CN101924129A - Field effect transistor - Google Patents
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- CN101924129A CN101924129A CN 201010231809 CN201010231809A CN101924129A CN 101924129 A CN101924129 A CN 101924129A CN 201010231809 CN201010231809 CN 201010231809 CN 201010231809 A CN201010231809 A CN 201010231809A CN 101924129 A CN101924129 A CN 101924129A
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- 239000000463 material Substances 0.000 claims abstract description 54
- 230000000694 effects Effects 0.000 claims abstract description 26
- 230000005684 electric field Effects 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims description 57
- 238000002161 passivation Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
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Abstract
The invention provides a field effect transistor. The surface of the transistor is provided with a first dielectric layer and a second dielectric layer, wherein the second dielectric layer is arranged on the first dielectric layer; the dielectric constants of the materials of the first dielectric layer and the second dielectric layer are different; and the material of the second dielectric layer has low dielectric constant. In the field effect transistor of the invention, the second dielectric layer with low dielectric constant is arranged on the first dielectric layer; the first dielectric layer is used to passivate the defects and surface states of the material; the second dielectric layer is used to reduce the air ionization effect in a strong field; and the second dielectric layer with low dielectric constant can be used to greatly reduce the parasitic capacitance of elements and increase the cut-off frequency of elements. With the help of the first dielectric layer and the second dielectric layer, a field plate structure can be formed, and the field plate structure facilitates to further reduce the electrical field strength and the current collapse effect.
Description
Technical field
The present invention relates to a kind of field-effect transistor.
Background technology
The dielectric breakdown field of third generation semiconductor gallium nitride (GaN) is higher than first generation semiconductor silicon (Si) or second generation semiconductor GaAs (GaAs) far away, up to 3MV/cm, makes its electronic device can bear very high voltage.Simultaneously, gallium nitride can form heterojunction structure with other gallium compounds semiconductors (III group-III nitride semiconductor).Because the III group-III nitride semiconductor has strong spontaneous polarization and piezoelectric polarization effect, at the near interface of heterojunction, can form two-dimensional electron gas (2DEG) raceway groove of very high electron concentration.This heterojunction structure has also effectively reduced ionized impurity scattering, so the electron mobility in the raceway groove promotes greatly.The GaN high electron mobility transistor of making on this heterojunction basis (HEMT) can be at the high electric current of high-frequency conducting, and has very low conducting resistance.These characteristics make gallium nitride HEMT be specially adapted to make the high-power RF device of high frequency and the switching device of high withstand voltage big electric current.
Because the electronics in the two-dimensional electron gas raceway groove has very high mobility, thus gallium nitride HEMT for silicon device, switching rate improves greatly.The two-dimensional electron gas of high concentration also makes gallium nitride HEMT have higher current density simultaneously, is applicable to the needs of super-current power unit.In addition, gallium nitride is a wide bandgap semiconductor, can be operated in higher temperature.Silicon device often needs extra cooling device to guarantee its operate as normal under the high power work environment, and gallium nitride need not be done like this, perhaps requires lower to cooling.Therefore the gallium nitride power device helps saving space and cost.
The sectional view of the device architecture of conventional gallium nitride HEMT as shown in Figure 1.Bottom is a substrate 1, deposits nucleating layer 2, resilient coating 3 and separator 4 on the substrate 1.The two-dimensional electron gas raceway groove forms at the near interface of resilient coating and separator.Source electrode 5 and drain electrode 6 communicate with two-dimensional electron gas, can control the flow direction of the interior electronics of raceway groove.Grid 7 is used to control the number of electronics in the raceway groove between source electrode and drain electrode, and then the size of Control current.
In transistor, between grid and drain electrode, bear higher voltage usually, cause the zone of close grid between grid and the drain electrode to have highfield, highfield herein causes the current collapse effect of gallium nitride device.The current collapse effect shows as: the current density when current density is much smaller than the device stable state under high frequency.The current collapse effect occurs and make device performance degeneration, reduce output power density, power gain efficient etc. have seriously restricted the high-frequency and high-voltage high-power applications of device.For gallium nitride radio-frequency power device, because it often will be operated under hyperfrequency and the high voltage environment, the requirement of current collapse effect control is strict more.
The physical machine that causes current collapse is shaped on two kinds.The first, the current collapse effect that the material surface defective causes.In AlGaN/GaN heterojunction HEMT, material surface exists highdensity surface state or electron trap, under the highfield effect, the electronics of grid is by tunnelling, and hopping conduction physical mechanisms such as (hopping conduction) enters into the electron trap in zone between material surface grid and the drain electrode.The reaction speed of electron trap is slow, thereby causes the current collapse effect.See also shown in Figure 2ly, be the current collapse effect that reply material surface electron trap causes, gallium nitride HEMT generally adopts the passivation technology on material (dielectric layer 8) covering device surface such as SiN medium.Passivation dielectric layer (as SiN or GaN) can be by improving the material surface attitude and stoping electronics at surface aggregation, reduces or eliminate the current collapse effect.
The second, the current collapse effect that air ionization causes.In transistor, there is highfield in the zone near grid between grid and drain electrode.Under the highfield effect, this regional air ionization, because the electromotive force of material surface is being for just, the anion behind the air ionization is attracted by surface potential, accumulates in the surface of device.These anions are similar to empty grid, strengthen exhausting two-dimensional electron gas in the empty grid lower channel.Under high frequency situations, when grid voltage was upgraded to malleation by pinch-off voltage, the raceway groove under the grid was opened rapidly, but the anion between source electrode and drain electrode has little time to withdraw, and the pace of change of empty gate potential is much smaller than the grid potential pace of change.Therefore the two-dimensional electron gas under the empty grid still is in and exhausts attitude, and raceway groove can't be opened, and the current collapse effect appears in the current density when current density is much smaller than the device stable state under the high frequency.See also shown in Figure 2ly, in order to tackle the current collapse effect that air ionization causes, gallium nitride HEM is general to adopt thick passivation dielectric layer (as SiN).Adopt thick SiN passivation dielectric layer, be exposed to airborne zone for device, its electric field reduces greatly.Therefore the effect of air ionization also reduces greatly.
But the structure of traditional thick SiN passivation dielectric layer can reduce the frequency response (seeing also shown in Figure 2) for device, is unfavorable for the design of hyperfrequency gallium nitride device.
For the high frequency gallium nitride device, the grid of device are long very little, so the intrinsic capacity of device is very little.Parasitic capacitance is very big for the influence of device cut-off frequency.Common high frequency gallium nitride device adopts the design of T type grid, adopts SiN or GaN as surface passivation layer, between grid cover and the gallium nitride by air insulated.But SiN and GaN surface passivation layer dielectric constant commonly used are big, and the parasitic capacitance of introducing is big.Accompanying drawing 3 usefulness finite element analysis method are simulated structure shown in the accompanying drawing 2, if surface passivation layer adopts the dielectric layer of low-k, parasitic capacitance can reduce greatly, and this is particularly crucial for the long device of little grid.But, SiO2, multiple dielectric layer such as SiON all is studied and attempted, and for SiN and GaN, effective passivating material surface can not effectively reduce and caused by the gallium nitride surface attitude.
Summary of the invention
The purpose of this invention is to provide a kind of field-effect transistor, it can improve the current collapse effect, can reduce parasitic capacitance again, improves cut-off frequency.
To achieve these goals, the present invention adopts following technical scheme:
A kind of field-effect transistor, its surface is provided with first dielectric layer and second dielectric layer, described second dielectric layer is arranged on described first dielectric layer, and described first dielectric layer is different with the dielectric constant of the material of described second dielectric layer, and the material of described second dielectric layer is the material of low-k.
The material of described second dielectric layer is the material of DIELECTRIC CONSTANT＜4.
Described field-effect transistor comprises substrate, semiconductor layer, separator, first dielectric layer and second dielectric layer from the bottom to top successively, this field-effect transistor also comprises source electrode, drain and gate, described source electrode and drain electrode are arranged on the described separator and electrically connect described semiconductor layer, described grid is arranged on the described separator, and described grid is between described source electrode and drain electrode.
Described grid is a T type grid.
The grid cover of described T type grid contacts described second dielectric layer.
Described first dielectric layer is the passivation dielectric layer of described field-effect transistor surface state of passivation or surface electronic trap; Described second dielectric layer is the electric field that is used to reduce device and air contact area, reduce the dielectric layer of the current collapse effect that air ionization causes.
The material of described first dielectric layer is GaN, AlN or SiN, and the material of described second hypothallus is SiO
2Or BCB.
The material of described semiconductor layer is a nitride semi-conductor material, and the material of described separator is the semi-conducting material that forms heterojunction with the material of described semiconductor layer.
The material of described substrate is sapphire, SiC, GaN or Si; The material of described semiconductor layer and described separator is the III hi-nitride semiconductor material, and wherein III valency atom comprises indium, aluminium or gallium.
The material of described semiconductor layer and separator is In
xAl
yGa
zN
1-x-y-z(0≤x, y, z≤1).
Compared with prior art, the present invention has the following advantages: a kind of field-effect transistor of the present invention is by being provided with second dielectric layer of low-k on first dielectric layer, first dielectric layer and second dielectric layer can be assisted the formation field plate structure, field plate structure helps further lowering electric field, lower the current collapse effect, second dielectric layer of low-k also can reduce the parasitic capacitance of device greatly, improves the cut-off frequency of device.
Description of drawings
Fig. 1 is the sectional view of conventional gallium nitride HEMT device structure;
Fig. 2 is the sectional view of conventional high frequency gallium nitride HEMT device structure, and the device material surface forms one deck passivation dielectric layer;
Fig. 3 is the model configuration of device capacitor shown in Figure 2: for the long device of 100nm grid, adopt SiN as dielectric layer, than the medium that adopts low-k (ε=3), it is about 58% that its parasitic capacitance will increase, and its total capacitance will increase about 19%;
Fig. 4 is the sectional view of a kind of field-effect transistor structure of the present invention;
Fig. 5 is that the another kind of transistor arrangement shown in Figure 4 changes, and T type grid cover is located immediately on the passivation dielectric layer.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiment of the invention is described in detail.
See also shown in Figure 4, the material of substrate 1 can be known any other the suitable growing gallium nitride material of sapphire (Sapphire), SiC, GaN, Si or those skilled in the art, and the deposition process of substrate 1 comprises CVD, VPE, MOCVD, LPCVD, PECVD, pulsed laser deposition (PLD), atomic layer epitaxy, MBE, sputter, evaporation etc.
Be optional nucleating layer 2 on the substrate 1, be used for grown semiconductor layer thereon, the present invention also can not be formed into stratum nucleare 2, and directly forms semiconductor layer on substrate 1.
Be semiconductor layer 3 on the nucleating layer 2, it can be based on any semi-conducting material of nitride, III hi-nitride semiconductor material for example, and wherein III valency atom comprises the combination with arbitrary proportion of indium, aluminium, gallium or indium, aluminium, gallium.Particularly, semiconductor layer 3 can comprise gallium nitride (GaN) and other gallium compounds semi-conducting materials, and for example AlGaN, InGaN etc. also can be the laminations of gallium compounds semi-conducting material and other semi-conducting materials.The polarity of gallium based semiconductor material can be Ga-polarity, also can be N-polarity, nonpolar or semi-polarity.
Be separator 4 on the semiconductor layer 3, it is any semi-conducting material that can form heterojunction with following semiconductor layer 3, comprises gallium compounds semi-conducting material or III hi-nitride semiconductor material, for example In
xAl
yGa
zN
1-x-y-z(0≤x, y, z≤1).That is to say, the present invention for semiconductor layer 3 and separator 4 without any restriction, as long as can form heterojunction between the two.Owing to form heterojunction semiconductor between semiconductor layer 3 and separator 4, the polarization charge on heterojunction boundary has been introduced the two-dimensional electron gas (2DEG) of high concentration.Because ionized impurity scattering is greatly diminished, electronics has very high electron mobility simultaneously.
Promptly first dielectric layer 8 on the separator 4.This first dielectric layer 8 can be the crystalline material that deposits in growth or technical process, as GaN or AlN etc.; Also can be the amorphous material that deposits in growth or technical process, SiN etc. for example.These first dielectric layer, 8 purposes promptly are the passivation device surfaces, reduce or eliminate the current collapse effect of gallium nitride HEMT, and ectocine etc. are avoided on the protection device surface.
It on first dielectric layer 8 one or more layers second dielectric layer 9.This second dielectric layer 9 can be the crystalline material that deposits in growth or technical process; It also can be the amorphous material that in growth or technical process, deposits.This dielectric layer is selected the material (ε＜4) of low-k, for example SiO for use
2Or BCB etc., second dielectric layer 9 is in order to reduce between the grid leak near the grid end, the electric field in device and zone, air contact position 10 reduces or stops the air ionization in this zone 10, the current collapse effect that reduction air ionization effect causes.Second dielectric layer adopts the material of low-k simultaneously, can reduce the parasitic capacitance of device, improves the cut-off frequency of device.Device surface can prevent to be subjected to the influence or the damage of external environment, as anti-oxidation, moistureproof, radiation proof, insulation, antisitic defect etc. after being covered by first dielectric layer 8 and second dielectric layer 9.
First dielectric layer 8 and second dielectric layer 9 can be formed by multiple mode, as MOCVD, and PECVD, ALD, MBE and heat growth etc., but be not limited to this method.Should be appreciated that, describe the method that forms dielectric layer here and just give an example that the present invention can form dielectric layer by the known any method of those skilled in the art.
First dielectric layer 8 and second dielectric layer 9 can be made of multiple material, as GaN, and Si
XN
Y, Si
XO
Y, Al
2O
3, BCB etc., but be not limited to cited material.
The structure of first dielectric layer 8 and second dielectric layer 9 can be individual layer or multilayer, also can be that multiple material repeatedly stacking forms.
Thickness the present invention of first dielectric layer 8 and second dielectric layer 9 does not limit, and can change according to different purposes and application.The source electrode 5 of semiconductor device and drain electrode 6 are electrically connected with 2DEG formation in the semiconductor layer 3.In the present embodiment, the mode that is electrically connected with 2DEG formation in the semiconductor layer 3 of source electrode 5 and drain electrode 6 can adopt but be not limited to following mode and form: a. high annealing; B. ion injects; C. heavy doping.Under the situation of carrying out high annealing, the electrode metal of source electrode 5 and drain electrode 6 passes separator 4 and contacts with semiconductor layer 3, thereby is electrically connected with the 2DEG of formation in the semiconductor layer 3.Carrying out that ion injects and heavily doped situation under, source electrode 5 and drain electrode 6 inject partly by the ion that is electrically connected with the 2DEG that forms in the semiconductor layer 3 or heavy doping partly with its on electrode constitute.Should be appreciated that, describe the method that forms source electrode 5 and drain electrode 6 here and just give an example that the present invention can form source electrode 5 and drain electrode 6 by the known any method of those skilled in the art.
The grid 7 of semiconductor device is in source electrode 5 and the zone between 6 of draining.Grid 7 can be the single-layer metal grid, also can bilayer or stacked gate structure, and for example lower floor is dielectric (SiO for example
2), the upper strata is a gate metal, gate metal also can be a multiple layer metal.Should be appreciated that, describe the method that forms grid here and just give an example that the present invention can form grid by the known any method of those skilled in the art.Grid is preferably T type grid among the present invention.T type grid can reduce the resistance of device, improves the frequency response of device.
Can use field plate structure in high tension apparatus, first dielectric layer 8 and second dielectric layer 9 can be assisted the formation field plate structure.See also shown in Figure 5ly, show a kind of distortion of the present invention, it forms field plate structure between the grid cover of T type grid and the dielectric layer on the basis of Fig. 4.Field plate structure evenly distributes the nearly drain terminal of grid zone electric field, improves device electric breakdown strength.In Fig. 5 structure, adopt low-k second dielectric layer 9 to replace the SiN layer, also can reduce the parasitic capacitance of device greatly, improve the cut-off frequency of device.
This gallium nitride field effect transistor also can adopt structures such as source field plate, floating boom to strengthen its performance.
Should be appreciated that the present invention is a current collapse effect of improving semiconductor device from the device architecture design point of view, improve device cut-off frequency effect, so the gallium nitride HEMT of the depletion type of foregoing description is an example, the present invention is not limited to this.The present invention both had been applicable to the gallium nitride HEMT that is operated under the high-voltage large current environment, also go for other forms of transistor, as metal oxide layer semiconductor field-effect transistor (MOSFET), metal dielectric layer semiconductor field effect transistor (MISFET), dual heterogeneity node field effect transistor (DHFET), junction field effect transistor (JFET), metal-semiconductor field effect transistor (MESFET), metal dielectric layer heterogeneous semiconductor junction field effect transistor (MISHFET) or other field-effect transistors.And these devices can be enhancement mode, also can be depletion types.
Though more than by some exemplary embodiments semiconductor device of the present invention and the method that is used for producing the semiconductor devices are described in detail, but above these embodiment are not exhaustive, and those skilled in the art can realize variations and modifications within the spirit and scope of the present invention.Therefore, the present invention is not limited to these embodiment, and scope of the present invention only is as the criterion with appended claims.
Claims (10)
1. field-effect transistor, it is characterized in that: this transistor surface is provided with first dielectric layer (8) and second dielectric layer (9), described second dielectric layer (9) is arranged on described first dielectric layer (8), described first dielectric layer (8) is different with the dielectric constant of the material of described second dielectric layer (9), and the material of described second dielectric layer (9) is the material of low-k.
2. field-effect transistor according to claim 1, it is characterized in that: the material of described second dielectric layer (9) is the material of DIELECTRIC CONSTANT＜4.
3. field-effect transistor as claimed in claim 1 or 2, it is characterized in that: described field-effect transistor comprises substrate (1), semiconductor layer (3), separator (4), first dielectric layer (8) and second dielectric layer (9) from the bottom to top successively, this field-effect transistor also comprises source electrode (5), drain electrode (6) and grid (7), described source electrode (5) and drain electrode (6) are arranged at described separator (4) and go up and electrically connect described semiconductor layer (3), described grid (3) is arranged on the described separator (4), and described grid (7) is positioned between described source electrode (5) and the drain electrode (6).
4. as field-effect transistor as described in the claim 3, it is characterized in that: described grid (7) is a T type grid.
5. as field-effect transistor as described in the claim 4, it is characterized in that: the grid cover of described T type grid contacts described second dielectric layer (9).
6. as field-effect transistor as described in the claim 3, it is characterized in that: described first dielectric layer (8) is the passivation dielectric layer of described field-effect transistor surface state of passivation or surface electronic trap; Described second dielectric layer (9) is the electric field that is used to reduce device and air contact area, the dielectric layer of the current collapse effect that causes of reduction air ionization.
7. as field-effect transistor as described in the claim 6, it is characterized in that: the material of described first dielectric layer (8) is GaN, AlN or SiN, and the material of described second hypothallus (9) is SiO
2Or BCB.
8. as field effect transistor pipe fitting as described in the claim 3, it is characterized in that: the material of described semiconductor layer (3) is a nitride semi-conductor material, and the material of described separator (4) is the semi-conducting material that forms heterojunction with the material of described semiconductor layer (3).
9. as field-effect transistor as described in the claim 3, it is characterized in that: the material of described substrate (1) is sapphire, SiC, GaN or Si; The material of described semiconductor layer (3) and described separator (4) is the III hi-nitride semiconductor material, and wherein III valency atom comprises indium, aluminium or gallium.
10. as field-effect transistor as described in claim 8 or 9, it is characterized in that: the material of described semiconductor layer (3) and separator (4) is In
xAl
yGa
zN
1-x-y-z(0≤x, y, z≤1).
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104393037A (en) * | 2014-09-22 | 2015-03-04 | 苏州能讯高能半导体有限公司 | Sub-micron gate length GaN HEMT device and preparation method thereof |
| CN107302022A (en) * | 2017-07-07 | 2017-10-27 | 西安电子科技大学 | Low injured surface processing high efficiency device and preparation method thereof |
| CN108461543A (en) * | 2018-05-29 | 2018-08-28 | 苏州闻颂智能科技有限公司 | A kind of GaN HEMT devices and preparation method thereof |
| CN110600542A (en) * | 2019-08-13 | 2019-12-20 | 中山市华南理工大学现代产业技术研究院 | GaN-based radio frequency device with П type gate and preparation method thereof |
| CN114023818A (en) * | 2020-07-08 | 2022-02-08 | 英诺赛科（珠海）科技有限公司 | Electronic device |
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