitoring temperature of electrical conductor |
| CN106291201A (en) * | 2016-09-09 | 2017-01-04 | 深圳市雷博斯科技有限公司 | The lightning monitoring of a kind of lightning protection box and deterioration state monitoring system and method |
| CN106940226A (en) * | 2017-05-15 | 2017-07-11 | 上海安誉智能科技有限公司 | Temperature sensor line based on temperature element |
| CN106969850A (en) * | 2017-05-15 | 2017-07-21 | 上海安誉智能科技有限公司 | The temperature sensing cable and its application and method of temperature sensor line based on output PWM ripples |
| CN106969852A (en) * | 2017-05-15 | 2017-07-21 | 上海安誉智能科技有限公司 | Export temperature sensor line circuit structure, system for detecting temperature and its method for PWM ripples |
| WO2024069539A1 (en) * | 2022-09-30 | 2024-04-04 | Novocure Gmbh | Single wire temperature measurement solution for a ttfield application system and methods of production and use thereof |
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| JP5341746B2 (en) * | 2009-12-28 | 2013-11-13 | 株式会社福田結晶技術研究所 | Multi-point temperature measuring device |
| JP5545258B2 (en) * | 2011-04-13 | 2014-07-09 | 株式会社オートネットワーク技術研究所 | Temperature measuring device |
| JP2014038053A (en) * | 2012-08-19 | 2014-02-27 | Furukawa Electric Co Ltd:The | Temperature variation detector |
| CN103207031B (en) * | 2013-03-19 | 2014-12-03 | 浙江大学 | Non-contact temperature measurement device and temperature measurement method thereof |
| JP6342179B2 (en) * | 2014-02-20 | 2018-06-13 | 住友電工プリントサーキット株式会社 | Temperature sensing device and circuit board |
| JP2017151014A (en) * | 2016-02-26 | 2017-08-31 | 積水化学工業株式会社 | Electric circuit and sensor |
| CN109100040A (en) * | 2018-09-21 | 2018-12-28 | 杭州科美特传感器有限公司 | The temperature sensor and power battery BMS device detection system of more thermistors |
| JP7334986B2 (en) * | 2019-01-16 | 2023-08-29 | Ｐｏｓｈ Ｗｅｌｌｎｅｓｓ Ｌａｂｏｒａｔｏｒｙ株式会社 | Detector and Condition Determining Device |
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2009
- 2009-07-29 JP JP2009177118A patent/JP2011033359A/en not_active Withdrawn
-
2010
- 2010-07-28 CN CN2010102407279A patent/CN101988856A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102998012A (en) * | 2012-11-30 | 2013-03-27 | 上海宏力半导体制造有限公司 | Pipeline monitoring device |
| CN103090989A (en) * | 2013-01-18 | 2013-05-08 | 北京瑞恒超高压电器研究所(普通合伙) | Contact type rotor temperature measuring method and device |
| CN103090989B (en) * | 2013-01-18 | 2015-02-18 | 北京瑞恒超高压电器研究所(普通合伙) | Contact type rotor temperature measuring method and device |
| WO2014176784A1 (en) * | 2013-05-03 | 2014-11-06 | 3M Innovative Properties Company | System for monitoring temperature of electrical conductor |
| CN105190268A (en) * | 2013-05-03 | 2015-12-23 | 3M创新有限公司 | System for monitoring temperature of electrical conductor |
| US9885618B2 (en) | 2013-05-03 | 2018-02-06 | 3M Innovative Properties Company | System for monitoring temperature of electrical conductor |
| CN106291201A (en) * | 2016-09-09 | 2017-01-04 | 深圳市雷博斯科技有限公司 | The lightning monitoring of a kind of lightning protection box and deterioration state monitoring system and method |
| CN106291201B (en) * | 2016-09-09 | 2023-08-22 | 深圳市雷博斯科技有限公司 | Lightning monitoring and degradation state monitoring system and method for lightning protection box |
| CN106940226A (en) * | 2017-05-15 | 2017-07-11 | 上海安誉智能科技有限公司 | Temperature sensor line based on temperature element |
| CN106969850A (en) * | 2017-05-15 | 2017-07-21 | 上海安誉智能科技有限公司 | The temperature sensing cable and its application and method of temperature sensor line based on output PWM ripples |
| CN106969852A (en) * | 2017-05-15 | 2017-07-21 | 上海安誉智能科技有限公司 | Export temperature sensor line circuit structure, system for detecting temperature and its method for PWM ripples |
| WO2024069539A1 (en) * | 2022-09-30 | 2024-04-04 | Novocure Gmbh | Single wire temperature measurement solution for a ttfield application system and methods of production and use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011033359A (en) | 2011-02-17 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110323 |