CN101932193A

CN101932193A - Printed circuit board (PCB) and the method that is used to make described printed circuit board (PCB)

Info

Publication number: CN101932193A
Application number: CN2010102178369A
Authority: CN
Inventors: 渡边裕人
Original assignee: Fujikura Ltd
Current assignee: Fujikura Ltd
Priority date: 2009-06-23
Filing date: 2010-06-23
Publication date: 2010-12-29
Anticipated expiration: 2030-06-23
Also published as: US20100319972A1; JP2011009271A; US8546696B2; CN101932193B; JP5342341B2

Abstract

The present invention relates to printed circuit board (PCB) and the method that is used to make described printed circuit board (PCB).Described printed circuit board (PCB) has splicing ear, and described splicing ear comprises: dielectric substrate, described dielectric substrate comprise first surface and second surface and along the end face of profile, described profile is perpendicular to the direction of insertion of splicing ear; At least one wiring layer that goes between, described at least one lead-in wire wiring layer is formed on the first surface of dielectric substrate; Insulating protective film, described insulating protective film cover the lead-in wire wiring layer; At least one lead end sublayer, described at least one lead end sublayer constitutes the end of lead-in wire wiring layer, and described lead end sublayer is formed bar, and has the end face along profile; Intensive aspect, described intensive aspect sticks on the second surface of dielectric substrate at the back position place of lead end sublayer; Wherein between the outer surface of the outer surface of lead end sublayer and intensive aspect the distance of profile side less than between it in the distance of lead-in wire wiring layer side.

Description

Printed circuit board (PCB) and the method that is used to make described printed circuit board (PCB)

The cross-reference of related application

The application requires the priority of the Japanese patent application No.2009-148510 of submission on June 23rd, 2009, and the full content of this patent application is herein incorporated by reference.

Technical field

The present invention relates to a kind of printed circuit board (PCB) and be used to make the method for described printed circuit board (PCB), relate more specifically to a kind of printed circuit board (PCB) with splicing ear and the described splicing ear of method that is used to make described printed circuit board (PCB) and have and be suitable for the structure that is connected with connector.

Background technology

Recently, the demand of the size that reduces electronic device is being increased, and the same demand of the printed circuit board (PCB) that is attached to electronic device is also being increased.Usually, printed circuit board (PCB) has main body and splicing ear.On described main body, circuit layer is arranged to be used for the connection of various electronic units.Described splicing ear engages with aerial lug and links to each other.

Printed circuit board (PCB) has all kinds, such as printed circuit board (RPC), flexible printed circuit board (FPC), RPC/FPC composite plate, flexible flat cable (FFC) etc.Here, FFC only is used to the cable that connects, and it does not have the aforementioned circuit layer.Yet FFC can be considered to a kind of printed circuit board (PCB), and this is because it is made up of with the parallel lead-in wire wiring layer that is printed on the described insulation board band shape or bar shaped flexible insulation plate.

On the other hand, connector is the electronic unit that the splicing ear with printed circuit board (PCB) is connected with electronic device, trunk junction etc.In company with the size of electronic device and printed circuit board (PCB) is reduced, the height (thickness) of connector is also reduced.

When printed circuit board (PCB) has when using in the equipment (for example, Collapsible mobile phone etc.) such as the movable part of hinge, form by FPC or FFC corresponding at least a portion of the printed circuit board (PCB) of described movable part.In this case, printed circuit board (PCB) has splicing ear probably, and described splicing ear is used to connect connector along a formation in the profile of FPC or FFC.

Height in company with connector reduces, and the splicing ear of printed circuit board (PCB) more may be thin.In this case, splicing ear even need repeatedly insert and keep enough mechanical strength and shapes from connector removes to connector is connected and positive engagement with the good electrical of the contact site of the bonder terminal in realization and the connector.

Therefore, with reference to Fig. 1 the example of the common structure that is arranged on the traditional splicing ear in the printed circuit board (PCB) is described.This figure schematically shows connector and printed circuit board (PCB) and cutaway view described connector connection terminals.

Connector C0 has connector shell Ca (being illustrated by double dot dash line) and a plurality of bonder terminal C1 that is contained among the connector shell Ca.Connector shell Ca for example is made of plastics.Bonder terminal C1 with arranged in parallel relation in shell Ca.Each terminal C1 is made by the electrically conductive elastic metallic plate, and is formed as and has the U-shaped shape that has two arms.Each bonder terminal C1 has outstanding contact site C2, described contact site C2 be formed from the inner surface of two arms at least one is outstanding.

Splicing ear T links to each other with the main body of printed circuit board (PCB) PC.Splicing ear T forms rectangular slab, and have with the whole flexible insulation plate 51 that is connected of main body and a plurality of upper surface that is arranged on described flexible insulation plate 51 on lead-in wire wiring layer 53.Lead-in wire wiring layer 53 forms by copper film is formed pattern, and described copper film sticks on the upper surface of flexible insulation plate 51 by the adhesive layer 52 that is arranged between itself and the flexible insulation plate 51.The lead-in wire wiring layer 53 that has formed pattern is positioned in parallel within on the flexible insulation plate 51.

The main body side of each lead-in wire wiring layer 53 is coated with the coverlay 55 that adheres to by adhesive layer 54.The connector C0 side of each lead-in wire wiring layer 53 exposes so that form lead end sublayer 53a at the point of lead-in wire wiring layer 53 from coverlay 55.

In splicing ear T, reinforced layer 57 sticks on the lower surface of insulating barrier 51 by the adhesive layer 56 that is arranged between itself and the insulating barrier 51.The end face of insulating barrier 51, lead end sublayer 53a and reinforced layer 57 terminates as and forms public end face Te, and described public end face Te forms in the profile of printed circuit board (PCB) PC.

In above-mentioned conventional art, when splicing ear T being inserted among the connector C0 and splicing ear T when engaging with described connector C0, lead terminal 53a might peel off from insulation board 51.This is because the end face that is positioned on the public end face Te of lead end sublayer 53a is formed perpendicular to direction of insertion, thereby described end face might be answered back to the edge of inner surface of bonder terminal C1 or the protuberance of portion of terminal C2.

Therefore, have such problem: the contact site C2 of bonder terminal C1 can not suitably engage with the upper surface of lead end sublayer 53a being electrically connected with it, and the terminal layer 53a that peels off by bending of abutting end sublayer and unexpectedly produce short circuit.

Engagement state between expectation splicing ear T and the connector C0 is steady in a long-term.Yet,,, make being connected and can not realizing between splicing ear T and the connector C0 so splicing ear T may peel off because splicing ear T may repeatedly insert among the connector C0 and from connector C0 and remove.

Japan Patent No.3248266 (patent documentation 1) discloses a kind of technology of peeling off that prevents splicing ear.This technology is described with reference to Fig. 1.So seen in the figure, connector shell Ca has tapered inner surface Cat.Patent documentation 1 usefulness solves such problem: before the insertion of splicing ear T in connector C0 finished, lead end sublayer 53a and dielectric substrate 51 were owing to the end of lead end sublayer 53a is peeled off with contacting of inner surface Cat.

As the solution to the problems referred to above, protuberance PX (being illustrated by the broken lines) is arranged on the end of intensive aspect 57 and dielectric substrate 51.This protuberance PX is longlyer more outstanding towards direction of insertion than the extension of the end face of lead end sublayer 53a.Yet, still can not solve the edge of above-mentioned inner surface of answering back to bonder terminal C1 by lead end sublayer 53a or outstanding contact site C2 and the problem that produces.

Simultaneously, form (referring to, Japan Patent No.2923012 (patent documentation 2)) along the public end face Te of the profile of printed circuit board (PCB) PC by conventional art.In this technology, the printed circuit board (PCB) that the substrate for printed circuit board that has the same circuits pattern above becomes each to have circuit and profile by cutting (punching press) is separated to form net shape.

Summary of the invention

The invention provides a kind of printed circuit board (PCB) and be used to make the method for described printed circuit board (PCB), described printed circuit board (PCB) is suitable for preventing that the lead end sublayer of splicing ear from peeling off.

A first aspect of the present invention provides a kind of printed circuit board (PCB), and described printed circuit board (PCB) has splicing ear, and described splicing ear has profile, and described splicing ear is constructed to be inserted in the aerial lug.Described splicing ear has: dielectric substrate, described dielectric substrate be provided with first surface and with described first surface opposing second surface, described dielectric substrate comprises the end face along described profile, and described profile is perpendicular to the direction of insertion of splicing ear to aerial lug; At least one wiring layer that goes between, described at least one lead-in wire wiring layer is formed on the first surface of dielectric substrate; Insulating protective film, described insulating protective film cover described lead-in wire wiring layer; At least one lead end sublayer, described at least one lead-in wire wiring layer forms the end of lead-in wire wiring layer, and described lead end sublayer is formed slice, and has the outer surface of exposure and along the end face of described profile; And intensive aspect, described intensive aspect sticks on the second surface of dielectric substrate at the back position place of lead end sublayer, and described intensive aspect has outer surface; Wherein between the outer surface of the outer surface of lead end sublayer and intensive aspect between first distance of profile side is less than the outer surface of the outer surface of lead end sublayer and intensive aspect at the second distance of wiring layer side that goes between.

Described at least one lead-in wire wiring layer and at least one lead end sublayer can comprise a plurality of lead-in wire wiring layers and a plurality of lead ends sublayer respectively, and described lead end sublayer can parallel to each otherly be arranged.

Described printed circuit board (PCB) can further comprise the adhesive layer that intensive aspect is adhered to dielectric substrate, wherein adhesive layer at the thickness of profile side less than the thickness of described adhesive layer in lead-in wire wiring layer side, thereby limit the relation of first distance less than second distance.

Printed circuit board (PCB) can further comprise: first circuit layer, and described first circuit layer is arranged on the first surface of dielectric substrate, and described first circuit layer is electrically connected with the lead end sublayer by the lead-in wire wiring layer; And the second circuit layer, described second circuit layer is arranged on the second surface of dielectric substrate, and described second circuit layer is formed the back position of avoiding the lead end sublayer.

Described second circuit layer can have and is parallel to described profile and leaves the edge of described profile towards lead-in wire wiring layer side, forming ladder on the second surface of dielectric substrate, thereby limits the relation of first distance less than second distance.

The difference of the second distance and first distance can be 2 μ m or more than.

The lead end sublayer can have the inclined plane at its place, end, and described inclined plane tilts towards dielectric substrate.

Adhesive layer can be made by thermosetting resin adhesive.

A second aspect of the present invention is a kind of method that is used to make printed circuit board (PCB), described printed circuit board (PCB) has splicing ear, described splicing ear is constructed to be inserted in the aerial lug, and described splicing ear has the profile perpendicular to the direction of insertion of splicing ear.Described method comprises: (a) make at least one lead end sublayer form slice on the first surface of dielectric substrate, described at least one lead terminal has along the end face of described profile and is exposed to outside last outer surface; And described dielectric substrate has the end face along described profile; (b) first adhesive layer and second adhesive layer thicker than described first adhesive layer are sticked on the first surface of intensive aspect, first adhesive layer is arranged in the profile side, and second adhesive layer is arranged in the opposite side of described profile side; (c) make first adhesive layer and second adhesive layer face the second surface of dielectric substrate at the back position place of lead end sublayer, described second surface is relative with the first surface of dielectric substrate; And (d) after this, towards each other the first surface of hot pressing lead end sublayer and intensive aspect with the first surface opposing second surface with stick to dielectric substrate with its first surface opposing second surface on.

In the printed circuit board (PCB) according to above-mentioned one exemplary embodiment, lead end sublayer and intensive aspect face with each other, and make that the distance between its outer surface is littler in lead-in wire wiring layer side at profile side ratio.Therefore, in the early stage insertion state of splicing ear in connector, can prevent that the end face of lead end sublayer or edge from contacting with the edge of the inner surface of bonder terminal or the protuberance of portion of terminal.When splicing ear was further inserted, the tip of contact site promoted lead terminal, and splicing ear slides smoothly along the inclined plane.Therefore, splicing ear can engage with connector, thereby the outer surface of lead end sublayer is located rightly.

Above-mentioned inserted mode can prevent that the lead end sublayer is stripped from.Therefore, even being inserted in the connector and from described connector repeatedly, splicing ear removes many times, the shape of lead end sublayer also can keep for a long time, the generation of the short circuit between the lead end sublayer can be prevented, and good bond and connection status between splicing ear and the connector can be stably guaranteed.

In addition, according to the method that is used to make printed circuit board (PCB), process (b) can be simply and is easily made between the outer surface of the outer surface of lead end sublayer and intensive aspect between the distance of profile side is less than the outer surface of the outer surface of described lead end sublayer and intensive aspect distance in lead-in wire wiring layer side.

Description of drawings

Fig. 1 is the profile that shows the splicing ear in the traditional printing circuit board.

Fig. 2 is the cutaway view that shows the splicing ear in the printed circuit board (PCB) of first one exemplary embodiment according to the present invention.

Fig. 3 A be when when seeing by the arrow indicated direction along the profile of A-A line, and it has shown near the printed circuit board (PCB) crooked state base portion of splicing ear.

Fig. 3 B be when when seeing by the arrow indicated direction along the profile of A-A line, and it has shown the unbending state of printed circuit board (PCB).

Fig. 4 A and Fig. 4 B show bonder terminal respectively and according to the profile of the engagement state between the splicing ear of the printed circuit board (PCB) of first one exemplary embodiment.

Fig. 5 A, Fig. 5 B and Fig. 5 C are the profiles that shows the step of manufacturing of first one exemplary embodiment according to the present invention.

Fig. 6 has shown the result for the test of the stripper-resistance of the lead end sublayer of the printed circuit board (PCB) of first one exemplary embodiment according to the present invention, this experimental study have a stripper-resistance of the lead end sublayer of differing tilt angles.

Fig. 7 is the profile that shows the splicing ear of the printed circuit of second one exemplary embodiment according to the present invention.

Fig. 8 is the amplification profile that shows the part of the splicing ear of the printed circuit board (PCB) of the 3rd one exemplary embodiment according to the present invention.

Embodiment

Hereinafter, the printed circuit board (PCB) according to first to the 3rd one exemplary embodiment is described to Fig. 8 with reference to Fig. 2.Should be noted in the discussion above that identical parts are represented with identical Reference numeral in institute's drawings attached.Therefore, for the sake of simplicity, in case the parts of an accompanying drawing are illustrated, with the explanation about these parts of omitting to other accompanying drawing.

[first embodiment]

Fig. 2 has mainly shown according to the splicing ear in the printed circuit board (PCB) of first one exemplary embodiment to Fig. 5.To utilize Fig. 2 (cutaway view), Fig. 3 A and Fig. 3 B (profile) that the structure of splicing ear is described.Fig. 3 A and Fig. 3 B have shown following difference: splicing ear is bending or unbending near its base portion.

Printed circuit board (PCB) PC has: main body, and in described main body, the circuit layer (not shown) is connected electrically between the various electronic units that are installed on the described main body; And splicing ear T1, described splicing ear T1 is inserted among the aerial lug C0 and with described aerial lug C0 and engages, and is used for being electrically connected.

Connector C0 has connector shell (referring to " Ca " among Fig. 1) and is contained in bonder terminal C1 in the connector shell.Connector shell for example is formed from a resin.Bonder terminal C1 layout parallel to each other.Each bonder terminal C1 is made by the electrically conductive elastic metallic plate, and for example has the U-shaped shape that has two arms.Each bonder terminal C1 has contact site C2 at least one of the inner surface of two arms.Contact site C2 is formed from inner surface outstanding, and is positioned at the most advanced and sophisticated side place of arm.Splicing ear T1 has the length (terminal length) that the degree of depth with U-shaped bonder terminal C1 adapts, and described splicing ear T1 engages with contact site C2 with the inner surface of bonder terminal C1 and is connected.

Splicing ear T1 has dielectric substrate 1 and is formed on lead end sublayer 2 on the first surface (upper surface among Fig. 3 A) of dielectric substrate 1.Dielectric substrate 1 has along the end face 1a of the profile Y of printed circuit board (PCB) PC.Profile Y is perpendicular to the direction of insertion (by arrow X indication) of splicing ear T1 to connector C0.Lead end sublayer 2 is formed the end of the lead-in wire wiring layer 4 that is electrically connected with the circuit layer (not shown).In other words, lead end sublayer 2 forms the extension pattern of lead-in wire wiring layer 4.Lead end sublayer 2 layouts parallel to each other, and have end face 2a along profile Y.These terminal layer 2 and lead-in wire wiring layer 4 stick on the upper surface of dielectric substrate 1 by adhesive layer 3.

Insulating protective film 6 sticks on lead-in wire wiring layer 4 and the circuit layer by adhesive layer 5.Insulating protective film 6 is arranged to the length (terminal length) that the upper surface that makes lead end sublayer 2 exposes and the degree of depth of U-shaped bonder terminal C1 adapts.The edge 6a of insulating protective film 6 is parallel to profile Y and extends, and locatees with the spaced apart terminal length of the end face 2a of lead end sublayer 2.Therefore, edge 6a is as the base portion of lead end sublayer 2 and the border between the lead-in wire wiring layer 4.

Each lead end sublayer 2 is rectangle slices, has flat outer surface 2s (being designated hereinafter simply as surperficial 2s), and described surperficial 2s engages with the contact site C2 of each bonder terminal C1.Lead end sublayer 2 is arranged such that its length direction is perpendicular to profile Y.Lead end sublayer 2 is arranged in parallel with preset distance (being spacing) each other.The upper surface of lead end sublayer 2 is by scolder etc. or high-conductive metal such as plating such as nickel, gold, so that avoid corroding and reduce the contact resistance between lead end sublayer 2 and the bonder terminal C1.Particularly, the electrodeposited coating of being made by above-mentioned material is formed on all these upper surfaces.

Intensive aspect 7 sticks on the second surface (lower surface among Fig. 3 A) of dielectric substrate 1 by adhesive layer.Intensive aspect 7 is strengthened the mechanical strength of the described lead end sublayer 2 of overall alignment from the back side of lead end sublayer 2.

Identical with the end face 2a of the end face 1a of dielectric substrate 1 and lead end sublayer 2, intensive aspect 7 has the end face 7a along profile Y.The part of intensive aspect 7 is arranged on the base portion of lead end sublayer 2, with overlapping with insulating protective film 6.Therefore, as with end face 7a opposing end faces, end face 7b is positioned at below the insulating protective film 6.The position of end face 7b depends on that the required brute force that adds that is used for lead end sublayer 2 sets.

Intensive aspect 7 is formed plate-like shape, and has flat outer surface 7s (being designated hereinafter simply as surperficial 7s) in a side (downside among Fig. 3 A) relative with a side of arranging dielectric substrate 1.In this embodiment, intensive aspect 7 totally has homogeneous thickness, and is formed by strengthening membrane, and described strengthening membrane is made such as polyimide resin, glass epoxy resin etc. by insulating material.

Next, will describe distance H 1 and the H2 on its thickness direction between the surperficial 7s of the surperficial 2s of each lead end sublayer 2 and intensive aspect 7, wherein surperficial 2s and 7s and are clipped in the middle dielectric substrate 1 toward each other.

Distance H 1 in the position at 6a place, the edge of insulating protective film 6 between two surperficial 2s and the 7s has maximum, and described distance H 1 is corresponding to the maximum ga(u)ge of splicing ear T1.Distance H 2 in the position at the end face 2a place of lead end sublayer 2 between two surperficial 2s and the 7s has minimum value, and this distance H 2 is corresponding to the minimum thickness of splicing ear T1.

There are various connectors, such as: fastening connector, fastening connector has bonder terminal, and each bonder terminal has the arm of two clearance constant; And the open and close type connector, the open and close type connector has bonder terminal, and each bonder terminal has two gaps can manually variable arm.In exemplary present embodiment,, fastening connector is used as connector C1 as example.

Here, clearance D 1 is defined as before the engaging between splicing ear T1 and connector C0, the distance between the inner surface of another arm (underarm among Fig. 3 A) in the tip of the contact site C2 in the arm (upper arm among Fig. 3 A) in two arms and two arms.Clearance D 1 is set to satisfy the value that concerns H1＞D1＞H2, so that realize having the resilient engagement of suitable pressure.In this case, the position at the tip of contact site C2 depends on that splicing ear T1 is to the insertion depth of bonder terminal C1 and change.Particularly, the variable quantity of clearance D 1 is set in the scope of the range difference Δ H between two distance H 1 and the H2.

As mentioned above, lead end sublayer 2 and intensive aspect 7 face with each other, and make that the distance between surperficial 2s and the 7s is little in lead-in wire wiring layer 4 sides at profile Y side ratio.Particularly, surperficial 2s and 7s tilt mutually, make splicing ear T1 become thinner in its end.In addition, distance H 2 and clearance D 1 be set to the end face 2a that prevents each lead end sublayer 2 its with contact site C2 between unexpectedly bang in the tip of contact site C2 when engaging, and be set at and realize that the go between activating pressure of wiring layer 2 of contact site C2 and each is big as much as possible, thereby surperficial 2s and 7s tilt mutually.

In order to obtain aforesaid distance H 1 and H2, the adhesive layer 8 that is used for intensive aspect 7 is formed and makes its thickness become than little in lead-in wire wiring layer 4 sides in profile Y side.As an alternative, adhesive layer can have constant thickness, and reinforced layer 7 can be formed make its thickness in profile Y side than little in lead-in wire wiring layer 4 sides.In this regard, as mentioned below, the thickness that changes adhesive layer 8 is more favourable.

Printed circuit board (PCB) PC as shown in Fig. 3 A is bending or curve near lead-in wire wiring layer 4 and position that the base portion of splicing ear T1 is connected, makes the outer flat surfaces 6s of insulating protective film 6 become and is parallel to the surperficial 7s of intensive aspect 7.This is crooked or curved for example by heating and pressurization (being hot pressing) formation.On the other hand, the also curve not of bending neither of the printed circuit board (PCB) PC as shown in Fig. 3 B.But intensive aspect 7 sticks on the planar shaped end of printed circuit board (PCB) PC in the mode that tilts.No matter whether bending or curve, depend under the situation of the surperficial 7s of intensive aspect 7 and the parallel placement of following inner surface of bonder terminal C1, the insertion operability when inserting splicing ear T1 among the connector C0 and the shape of connector shell, printed circuit board (PCB) PC can at random select.

Next, will the exemplary materials and the size of the member that constitutes splicing ear T1 be described.By single face being covered Copper Foil substrate (singlesided copperclad laminate; Single face CCL) forms pattern and form lead-in wire wiring layer 4, lead end sublayer 2 and circuit layer (not shown).Single face covers the lip-deep copper film (for example 35 μ m are thick) that the Copper Foil substrate has dielectric substrate 1 (for example 25 μ m are thick) and sticks to dielectric substrate 1.Dielectric substrate 1 is flexible and is made by polyimide resin film.In this case, has the epoxy thermosetting resin adhesive of thickness (for example 10 μ m are thick) as adhesive layer 3.Notice that liquid polymers also can be used as the material of flexible insulation substrate 1.

Insulating protective film 6 forms by the cover layer of being made by polyimide resin film (for example 25 μ m are thick).Intensive aspect 7 forms film or plate (for example 125 μ m are thick), and is made by polyimide resin.Adhesive layer 5 is that 35 μ m are thick.Adhesive layer 8 is that 50 μ m are thick in distance H 1 (being ultimate range) side, and is that (50-Δ H) μ m is thick in distance H 2 sides.Two

adhesive layers

5 and 8 are all made by the epoxy thermosetting resin adhesive.

According to above-mentioned size, the maximum ga(u)ge of splicing ear T1 is about 245 μ m, and described maximum ga(u)ge equals the ultimate range H1 between surface (flat outer surface) 7s of surface (flat outer surface) 2s of lead end sublayer 2 and intensive aspect 7.In addition, when by adhesive layer 8 is set at zero and will be set at 50 μ m apart from (thickness) difference Δ H the time, the minimum thickness of splicing ear T1 in the same side can be set to about 195 μ m substantially at the thickness of distance H 2 sides, described minimum thickness equals minimum range H2.

Simultaneously, depend on the standard of the connector of the connector pin (for example 4 to 50 pins) with various quantity, the quantity of lead end sublayer 2 (being the quantity of terminal) can be set arbitrarily.

In this one exemplary embodiment, the length of each lead end sublayer 2 (terminal length) and its width (terminal width) are respectively 1.7mm and 0.3mm.Distance between the adjacent legs terminal layer (being spacing) is 0.5mm.Lead end sublayer 2 can form various patterns, such as parallel stripes, zigzag striped etc.The width (wire widths) of each lead-in wire wiring layer 4 is identical with the width of lead end sublayer 2, and the distance between the adjacent legs wiring layer 4 is identical with distance between the adjacent legs terminal layer 2.

Next, with reference to Fig. 4 A and Fig. 4 B the engagement state in the insertion operation of splicing ear T1 in connector C1 is described.Fig. 4 A shown the end face of splicing ear T1 cross a little bonder terminal C1 contact site C2 the tip and be inserted into early stage insertion state among the connector C1.Fig. 4 B has shown that splicing ear T1 is further inserted, the surperficial 2s state of contact slidably of the tip of contact site C2 and lead end sublayer 2 simultaneously.

As shown in Fig. 4 A, when splicing ear T1 begin to be inserted among the bonder terminal C1 and the surperficial 7s that makes intensive aspect 7 and the following inner surface of bonder terminal C1 form contact and the time, the surperficial 2s of lead end sublayer 2 be tilted into lower its base portion in its end higher.

In the early stage insertion state as shown in Fig. 4 A, end face 2a and inclined plane 2s enter among the bonder terminal C1 under the situation at the tip of the edge of contact-connection assembly for electric terminal C1 not and contact site C2.Therefore, in lead end sublayer 2, do not produce and cause the stress peeled off.

In the state as shown in Fig. 4 B, the tip of contact site C2 forms with surperficial 2s and contacts.After this, the end of splicing ear T1 continues to move to slidably among the splicing ear C1, and surperficial 2s bears by the total power on the arrow P W indicated direction simultaneously, described total power by bonder terminal C1 move horizontally and elastic force produces.

The insertion of splicing ear T1 and joint proceed to contact site C2 promotes surperficial 2s towards dielectric substrate 1 state.Therefore, peel off from dielectric substrate 1 end that can prevent lead end sublayer 2.In addition, can avoid short circuit between the adjacent legs terminal layer 2.

When the insertion of splicing ear T1 was finished, contact site C2 suitably was positioned at the position that is limited by the connector standard and keeps being electrically connected.

Next, the method that is used to make printed circuit board (PCB) PC is described to Fig. 5 C with reference to Fig. 5 A.Printed circuit board (PCB) PC is by following process manufacturing.At first, prepare the distribution base material.The distribution base material is made by singlesided copperclad laminate (single face CCL).On the distribution base material, form identical circuit pattern.Use punch die the distribution base material to be cut into the shape that has circuit pattern and predetermined profile separately.Here, three layers of copper clad laminate (three layers of CCL) are used as the distribution base material.Three layers of CCL has the adhesive layer between copper film, basement membrane (dielectric substrate) and copper film and the basement membrane.

In the formation of each printed circuit board (PCB) PC; make copper film form pattern and form aforesaid circuit layer (not shown), lead-in wire wiring layer 4 and lead end sublayer 2, and insulating protective film 6 is sticked on the lead-in wire wiring layer 4 by adhesive layer 5 to go up at the upper surface (first surface) of the dielectric substrate 1 of single face CCL.

After this, as shown in Fig. 5 A, the profile Y (referring to Fig. 2) that edge 6a is formed in insulating protective film 6 with the end of splicing ear T1 separates, and lead end sublayer 2 forms parallel slice on the upper surface of dielectric substrate 1.Each lead end sublayer 2 has along the end face 2a of profile Y and flat outer surface 2s, and described flat outer surface 2s is the upper surface that exposes from insulating protective film 6.

Prepare intensive aspect 7 in advance with following structure.The first adhesive layer 8a and the second adhesive layer 8b are sticked on the surface (upper surface among Fig. 5 A) of intensive aspect 7.The first adhesive layer 8a relative thin, and be positioned at profile Y side.The second adhesive layer 8b thicker than the first adhesive layer 8a is positioned at a side of leaving profile Y side.

Next, as shown in Fig. 5 B, intensive aspect 7 is set so that the first adhesive layer 8a is positioned at profile Y side, and makes the first adhesive layer 8a and the second adhesive layer 8b face the lower surface (second surface) of dielectric substrate 1 at the back position place of lead end sublayer 2.After this, by the surperficial 2s of hot pressing lead end sublayer 2 and the outer surface 7s of intensive aspect 7 stick to intensive aspect 7 on the lower surface (second surface) of dielectric substrate 1 towards each other.In this hot pressing, distance relation H1＞D1＞H2 is simple and foundation easily owing to the thickness difference between the first adhesive layer 8a and the second adhesive layer 8b.That is to say that printed circuit board (PCB) PC is simple and be easy to make.

As shown in Fig. 5 C, printed circuit board (PCB) PC can be at bending or curve near lead-in wire wiring layer 4 and the position that the base portion of splicing ear T1 is connected, makes the outer flat surfaces 6s of insulating protective film 6 become and is parallel to the outer flat surfaces 7s of intensive aspect 7.This is crooked or curved for example makes by hot pressing.

Next, test describes to stripper-resistance with reference to Fig. 6.In this test, at various range difference Δ H=H1-H2[μ m] in the stripper-resistance of lead end sublayer 2 is studied, each of described range difference is poor between the distance at the base portion of splicing ear T1 and place, end thereof between surperficial 2s and the 7s.

[sample]

In stripper-resistance test, sample 1 is traditional splicing ear, in described splicing ear, and

surperficial

2s and 7s be parallel to each other (being Δ H=0).Sample 2 to 5 is the splicing ears according to this one exemplary embodiment, and has range difference Δ H=2 μ m, 5 μ m, 30 μ m and 50 μ m respectively.

[test]

Each splicing ear T1 is engaged with bonder terminal C0 and remove repetition 100 times from described bonder terminal C0.After this, for each described splicing ear T1, by the adhesion situation between microscopic examination lead end sublayer 2 and the dielectric substrate 1 to determine whether to occur peeling off of lead end sublayer 2.In Fig. 6, " X " points out now to peel off, and " O " refers to not occur peeling off.

As shown in Figure 6, in sample 1, found peeling off of lead end sublayer 2, yet, be not find peeling off of lead end sublayer 2 in 2 μ m or the above sample 2 to 5 at range difference Δ H.Here, in sample 5, range difference Δ H is 50 μ m, and this value is the maximum ga(u)ge that is used for the adhesive layer 8 of intensive aspect 7.This means that the thickness of adhesive layer 8 in the end face of splicing ear T1 is zero.However, does not peel off from dielectric substrate 1 yet lead end sublayer 2.

As understanding, when range difference Δ H being set to 2 μ m or when above, lead end sublayer 2 is unstripped according to The above results.Particularly, when adhesive layer 8 has this range difference Δ H, lead end sublayer 2 can bear above-mentioned cutting technique and with the engaging repeatedly of connector, and the mechanical strength of lead end sublayer 2, shape and be connected and can keep with the good electrical of connector.Recently, printed circuit board (PCB) and connector thin down.Therefore, even can improve the property inserted of splicing ear by the gap increase of about 10 μ m.In this case, this one exemplary embodiment is well-adapted.

Simultaneously, the aforementioned distribution base material that should be noted in the discussion above that printed circuit board (PCB) PC is not limited to three layers of CCL.For example, can use two-layer CCL.Two-layer CCL has basement membrane (for example polyimide resin film) and is positioned at described epilamellar copper film.The copper layer is formed on the basement membrane by sputter and electro-plating method etc.

When electroplate by nickel, gold etc. lead end sublayer 2, the electrode (not shown) that is used to electroplate can be arranged on the profile Y outside of distribution base material, and leading part (narrower than lead end sublayer 2 usually) can be formed pattern in advance so that electrode is connected with lead end sublayer 2.When cutting distribution base material, can as shown in the broken circle among Fig. 2, cut the central part of leading part along profile Y.In this case, the leading part 2A with end face 2a can remain the end of lead end sublayer 2.

Remaining leading part 2A has weak relatively mechanical strength.Therefore, in conventional art, this becomes significant problem in the peeling off of lead end sublayer.Yet in this one exemplary embodiment, inclined plane 2s has reduced to peel off.

In this one exemplary embodiment, when leading part was provided, they had the width identical with lead end sublayer 2.Therefore, the leading part among Fig. 2 seems to be included in the lead end sublayer 2, and Fig. 2 does not show the differences in shape between it.Particularly, the width according to the leading part of this one exemplary embodiment is big relatively.Therefore, the mechanical strength of leading part can remain greatly, thereby can easily the distribution base material be cut into required shape.

[second embodiment]

Next, the printed circuit board (PCB) of second one exemplary embodiment according to the present invention is described to Fig. 7 C with reference to Fig. 7 A.Fig. 7 A has shown the manufacture process of printed circuit board (PCB) in order to Fig. 7 C.

As shown in Figure 7A, have main body according to the printed circuit board (PCB) PCa of this one exemplary embodiment, in described main body, circuit layer is arranged on its both sides.Printed circuit board (PCB) PCa uses doublesided copperclad laminate (two-sided CCL), in described laminated sheet, to the copper film formation pattern of both sides.

In this one exemplary embodiment, the first circuit layer (not shown) on the upper surface of insulating barrier 1 (first surface), lead end sublayer 2,

adhesive layer

3 and 5, lead-in wire wiring layer 4 and first insulating protective film 6 are and the same or analogous parts of being represented by same reference numerals in first one exemplary embodiment.

On lower surface (second surface), adhere to second circuit layer 21 by adhesive layer 22.Here, second circuit layer 21 for example is the screen that is connected to earth potential (GND).The part of second circuit layer 21 is formed the back position of the lead end sublayer 2 of avoiding splicing ear T2.Should be noted that Fig. 7 A shows that to Fig. 7 C the edge 21a of second circuit layer 21 is more farther apart from profile Y than the edge 6a of first insulating protective film 6, yet these accompanying drawings also are not intended to forbid that second circuit layer 21 is overlapping with at least a portion of lead end sublayer 2.

Second circuit layer 21 is covered with second insulating protective film 23 by adhesive 24.Particularly, second insulating protective film 23 is cover layers, and is made by polyimide film.The part of second insulating protective film 23 sticks on the lower surface (second surface) of dielectric substrate 1 at the back position place of lead end sublayer 2.The described part of second insulating protective film 23 has the end face (referring to Fig. 2) along profile Y.

As mentioned above, second circuit layer 21 has the edge 21a that extends along the lower surface (second surface) of dielectric substrate 1.Edge 21a leaves profile Y along profile Y extension and towards lead-in wire wiring layer 4 sides.Therefore, second circuit layer 21 is gone up at the lower surface (second surface) of dielectric substrate 1 by its thickness and is formed ladder.

In the face of the intensive aspect 7 of splicing ear T2 has the rectangular plate shape shape, has at least length from the end face 1a of dielectric substrate 1 to the edge 21a of second circuit layer 21.Intensive aspect 7 has the adhesive layer 8 that sticks on its upper surface.Intensive aspect 7 is made by polyimide resin film, glass epoxy resin film etc.Adhesive layer 8 is made by the epoxy thermosetting resin adhesive.

As shown in Fig. 7 A and Fig. 7 B, intensive aspect 7 sticks on the lower surface (second surface) of dielectric substrate 1 at the back position place of lead end sublayer 2 as follows.At first, with intensive aspect 7 be set in the lead-in wire wiring layer 2 the back position place, the end face 7a of intensive aspect 7 is placed along profile Y.Adhesive layer 8 is in the face of second insulating protective film 23.Then, by the surperficial 2s of hot pressing lead end sublayer 2 and the outer surface 7s of intensive aspect 7 stick to intensive aspect 7 on the lower surface (second surface) of dielectric substrate 1 towards each other.

In this hot pressing, the surperficial 7s of intensive aspect 7 is because the ladder that is formed by the edge 21a and the dielectric substrate 1 of second circuit layer 21 and spontaneously inclination.Therefore, distance relation H1＞H2 can easily realize, and can simply have the printed circuit board (PCB) of distance relation H1＞D1＞H2 with manufacturing easily.

Fig. 7 C has shown the similar process with Fig. 5 C.Particularly, printed circuit board (PCB) PCa can be bent or curve, makes the outer flat surfaces 6s of insulating protective film 6 become and is parallel to the surperficial 7s of intensive aspect 7.

Compare with the printed circuit board (PCB) in first one exemplary embodiment, can increase the function of circuit according to the printed circuit board (PCB) of second one exemplary embodiment.In addition, identical with first one exemplary embodiment, printed circuit board (PCB) can be made easily and simply, and can prevent that the lead end sublayer from peeling off.

[the 3rd embodiment]

With reference to Fig. 8 the printed circuit board (PCB) of the 3rd one exemplary embodiment according to the present invention is described.In this one exemplary embodiment, the splicing ear T1 of first one exemplary embodiment and the point of the splicing ear T2 in second one exemplary embodiment are made amendment, and other parts except point and first or second one exemplary embodiment is identical.

In the 3rd one exemplary embodiment, splicing ear T1 (T2) has inclined plane 2b in the bight that the extension by the surperficial 2s of lead end sublayer 2 and end face 2a limits.Face 2b tilts towards dielectric substrate 1, and with the surperficial 2s and the end face 2a oblique of lead end sublayer 2.Particularly, when intersection location O is the intersection location of extension of the extension of surperficial 2s and end face 2a, the end of inclined plane 2b and surperficial 2s with the intersection of the horizontal distance Q of intersection location O, and the other end of face 2b and end face 2a with the intersection of the vertical distance P of intersection location O.In Fig. 8, each inclined plane 2b has flat surfaces.Yet it can have concave curvatures or convex surface.For example, curved surface can have circle or cartouche in its cross section.

In the 3rd one exemplary embodiment, become littler than in first and second one exemplary embodiment of the distance H 2 (referring to Fig. 3) that in the tip of splicing ear T1 (T2), limits.Therefore, can prevent reliably further that end face 2a from banging in the tip of contact site C2 and can prevent that lead end sublayer 2 from peeling off.

About distance Q and P, Fig. 8 range of a signal Q is greater than distance P.Can be equal to or less than distance P apart from Q.Yet as distance Q during greater than distance P, because inclined plane 2b support with favored policy, this can slide more smoothly to prevent that lead terminal layer 2 from peeling off contact site C2 on the 2b of inclined plane.

Should be noted in the discussion above that the present invention is not limited to the printed circuit board (PCB) in above-mentioned first to the 3rd one exemplary embodiment.Particularly, the present invention can be applicable to multilayer board, in described multilayer board, its main body forms by piling up a plurality of distribution base materials, and the present invention also can be applicable to flexible flat cable (FFC), and described flexible flat cable does not have circuit layer to interconnect electronic unit mounted thereto.In addition, the present invention not only can be applicable to flexible print circuit (FPC), but also can be applicable to rigid printed circuit (RPC) and have FPC and the hybrid circuit board of RPC, and described FPC and RPC have the connection terminals that is used for connector.

Claims

1. a printed circuit board (PCB) has splicing ear, and described splicing ear has profile, and described splicing ear is configured to insert in the aerial lug, and described splicing ear comprises:

Dielectric substrate, described dielectric substrate be provided with first surface and with described first surface opposing second surface, described dielectric substrate comprises the end face along described profile, described profile is perpendicular to the direction of insertion of described splicing ear to described aerial lug;

At least one wiring layer that goes between, described at least one lead-in wire wiring layer is formed on the described first surface of described dielectric substrate;

Insulating protective film, described insulating protective film cover described lead-in wire wiring layer;

At least one lead end sublayer, described at least one lead end sublayer constitutes the end of described lead-in wire wiring layer, and described lead end sublayer is formed bar, and has the outer surface of exposure and along the end face of described profile; And

Intensive aspect, described intensive aspect sticks on the described second surface of described dielectric substrate at the back position place of described lead end sublayer, and described intensive aspect has outer surface,

Between the outer surface of wherein said lead end sublayer and the outer surface of described intensive aspect between first distance of described profile side is less than the outer surface of the outer surface of described lead end sublayer and described intensive aspect at the second distance of described lead-in wire wiring layer side.

2. printed circuit board (PCB) according to claim 1, wherein said at least one lead-in wire wiring layer and described at least one lead end sublayer comprise a plurality of lead-in wire wiring layers and a plurality of lead ends sublayer respectively, and described lead end sublayer layout parallel to each other.

3. printed circuit board (PCB) according to claim 1 also comprises the adhesive layer that described intensive aspect is adhered to described dielectric substrate, wherein said adhesive layer at the thickness of described profile side less than the thickness of described adhesive layer in described lead-in wire wiring layer side, and

The thickness difference of wherein said adhesive layer limits the relation of described first distance less than described second distance.

4. printed circuit board (PCB) according to claim 1 also comprises:

First circuit layer, described first circuit layer are arranged on the described first surface of described dielectric substrate, and described first circuit layer is electrically connected with described lead end sublayer by described lead-in wire wiring layer; And

Second circuit layer, described second circuit layer are arranged on the described second surface of described dielectric substrate, and described second circuit layer is formed the described back position of avoiding described lead end sublayer.

5. printed circuit board (PCB) according to claim 4, wherein said second circuit layer has the edge that is parallel to described profile and leaves described profile towards described lead-in wire wiring layer side, and on the described second surface of described dielectric substrate, forming ladder, described ladder limits the relation of described first distance less than described second distance.

6. printed circuit board (PCB) according to claim 1, the difference of wherein said second distance and described first distance be 2 μ m or more than.

7. printed circuit board (PCB) according to claim 1, wherein said lead end sublayer has the inclined plane at its place, end, and described inclined plane tilts towards described dielectric substrate.

8. printed circuit board (PCB) according to claim 3, wherein said adhesive layer is made by thermosetting resin adhesive.

9. method that is used to make printed circuit board (PCB), described printed circuit board (PCB) has splicing ear, described splicing ear is configured to insert in the aerial lug, and described splicing ear has the profile perpendicular to the direction of insertion of described splicing ear, and described method comprises:

(a) make at least one lead end sublayer form bar on the first surface of dielectric substrate, described at least one lead terminal has along the end face of described profile and is exposed to outside last outer surface; And described dielectric substrate has the end face along described profile;

(b) first adhesive layer and second adhesive layer thicker than described first adhesive layer are sticked on the first surface of intensive aspect, described first adhesive layer is arranged in described profile side, and described second adhesive layer is arranged in the opposite side of described profile side;

(c) make described first adhesive layer and described second adhesive layer face the second surface of described dielectric substrate at the back position place of described lead end sublayer, described second surface is relative with the first surface of described dielectric substrate; And

(d) with the first surface of described lead end sublayer and described intensive aspect with the hot pressing towards each other of first surface opposing second surface, with described intensive aspect is sticked to described dielectric substrate with its first surface opposing second surface on.

10. a printed circuit board (PCB) has splicing ear, and described splicing ear is configured to insert in the aerial lug, and described splicing ear comprises:

Dielectric substrate, described dielectric substrate have first surface and with described first surface opposing second surface, described dielectric substrate comprises the end face of the insertion end that is positioned at described splicing ear, and described end face is perpendicular to the direction of insertion of described splicing ear to described aerial lug;

At least one lead end sublayer, described at least one lead end sublayer is formed on the first surface of described dielectric substrate at the place, end of described lead-in wire wiring layer, described lead end sublayer comprises the exposed surface that does not have insulating protective film of described lead-in wire wiring layer, and extend at the point that the insertion end of described splicing ear stops, and has the end face of exposure in the insertion end of described splicing ear from described insulating protective film; And

Intensive aspect, described intensive aspect has upper surface and lower surface, described upper surface stick to described dielectric substrate with described lead end sublayer opposing second surface on,

Between the exposed surface of wherein said lead end sublayer and the lower surface of described intensive aspect first distance of the insertion end of described splicing ear less than described lead end sublayer the exposed surface at the some place that described insulating protective film stops and described intensive aspect and described some opposing lower surface between second distance.

11. printed circuit board (PCB) according to claim 10, also comprise the adhesive layer that described intensive aspect is adhered to described dielectric substrate, the thickness that wherein said adhesive layer is located in the end relative with insertion end described splicing ear described intensive aspect less than described adhesive layer at the thickness of the insertion end of described splicing ear, and

The thickness difference of wherein said adhesive layer is set up the relation of described first distance less than described second distance.

12. printed circuit board (PCB) according to claim 10, the difference of wherein said second distance and described first distance are more than or equal to 2 μ m.

13. printed circuit board (PCB) according to claim 10, the difference of wherein said second distance and described first distance is in the scope of 2-50 μ m.