CN101942651A - Zero-discharge chemical nickel-plating technology - Google Patents
Zero-discharge chemical nickel-plating technology Download PDFInfo
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- CN101942651A CN101942651A CN 201010295779 CN201010295779A CN101942651A CN 101942651 A CN101942651 A CN 101942651A CN 201010295779 CN201010295779 CN 201010295779 CN 201010295779 A CN201010295779 A CN 201010295779A CN 101942651 A CN101942651 A CN 101942651A
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Abstract
The invention relates to zero-discharge chemical nickel-plating technology. Chemical compositions of aqueous solution in a No.1 groove and a No.2 groove comprise 75 to 82 mL/L of home-made concentrated solution of nickeloushypophosphite, 9.5 to 10.5 g/L of hypophosphorous acid, 22 to 25 g/L of acetic acid and 8 to 10 mL/L of tin additive. The technology comprises the following steps of: (1) soaking a part into the No.1 groove at the temperature of between 75 and 80 DEG C for plating; (2) when plating solution in the No.1 groove turns colorless from green, taking the part out of the No.1 groove and soaking the part into the No.2 groove at the temperature of between 75 and 80 DEG C for continued plating; (3) adding 75 to 82 mL/L of home-made concentrated solution of nickeloushypophosphite, 9.5 to 10.5 g/L of hypophosphorous acid, 22 to 25 g/L of acetic acid and 8 to 10 mL/L of tin additive into the No.1 groove, taking the part out of the No.2 groove when the plating solution in the No.2 groove turns colorless from green and soaking the part in the No.1 groove for continued plating; and (4) adding 75 to 82 mL/L of home-made concentrated solution of nickeloushypophosphite, 9.5 to 10.5 g/L of hypophosphorous acid, 22 to 25 g/L of acetic acid and 8 to 10 mL/L of tin additive into the No.2 groove, taking the part out of the No.2 groove when the plating solution in the No.1 groove turns colorless from green and soaking the part in the No.1 groove for continued plating. The method of the invention has the characteristics of complex operation, low operating cost, environmental protection and water saving.
Description
Technical field
The present invention relates to the material surface technology, particularly a kind of nothing discharging chemical plating nickel technology.
Background technology
Along with the issuing and implementation of " electroplating the pollutant emission new standard ", electroplating industry disposal of pollutants control requires strict further, and electroplating enterprise is also more and more higher to the technical requirements of wastewater treatment.Most of electroplating enterprises need or increase the requirement that treatment facility just can reach new standard to the further transformation of treatment facility.According to traditional production technology, 1 ton of plated item of every production needs 8～10 tons of consumption of new water, and sewage effluent is 6～8 tons simultaneously, contains in the sewage of discharging being electroplate with the ion of usefulness, has so not only made alkaligenous waste but also has caused environmental pollution.Form a concept in whole electroplating industry for a long time: surface treatment industries such as electroless plating are the water rich anies influential family, and heavy polluter though this problem has caused attention, never really is resolved especially.Therefore, research and development nothing discharging process for treating surface is extremely important.
It is main salt that the present chemical plating nickel technology of using adopts single nickel salt more, the single nickel salt consumption is big, in nickel process, also to constantly add, single nickel salt impurities element can be in the accumulation of plating bath, cause the decline of plating bath plating speed, the lost of life, also can have influence on coating performance, especially solidity to corrosion.The bath life shortening causes heavy metal content height in the waste water, and environment is polluted.The patent No. is that 200810237687.5 the patent of invention " treatment method of chemical nickel phosphor " and the patent No. are 200910194106.9 patent of invention " electroplate and electroless plating technology in the method for in-line purification waste water and recovery waste material ".The ubiquitous shortcoming of in-line purification waste water technology is: complicated operation, running cost height.
Summary of the invention
The present invention is big for overcoming in the chemical nickel plating water consumption, and the shortcoming that sewage quantity is big provides a kind of nothing discharging chemical plating nickel technology.
For solving above technical problem and economic problems, the technical scheme that the present invention takes: a kind of nothing discharging chemical plating nickel technology, adopt the following step to carry out chemical nickel plating:
(1) dispose the identical aqueous solution of chemical ingredients respectively in No. 1 groove and No. 2 grooves, the chemical constitution of the aqueous solution is: the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L.
(2) under 75～80 ℃ of temperature, part immersed plating in No. 1 groove.
(3) when the plating bath of No. 1 groove is become colorless by green, part is taken out from No. 1 groove, immerse No. 2 grooves (75～80 ℃) and continue plating.
(4) in No. 1 groove, add the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L.When the green in the plating bath of No. 2 grooves becomes colorless, part is taken out from No. 2 grooves, immerse No. 1 groove and continue plating.
(5) in No. 2 grooves, add the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L, when the plating bath of No. 1 groove is become colorless by green, part is taken out from No. 2 grooves, immerse in No. 1 groove and continue plating (thickness that part is plated to requirement can take out).
Described nickelous hypophosphite strong solution preparation method is: nickel hydroxide is added the reactor that deionized water is housed in proportion, add the Hypophosporous Acid, 50 of metering; Fully after the reaction reaction product is all squeezed into concentration kettle, concentrate; Obtain the nickelous hypophosphite strong solution, this strong solution is handled 3～5h under 0.01～0.40A/dm2 (corrugated panel is done negative electrode, stainless steel plate is done anode), adjusting the pH value with Hypophosporous Acid, 50 is 6.2, promptly obtains finished product---elaboration level content is the nickelous hypophosphite strong solution of 220～250g/L.
Described No. 1 groove and No. 2 grooves adopt ceramic coated that the prescription of agalmatolite 5～15%, kaolin 77～80%, feldspar 4～6%, additive 1～3%, crystal type aluminum oxide 26～30% makes in the groove inwall; Sintering special cermacis on the A3 of thickness 2～6mm steel plate groove inwall is made through 1400～1425 ℃ of twice sintering homemade anti-chemical deposition special cermacis that is made.
Embodiment
Embodiment 1
A kind of nothing is discharged chemical plating nickel technology, at first the 1M nickel hydroxide is equipped with the reactor of deionized water, adds the Hypophosporous Acid, 50 of 1ML; Behind the reaction 2h reaction product is all squeezed into concentration kettle, obtain the nickelous hypophosphite strong solution behind the concentrated 3h, this strong solution is done negative electrode with corrugated panel, stainless steel plate is done anode at 0.05A/dm
2Under handle 1h, at 0.25A/dm
2Under handle 1h, at 0.40A/dm
2Under handle 1h, adjusting the pH value with Hypophosporous Acid, 50 is 6.2, promptly obtains finished product---content is the nickelous hypophosphite strong solution of 223g/L.
Adopt the following step electroless plating:
Cylinder body plating chemical nickel, 12 microns of thickness requirements, in No. 1 groove and No. 2 grooves, dispose the identical aqueous solution of chemical ingredients respectively, the chemical constitution of the aqueous solution is: the homemade nickelous hypophosphite strong solution of 82mL/L, 10.5g/L Hypophosporous Acid, 50,25g/L acetate, bis oxide tributyl tin solution 8mL/L (bis oxide tributyl tin and alcoholic acid volume ratio are 9: 1).
Under 80 ℃ of temperature, cylinder body immersed plating in No. 1 groove.
When the plating bath of No. 1 groove is become colorless by green, cylinder body is taken out from No. 1 groove, immerse No. 2 grooves (80 ℃) and continue plating.
In No. 1 groove, add the homemade nickelous hypophosphite strong solution of 82mL/L, 10.5g/L Hypophosporous Acid, 50,25g/L acetate, bis oxide tributyl tin solution 8mL/L.When the plating bath of No. 2 grooves is become colorless by green, cylinder body is taken out from No. 2 grooves, immerse No. 1 groove and continue plating.
In No. 2 grooves, add the homemade nickelous hypophosphite strong solution of 82mL/L, 10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, bis oxide tributyl tin solution 8mL/L.Cylinder body is taken out from No. 1 groove, immerse No. 2 grooves and continue plating.Meet the requirements of 12 microns of thickness when plating 12 minutes, take out, dry up.
Claims (5)
1. one kind is not had the discharging chemical plating nickel technology, it is characterized in that: the step that comprises following order:
(1) dispose the identical aqueous solution of chemical ingredients respectively in No. 1 groove and No. 2 grooves, the chemical constitution of the aqueous solution is: the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L.
(2) under 75～80 ℃ of temperature, part immersed plating in No. 1 groove.
(3) when the plating bath of No. 1 groove is become colorless by green, part is taken out from No. 1 groove, immerse No. 2 grooves (75～80 ℃) and continue plating.
(4) in No. 1 groove, add the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L; When becoming colorless by green in the plating bath of No. 2 grooves, part is taken out from No. 2 grooves, immerse No. 1 groove and continue plating.
(5) in No. 2 grooves, add the homemade nickelous hypophosphite strong solution of 75～82mL/L, 9.5～10.5g/L Hypophosporous Acid, 50,22～25g/L acetate, tin class additive 8～10mL/L, when the plating bath of No. 1 groove is become colorless by green, part is taken out from No. 2 grooves, immerse in No. 1 groove and continue plating.
2. ask 1 described a kind of nothing discharging chemical plating nickel technology according to power, it is characterized in that: described nickelous hypophosphite strong solution preparation method is: nickel hydroxide is added the reactor that deionized water is housed in proportion, add the Hypophosporous Acid, 50 of metering; Fully after the reaction reaction product is all squeezed into concentration kettle, concentrate; Obtain the nickelous hypophosphite strong solution, with this strong solution at 0.01～0.40A/dm
2Under handle 3～5h, have corrugated panel to do negative electrode, stainless steel plate is done anode, adjusting the pH value with Hypophosporous Acid, 50 is 6.2, promptly obtains finished product.
3. ask 1 described a kind of nothing discharging chemical plating nickel technology according to power, it is characterized in that: on described No. 1 groove and No. 2 grooves pH on-line monitoring setting device is installed, when the pH of solution value is higher than 6.8, ejector priming splashes into solution adjustment pH value to 5.5 with 10% ammoniacal liquor automatically.
4. ask 1 described a kind of nothing discharging chemical plating nickel technology according to power, it is characterized in that: described No. 1 groove and No. 2 grooves adopt ceramic coated that the prescription of agalmatolite 5～15%, kaolin 77～80%, feldspar 4～6%, additive 1～3%, crystal type aluminum oxide 26～30% makes in the groove inwall; Sintering special cermacis on the A3 of thickness 2～6mm steel plate groove inwall is made through 1400～1425 ℃ of twice sintering homemade anti-chemical deposition special cermacis that is made.
5. ask 1 described a kind of nothing discharging chemical plating nickel technology according to power, it is characterized in that: described tin class additive adopts novel chitosan base organo-tin compound and alcoholic acid mixed solution.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102957796A CN101942651B (en) | 2010-09-28 | 2010-09-28 | Zero-discharge chemical nickel-plating technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102957796A CN101942651B (en) | 2010-09-28 | 2010-09-28 | Zero-discharge chemical nickel-plating technology |
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| CN101942651A true CN101942651A (en) | 2011-01-12 |
| CN101942651B CN101942651B (en) | 2012-07-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104131272A (en) * | 2014-07-28 | 2014-11-05 | 湖南工程学院 | Zero emission type chemical nickel plating liquid |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182808A (en) * | 1996-11-20 | 1998-05-27 | 山东矿业学院 | Acidic chemical plating nickel solution and plating method |
| US6030593A (en) * | 1995-09-29 | 2000-02-29 | Ceca S.A. | Method for preparing nickel hypophosphite |
| CN1317596A (en) * | 2000-04-12 | 2001-10-17 | 林忠华 | Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
| CN1546726A (en) * | 2003-12-09 | 2004-11-17 | 南开大学 | Method for chemical plating nickel phosphor alloy |
-
2010
- 2010-09-28 CN CN2010102957796A patent/CN101942651B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030593A (en) * | 1995-09-29 | 2000-02-29 | Ceca S.A. | Method for preparing nickel hypophosphite |
| CN1182808A (en) * | 1996-11-20 | 1998-05-27 | 山东矿业学院 | Acidic chemical plating nickel solution and plating method |
| CN1317596A (en) * | 2000-04-12 | 2001-10-17 | 林忠华 | Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
| CN1546726A (en) * | 2003-12-09 | 2004-11-17 | 南开大学 | Method for chemical plating nickel phosphor alloy |
Non-Patent Citations (1)
| Title |
|---|
| 《南开大学学报（自然科学版）》 20040930 王福生等 以电解法制备的次磷酸镍和次磷酸进行化学镀镍 78-81 1-5 第37卷, 第3期 2 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104131272A (en) * | 2014-07-28 | 2014-11-05 | 湖南工程学院 | Zero emission type chemical nickel plating liquid |
| CN104131272B (en) * | 2014-07-28 | 2017-04-05 | 湖南工程学院 | A kind of zero-emission type chemical nickel-plating liquid |
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| CN101942651B (en) | 2012-07-25 |
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