CN101923380A - Power supply design method of high-density system - Google Patents

Power supply design method of high-density system Download PDF

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Publication number
CN101923380A
CN101923380A CN 201010242197 CN201010242197A CN101923380A CN 101923380 A CN101923380 A CN 101923380A CN 201010242197 CN201010242197 CN 201010242197 CN 201010242197 A CN201010242197 A CN 201010242197A CN 101923380 A CN101923380 A CN 101923380A
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power supply
server
space
density
design method
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CN 201010242197
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Chinese (zh)
Inventor
姚萃南
罗嗣恒
滕学军
吴明生
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Inspur Electronic Information Industry Co Ltd
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Langchao Electronic Information Industry Co Ltd
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Priority to CN 201010242197 priority Critical patent/CN101923380A/en
Publication of CN101923380A publication Critical patent/CN101923380A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a power supply design method of a high-density system, belonging to the field of power supply of server cabinet systems. In structure, a 1U rack server system is comprised; two server mainboards are arranged in the space of the mainbaord of a general server system, and density computation is doubled in a 1U space; in a 1U high-density space, two computing nodes are arranged and the two mainboard which are integrated into a whole shares power supply modules for centralized power supply, wherein the power supply modules are connected with the main boards together through the power supply backboard of the computing nodes, thereby realizing dual-power redundance in a limited space. The power supply design method of a high-density system can realize the arrangement of two computing nodes in a limited case space and the reduncance function of the two 1U power supply modules through the power supply backboard, fully use structural space and improve the power supply safety of the whole system.

Description

A kind of power supply design method of high-density system
Technical field
The present invention relates to a kind of server cabinet system power supply art, specifically a kind of power supply design method of high-density system.
Background technology
The fast development of internet makes information resources present explosive growth, and people are medium with the network, and the demand of information is also constantly being increased.Various large-scale data machine rooms also arise at the historic moment.The quantity of the individuality of composition data machine room---server, storage rack is also in continuous increase.Because in most cases, the space of machine room rack is limited, for satisfying the needs of network application, need the size of server self be limited.
Tradition 1U rack-mount server adopts mainboard satisfies the user as single computing node various application scenarios.The Supply Security that how realize redundant power supply in the limited chassis space of server cabinet, improves total system becomes the problem that present needs overcome.
Summary of the invention
Technical assignment of the present invention provide a kind of limited chassis space realize two computing nodes deployment, the power module of two 1U is realized redundancy feature, makes full use of structure space, is improved a kind of power supply design method of high-density system of the Supply Security of total system by power supply backplane.
Technical assignment of the present invention is realized in the following manner, comprise 1U rack-mount server system, realize the deployment of two computing nodes the power module of two 1U being realized redundancy feature by power supply backplane at the chassis space of limited 1U rack-mount server system; On the position of generic server system board size, two server master boards are put in design, and in the 1U space, the realization bulk density is doubled; In the highdensity space of 1U, place two computing nodes, and shared two power modules of two integrated server master boards carry out centrally connected power supply; Wherein, power module is connected one with the power supply backplane that is connected by computing node of server master board, can realize that in limited space two electricity are redundant.
Power supply module and computing node all adopt the connected mode of golden finger to be connected one by power supply backplane.
Golden finger (connecting finger) is a computer hardware.Golden finger is made up of numerous flavous conductive contact blades, because of its surface gold-plating and conductive contact blade are arranged as finger-shaped, so be called " golden finger ".Golden finger is actually in copper-clad plate and is covered with one deck gold again by special process, because the inoxidizability of gold is extremely strong, and conduction is also very strong.But because the expensive price of gold, more zinc-plated replacement of all employings at present.
In a 42U standard server rack, can dispose 84 computing nodes, thereby realize the high density of deployment density.
The deployment density of calculating based on the server of this design philosophy has surpassed blade server.Can carry out simple a calculating, adopt two-way server equally, the design of blade server is the 7U14 sheet, in the standard rack of a 42U height, can put into 6 groups of blade servers, and its bulk density is 128 processors; Adopt the server of high density designs, the 42U frame can be put into 42 1U servers, and each 1U server is made up of the two-way server of two half-breadths, and its bulk density is 168 processors.Therefore high density is the development trend of future server.
High density server is fit to High-Performance Computing Cluster calculating, corporate grid application, the application of Web 2.0 enterprises etc. very much.These use requirement for bulk density, calculated performance than higher, but so not high for the individual node reliability requirement.Play up with image and to be example, just very suitable.Compare with generic server, high density more can satisfy the demand of user to the large scale deployment of HPC and internet industry, is fit to very much the deployment request at high density data center.
The present invention is the advantage that has absorbed rack server and blade server, Jin Cou indoor design more, and two mainboards are integrated, make ultra dense degree server littler compared with the rack server occupation space; And with respect to the blade server of present propaganda normalizing, in purchase cost, the present invention of scalability aspect also has congenital advantage; At management aspect, high density server has still been continued to use traditional rack-mount server standard, so it is as broad as long with traditional server to get up in management, also wants an other cover management thinking and a mode unlike blade server.
A kind of power supply design method of high-density system of the present invention has the following advantages:
1, the deployment density of server calculating has surpassed blade server, and high density is the development trend of future server;
2, high density server is fit to High-Performance Computing Cluster calculating, corporate grid application, the application of Web 2.0 enterprises etc. very much;
3, absorbed the advantage of rack server and blade server, Jin Cou indoor design more, two mainboard is integrated, occupation space is littler, purchase cost is low, scalability is strong, simple and convenient management is convenient;
4, can significantly improve the reliability and the security of system; Utilize the high density server system of this method design to have good market outlook; Thereby, have good value for applications.
Description of drawings
The present invention is further described below in conjunction with accompanying drawing.
Accompanying drawing 1 is a kind of structural representation of power supply design method of high-density system.
Among the figure: 1, computing node I, 2, the computing node II, 3, the power module I, 4, the power module II, 5, power supply backplane, 6, golden finger.
Embodiment
Explain below with reference to Figure of description and specific embodiment a kind of power supply design method of high-density system of the present invention being done.
Embodiment:
A kind of power supply design method of high-density system of the present invention, comprise 1U rack-mount server system, chassis space in limited 1U rack-mount server system is realized two computing nodes---the deployment of computing node I 1, computing node II 2, with the power module of two 1U---and power module I 3, power module II 4 realize redundancy feature by power supply backplane 5; On the position of generic server system board size, two server master boards are put in design, and in the 1U space, the realization bulk density is doubled; In the highdensity space of 1U, place two computing nodes---computing node I 1, computing node II 2, and two integrated server master boards are shared, and two power modules---power module I 3, power module II 4 are carried out centrally connected power supply; Wherein, the power supply backplane 5 of computing node I 1, computing node II 2 is connected one to power module---power module I 3, power module II 4 are passed through computing node with being connected of server master board---, can realize that in limited space two electricity are redundant.
Power supply module---power module I 3, power module II 4 and computing node---computing node I 1, computing node II 2 all adopt the connected mode of golden finger 6 to be connected one by power supply backplane 5.
In a 42U standard server rack, can dispose 84 computing nodes, thereby realize the high density of deployment density.
The deployment density of calculating based on the server of this design philosophy has surpassed blade server.Can carry out simple a calculating, adopt two-way server equally, the design of blade server is the 7U14 sheet, in the standard rack of a 42U height, can put into 6 groups of blade servers, and its bulk density is 128 processors; Adopt the server of high density designs, the 42U frame can be put into 42 1U servers, and each 1U server is made up of the two-way server of two half-breadths, and its bulk density is 168 processors.Therefore high density is the development trend of future server.
High density server is fit to High-Performance Computing Cluster calculating, corporate grid application, the application of Web 2.0 enterprises etc. very much.These use requirement for bulk density, calculated performance than higher, but so not high for the individual node reliability requirement.Play up with image and to be example, just very suitable.Compare with generic server, high density more can satisfy the demand of user to the large scale deployment of HPC and internet industry, is fit to very much the deployment request at high density data center.
The present invention is the advantage that has absorbed rack server and blade server, Jin Cou indoor design more, and two mainboards are integrated, make ultra dense degree server littler compared with the rack server occupation space; And with respect to the blade server of present propaganda normalizing, in purchase cost, the present invention of scalability aspect also has congenital advantage; At management aspect, high density server has still been continued to use traditional rack-mount server standard, so it is as broad as long with traditional server to get up in management, also wants an other cover management thinking and a mode unlike blade server.
Except that the described technical characterictic of instructions, be the known technology of those skilled in the art.

Claims (2)

1. power supply design method of high-density system, comprise 1U rack-mount server system, it is characterized in that realizing the deployment of two computing nodes, the power module of two 1U is realized redundancy feature by power supply backplane at the chassis space of limited 1U rack-mount server system; On the position of generic server system board size, two server master boards are put in design, and in the 1U space, the realization bulk density is doubled; In the highdensity space of 1U, place two computing nodes, and shared two power modules of two integrated server master boards carry out centrally connected power supply; Wherein, power module is connected one with the power supply backplane that is connected by computing node of server master board, can realize that in limited space two electricity are redundant.
2. a kind of power supply design method of high-density system according to claim 1 is characterized in that power supply module and computing node all adopt the connected mode of golden finger to be connected one by power supply backplane.
CN 201010242197 2010-08-02 2010-08-02 Power supply design method of high-density system Pending CN101923380A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101989120A (en) * 2010-10-14 2011-03-23 浪潮电子信息产业股份有限公司 Power supply design method of high-density server system
CN102012734A (en) * 2010-10-21 2011-04-13 浪潮电子信息产业股份有限公司 High density redundant power supply
CN103529921A (en) * 2013-10-18 2014-01-22 浪潮电子信息产业股份有限公司 Method for designing hot plugging power supplying applicable to high-density server
CN103677153A (en) * 2012-09-18 2014-03-26 英业达科技有限公司 Server and server rack system
CN103984391A (en) * 2014-05-29 2014-08-13 浪潮电子信息产业股份有限公司 High density and high bandwidth server main board
CN104793707A (en) * 2014-01-20 2015-07-22 纬创资通股份有限公司 Computer and power supply rotating plate thereof
CN105511572A (en) * 2015-12-10 2016-04-20 浪潮电子信息产业股份有限公司 Method for extending compute nodes of blade server
CN105759926A (en) * 2016-04-20 2016-07-13 浪潮电子信息产业股份有限公司 Server framework integrating air cooling and liquid cooling
CN112055499A (en) * 2019-06-05 2020-12-08 环达电脑(上海)有限公司 Server cabinet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009251733A (en) * 2008-04-02 2009-10-29 Kawamura Electric Inc Structure for mounting device onto server rack
CN201413488Y (en) * 2009-04-16 2010-02-24 浪潮电子信息产业股份有限公司 Energy-saving heat dissipation frame structure device for high-density servers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009251733A (en) * 2008-04-02 2009-10-29 Kawamura Electric Inc Structure for mounting device onto server rack
CN201413488Y (en) * 2009-04-16 2010-02-24 浪潮电子信息产业股份有限公司 Energy-saving heat dissipation frame structure device for high-density servers

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101989120A (en) * 2010-10-14 2011-03-23 浪潮电子信息产业股份有限公司 Power supply design method of high-density server system
CN102012734A (en) * 2010-10-21 2011-04-13 浪潮电子信息产业股份有限公司 High density redundant power supply
CN103677153A (en) * 2012-09-18 2014-03-26 英业达科技有限公司 Server and server rack system
CN103677153B (en) * 2012-09-18 2017-07-07 英业达科技有限公司 Server and server rack system
CN103529921A (en) * 2013-10-18 2014-01-22 浪潮电子信息产业股份有限公司 Method for designing hot plugging power supplying applicable to high-density server
CN104793707A (en) * 2014-01-20 2015-07-22 纬创资通股份有限公司 Computer and power supply rotating plate thereof
CN103984391A (en) * 2014-05-29 2014-08-13 浪潮电子信息产业股份有限公司 High density and high bandwidth server main board
CN105511572A (en) * 2015-12-10 2016-04-20 浪潮电子信息产业股份有限公司 Method for extending compute nodes of blade server
CN105759926A (en) * 2016-04-20 2016-07-13 浪潮电子信息产业股份有限公司 Server framework integrating air cooling and liquid cooling
CN112055499A (en) * 2019-06-05 2020-12-08 环达电脑(上海)有限公司 Server cabinet
CN112055499B (en) * 2019-06-05 2022-01-04 环达电脑(上海)有限公司 Server cabinet

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Application publication date: 20101222