CN101957148A - Structures, materials and forms of nonmetal heat radiators - Google Patents
Structures, materials and forms of nonmetal heat radiators Download PDFInfo
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- CN101957148A CN101957148A CN2010102694714A CN201010269471A CN101957148A CN 101957148 A CN101957148 A CN 101957148A CN 2010102694714 A CN2010102694714 A CN 2010102694714A CN 201010269471 A CN201010269471 A CN 201010269471A CN 101957148 A CN101957148 A CN 101957148A
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Abstract
The invention relates to structures, materials and form of nonmetal heat radiators. The invention is characterized in that the structure and the material 1 of the nonmetal heat radiator mainly comprise a water cavity (1), an outer wall (2) and an outer surface layer (may or may not be needed), the typical nonmetal water cavity (1) mainly comprises a composite material of hot melting macromolecules and a heat conduction auxiliary agent, the outer wall (2) is mainly a compound comprising adhesive as well as powder, particles and a fibrous material which have good heat conducting properties, and the outer surface layer comprises metal, paint materials (comprising metal paint, and the like) or other exterior materials; and the structure and the material 2 of the nonmetal heat radiator mainly comprise the water cavity (1) and the outer surface layer (may or may not be needed), the water cavity (1) is mainly a compound of PB (Plumbum), PE (Polyethylene)-RT, cross-linked PE or glass fiber reinforced plastic resin and a heat conducting auxiliary agent, and the outer layer surface comprises metal, paint materials (comprising metal paint, and the like) or other exterior materials. Various heat radiator forms can be manufactured through the structures and the materials.
Description
Technical field
The present invention is structure, material and the form of nonmetal radiator, belongs to the energy, material and HVAC technical field.
Background technology
The radiator that uses is based on metal material at present, and the radiator of non-metallic material also has report, but uses few.Nonmetal radiator has environmental protection, the life-span is long, burn into is not subjected to water quality impact, and the manufacture process energy consumption is low, and cost also has superiority.It is a kind of product of low-carbon (LC).
But nonmetallic heat conductivility, mechanical property are the keys that the nonmetal radiator of influence is succeeded in developing.Can solve the contradictory relation of these two problems well, the product that just has success occurs.The present invention solves this contradiction exactly well on material-structure constitutes, thereby proposes the nonmetal radiator structure and the corresponding radiator product of innovation.
The mechanics and the corrosion resistance and good of macromolecular material in nonmetal, but when improving toward the heat conduction direction on, its mechanical property can be destroyed, so this performance that connects individual aspect of balance is an essence of the present invention.
The summary of the invention and the specific embodiment
1. the structure of nonmetal radiator, material and form is characterized in that:
First: the structure of nonmetal radiator and material 1 mainly are made of water cavity (1), outer wall (2) and outer surface layer (outer surface layer is not essential).Water cavity (1) mainly plays the effect of chamber inner fluid separation layer; Outer wall (2) mainly plays the effect that increases area of dissipation and bear water cavity (1) fluid pressure; Outer surface layer plays and improves radiation heat transfer performance, protection and decorative effect (outer surface layer is not essential).Water cavity (1) has the excellent heat conductivity ability or has improved the capacity of heat transmission, and the pressure of water cavity (1) inner fluid can not born or not exclusively bear, and its material can be nonmetallic materials, metal material or both composites.The main material of the nonmetal water cavity of one quasi-representative (1) material constitutes: but the macromolecule of hot melt (comprises PP, PE, PB or other macromolecule types, at least a) with the composite of heat conduction auxiliary agent (comprising graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride or the good material of other heat conductivility, at least a).The main material of outer wall (2) is: the complex that good powder, particle and the fibrous material (three is at least a) of jelly and thermal conductivity constitutes.Jelly refers to: the fiberglass resinoid of high temperature resistance and high strength in organic jelly (comprising epoxy resin, phenolic resins, unsaturated-resin, acrylic size, organic siliconresin, PI, PEEK, PEI, PPS, other resin glue type and material modified), inorganic jelly (comprising waterglass, lithium silicate, Ludox, cement and other inorganic glue agent type) and composite modified class jelly, and at least a.Powder and particle comprise: graphite, small particle diameter sandstone or other powder particles, and at least a.Fibrous material comprises: carbon fiber, metallic fiber, glass fibre or other material fiber, and at least a.The outer surface layer material is metal, lacquer class material (comprising metallic paint etc.) or other outer exterior materials.
Second: nonmetal radiator structure and material 2 mainly are made of water cavity (1) and outer surface layer (outer surface layer is not essential).The main material of water cavity (1) is: PB, PE-RT, crosslinked polyethylene or resistant to elevated temperatures fiberglass resinoid (comprise epoxy resin, phenolic resins, unsaturated-resin, acrylic size, organic siliconresin, PI, PEEK, PEI, PPS and other resin, at least a), the complex of heat conduction auxiliary agent (comprising graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride, carbon fiber, metallic fiber or the good material of other heat conductivility, at least a).The outer surface layer material is metal, lacquer class material (comprising metallic paint etc.) or other outer exterior materials.
The 3rd: one of heat sink format is the nonmetal radiator of thin board type.Adopt nonmetal radiator structure and material 1 to make; The form of the water cavity of the nonmetal radiator of thin board type (1) is: the collector of tubule road and termination is formed.In outer wall (2) layer is wrapped in thin conduit and collector.Or adopting nonmetal radiator structure and material 2 to make, water cavity (1) is the cavity of different shape.The form of the nonmetal radiator of thin board type is the tabular of plane or curved surface, and is independent mutually with building maintenance structure.
The 4th: two of heat sink format is the nonmetal radiator of chip.Adopt nonmetal radiator structure and material 1 to make; The form of the water cavity of the nonmetal radiator of chip (1) is: the collector of tubule road and termination constitutes; Or be the cavity formation of different shape.In outer wall (2) layer is wrapped in the cavity of thin conduit, collector or different shape.Or adopting nonmetal radiator structure and material 2 to make, water cavity (1) is the cavity of different shape.The form of the nonmetal radiator of chip is a chip, and the thickness direction size is more board-like big, promptly is similar to a slice or a post of traditional heat-dissipating device sheet.Integratedly between sheet and the sheet make, the built-in metal mantle fiber is connected or but other connector is connected.
The 5th: three of heat sink format is the nonmetal radiator of card formula.Adopt nonmetal radiator structure and material 1 or adopt nonmetal radiator structure and material 2 to make.The form of the nonmetal radiator of card formula be the nonmetal radiator of a plurality of thin board types to leave the hole of various forms on combination of certain artistic form or the nonmetal radiator of single thin plate formula.
The 6th: four of heat sink format is nonmetal around gilled radiator.Nonmetally around the gilled radiator preparation method be: adopt nonmetal radiator structure and material 2 to make, one-shot forming is the radiator body of band around sheet or fin, adds cover body and forms nonmetal around gilled radiator.
2. the thickness of slab size range of nonmetal radiator of thin board type and the nonmetal radiator of card formula is: 10-50mm; Water cavity (1) thin conduit caliber is 3-20mm; Water cavity or water cavity (1) wall thickness is 0.01-3mm.
3. the gauge scope of the nonmetal radiator of chip is: 50-200mm.A kind of reinforcement convection current measure of the nonmetal radiator of chip is: have the micropore (3) that a large amount of air can circulate on the lamellar body, micro-pore diameter is: 1-10mm.
4. the heat conduction auxiliary agent that adopts in the structure of the structure of nonmetal radiator and material 1 and metal heat sink and the material 2 (comprises graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride or the good material of other heat conductivility, at least a), can be the nanometer grade powder material.
Principle
The structure of nonmetal radiator and material 1 mainly are made of water cavity (1), outer wall (2) and outer surface layer.But water cavity adopts the macromolecule and the composite of heat conduction auxiliary agent of hot melt, and when heat conduction auxiliary agent content was high, the reduction of the mechanical property of polymer composite was very big, but makes successful heat conductivility and all good hot melt material radiator of mechanical property is difficult.Therefore must rely on outer wall to bear or the bearing capacity of compensative material, increase area of dissipation simultaneously.It is a kind of fairly perfect form.
The structure of nonmetal radiator and material 2 mainly are made of water cavity (1) and outer surface layer.The water cavity of this material is that the complex of macromolecule and heat conduction auxiliary agent etc. is born heat conduction and mechanical property, therefore macromolecular material requires height, and the heat conduction auxiliary dosage is limited, and heat conductivility is limited, be applied to big area of dissipation radiator, promptly more satisfactory around gilled radiator.
Description of drawings
The structure of accompanying drawing 1, nonmetal radiator and material 1 schematic diagram;
Accompanying drawing 2, the nonmetal radiator schematic diagram of thin board type;
Accompanying drawing 3, the nonmetal radiator schematic diagram of chip;
Reference numeral: 1-water cavity 2-outer wall 3-micropore
Claims (4)
1. the structure of nonmetal radiator, material and form is characterized in that:
First: the structure of nonmetal radiator and material 1 mainly are made of water cavity (1), outer wall (2) and outer surface layer (outer surface layer is not essential).Water cavity (1) mainly plays the effect of chamber inner fluid separation layer; Outer wall (2) mainly plays the effect that increases area of dissipation and bear water cavity (1) fluid pressure; Outer surface layer plays and improves radiation heat transfer performance, protection and decorative effect (outer surface layer is not essential).Water cavity (1) has the excellent heat conductivity ability or has improved the capacity of heat transmission, and the pressure of water cavity (1) inner fluid can not born or not exclusively bear, and its material can be nonmetallic materials, metal material or both composites.The main material of the nonmetal water cavity of one quasi-representative (1) material constitutes: but the macromolecule of hot melt (comprises PP, PE, PB or other macromolecule types, at least a) with the composite of heat conduction auxiliary agent (comprising graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride or the good material of other heat conductivility, at least a).The main material of outer wall (2) is: the complex that good powder, particle and the fibrous material (three is at least a) of jelly and thermal conductivity constitutes.Jelly refers to: the fiberglass resinoid of high temperature resistance and high strength in organic jelly (comprising epoxy resin, phenolic resins, unsaturated-resin, acrylic size, organic siliconresin, PI, PEEK, PEI, PPS, other resin glue type and material modified), inorganic jelly (comprising waterglass, lithium silicate, Ludox, cement and other inorganic glue agent type) and composite modified class jelly, and at least a.Powder and particle comprise: graphite, small particle diameter sandstone or other powder particles, and at least a.Fibrous material comprises: carbon fiber, metallic fiber, glass fibre or other material fiber, and at least a.The outer surface layer material is metal, lacquer class material (comprising metallic paint etc.) or other outer exterior materials.
Second: nonmetal radiator structure and material 2 mainly are made of water cavity (1) and outer surface layer (outer surface layer is not essential).The main material of water cavity (1) is: PB, PE-RT, crosslinked polyethylene or resistant to elevated temperatures fiberglass resinoid (comprise epoxy resin, phenolic resins, unsaturated-resin, acrylic size, organic siliconresin, PI, PEEK, PEI, PPS and other resin, at least a), the complex of heat conduction auxiliary agent (comprising graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride, carbon fiber, metallic fiber or the good material of other heat conductivility, at least a).The outer surface layer material is metal, lacquer class material (comprising metallic paint etc.) or other outer exterior materials.
The 3rd: one of heat sink format is the nonmetal radiator of thin board type.Adopt nonmetal radiator structure and material 1 to make; The form of the water cavity of the nonmetal radiator of thin board type (1) is: the collector of tubule road and termination is formed.In outer wall (2) layer is wrapped in thin conduit and collector.Or adopting nonmetal radiator structure and material 2 to make, water cavity (1) is the cavity of different shape.The form of the nonmetal radiator of thin board type is the tabular of plane or curved surface, and is independent mutually with building maintenance structure.
The 4th: two of heat sink format is the nonmetal radiator of chip.Adopt nonmetal radiator structure and material 1 to make; The form of the water cavity of the nonmetal radiator of chip (1) is: the collector of tubule road and termination constitutes; Or be the cavity formation of different shape.In outer wall (2) layer is wrapped in the cavity of thin conduit, collector or different shape.Or adopting nonmetal radiator structure and material 2 to make, water cavity (1) is the cavity of different shape.The form of the nonmetal radiator of chip is a chip, and the thickness direction size is more board-like big, promptly is similar to a slice or a post of traditional heat-dissipating device sheet.Integratedly between sheet and the sheet make, the built-in metal mantle fiber is connected or but other connector is connected.
The 5th: three of heat sink format is the nonmetal radiator of card formula.Adopt nonmetal radiator structure and material 1 or adopt nonmetal radiator structure and material 2 to make.The form of the nonmetal radiator of card formula be the nonmetal radiator of a plurality of thin board types to leave the hole of various forms on combination of certain artistic form or the nonmetal radiator of single thin plate formula.
The 6th: four of heat sink format is nonmetal around gilled radiator.Nonmetally around the gilled radiator preparation method be: adopt nonmetal radiator structure and material 2 to make, one-shot forming is the radiator body of band around sheet or fin, adds cover body and forms nonmetal around gilled radiator.
2. the structure of nonmetal radiator according to claim 1, material and form, the thickness of slab size range of nonmetal radiator of thin board type and the nonmetal radiator of card formula is: 10-50mm; Water cavity (1) thin conduit caliber is 3-20mm; Water cavity or water cavity (1) wall thickness is 0.01-3mm.
3. the structure of nonmetal radiator according to claim 1, material and form, the gauge scope of the nonmetal radiator of chip is: 50-200mm.A kind of reinforcement convection current measure of the nonmetal radiator of chip is: have the micropore (3) that a large amount of air can circulate on the lamellar body, micro-pore diameter is: 1-10mm.
4. the structure of nonmetal radiator according to claim 1, material and form, the heat conduction auxiliary agent that adopts in the structure of the structure of nonmetal radiator and material 1 and metal heat sink and the material 2 (comprises graphite, Graphon, carborundum, beryllium oxide, aluminium oxide, aluminium nitride or the good material of other heat conductivility, at least a), can be the nanometer grade powder material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102694714A CN101957148A (en) | 2010-09-01 | 2010-09-01 | Structures, materials and forms of nonmetal heat radiators |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102694714A CN101957148A (en) | 2010-09-01 | 2010-09-01 | Structures, materials and forms of nonmetal heat radiators |
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| CN101957148A true CN101957148A (en) | 2011-01-26 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103256575A (en) * | 2012-02-15 | 2013-08-21 | 陈炳武 | Radiator and LED (light emitting diode) lamp with same |
| EP2677011A1 (en) * | 2012-06-22 | 2013-12-25 | Zehnder Verkaufs- und Verwaltungs AG | Heat conductive adhesive and cast compound |
| CN104180348A (en) * | 2014-08-07 | 2014-12-03 | 国家电网公司 | LED lamp provided with radiating fins |
| CN107179631A (en) * | 2017-06-27 | 2017-09-19 | 厦门天马微电子有限公司 | A kind of display device |
| CN112093841A (en) * | 2020-07-31 | 2020-12-18 | 曾庆福 | Solar energy distillation drinking water system |
| CN114495747A (en) * | 2022-01-28 | 2022-05-13 | 北海惠科光电技术有限公司 | Heat dissipation structure and display device |
-
2010
- 2010-09-01 CN CN2010102694714A patent/CN101957148A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103256575A (en) * | 2012-02-15 | 2013-08-21 | 陈炳武 | Radiator and LED (light emitting diode) lamp with same |
| EP2677011A1 (en) * | 2012-06-22 | 2013-12-25 | Zehnder Verkaufs- und Verwaltungs AG | Heat conductive adhesive and cast compound |
| CN104180348A (en) * | 2014-08-07 | 2014-12-03 | 国家电网公司 | LED lamp provided with radiating fins |
| CN104180348B (en) * | 2014-08-07 | 2017-07-04 | 国家电网公司 | A kind of LED lamp comprising fin |
| CN107179631A (en) * | 2017-06-27 | 2017-09-19 | 厦门天马微电子有限公司 | A kind of display device |
| CN107179631B (en) * | 2017-06-27 | 2020-08-25 | 厦门天马微电子有限公司 | Display device |
| CN112093841A (en) * | 2020-07-31 | 2020-12-18 | 曾庆福 | Solar energy distillation drinking water system |
| CN114495747A (en) * | 2022-01-28 | 2022-05-13 | 北海惠科光电技术有限公司 | Heat dissipation structure and display device |
| CN114495747B (en) * | 2022-01-28 | 2024-02-02 | 北海惠科光电技术有限公司 | Heat radiation structure and display device |
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Application publication date: 20110126 |