CN101974833A - Crosswise slicing device of computer chip embroidery machine - Google Patents
Crosswise slicing device of computer chip embroidery machine Download PDFInfo
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- CN101974833A CN101974833A CN2010105243957A CN201010524395A CN101974833A CN 101974833 A CN101974833 A CN 101974833A CN 2010105243957 A CN2010105243957 A CN 2010105243957A CN 201010524395 A CN201010524395 A CN 201010524395A CN 101974833 A CN101974833 A CN 101974833A
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- cutter
- embroidery machine
- slicing
- rack
- gear
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Abstract
The invention discloses a crosswise slicing device of a computer chip embroidery machine, which comprises a drive motor, a gear, a rack seat, a rack, a slicing cutter rest, a cutter-delivering sliding block, a cutter-installing frame, an upper cutter and a lower cutter, wherein the gear is arranged on an output shaft of the drive motor and meshed with the rack on the rack seat; the rack seat is connected with the cutter-delivering sliding block is arranged on the slicing cutter rest, the upper cutter and the lower cutter are arranged on the cutter-installing frame; and under the drive of the motor, the gear and the rack, the cutter-delivering sliding block can slide left and right transversely in the slicing cutter frame so as to drive the upper cutter and the lower cutter on the cutter rest to move left and right transversely for cutting a wafer. The invention has compact and reasonable structure, changes the manner of realizing slicing by impacting power of a needle rod, and realizes the separation of power generated by slicing and the embroidery machine, thereby ensuring the stability and the reliability of the computer embroidery machine and effectively enhancing the production efficiency of the computer embroidery machine and the quality of embroideries.
Description
Technical field:
The present invention relates to a kind of slices across device of electronic chip embroidery machine, belong to garment machinery manufacturing technology field.
Background technology:
At present, the wafer film advance mechanism is installed all on the electronic chip embroidery machine, the wafer on the wafer film advance mechanism is delivered to by conveying mechanism on the sewing that need make, by the wafer slice device it is cut off, and by eedle it is made on sewing then.Slicing device on traditional electronic chip embroidery machine is provided with all in vertical direction, slicing device on this electronic chip embroidery machine that is provided with in vertical direction, in the section course of work, need a sizable impulsive force that it is moved downward, could cut off interconnective wafer in the wafer film advance mechanism.This wafer slice device that is provided with in vertical direction not only structure is comparatively complicated, and because it adopts shank bump moving knife to realize cutting into slices, therefore, in the section course of work, wafer shearing device vertically downward can bump with the shank that moves downward, influence the reliability and stability of electronic chip embroidery machine, thereby seriously influenced the production efficiency and the embroidery quality of electronic chip embroidery machine.
Summary of the invention:
In view of the problem of above-mentioned existence, the purpose of this invention is to provide a kind of reasonable in design, mechanism's compactness, working stability, production efficiency height, and the low electronic chip embroidery machine slices across device of cost.
For achieving the above object, the present invention has taked following technical measures:
Electronic chip embroidery machine slices across device of the present invention, include drive motors, gear, tooth bar seat, tooth bar, section knife rest, send the cutter slide block, adorn parts such as knife rest, upper cutter, lower cutter, wherein, gear is installed on the output shaft of drive motors, and is meshed with tooth bar on the tooth bar seat; The tooth bar seat is connected with sending the cutter slide block; Send the cutter slide block to be installed on the section knife rest, upper cutter, lower cutter are installed on the dress knife rest; Send the cutter slide block in the section knife rest, laterally to horizontally slip, send the cutter slide block then can drive the upper cutter, the lower cutter that are installed on the knife rest and make horizontal move left and right, thereby reach the purpose of cutting off wafer.
Through the present invention after the above-mentioned design, compact conformation, reasonable, it has changed original employing shank bump moving knife and has realized the method for cutting into slices, the power of section generation and separating of embroidery machine have been realized, thereby prevented that embroidery machine from sending the vibrations that produce in sheet, the slicing processes, guarantee stability and reliability that computerized emboridering machine is produced, and effectively improved the production efficiency of computerized emboridering machine and the quality of embroidery.
Description of drawings:
Fig. 1 is a part assembling schematic diagram of the present invention
Wherein: 1-drive motors 2-gear 3-tooth bar seat 4-tooth bar 5-section knife rest 6-send cutter slide block 7-dress knife rest 8-upper cutter 9-lower cutter 10-apart from pad
The specific embodiment:
Electronic chip embroidery machine slices across device of the present invention, include drive motors 1, gear 2, tooth bar seat 3, tooth bar 4, section knife rest 5, send cutter slide block 6, dress knife rest 7, upper cutter 8, lower cutter 9, wherein, gear 2 is installed on the output shaft of drive motors 1, and is meshed with tooth bar 2 on the tooth bar seat 3; Tooth bar seat 3 is connected with sending cutter slide block 6; Send cutter slide block 6 to be installed on the section knife rest 5, upper cutter 8, lower cutter 9 are installed on the dress knife rest 7; Send cutter slide block 6 laterally to horizontally slip in the knife rest 5, send 6 of cutter slide blocks to drive to be installed in upper cutter 8, the lower cutter 9 adorned on the knife rest 7 and make horizontal move left and right, to reach the purpose of cut-out wafer in section.Between upper cutter 8 and lower cutter 9, be provided with one apart from pad 10.Thickness apart from pad 10 is adjustable, with the effective clearance between assurance upper cutter 8 and the lower cutter 9, thereby has guaranteed the operate as normal of upper cutter 8 and lower cutter 9 and the cut-out of wafer effectively.
Claims (2)
1. electronic chip embroidery machine slices across device, it is characterized in that this electronic chip embroidery machine slices across device, include drive motors (1), gear (2), tooth bar seat (3), tooth bar (4), section knife rest (5), send cutter slide block (6), dress knife rest (7), upper cutter (8), lower cutter (9), wherein, gear (2) is installed on the output shaft of drive motors (1), and is meshed with tooth bar (2) on the tooth bar seat (3); Tooth bar seat (3) is connected with sending cutter slide block (6); Send cutter slide block (6) to be installed on the section knife rest (5), upper cutter (8), lower cutter (9) are installed on the dress knife rest (7), send cutter slide block (6) laterally to horizontally slip in section knife rest (5).
2. a kind of electronic chip embroidery machine slices across device according to claim 1 is characterized in that being provided with one apart from pad (10) between upper cutter (8) and lower cutter (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105243957A CN101974833A (en) | 2010-10-29 | 2010-10-29 | Crosswise slicing device of computer chip embroidery machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105243957A CN101974833A (en) | 2010-10-29 | 2010-10-29 | Crosswise slicing device of computer chip embroidery machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101974833A true CN101974833A (en) | 2011-02-16 |
Family
ID=43574736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105243957A Pending CN101974833A (en) | 2010-10-29 | 2010-10-29 | Crosswise slicing device of computer chip embroidery machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101974833A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109304818A (en) * | 2018-10-17 | 2019-02-05 | 江苏英锐半导体有限公司 | A kind of segmentizing unit for wafer flow manufacture |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005205153A (en) * | 2003-12-22 | 2005-08-04 | Barudan Co Ltd | Sequin supply arrangement |
| CN2830453Y (en) * | 2005-08-19 | 2006-10-25 | 陈学军 | Feeder for embroidering chips |
| CN201485662U (en) * | 2009-08-27 | 2010-05-26 | 许晓会 | Multiple gold plate sending device |
| CN201835120U (en) * | 2010-10-29 | 2011-05-18 | 张丁元 | Transverse slicing device of computerized embroidery machine capable of knitting crystal plates |
-
2010
- 2010-10-29 CN CN2010105243957A patent/CN101974833A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005205153A (en) * | 2003-12-22 | 2005-08-04 | Barudan Co Ltd | Sequin supply arrangement |
| CN2830453Y (en) * | 2005-08-19 | 2006-10-25 | 陈学军 | Feeder for embroidering chips |
| CN201485662U (en) * | 2009-08-27 | 2010-05-26 | 许晓会 | Multiple gold plate sending device |
| CN201835120U (en) * | 2010-10-29 | 2011-05-18 | 张丁元 | Transverse slicing device of computerized embroidery machine capable of knitting crystal plates |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109304818A (en) * | 2018-10-17 | 2019-02-05 | 江苏英锐半导体有限公司 | A kind of segmentizing unit for wafer flow manufacture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110216 |