CN101923656B - Method and equipment for processing die-cut tag - Google Patents
Method and equipment for processing die-cut tag Download PDFInfo
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- CN101923656B CN101923656B CN2010102939533A CN201010293953A CN101923656B CN 101923656 B CN101923656 B CN 101923656B CN 2010102939533 A CN2010102939533 A CN 2010102939533A CN 201010293953 A CN201010293953 A CN 201010293953A CN 101923656 B CN101923656 B CN 101923656B
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- raw material
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- folding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
Abstract
The invention relates to a method and equipment for processing a die-cut tag. The method comprises the following processing steps of: feeding a raw material of which the bottom layer is bonded with a conductive layer material into a die-cutting machine to obtain a front side conductive layer circuit structure and a back side conductive layer circuit structure by die cutting; stripping conductive layer material waste on the raw material from the bottom layer by a stripping mechanism and winding usable raw material; coating hot melt adhesive on the conductive layer material of the raw material; correctly folding the raw material along a middle boundary by a folding mechanism and conveying the folded raw material to a hot-pressing mechanism; performing hot-pressing combination on the front side conductive layer circuit structure and the back side conductive layer circuit structure on the raw material coated with the hot melt adhesive by the hot-pressing mechanism and conveying the raw material after hot-pressing combination to a winding mechanism; and winding an electronic tag raw material formed by hot pressing by the winding mechanism. The method is mainly used in mass production of substrate-free electronic tags and requires improving production efficiency and ensuring product quality in a production process.
Description
Technical field
The present invention relates to the job operation and the process equipment of job operation and equipment, particularly a kind of die-cut tag of the electronic soft label at a kind of linerless end.
Background technology
Along with development of electronic technology, the electronic tag with safety anti-fake function enters in our life gradually, it also have simultaneously highly sensitive, volume is little, low cost and other advantages.
Like Chinese invention patent instructions (Granted publication number: CN100423026C) disclose a kind of high-precision radio frequency soft tag.The basic unit of this label is made up of an insulating film layer and the conductive layer that is sticked respectively at the insulating film layer front and back; Have on the described conductive layer by electric capacity, lead and conciliate the decoding circuit that code-point constitutes; This electric capacity is positioned at the coil periphery that is made up of lead, it is characterized in that: the width ecto-entad of this capacitive lead and winding wire reduces gradually.The width of the capacitive lead on this decoding circuit helps increasing the capacity of capacitive region greater than the width of winding wire, helps improving the precision of label.This winding wire width ecto-entad reduces gradually, helps increasing the winding turns of coil, and then has increased winding wire, and the inductance value of coil is greatly improved, and also helps improving the precision of label.But existing this electronic tag really has following shortcoming: (1) existing electronic tag all needs backing material (insulating film layer), has caused the thickness of product increase.(2) existing electronic tag all needs backing material (insulating film layer), has caused the production cost of products rising.(3) existing electronic tag all needs backing material (insulating film layer); Caused in the Design and Machining process of its Design and Machining of separating code-point (or tie point), electric capacity and all need the factor of insulating film layer have been taken into account, otherwise the performance of label (as: sensitivity) will be difficult to ensure.
In order to address the above problem; The dealer has developed a kind of no substrate electron label; Shown in Fig. 1-3: it has the circuit that is made up of the front and back two conductive layers of directly each other fitting, and the coil that has capacitor on the described front and back conductive layer and position are corresponding is positioned at the middle tie point of coil.When front and back is fitted; Bonding hot melt adhesive has not only played the effect of applying front and back circuit; And hot melt adhesive layer also has the effect of insulating film layer; The advantage that this product has is: the backing material of insulating film layer has been reduced in (1), so the thickness of label and weight all reduces, and production cost also descends to some extent.(2) can reduce consideration in design and the production, more help controlling the sensitivity of electronic tag the insulating film layer factor.
At present; The electronic tag at the above-mentioned linerless end has remedied the existing defective of lining label with dielectric film from structure; But, how to realize the label large-scale industrial production processing of the linerless end with and the equipment of production and processing, all do not mention in the prior art.
Summary of the invention
The object of the present invention is to provide a kind of job operation and process equipment of die-cut tag, be mainly used in the above-mentioned no substrate electron label of production of scale, it not only requires to enhance productivity, and requires to guarantee in process of production the quality of product.
For realizing above-mentioned purpose, the present invention realizes like this.
A kind of job operation of die-cut tag; It is characterized in that production stage is: step 1, the raw material that is bonded with conductive on the bottom is sent into die-cutting machine; On raw material, constantly process front side conductive layer circuit structure and backside conductive layer circuit structure through die-cutting machine; Described front side conductive layer circuit structure and backside conductive layer circuit structure on raw material symmetry be distributed in both sides, intermediate section boundary line; To guarantee that front side conductive layer circuit structure and backside conductive layer circuit structure combine to form complete tag circuit after raw material is folding by the intermediate section boundary line of adjacent front side conductive layer circuit structure and backside conductive layer circuit structure; Step 2, material stripping mechanism peel off the conductive waste material on the raw material from bottom, and furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom; Step 3, on the conductive of raw material coating hot-melt adhesive; Step 4, through fold mechanism raw material is carried out accurately foldingly along the intermediate section boundary line, and the raw material after will folding is transported to hot pressing mechanism; Step 5, will be coated with front side conductive layer circuit structure and backside conductive layer circuit structure on the raw material of hot melt adhesive through hot pressing mechanism and carry out hot pressing and combine, the raw material after hot pressing combines to accomplish is transported to furling mechanism; Step 6, the electronic tag raw material after hot-forming is furled through furling mechanism.
The job operation of described die-cut tag, it is characterized in that described on the conductive of raw material coating hot-melt adhesive be before raw material is sent into die-cutting machine, to accomplish.
The job operation of described die-cut tag is characterized in that keeping intermediate section boundary line and near conductive thereof in the cross cutting process of described step 1, and on the conductive that keeps, cuts out the intermediate section boundary line with the form film that cuts off at interval.
A kind of process equipment of die-cut tag is used to implement aforesaid method, it is characterized in that it comprises the combining mechanism of the electronic tag of the die-cutting machine that is used for implementation step one, the material stripping mechanism that is used for implementation step two and continual implementation step three-six; The combining mechanism of this electronic tag is arranged on a feeding roller and and furls between the roller, and wherein feeding roller is used to see off folding preceding raw material, furls roller and is used to furl the electronic tag strip after hot pressing combines; Described feeding roller and transport path one side that furls between the roller are provided with folding cut somebody's hair, fold pressing plate and hot press successively; The described folding both sides, the place ahead of cutting somebody's hair have the folding spacer of the position, intermediate section boundary line that is positioned at strip respectively, and being used for raw material is that benchmark folds with position, intermediate section boundary line; Described folding pressing plate also is arranged on the position, intermediate section boundary line of strip; It is a L type structure; And form a folded slot with the hot pressing table top, be used for further folding to guarantee that front side conductive layer circuit structure on the raw material is positioned at the position of directly hot pressing combination after folding with the backside conductive layer circuit structure through the raw material behind the folding folding of cutting somebody's hair; Front side conductive layer circuit structure and backside conductive layer circuit structure that described hot press is used on the raw material that position, folding back is corresponding carry out the hot pressing combination.
The process equipment of described die-cut tag; It is characterized in that: described material stripping mechanism is made up of stripper roll and material receiving roller; Wherein, Stripper roll is used for constantly peeling off the conductive waste material on the raw material, and material receiving roller is used to furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom.
The process equipment of described die-cut tag is characterized in that: described die-cutting machine is a WQM series pressure-sensitive adhesive trade mark die-cutting machine automatically.
The present invention provides a kind of through technique scheme and has stablized and method and the process equipment of producing linerless bed die cut type electronic tag efficiently.
Description of drawings
Fig. 1 is the front side conductive layer electrical block diagram of the electronic tag produced of the inventive method.
Fig. 2 is the backside conductive layer electrical block diagram of the electronic tag produced of the inventive method.
Fig. 3 is the structural representation after front, the backside conductive layer circuit of the electronic tag produced of the inventive method combines.
Fig. 4 is a processing step process flow diagram of the present invention.
Fig. 5 is the plan structure synoptic diagram of the combining mechanism of production equipment electronic tag of the present invention.
Fig. 6 is that film is cut the raw material mix figure after the step in the inventive method production run.
Fig. 7 is that film is cut the another kind of raw material mix figure after the step in the inventive method production run.
Embodiment
As shown in Figure 4; The invention discloses a kind of job operation of die-cut tag; Production stage is: step 1, the raw material that is bonded with conductive (as: aluminium foil) on the bottom is sent into die-cutting machine; On raw material, constantly process front side conductive layer circuit structure and backside conductive layer circuit structure through die-cutting machine; Described front side conductive layer circuit structure and backside conductive layer circuit structure on raw material symmetry be distributed in both sides, intermediate section boundary line (like Fig. 6); To guarantee that front side conductive layer circuit structure and backside conductive layer circuit structure combine to form complete tag circuit after raw material is folding by the intermediate section boundary line of adjacent front side conductive layer circuit structure and backside conductive layer circuit structure; Step 2, material stripping mechanism peel off the conductive waste material on the raw material from bottom, and furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom; Step 3, on the conductive of raw material coating hot-melt adhesive; Step 4, through fold mechanism raw material is carried out accurately foldingly along the intermediate section boundary line, and the raw material after will folding is transported to hot pressing mechanism; Step 5, will be coated with front side conductive layer circuit structure and backside conductive layer circuit structure on the raw material of hot melt adhesive through hot pressing mechanism and carry out hot pressing and combine, the raw material after hot pressing combines to accomplish is transported to furling mechanism; Step 6, the electronic tag raw material after hot-forming is furled through furling mechanism.
As a kind of embodiment of variation, the job operation of described die-cut tag, it is characterized in that described on the conductive of raw material coating hot-melt adhesive be before raw material is sent into die-cutting machine, to accomplish.
Through said method, can accomplish the production and processing of the soft label of no substrate electron very efficiently.
In the inventive method, keep intermediate section boundary line and near conductive thereof in the cross cutting process of described step 1, and on the conductive that keeps, cut out the intermediate section boundary line with the form film that cuts off at interval, as shown in Figure 7.Through this structure setting, in the folding process of step 4, not only can guarantee the accuracy of folding position, and can reduce folding difficulty at a distance from the structure of cutting off therebetween.
The present invention further discloses the process equipment that is used to implement aforesaid method, it comprises the combining mechanism of the electronic tag of the die-cutting machine that is used for implementation step one, the material stripping mechanism that is used for implementation step two and continual implementation step three-six.Wherein: die-cutting machine can use general product, as: WQM series is the pressure-sensitive adhesive trade mark die-cutting machine automatically; And material stripping mechanism also is more traditional structure; It can be made up of stripper roll and material receiving roller; Wherein, stripper roll is used for constantly peeling off the conductive waste material on the raw material, and material receiving roller is used to furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom.
Creative characteristics is the combining mechanism of the electronic tag of continual implementation step three-six among the present invention.As shown in Figure 5: the combining mechanism of this electronic tag is arranged on a feeding roller 41 and and furls between the roller 42, and wherein feeding roller 41 is used to see off folding preceding raw material, furls roller 42 and is used to furl the electronic tag strip after hot pressing combines; Described feeding roller 41 and furl transport path one side between the roller 42 be provided with successively foldingly cut somebody's hair 43, folding pressing plate 44 and hot press 45; The described folding both sides, 43 the place ahead of cutting somebody's hair have the folding spacer 461,462 of the position, intermediate section boundary line that is positioned at strip respectively, and being used for raw material is that benchmark folds with position, intermediate section boundary line; Described folding pressing plate 44 also is arranged on the position, intermediate section boundary line of strip; It is a L type structure; And form a folded slot with hot pressing table top 47, be used for further folding to guarantee that front side conductive layer circuit structure on the raw material is positioned at the position of directly hot pressing combination after folding with the backside conductive layer circuit structure through the raw material behind the folding folding of cutting somebody's hair; Front side conductive layer circuit structure and backside conductive layer circuit structure that described hot press 45 is used on the raw material that position, folding back is corresponding carry out the hot pressing combination.The thermal head of described hot press 45, folding pressing plate 44, folding spacer 461,462 all can be arranged at hot pressing table top 47 tops.
Being merely preferred embodiment of the present invention in sum, is not to be used for limiting practical range of the present invention.Be that all equivalences of doing according to the content of claim of the present invention change and modification, all should be technological category of the present invention.
Claims (5)
1. the job operation of a die-cut tag; It is characterized in that production stage is: step 1, the raw material that is bonded with conductive on the bottom is sent into die-cutting machine; On raw material, constantly process front side conductive layer circuit structure and backside conductive layer circuit structure through die-cutting machine; Described front side conductive layer circuit structure and backside conductive layer circuit structure on raw material symmetry be distributed in both sides, intermediate section boundary line; To guarantee that front side conductive layer circuit structure and backside conductive layer circuit structure combine to form complete tag circuit after raw material is folding by the intermediate section boundary line of adjacent front side conductive layer circuit structure and backside conductive layer circuit structure; Step 2, material stripping mechanism peel off the conductive waste material on the raw material from bottom, and furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom; Step 3, on the conductive of raw material coating hot-melt adhesive; Step 4, through fold mechanism raw material is carried out accurately foldingly along the intermediate section boundary line, and the raw material after will folding is transported to hot pressing mechanism; Step 5, will be coated with front side conductive layer circuit structure and backside conductive layer circuit structure on the raw material of hot melt adhesive through hot pressing mechanism and carry out hot pressing and combine, the raw material after hot pressing combines to accomplish is transported to furling mechanism; Step 6, the electronic tag raw material after hot-forming is furled through furling mechanism.
2. the job operation of die-cut tag according to claim 1; It is characterized in that keeping intermediate section boundary line and near conductive thereof in the cross cutting process of described step 1, and on the conductive that keeps, cut out the intermediate section boundary line with the form film that cuts off at interval.
3. the process equipment of a die-cut tag; Be used to implement method according to claim 1 or claim 2, it is characterized in that it comprises the combining mechanism of the electronic tag of the die-cutting machine that is used for implementation step one, the material stripping mechanism that is used for implementation step two and continual implementation step three-six; The combining mechanism of this electronic tag is arranged on a feeding roller (41) and and furls between the roller (42), and wherein feeding roller (41) is used to see off folding preceding raw material, furls roller (42) and is used to furl the electronic tag strip after hot pressing combines; Described feeding roller (41) and transport path one side that furls between the roller (42) are provided with folding cut somebody's hair (43), fold pressing plate (44) and hot press (45) successively; Described folding (43) both sides, the place ahead of cutting somebody's hair have the folding spacer (461,462) of the position, intermediate section boundary line that is positioned at strip respectively, and being used for raw material is that benchmark folds with position, intermediate section boundary line; Described folding pressing plate (44) also is arranged on the position, intermediate section boundary line of strip; It is a L type structure; And form a folded slot with hot pressing table top (47), be used for further folding to guarantee that front side conductive layer circuit structure on the raw material is positioned at the position of directly hot pressing combination after folding with the backside conductive layer circuit structure through the raw material behind the folding folding of cutting somebody's hair; Front side conductive layer circuit structure and backside conductive layer circuit structure that described hot press (45) is used on the raw material that position, folding back is corresponding carry out the hot pressing combination.
4. the process equipment of die-cut tag according to claim 3; It is characterized in that: described material stripping mechanism is made up of stripper roll and material receiving roller; Wherein, Stripper roll is used for constantly peeling off the conductive waste material on the raw material, and material receiving roller is used to furl the raw material that has front side conductive layer circuit structure and backside conductive layer circuit structure on the bottom.
5. the process equipment of die-cut tag according to claim 3 is characterized in that: described die-cutting machine is a WQM series pressure-sensitive adhesive trade mark die-cutting machine automatically.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102939533A CN101923656B (en) | 2010-09-28 | 2010-09-28 | Method and equipment for processing die-cut tag |
| PCT/CN2010/001743 WO2012040885A1 (en) | 2010-09-28 | 2010-11-01 | Processing method and processing device of die cutting type tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102939533A CN101923656B (en) | 2010-09-28 | 2010-09-28 | Method and equipment for processing die-cut tag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101923656A CN101923656A (en) | 2010-12-22 |
| CN101923656B true CN101923656B (en) | 2012-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102939533A Active CN101923656B (en) | 2010-09-28 | 2010-09-28 | Method and equipment for processing die-cut tag |
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| CN (1) | CN101923656B (en) |
| WO (1) | WO2012040885A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103679243B (en) * | 2012-09-20 | 2016-12-21 | 一芯智能科技股份有限公司 | Intelligent dual-interface card chip contacts point stannum, viscous PUR automation equipment |
| CN104050492A (en) * | 2013-03-13 | 2014-09-17 | 深圳市华阳微电子股份有限公司 | Fragile paper anti-fake RFID label and preparation method thereof |
| CN103235966A (en) * | 2013-04-16 | 2013-08-07 | 凤宝珍 | Production process and machining equipment for environment-friendly tags |
| CN105070674B (en) * | 2015-07-31 | 2018-01-09 | 华中科技大学 | A kind of transfer device piecewise suitable for coiled flexible electronic device |
| CN111383512A (en) * | 2018-12-31 | 2020-07-07 | 佛山艾仕仑科技有限公司 | Water label capable of being conveniently marked and production method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2969426B2 (en) * | 1994-07-26 | 1999-11-02 | 株式会社サニー・シーリング | Resonant label and method of manufacturing the same |
| WO2005083627A1 (en) * | 2004-02-23 | 2005-09-09 | Checkpoint Systems, Inc. | Security tag and method for fabricating a tag |
| FR2873470A1 (en) * | 2004-07-21 | 2006-01-27 | Fci Sa | CONNECTING DEVICE FOR FLAT CIRCUITS |
| CN201010081Y (en) * | 2006-12-31 | 2008-01-23 | 刘述江 | Labeling machine without bottom paper |
| JP2009026042A (en) * | 2007-07-19 | 2009-02-05 | Toppan Forms Co Ltd | Rf-id medium and manufacturing method thereof |
| CN101609926A (en) * | 2008-06-17 | 2009-12-23 | 深圳市华阳微电子有限公司 | Adopt the ultrahigh frequency electronic tag and the manufacture method thereof of separated antennae |
| CN201429857Y (en) * | 2009-07-08 | 2010-03-24 | 黄佳佳 | Electronic tag without substrate |
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2010
- 2010-09-28 CN CN2010102939533A patent/CN101923656B/en active Active
- 2010-11-01 WO PCT/CN2010/001743 patent/WO2012040885A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2012040885A1 (en) | 2012-04-05 |
| CN101923656A (en) | 2010-12-22 |
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Owner name: SHANGHAI UBIQUETAG PACKAGE MATERIALS CO., LTD. Free format text: FORMER OWNER: HUANG JIAJIA Effective date: 20140508 |
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Effective date of registration: 20140508 Address after: 201300 Shanghai city Pudong New Area Town Park Road No. 318 Patentee after: Shanghai Ubiquetag Package Materials Co., Ltd. Address before: 3, 201300, Lane 1168, Lane 136, Cambridge, Pudong New Area, Shanghai, Nanhui Patentee before: Huang Jiajia |
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Owner name: SHANGHAI YOUBIKE ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHANGHAI UBIQUETAG PACKAGE MATERIALS CO., LTD. |
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Address after: 201300 Shanghai city Pudong New Area Town Park Road No. 318 Patentee after: Shanghai Electronic Science and Technology Co., Ltd. of ratio of greater inequality section Address before: 201300 Shanghai city Pudong New Area Town Park Road No. 318 Patentee before: Shanghai Ubiquetag Package Materials Co., Ltd. |
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Effective date of registration: 20171204 Address after: 201300 Shanghai city Pudong New Area Town Park Road 318, building 11, floor 3 Patentee after: Shanghai ubique.tag Networking Technology Co. Ltd. Address before: 201300 Shanghai city Pudong New Area Town Park Road No. 318 Patentee before: Shanghai Electronic Science and Technology Co., Ltd. of ratio of greater inequality section |
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