CN101909408A - Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) - Google Patents
Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) Download PDFInfo
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- CN101909408A CN101909408A CN 201010217096 CN201010217096A CN101909408A CN 101909408 A CN101909408 A CN 101909408A CN 201010217096 CN201010217096 CN 201010217096 CN 201010217096 A CN201010217096 A CN 201010217096A CN 101909408 A CN101909408 A CN 101909408A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a method for implanting an RFID (radio frequency identification) signal into a PCB (printed circuit board), relates to the fields of manufacturing of the PCB and application of UHF RFID, and discloses a method for implanting the UHF RFID into the PCB to fulfill the aims of anti-counterfeiting and tracing. Different from a method for directly embedding or attaching a packaged RFID label on the surface, the method is basically characterized in that: an unpackaged RFID chip is directly embedded into the PCB, an antenna is made in the PCB, and the antenna and the chip are interconnected in the PCB by a Build-up technique. Through the method, one-time packaging of the RFID chip and the antenna is saved, the chip embedding and antenna making are compatible with the PCB processing technique, and the RFID labels can be simultaneously made in batches on the entire PCB so as to reduce the application cost of embedding the RFID labels.
Description
Technical field
The present invention relates to PCB and make field and UHF RFID application, mainly is a kind of structure of heeling-in UHF RFID in PCB, with the heeling-in and being produced in the PCB respectively of RFID chip and antenna, and finishes interconnection, thereby can finish false proof and effect spike.
Background technology
According to the thought of hyundai electronics assembling, printed circuit board (PCB) is divided into different types in the different phase of electronics assembling process.Dissimilar printed circuit board (PCB)s (Printed Circuit Board, PCB), the function that it plays is slightly variant, and application direction is also different.Base plate for packaging is applied to the assembling of first order electronics.On this substrate, directly carry single-chip, constitute the basal disc of encapsulation; Conventional printed circuit board applications is in the assembling of second and third grade electronics, as the motherboard of construction system, carries out discrete device and the assembling of the integrated chip that encapsulated.
The structure of a pcb board generally is made of individual layer or multiple layer of copper conductive pattern layer, supports with dielectric layer between the conductive pattern layer and insulate, and the intercommunicated laminating technique (Build-up technology) of crossing between each layer realizes that the element dress is attached to the surface of pcb board.
Fig. 1 is the example of 4 layers of pcb board.4 layers of pcb board are made by 7 layer materials.101 and 107 is signals layer, and 103 is power plane, and 105 is ground plane, is central layer insulation by 104 between 103 and 105 and supports, and between 101 and 103, between 105 and 107, is insulated by dielectric material (102,106).
RFID is REID (Radio Frequency Identification), is a kind of automatic identification technology that begins to rise the nineties in 20th century.REID is utilized radiofrequency signal, realizes that by space coupling (alternating magnetic field or electromagnetic field) contactless information transmission and the information of passing through to be transmitted reach the technology of identifying purpose.Wherein, UHF RFID is the super high frequency radio frequency recognition technology, operating frequency be 860MHz between the 960MHz, the electric wave of this frequency range can not pass through many materials, particularly water, dust, suspended particulate matters such as mist.With respect to the RFID (operating frequency 13.56MHz) of high frequency, the electronic tag of hyper band does not need to separate with metal.Another advantage of UHF RFID is the message transmission rate height, can read a large amount of electronic tags in the very short time.
In the PCB industry, need suitable manner that the PCB product of producing is carried out anti-fake mark and whereabouts affirmation.Initial mode is manual dress joint strip font code on the surface, puts the RFID of reading of data automatically to labeing on the surface.As shown in Figure 2, on a packaged pcb board that posts 201, select suitable space dress joint strip font code or RFID label 202.But manually dress pastes and loses time, and the surface is labeled the form of putting and can not well be protected, to guarantee false proof and function spike.Because label be placed on the surface may suffer artificial or unexpected failure, carve or the like such as peeling off, drawing.Therefore people begin to consider that with the heeling-in of RFID label in substrate inside, because the RFID label has certain distance that reads, heeling-in can not influence its data read in substrate inside, and has effectively protected the RFID label.As shown in Figure 3, for a kind of existing with the structure of RFID label heeling-in in pcb board inside.With the doubling plate is example, among the dielectric layer between signals layer 301 and 304 302, heeling-in RFID label 303.
The present invention is directed to the new heeling-in method of heeling-in UHF RFID proposition in PCB.
Summary of the invention
The object of the present invention is to provide a kind of in PCB the method for heeling-in UHF RFID label, omit the encapsulation of RFID label, the UHF RFID chip that direct heeling-in does not encapsulate, utilize the pcb board manufacture craft to finish the making of antenna and the interconnection between chip and the antenna, thereby reduce cost, and can finish different antenna making according to specifically reading needs.
One of feature of the present invention is, for four layer printed circuit boards, select top signal of telecommunication layer TopLayer and these two centres of power plane Power Plane that the electrically conductive signal layer of a dielectric layer is arranged, on described power plane Power Plane, do not have wiring and element and adorn the UHF RFID chip that the Keep-out area bonded of subsides does not encapsulate, in the signal of telecommunication layer of described top, vertically make antenna pattern corresponding to the UHF RFID chip area of described not encapsulation, on the UHF RFID chip of described not encapsulation, utilize build-up technology to draw the interface of antenna, pass the interconnection of described dielectric layer and described antenna.Be not limited to the signal of telecommunication layer of above explanation, interconnection is made and finished to two adjacent arbitrarily in pcb board signal of telecommunication layers with heeling-in of RFID chip and antenna that its middle dielectric layer can not encapsulate.
Two of feature of the present invention is: described four layer printed circuit boards comprise base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Three of feature of the present invention is, for printed circuit board (PCB) more than four layers, select second signal of telecommunication layer and the 3rd signal of telecommunication layer from the top down, there is a dielectric layer two-layer centre, on described the 3rd signal of telecommunication layer, do not have wiring and element and adorn the UHF RFID chip that the Keep-out area bonded of subsides does not encapsulate, in described secondary signal layer, vertically make antenna pattern corresponding to the UHF RFID chip area of described not encapsulation, on the UHF RFID chip of described not encapsulation, utilize build-up technology to draw the interface of antenna, pass the interconnection of described dielectric layer and described antenna.Be not limited to the signal of telecommunication layer of above explanation, interconnection is made and finished to two adjacent arbitrarily in pcb board signal of telecommunication layers with heeling-in of RFID chip and antenna that its middle dielectric layer can not encapsulate.
Four of feature of the present invention is: described printed circuit board (PCB) more than four layers comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
The general mode that adopts the packaged RFID label of direct heeling-in of existing heeling-in RFID technology has comprised RFID control store chip and antenna in this encapsulation.Itself has increased cost encapsulation, and chip area is very little, and area is subject to Antenna Design in encapsulation, and Antenna Design is subject to packaging appearance, in promptly a certain proportion of rectangular profile.The present invention will be in PCB the RFID control store chip of heeling-in un-encapsulated, and in PCB, finish the making of antenna and the interconnection of chip and antenna, thereby constitute complete RFID label.When reaching the purpose of heeling-in RFID with false proof spike, reduced the packaging cost of RFID label, while batch making on the plate can put in order, and designing antenna more freely, Antenna Design in pcb board does not have the Keep-out zone of wiring and the subsides of element dress, is adapted to different RFID with the flexible antenna design and reads demand.
Description of drawings
Fig. 1 is 4 layers of pcb board signal;
Fig. 2 is pcb board surface mount bar code or the signal of RFID label;
Fig. 3, for a kind of with the structure of RFID label heeling-in in pcb board inside;
Fig. 4 is Keep-out zone explanation in the pcb board;
Fig. 5 is heeling-in structure explanation among the present invention;
Fig. 6 makes signal for antenna among the present invention, (a) is the broken line type antenna pattern, (b) is the linear pattern antenna pattern;
Fig. 7 is the RFID chip example that four layers of pcb board heeling-in do not encapsulate;
Fig. 8 is the RFID chip example that six layers of pcb board heeling-in do not encapsulate.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the present invention, and can not be interpreted as limitation of the present invention.
In the present invention, utilize pcb board not have the Keep-out zone of wiring and the subsides of element dress, carry out heeling-in of RFID chip and antenna and make.
1) on pcb board, select certain Keep-out zone on one side to carry out the chip heeling-in;
2) select inner two the adjacent conductive signals layers of pcb board;
3) in PCB manufacturing process, with the heeling-in of RFID chip between two signals layers;
4) utilize build-up technology to form being connected of chip and last layer signals layer;
5) finish the making of antenna pattern at the last layer signals layer.
The Keep-out zone of mentioning in such scheme, promptly plank apart from the zone that does not have wiring or element dress to paste in the edge certain limit, is seen Fig. 4 all around.In pcb board 400,401 zones are wiring and element put area, the Keep-out zone of reserving during 402 zones are all around promptly designed.403 are the predetermined zone of finishing the chip heeling-in of selection.Because the RFID chip size is very little, in 0.5mm*0.5mm, the chip heeling-in can both be finished in the Keep-out zone that general pcb board is reserved.
In selected zone 403, carry out the chip heeling-in, see Fig. 5.Bonding chip 502 is finished Build-up technology 503 on 502 on signals layer 501, makes flow process according to PCB then, adds dielectric layer 504, compresses signals layer 505.The making of antenna pattern is finished in the corresponding region of signals layer 505.The antenna of making in the signals layer 505 as shown in Figure 6, but the form that is not limited to provide among Fig. 6.
In fact, because the signal of UHF RFID frequency range can be by copper shield, therefore the heeling-in position of chip is not limited to the Keep-out zone, for example, can open up a zone at the power plane layer and carry out chip attach and carry out the antenna making in another laminated suitable independent position, condition is in the not boring of chip attach zone.
With the four-layer circuit board is example, and 701,703,705,707 is signal of telecommunication layer, and 702,706 is dielectric layer, and 704 is central layer among the figure, and for no core plate structure circuit board, 704 is dielectric layer.In selected Keep-out zone, two signals layers selecting top signal of telecommunication layer 701 and power plane 703 need use for the RFID heeling-in, bonding UHF RFID chip 708 in definite zone of 703, vertical correspondence position 701 is made antenna pattern 709, on chip 708, utilize Build-up technology to draw the port that connects antenna, pass dielectric layer 702 and antenna 709 is finished interconnection.Can cover green oils with protective circuit on signals layer 701 surfaces after finishing the lamination making, antenna pattern is also protected by green oil.
For printed circuit board (PCB) more than four layers, with the 6-layer circuit board is example, in selected Keep-out zone, select second from top to bottom, two signals layers that the 3rd layer signal layer need be used as the RFID heeling-in, bonding UHF RFID chip 808 is made antenna pattern 809 at 801 vertical correspondence position in definite zone of 803, on chip 808, utilize Build-up technology to draw the port that connects antenna, pass dielectric layer 802 and antenna 809 is finished interconnection.Because antenna is produced on the secondary signal layer, does not directly contact with the outside, has obtained good protection.
Claims (4)
1. method that is implanted into the RFID label of radio-frequency (RF) identification at printed circuit board (PCB), it is characterized in that: for four layer printed circuit boards, select top signal of telecommunication layer Top Layer and these two centres of power plane PowerPlane that the electrically conductive signal layer of a dielectric layer is arranged, on described power plane Power Plane, do not have wiring and element and adorn the UHF RFID chip that the Keep-out area bonded of subsides does not encapsulate, in the signal of telecommunication layer of described top, vertically make antenna pattern corresponding to the UHF RFID chip area of described not encapsulation, on the UHF RFID chip of described not encapsulation, utilize build-up technology to draw the interface of antenna, pass the interconnection of described dielectric layer and described antenna.
2. according to claim 1, its essential characteristic also is: described four layer printed circuit boards comprise base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
3. method that is implanted into the RFID label of radio-frequency (RF) identification at printed circuit board (PCB), it is characterized in that: for printed circuit board (PCB) more than four layers, select second signal of telecommunication layer and the 3rd signal of telecommunication layer from the top down, there is a dielectric layer two-layer centre, on described the 3rd signal of telecommunication layer, do not have wiring and element and adorn the UHF RFID chip that the Keep-out area bonded of subsides does not encapsulate, in described secondary signal layer, vertically make antenna pattern corresponding to the UHF RFID chip area of described not encapsulation, on the UHF RFID chip of described not encapsulation, utilize build-up technology to draw the interface of antenna, pass the interconnection of described dielectric layer and described antenna.
4. according to claim 3, its essential characteristic also is: described printed circuit board (PCB) more than four layers comprises base plate for packaging that is used for the assembling of first order electronics and the conventional printed circuit board (PCB) that is used for the assembling of second and third grade electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102170969A CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102170969A CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
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| Publication Number | Publication Date |
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| CN101909408A true CN101909408A (en) | 2010-12-08 |
| CN101909408B CN101909408B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102170969A Active CN101909408B (en) | 2010-06-23 | 2010-06-23 | Method for implanting RFID (radio frequency identification) signal into PCB (printed circuit board) |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10713450B2 (en) | 2017-01-12 | 2020-07-14 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Ambient backscatter communication with devices having a circuit carrier with embedded communication equipment |
| US10992055B2 (en) | 2016-04-28 | 2021-04-27 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method |
| US11264708B2 (en) | 2015-01-27 | 2022-03-01 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna structure |
| WO2022257059A1 (en) * | 2021-06-10 | 2022-12-15 | Tridonic Gmbh & Co Kg | Antenna device, led driver and led device |
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200782A1 (en) * | 2006-02-24 | 2007-08-30 | Kosuke Hayama | Antenna and RFID tag |
| KR100819196B1 (en) * | 2006-10-25 | 2008-04-04 | 광운대학교 산학협력단 | Uhf band rfid tag antenna mountable on metallic object |
| CN201117799Y (en) * | 2007-11-30 | 2008-09-17 | 华南理工大学 | UHF RFID electronic label antenna possessing broad band characteristic |
| CN101299486A (en) * | 2008-06-18 | 2008-11-05 | 北京邮电大学 | RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band |
-
2010
- 2010-06-23 CN CN2010102170969A patent/CN101909408B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200782A1 (en) * | 2006-02-24 | 2007-08-30 | Kosuke Hayama | Antenna and RFID tag |
| KR100819196B1 (en) * | 2006-10-25 | 2008-04-04 | 광운대학교 산학협력단 | Uhf band rfid tag antenna mountable on metallic object |
| CN201117799Y (en) * | 2007-11-30 | 2008-09-17 | 华南理工大学 | UHF RFID electronic label antenna possessing broad band characteristic |
| CN101299486A (en) * | 2008-06-18 | 2008-11-05 | 北京邮电大学 | RFID reader-writer antenna capable of overlapping high-frequency and ultrahigh frequency as well as microwave frequency band |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11264708B2 (en) | 2015-01-27 | 2022-03-01 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna structure |
| US10992055B2 (en) | 2016-04-28 | 2021-04-27 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method |
| US10713450B2 (en) | 2017-01-12 | 2020-07-14 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Ambient backscatter communication with devices having a circuit carrier with embedded communication equipment |
| US11933680B2 (en) | 2017-12-04 | 2024-03-19 | Greenvibe Wn Sensing Technologies Ltd. | System and method for detecting a modification of a compound during a transient period |
| WO2022257059A1 (en) * | 2021-06-10 | 2022-12-15 | Tridonic Gmbh & Co Kg | Antenna device, led driver and led device |
| GB2621271A (en) * | 2021-06-10 | 2024-02-07 | Tridonic Gmbh & Co Kg | Antenna device, LED driver and LED device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101909408B (en) | 2012-09-05 |
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Effective date of registration: 20201026 Address after: Room 1303, No. 99, Songyu south 2nd Road, Xiamen City, Fujian Province Patentee after: Xiamen Qingxin Integrated Technology Co., Ltd Address before: 100084 Beijing 100084-82 mailbox Patentee before: TSINGHUA University |
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