CN101901662A - Solenoid coil - Google Patents
Solenoid coil Download PDFInfo
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- CN101901662A CN101901662A CN2010102574801A CN201010257480A CN101901662A CN 101901662 A CN101901662 A CN 101901662A CN 2010102574801 A CN2010102574801 A CN 2010102574801A CN 201010257480 A CN201010257480 A CN 201010257480A CN 101901662 A CN101901662 A CN 101901662A
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- solenoid
- encapsulated layer
- wire winding
- enamelled wire
- accommodation section
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Abstract
The invention discloses a solenoid coil which is used for the solenoid valve of a refrigerating system, comprising a coil part and a magnetizer sheathed out of the coil part, wherein the coil part comprises a skeleton, an enamelled wire winding coiled on the skeleton, an encapsulated layer and a containing part, the encapsulated layer is coated out of the skeleton and the enamelled wire winding, and the containing part is used for containing a circuit board connected with the winding. The invention is provided with a defect part between the encapsulated layer outside the winding and the containing part of the containing circuit board by the coil part so as to effectively cut off the impact on the circuit board by the heating of the coil winding; meanwhile, the invention adds the heat dissipating area while being electrified to work, lowers coil temperature rise, prolongs the service life of the solenoid coil, shortens the shaping cooling time of the solenoid coil and improves the production efficiency of the solenoid coil.
Description
Technical field
The control technology field that the present invention relates to freeze, the solenoid that specifically a kind of electromagnetically operated valve of controlling the refrigerant break-make is used uses under the environment of the high temperature of freeze cycle, high humidity usually.
Background technology
At present, be extensive use of various electromagnetically operated valves as Automatic Control Component in refrigerating system, solenoid is controlled the break-make of refrigerant in the refrigerating system with the valve body acting in conjunction.
The structure of existing scheme as shown in Figure 1, a kind of electromagnetic coil for solenoid valve that is used for the control of refrigerating system fluid, it comprises skeleton and is wound on enamelled wire winding on the skeleton; Skeleton comprises around core and is arranged on a pair of blade of a sword shape portion that is parallel to each other around the core two ends, thereby form the wound portion of winding between this is to blade of a sword shape portion.Enamelled wire is wound on the wound portion of core, and has welded contact pin, and the skeleton that will be wound with enamelled wire is then sealed with encapsulating material, and circuit board is installed on the coil after sealing, with epoxy resin circuit board is sealed filling.The solenoid of existing scheme is that the heat that produces when preventing coil windings work is transmitted on the circuit board, cause that the circuit board temperature is too high, cause that electric components burns on the circuit board, the winding heat is transmitted on the circuit board when adopting thicker encapsulated layer to stop work between coil windings and circuit board.Though this scheme has effectively prevented the heat conduction between the two of coil windings and circuit board, but because encapsulated layer thickness L as shown in Figure 1 between the two has the thickness of 8mm at least, owing to being easy to generate bubble, the material contracts part forms the uniformity that shrinkage cavity influences encapsulated layer when causing coil to seal moulding, increased the moulding cooling time of coil in the moulding cooling procedure simultaneously, the molding cycle of coil is longer relatively; And solenoid is when energising work, and a large amount of heats that winding produces are not easy to distribute, and cause coil temperature rise too high, influence the useful life of coil.
Summary of the invention
The technical assignment of the technical problem to be solved in the present invention and proposition is to solve the too high problem of solenoid temperature rise, improves the radiating effect of solenoid encapsulated layer.The present invention adopts following technical scheme for this reason:
Solenoid of the present invention, comprise skeleton, be wound on enamelled wire winding on the described skeleton, be coated on described enamelled wire winding, the encapsulated layer around the skeleton, described solenoid also be included in described enamelled wire winding a side be used to hold the circuit board that is connected with described enamelled wire winding or the accommodation section of connector, be provided with the lack part between the encapsulated layer outside the enamelled wire winding of accommodation section and this side.
As the further of technique scheme improved and replenish, so that adopt multiple version in the specific implementation, the present invention also comprises following technical characterictic:
Particularly, the described accommodation section is the some of described encapsulated layer, and the encapsulated layer outside described accommodation section and the described enamelled wire winding is integrally formed.
Particularly, the described accommodation section comprises the container cavity that holds the circuit board that is connected with described enamelled wire winding or connector, the accommodation section wall portion that forms described container cavity, also is provided with connecting portion between described accommodation section and the described enamelled wire winding encapsulated layer outward.
Particularly, described solenoid also comprises the contact pin that connects described enamelled wire winding and described circuit board or connector, and described contact pin runs through described connecting portion, and an end of described contact pin is positioned at described container cavity, the other end is fixed in described skeleton, and the centre is sealed by described connecting portion.
Further, described lack part comprises not sealing or the space that is used to deaden of other insulating material between encapsulated layer that described enamelled wire winding is outer and the described accommodation section, the both sides in described space have second connecting portion that encapsulating material forms, and the outer encapsulated layer of second connecting portion and described enamelled wire winding, the bottom wall portion of described accommodation section are connected; The thickness S of preferred described second connecting portion is between 2mm～5mm.
Particularly, between two contact pins, be provided with the portion of running through in the described connecting portion.
Selectively, described space and/or the described cross sectional shape that runs through the length direction of portion are roughly rectangle, ellipse, annular, circular arc, circle or above-mentioned two or more combination of shapes, preferably, the intermediate location at its cross sectional shape also has knuckle.
Alternatively, described space and/or the described portion of running through are one, the combination more than 2 or 3.
Particularly, the encapsulated layer thickness d of the bottom wall portion of described accommodation section, described space around the thickness D of encapsulation object of wall and diapire and/or the described thickness that runs through the encapsulated layer between portion and the described contact pin (h S1) is not less than 2mm.
The invention has the beneficial effects as follows: by the improvement innovation of structure, compared with prior art, by to coil component outside winding encapsulated layer and the accommodation section of containment circuit board between be provided with the lack part, effectively cut off of the influence of the heating in winding of coil to circuit board, increase the area of dissipation of solenoid when energising work simultaneously, reduced coil temperature rise, prolonged the useful life of solenoid, shorten the moulding cooling time of solenoid, improve the production efficiency of solenoid.
Description of drawings:
Fig. 1: be the electromagnetic coil structure schematic diagram of prior art;
Fig. 2: be the structural representation of the dissection of first embodiment of solenoid of the present invention;
Fig. 3: for solenoid among Fig. 2 removes left view behind the magnetic conductor;
Fig. 4: be the coil component structural representation of second embodiment of solenoid of the present invention;
Fig. 5: be the coil component structural representation of the 3rd embodiment of solenoid of the present invention;
Fig. 6: be the structural representation of the dissection of the 4th embodiment of solenoid of the present invention;
Fig. 7: for the solenoid among Fig. 6 removes left view behind the magnetic conductor;
Fig. 8: be the structural representation of the dissection of the 5th embodiment of solenoid of the present invention;
Fig. 9: for the solenoid among Fig. 8 removes left view behind the magnetic conductor;
Figure 10: be the coil component structural representation of the 6th embodiment of solenoid of the present invention;
Symbol description among the figure:
1-skeleton, 2-enamelled wire winding, 3/33-encapsulated layer, 34-connecting portion, 4-contact pin, 5-circuit board, 6-embedding layer, 7-lead-in wire, 8-magnetic conductor;
91 1 spaces, 911 1 bottom surfaces, 912 1 downsides, 913 1 upper sides, 915 one the second connecting portions, 92-run through portion, 10 1 accommodation sections, 11 1 container cavities, 12 1 accommodation section wall portions.
Embodiment
In order to make those skilled in the art person understand this programme better, be described in further detail below in conjunction with drawings and embodiments.
Solenoid of the present invention comprises skeleton 1, be wound on enamelled wire winding 2 on the described skeleton 1, be coated on the encapsulated layer 3 around enamelled wire winding 2, the skeleton 1, described solenoid also be included in enamelled wire winding 2 a side be used to hold the circuit board 5 that is connected with enamelled wire winding 2 or the accommodation section 10 of connector, described accommodation section 10 is the some of described encapsulated layer, and integrally formed with the encapsulated layer 33 outside the enamelled wire winding.Accommodation section 10 comprises the container cavity 11 that holds the circuit board 5 that is connected with enamelled wire winding 2 or connector, the accommodation section wall portion 12 that forms container cavity 11, and accommodation section wall portion 12 comprises four side wall portions and the bottom wall portion that surrounds a week.Also be provided with connecting portion 34 between the encapsulated layer 33 outside accommodation section 10 and the described enamelled wire winding, be connected by contact pin 4 between enamelled wire winding 2 and circuit board 5 or the connector, contact pin 4 runs through connecting portion 34, one end of contact pin 4 is positioned at container cavity 11, the other end is fixed in skeleton 1, and the centre is sealed by described connecting portion 34.Circuit board 5 is installed in the container cavity 11, and irritates with epoxy resin embedding layer 6 envelope, in addition, is installed with magnetic conductor 8 in the solenoid outside, and magnetic conductor 8 is located by the positioning boss that is arranged on the encapsulated layer outer surface and closely cooperated with solenoid.Be provided with the lack part between the encapsulated layer 33 outside the enamelled wire winding 2 of accommodation section 10 and this side.
Fig. 2 is the structural representation of the dissection of solenoid first embodiment of the present invention, and Fig. 3 is the left view after the solenoid among Fig. 2 removes magnetic conductor.As Fig. 2, shown in Figure 3, lack part in the present embodiment be the outer encapsulated layer 33 of enamelled wire winding 2 with accommodation section 10 between not the sealing or the space that is used to deaden 91 of other insulating material of setting, the both sides in the longitudinal direction in space 91 are provided with the outer encapsulated layer 33 of second connecting portion, 915, the second connecting portions 915 that formed by encapsulating material and enamelled wire winding 2, the bottom wall portion of accommodation section is connected.In order to guarantee the bonding strength of second connecting portion 915, the thickness S of second connecting portion 915 is not less than 2mm, considers and saves encapsulating material and radiating effect, and the thickness S of second connecting portion 915 is less than 5mm.In addition, space 91 is arranged to arc surface at the upper side 913 of Width for plane downside 912, and parallels with the outer surface of enamelled wire winding 2, and the R shown in the figure is the external diameter of enamelled wire winding.In order to guarantee the dielectric strength of solenoid, the encapsulated layer thickness D of the downside 912 in the bottom surface 911 in the encapsulated layer thickness of the bottom wall portion of accommodation section 10 (the encapsulated layer thickness of the upper side 913 in space 91 just) d, space 91 and the encapsulated layer thickness D between the contact pin 4, space 91 is not less than 2mm.
After as can be seen from Figure 2 solenoid is provided with space 91, effectively cut off of the influence of the heating in winding of coil to circuit board, increase the area of dissipation of solenoid when energising work simultaneously, thereby reached the purpose that reduces coil temperature rise, the useful life of extension coil; Can shorten simultaneously the moulding cooling time of solenoid, reduce the consumption of encapsulating material, thus, improve the production efficiency of solenoid, reduce the production cost of solenoid.
Fig. 4 is the coil component structural representation of second embodiment of solenoid of the present invention, section shape as shown in the figure can be arranged in described space 91, particularly, the cross sectional shape in the space 91 in the present embodiment is set to rectangle, four sides in space 91 all are the plane, be connected by the arc surface transition between face and the face, the shape of downside that is space 91 with the main distinction of a last embodiment is different, the downside of present embodiment is the plane that parallels with upper side, design features such as encapsulated layer thickness of wall are same as the previously described embodiments around other, repeat no more here.
Fig. 5 is the coil component structural representation of the 3rd embodiment of solenoid of the present invention.Similarly, described space 91 also can be other shapes such as annular as shown in Figure 5, can reach the radiating effect of encapsulated layer equally.Four sides in the space 91 in the present embodiment are arc surface, wherein the arc surface of upper and lower two sides on Width parallels with the outer surface of enamelled wire winding, the minimum encapsulated layer thickness of wall all is not less than 2mm around the space 91, other design feature is same as the previously described embodiments, repeats no more here.
Fig. 6 is the structural representation of dissection of the 4th embodiment of solenoid of the present invention, Fig. 7 for the solenoid among Fig. 6 remove behind the magnetic conductor left view, the lack part in the present embodiment is set to the portion of running through 92.The portion of running through 92 as shown in Figure 6 is arranged between two contact pins, run through portion 92 run through encapsulated layer 33 away from the side 31 of contact pin 4 and side near contact pin 4, the cross sectional shape of the portion of running through 92 in the present embodiment is a rectangle, run through portion 92 left side in the longitudinal direction, right flank respectively with a left side, encapsulated layer thickness S1 between the right contact pin is more than 2mm, similarly, the encapsulated layer thickness h between downside on the Width 922 and contact pin 4 that runs through portion 92, encapsulated layer thickness (the encapsulated layer thickness of the bottom wall portion of the accommodation section 10 just) d that runs through the upper side on Width of portion 92 is not less than 2mm, guarantees the insulation property of coil.The solenoid of this structure has equally effectively cut off the influence of the heating in winding of coil to circuit board, the heat that winding is produced not only distributes by side around the portion of running through, and circulate up and down by the portion of running through and to distribute, the radiating effect of encapsulated layer is significantly improved, coil temperature rise is obviously descended, also can reach purpose of the present invention.
In addition, also can be other shape, as annular, ellipse, polygon or the like, can reach purpose of the present invention.But guarantee the downside of the portion of running through and the encapsulated layer thickness h between the contact pin, the encapsulated layer thickness d that runs through the upper side of portion, the portion of running through in the longitudinal direction two sides and the encapsulated layer thickness S1 between the contact pin all more than 2mm, guarantee the insulation property of coil.
As the 5th kind of embodiment of the present invention, Fig. 8 is the structural representation of dissection of the 5th embodiment of solenoid of the present invention, and Fig. 9 removes left view behind the magnetic conductor for the solenoid among Fig. 8.As shown in the figure, as the further improvement to above-mentioned execution mode, the lack part of present embodiment is space 91 and runs through the combination of portion 92, just to the space in the foregoing description 91 with run through the combination of portion 92.The solenoid of present embodiment and the main distinction of the foregoing description are provided with the portion of running through 92 again when being to be provided with in the connecting portion 34 of solenoid space 91, because the restriction of loop construction, it is littler than space 91 areas of section to run through the area of section of portion 92, such execution mode is more much bigger than the area of dissipation of above-mentioned arbitrary embodiment, therefore radiating effect is further promoted, present embodiment is the preferred execution mode that uses, other design feature is same as the previously described embodiments, repeats no more locating.
Figure 10 is the coil component structural representation of the 6th embodiment of solenoid of the present invention, and the lack part of solenoid of the present invention is made up of the space 91 of a plurality of relatively independent circles, and the radius of circle can be the same or different.As shown in the figure, the lack part in the present embodiment is made up of the space 91 of four circles; Also can will wherein be set to space 91 near two of coil edge, radius is r1's, and two of being positioned at the coil middle part are set to the portion of running through 92, radius is r2's, insulation property in order to ensure coil, and the radius r 1＞run through the radius r 2 of portion in space among the figure, S shown in the figure and S1 are more than 2mm.These two kinds of schemes can both reach purpose of the present invention, but a kind of formed area of dissipation of mode by space and the portion's of running through combination in back is relatively large, as the preferential execution mode in two kinds of schemes.Other design feature is same as the previously described embodiments, repeats no more locating.
Go up the space of the circle among the embodiment in addition or run through portion, equally also can be the space of other figure or run through portion,, also can both reach purpose of the present invention as combination of polygon or multiple figure or the like.But the minimum thickness of guaranteeing space 91 and/or running through the encapsulated layer of wall around the portion 92 is not less than 2mm, to guarantee the insulation property of coil.
Just to the enumerating of inventive concept way of realization, protection scope of the present invention should not be regarded as only limiting to the concrete form that embodiment states to the described content of this specification embodiment, comprises other similar form yet.
The various orientation of being mentioned in this specification in addition such as left and right, upper and lower, inside and outside are just quoted for convenience of description, should not be considered limitation of the present invention.
Claims (9)
1. solenoid, comprise skeleton (1), be wound on enamelled wire winding (2) on the described skeleton (1), be coated on described enamelled wire winding (2), skeleton (1) encapsulated layer (3) on every side, it is characterized in that, described solenoid also be included in described enamelled wire winding (2) a side be used to hold the circuit board (5) that is connected with described enamelled wire winding (2) or the accommodation section (10) of connector, be provided with the lack part between the encapsulated layer (33) outside the enamelled wire winding (2) of accommodation section (10) and this side.
2. solenoid according to claim 1 is characterized in that, described accommodation section (10) are the some of described encapsulated layer, and described accommodation section (10) are integrally formed with the encapsulated layer outside the described enamelled wire winding.
3. solenoid according to claim 1, it is characterized in that, described accommodation section (10) comprises the container cavity (11) that holds the circuit board (5) that is connected with described enamelled wire winding (2) or connector, the accommodation section wall portion (12) that forms described container cavity (11), also is provided with connecting portion (34) between the outer encapsulated layer (33) of described accommodation section (10) and described enamelled wire winding.
4. solenoid according to claim 1, it is characterized in that, described solenoid also comprises the contact pin (4) that connects described enamelled wire winding and described circuit board or connector, described contact pin (4) runs through described connecting portion (34), one end of described contact pin is positioned at described container cavity (11), the other end is fixed in described skeleton (1), and the centre is sealed by described connecting portion (34).
5. according to the wherein arbitrary described solenoid of claim 1-4, it is characterized in that, described lack part comprises not sealing or the space that is used to deaden (91) of other insulating material between encapsulated layer (33) that described enamelled wire winding is outer and the described accommodation section, the both sides in described space (91) have second connecting portion (915) that encapsulating material forms, and the outer encapsulated layer (33) of second connecting portion (915) and described enamelled wire winding, the bottom wall portion of described accommodation section are connected; The thickness S of preferred described second connecting portion (915) is between 2mm～5mm.
6. solenoid according to claim 4 is characterized in that, is provided with the portion of running through (92) in the described connecting portion (34) between two contact pins.
7. according to claim 5 or 6 described solenoids, it is characterized in that, described space (91) and/or the described cross sectional shape that runs through the length direction of portion (92) are roughly rectangle, ellipse, annular, circular arc, circle or above-mentioned two or more combination of shapes, preferably, the intermediate location at its cross sectional shape also has knuckle.
8. solenoid according to claim 7 is characterized in that, described space (91) and/or the described portion (92) of running through are one, the combination more than 2 or 3.
9. solenoid according to claim 7, it is characterized in that, (h S1) is not less than 2mm for the thickness D of the encapsulation object of wall and diapire and/or the described thickness that runs through the encapsulated layer between portion (92) and the described contact pin (4) around the encapsulated layer thickness d of the bottom wall portion of described accommodation section (10), described space (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010257480.1A CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010257480.1A CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
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| Publication Number | Publication Date |
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| CN101901662A true CN101901662A (en) | 2010-12-01 |
| CN101901662B CN101901662B (en) | 2016-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010257480.1A Active CN101901662B (en) | 2010-08-13 | 2010-08-13 | A kind of solenoid |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202251A (en) * | 2015-10-23 | 2015-12-30 | 宁波星宇国均汽车电磁阀有限公司 | Two-position three-way switch electromagnetic valve |
| CN109869518A (en) * | 2017-12-05 | 2019-06-11 | 浙江三花制冷集团有限公司 | A kind of solenoid valve and its electromagnetic coil |
| CN109916103A (en) * | 2017-12-12 | 2019-06-21 | 浙江三花制冷集团有限公司 | A kind of four-way reversing valve |
| WO2020108617A1 (en) * | 2018-11-30 | 2020-06-04 | 浙江三花智能控制股份有限公司 | Eletromagnetic coil, mold, and electromagnetic coil manufacturing method |
| CN113241871A (en) * | 2021-05-18 | 2021-08-10 | 江苏华阳智能装备股份有限公司 | Air conditioner draining pump stator assembly and encapsulating method thereof |
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| JPH10154626A (en) * | 1996-11-25 | 1998-06-09 | Tdk Corp | Method and device for manufacturing double layer coil |
| US20020175790A1 (en) * | 2001-05-25 | 2002-11-28 | Bruker Biospin Gmbh | Superconducting magnet coil for very high field having an HTS coil section and method for production thereof |
| CN101038809A (en) * | 2006-03-15 | 2007-09-19 | 浙江三花制冷集团有限公司 | Electromagnetic coil |
| CN101552076A (en) * | 2008-12-22 | 2009-10-07 | 吴培生 | Unsaturated resin plastic sealed explosion-proof electromagnetic coil |
| CN101604570A (en) * | 2008-06-10 | 2009-12-16 | 浙江三花股份有限公司 | Solenoid and skeleton thereof |
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2010
- 2010-08-13 CN CN201010257480.1A patent/CN101901662B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10154626A (en) * | 1996-11-25 | 1998-06-09 | Tdk Corp | Method and device for manufacturing double layer coil |
| US20020175790A1 (en) * | 2001-05-25 | 2002-11-28 | Bruker Biospin Gmbh | Superconducting magnet coil for very high field having an HTS coil section and method for production thereof |
| CN101038809A (en) * | 2006-03-15 | 2007-09-19 | 浙江三花制冷集团有限公司 | Electromagnetic coil |
| CN101604570A (en) * | 2008-06-10 | 2009-12-16 | 浙江三花股份有限公司 | Solenoid and skeleton thereof |
| CN101552076A (en) * | 2008-12-22 | 2009-10-07 | 吴培生 | Unsaturated resin plastic sealed explosion-proof electromagnetic coil |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202251A (en) * | 2015-10-23 | 2015-12-30 | 宁波星宇国均汽车电磁阀有限公司 | Two-position three-way switch electromagnetic valve |
| CN109869518A (en) * | 2017-12-05 | 2019-06-11 | 浙江三花制冷集团有限公司 | A kind of solenoid valve and its electromagnetic coil |
| CN109916103A (en) * | 2017-12-12 | 2019-06-21 | 浙江三花制冷集团有限公司 | A kind of four-way reversing valve |
| CN109916103B (en) * | 2017-12-12 | 2021-06-18 | 浙江三花制冷集团有限公司 | Four-way reversing valve |
| WO2020108617A1 (en) * | 2018-11-30 | 2020-06-04 | 浙江三花智能控制股份有限公司 | Eletromagnetic coil, mold, and electromagnetic coil manufacturing method |
| CN113241871A (en) * | 2021-05-18 | 2021-08-10 | 江苏华阳智能装备股份有限公司 | Air conditioner draining pump stator assembly and encapsulating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101901662B (en) | 2016-04-13 |
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Effective date of registration: 20170210 Address after: 312500 Shaoxing City, Zhejiang province Xinchang Qixing street under the Liquan Patentee after: Zhejiang three flower intelligent control Limited by Share Ltd Address before: 312500 Liquan village of Zhejiang County in Xinchang Province town under Patentee before: Sanhua Refrigeration Group Co., Ltd., Zhejang |
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