CN101944194A - Method for inserting radio frequency identification RFID signal in printed circuit board - Google Patents
Method for inserting radio frequency identification RFID signal in printed circuit board Download PDFInfo
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- CN101944194A CN101944194A CN 201010217098 CN201010217098A CN101944194A CN 101944194 A CN101944194 A CN 101944194A CN 201010217098 CN201010217098 CN 201010217098 CN 201010217098 A CN201010217098 A CN 201010217098A CN 101944194 A CN101944194 A CN 101944194A
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005516 engineering process Methods 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 3
- 239000011162 core material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides a method for inserting a radio frequency identification RFID signal in a printed circuit board, relates to the fields of PCB manufacture and UHF RFID application, and discloses a method for inserting UHF RFID in PCB to achieve the aims of counterfeiting and tracking. Different from that of directly embedding or adhering a packaged RFID label on the surface, the method is characterized in that the unpackaged RFID chip is directly inserted in the PCB by using a mode of adding a new electric signal layer to complete antenna manufacture in the PCB and complete interconnection of the antenna and the chip in the PCB by adopting the Build-up technology. The method saves primary package of the RFID chip and the antenna, is compatible with chip embedding, antenna manufacture and PCB manufacture process, and can manufacture the RFID label on the whole board simultaneously so as to reduce the application cost of embedding the RFID label.
Description
Technical field
The present invention relates to PCB and make field and UHF RFID application, mainly is a kind of structure of heeling-in UHF RFID in PCB, with the heeling-in and being produced in the PCB respectively of RFID chip and antenna, and finishes interconnection, thereby can finish false proof and effect spike.
Background technology
According to the thought of hyundai electronics assembling, printed circuit board (PCB) is divided into different types in the different phase of electronics assembling process.Dissimilar printed circuit board (PCB)s (Printed Circuit Board, PCB), the function that it plays is slightly variant, and application direction is also different.Base plate for packaging is applied to the assembling of first order electronics.On this substrate, directly carry single-chip, constitute the basal disc of encapsulation; Conventional printed circuit board applications is in the assembling of second and third grade electronics, as the motherboard of construction system, carries out discrete device and the assembling of the integrated chip that encapsulated.
The structure of a pcb board generally is made of individual layer or multiple layer of copper conductive pattern layer, supports with dielectric layer between the conductive pattern layer and insulate, and the intercommunicated lamination (Build-up technology) of crossing between each layer realizes that the element dress is attached to the surface of pcb board.
Fig. 1 is the example of 4 layers of pcb board.4 layers of pcb board are made by 7 layer materials.101 and 107 is signals layer, and 103 is power plane, and 105 is ground plane, is core material insulation by 104 between 103 and 105 and supports, and between 101 and 103, between 105 and 107, is insulated by dielectric material (102,106).
RFID is REID (Radio Frequency Identification), is a kind of automatic identification technology that begins to rise the nineties in 20th century.REID is utilized radiofrequency signal, realizes that by space coupling (alternating magnetic field or electromagnetic field) contactless information transmission and the information of passing through to be transmitted reach the technology of identifying purpose.Wherein, UHF RFID is the super high frequency radio frequency recognition technology, frequency of operation be 860MHz between the 960MHz, the electric wave of this frequency range can not pass through many materials, particularly water, dust, suspended particulate matters such as mist.With respect to the RFID (frequency of operation 13.56MHz) of high frequency, the electronic tag of hyper band does not need to separate with metal.Another advantage of UHF RFID is the message transmission rate height, can read a large amount of electronic tags in the very short time.
In the PCB industry, need suitable manner that the PCB product of producing is carried out anti-fake mark and whereabouts affirmation.Traditional approach is at surface mounted bar code, labels RFID of putting reading of data automatically etc. on the surface.As shown in Figure 2, on a packaged pcb board that posts 201, select suitable space dress joint strip font code or RFID label 202.But manually dress pastes and loses time, and the surface is labeled the form of putting and can not well be protected, to guarantee false proof and function spike.Because label be placed on the surface may suffer artificial or unexpected failure, carve or the like such as peeling off, drawing.Therefore people begin to consider that with the heeling-in of RFID label in substrate inside, because the RFID label has certain distance that reads, heeling-in can not influence its data read in substrate inside, and has effectively protected the RFID label.As shown in Figure 3, for a kind of existing with the structure of RFID label heeling-in in pcb board inside.With the doubling plate is example, among the dielectric layer between signals layer 301 and 304 302, heeling-in RFID label 303.
The present invention is directed to the new heeling-in method of heeling-in UHF RFID proposition in PCB.
Summary of the invention
The object of the present invention is to provide a kind of in PCB the method for heeling-in UHF RFID label, omit the encapsulation of RFID label, the UHF RFID chip that direct heeling-in does not encapsulate, utilize the pcb board manufacture craft to finish the making of antenna and the interconnection between chip and the antenna, thereby reduce cost, and can finish different antenna making according to specifically reading needs.
One of feature of the present invention is, for the printed circuit board (PCB) that central layer is arranged, in described central layer symmetry up and down, respectively with power plane and ground plane position adjacent, inserts two electrically conductive signal layers:
The first electrically conductive signal layer is positioned at described central layer top, and a power plane layer is arranged between this first electrically conductive signal layer and the central layer, and the described first electrically conductive signal layer is adjacent with the power plane layer, between a dielectric layer is arranged;
The second electrically conductive signal layer is positioned at described central layer bottom, between this second electrically conductive signal layer and the central layer ground plane is arranged, and the described second electrically conductive signal layer is adjacent with ground plane, between a dielectric layer is arranged;
On the described first electrically conductive signal layer, make antenna pattern, on the power plane layer, select an isolated area, bonding is the radio frequency discrimination RFID chip of encapsulation not, and the radio frequency discrimination RFID chip of described not encapsulation is drawn the port that connects antenna by lamination Build-up technology; Pass described dielectric layer and antenna and finish interconnection, the second electrically conductive signal layer is as pseudobed.
Two of feature of the present invention is: the described printed circuit board (PCB) that central layer is arranged comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Three of feature of the present invention is, printed circuit board (PCB) for no central layer, between power plane layer and ground plane, insert two electrically conductive signal layers: the first radio frequency discrimination RFID structural sheet and the second radio frequency discrimination RFID structural sheet, between described first radio frequency discrimination RFID structural sheet and the described second radio frequency discrimination RFID structural sheet, a dielectric layer is arranged, wherein:
Above the first radio frequency discrimination RFID structural sheet, be manufactured with antenna pattern;
Above the second radio frequency discrimination RFID structural sheet, be bonded with the not radio frequency discrimination RFID chip of encapsulation, the radio frequency discrimination RFID chip of described not encapsulation is drawn the port that connects antenna by lamination Build-up technology; Pass described dielectric layer and antenna and finish interconnection.
Four of feature of the present invention is: the printed circuit board (PCB) of described no central layer comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
The general mode that adopts the packaged RFID label of direct heeling-in of existing heeling-in RFID technology has comprised RFID chip and antenna in this encapsulation.Itself has improved cost encapsulation, and chip area is very little, and area is subject to Antenna Design in encapsulation, and Antenna Design is subject to packaging appearance, in promptly a certain proportion of rectangular profile.The present invention will be in PCB the RFID chip of heeling-in un-encapsulated, and in PCB, finish the making of antenna and the interconnection of chip and antenna, thereby constitute complete RFID label.When reaching the purpose of heeling-in RFID with false proof spike, reduced the packaging cost of RFID label, and can be in large tracts of land designing antenna more freely, adapt to different RFID with the flexible antenna design and read demand.
Description of drawings
Fig. 1 is 4 layers of core plate structure pcb board signal;
Fig. 2 is pcb board surface mount bar code or the signal of RFID label;
Fig. 3, for a kind of with the structure of RFID label heeling-in in pcb board inside;
Fig. 4 for inserting the signals layer signal in the pcb board, (a) is the signal of core plate structure pcb board, (b) no core plate structure pcb board signal;
Fig. 5 is heeling-in structure explanation among the present invention;
Fig. 6 makes signal for antenna among the present invention, (a) is the linear antenna figure, (b) is the helical antenna figure;
Fig. 7, the RFID chip example that does not encapsulate for the heeling-in of former four layers of core plate structure pcb board;
Fig. 8, the RFID chip example that does not encapsulate for the heeling-in of former four layers of no core plate structure pcb board.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the present invention, and can not be interpreted as limitation of the present invention.
In the present invention, under existing pcb board design, add two corresponding signals layers, carry out chip heeling-in and antenna and make.
1) in the project organization of pcb board, on the basis that does not change original rhythmo structure order and design, add two signals layers, carry out the chip heeling-in;
2) for the pcb board of core plate structure, these two signals layers are symmetrical up and down at central layer, one of them is as pseudobed, it is the dummy signals layer, another signals layer and power plane are adjacent, utilize power plane to finish chip attach, carry out antenna and make on the signals layer that increases newly, the interconnection between two-layer is realized by the Build-up technology.
3) for the pcb board of no core plate structure, these two signals layers are adjacent, and one is used for chip attach, and one is used to make antenna, and the interconnection between two-layer is realized by the Build-up technology.
In such scheme, do not influence on the basis of other signals layers, in the middle of pcb board, increase two signals layers newly, be used for heeling-in RFID chip and antenna and make.
For the pcb board 410 that contains core plate structure, corresponding two new signals layers 414 and 415 of inserting in central layer 411 both sides.Select first signals layer 414 wherein to carry out the antenna pattern making, then Dui Ying secondary signal layer 415 becomes pseudobed, the isolated area of chip attach on the power plane 412 adjacent with first signals layer 414, the antenna that chip passes on dielectric layer 416 and 414 is finished interconnection.
For the pcb board 420 of no core plate structure, shown in 421, be the electric signal layer among the figure, be depicted as dielectric layer as 422.In the middle of pcb board, add two new signals layers 423 and 424, carry out chip attach, carry out antenna at the second radio frequency discrimination RFID structural sheet 424 and make at the first radio frequency discrimination RFID structural sheet 423.
The concrete structure that chip heeling-in and antenna are made is seen Fig. 5.For carrying out two copper conducting wiring layers 501 and 505 that chip heeling-in and antenna are made, bonding chip 502 is finished Build-up technology 503 on 502 on signals layer 501, makes flow process according to PCB then, add dielectric layer 504, compress signals layer 505.On signals layer 505, finish the making of antenna pattern.Antenna is made must consider dodging through hole.The antenna of making in the signals layer 505 as shown in Figure 6, but the form that is not limited to provide among Fig. 6.
Because the making scope of antenna is whole pcb board size, therefore can design large-sized antenna to adapt to the different application demand.
With the former pcb board that is designed to four layers of core plate structure is example, adds two signals layers 703 and 704 on central layer 708 symmetria bilateralis ground, and this pcb board becomes 6 layers of pcb board.Selecting secondary signal layer 704 is pseudobed, on power plane 701, select an isolated area 705, bonding chip 706 in 705, in new signals layer first signals layer 703 that adds, finish the making of antenna pattern 707, utilize Build-up technology to draw the port that connects antenna on the chip 706, pass the interconnection that dielectric layer 702 is accomplished to antenna 707.
Pcb board with four layers of no core plate structure of former design is an example, is depicted as the electric signal layer as 801, is depicted as dielectric layer as 802.Two signals layers 803,804 of new interpolation in the middle of pcb board, this PCB becomes 6 layers of pcb board.New two signals layers that add are adjacent, on the second radio frequency discrimination RFID structural sheet 804, select any zone 805, there is not via hole in this zone, bonding chip 806 in 805, in the first radio frequency discrimination RFID signals layer 803, finish the making of antenna pattern 807, utilize Build-up technology to draw the port that connects antenna on the chip 806, pass dielectric layer 802 and finish the interconnection of chip 806 to antenna 807.
Claims (4)
1. go into the method for the RFID label of radio frequency identification to the printed circuit board (PCB) interpolation for one kind, it is characterized in that:,,, insert two electrically conductive signal layers respectively with power plane, ground plane position adjacent in described central layer symmetry up and down for the printed circuit board (PCB) that central layer is arranged:
The first electrically conductive signal layer is positioned at described central layer top, and a power plane layer is arranged between this first electrically conductive signal layer and the central layer, and the described first electrically conductive signal layer is adjacent with the power plane layer, between a dielectric layer is arranged;
The second electrically conductive signal layer is positioned at described central layer bottom, between this second electrically conductive signal layer and the central layer ground plane is arranged, and the described second electrically conductive signal layer is adjacent with ground plane, between a dielectric layer is arranged;
On the described first electrically conductive signal layer, make antenna pattern, on the power plane layer, select an isolated area, bonding is the radio frequency discrimination RFID chip of encapsulation not, and the radio frequency discrimination RFID chip of described not encapsulation is drawn the port that connects antenna by lamination Build-up technology; Pass described dielectric layer and antenna and finish interconnection, the second electrically conductive signal layer is as pseudobed.
2. according to claim 1, its essential characteristic also is: the described printed circuit board (PCB) that central layer is arranged comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
3. method of going into the RFID label of radio frequency identification to the printed circuit board (PCB) interpolation, it is characterized in that: for the printed circuit board (PCB) of no central layer, between power plane layer and ground plane, insert two electrically conductive signal layers: the first radio frequency discrimination RFID structural sheet and the second radio frequency discrimination RFID structural sheet, between described first radio frequency discrimination RFID structural sheet and the described second radio frequency discrimination RFID structural sheet, a dielectric layer is arranged, wherein:
Above the first radio frequency discrimination RFID structural sheet, be manufactured with antenna pattern;
Above the second radio frequency discrimination RFID structural sheet, be bonded with the not radio frequency discrimination RFID chip of encapsulation, the radio frequency discrimination RFID chip of described not encapsulation is drawn the port that connects antenna by lamination Build-up technology; Pass described dielectric layer and antenna and finish interconnection.
4. according to claim 3, its essential characteristic also is: the printed circuit board (PCB) of described no central layer comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010217098 CN101944194B (en) | 2010-06-23 | 2010-06-23 | Method for inserting radio frequency identification RFID signal in printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010217098 CN101944194B (en) | 2010-06-23 | 2010-06-23 | Method for inserting radio frequency identification RFID signal in printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101944194A true CN101944194A (en) | 2011-01-12 |
| CN101944194B CN101944194B (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010217098 Active CN101944194B (en) | 2010-06-23 | 2010-06-23 | Method for inserting radio frequency identification RFID signal in printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100567840B1 (en) * | 2005-12-16 | 2006-04-05 | 주식회사 알에프링크 | Radio frequency identification tag for the metal product with high thermal resistance and the fabricating method thereof |
| CN1886024A (en) * | 2005-06-22 | 2006-12-27 | 三星电机株式会社 | Printed circuit board having embedded RF module power stage circuit |
| JP2007066989A (en) * | 2005-08-29 | 2007-03-15 | Hitachi Ltd | Printed circuit board with rfid tag |
| CN101309559A (en) * | 2008-06-16 | 2008-11-19 | 深圳华为通信技术有限公司 | Multi-layer printed circuit board, design method thereof, and final product of mainboard |
-
2010
- 2010-06-23 CN CN 201010217098 patent/CN101944194B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1886024A (en) * | 2005-06-22 | 2006-12-27 | 三星电机株式会社 | Printed circuit board having embedded RF module power stage circuit |
| JP2007066989A (en) * | 2005-08-29 | 2007-03-15 | Hitachi Ltd | Printed circuit board with rfid tag |
| KR100567840B1 (en) * | 2005-12-16 | 2006-04-05 | 주식회사 알에프링크 | Radio frequency identification tag for the metal product with high thermal resistance and the fabricating method thereof |
| CN101309559A (en) * | 2008-06-16 | 2008-11-19 | 深圳华为通信技术有限公司 | Multi-layer printed circuit board, design method thereof, and final product of mainboard |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
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| CN101944194B (en) | 2012-12-26 |
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Effective date of registration: 20201026 Address after: Room 1303, No. 99, Songyu south 2nd Road, Xiamen City, Fujian Province Patentee after: Xiamen Qingxin Integrated Technology Co., Ltd Address before: 100084 Beijing 100084-82 mailbox Patentee before: TSINGHUA University |
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