CN101901652A - Method for separating organic bonding porcelain bushing without damage - Google Patents
Method for separating organic bonding porcelain bushing without damage Download PDFInfo
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- CN101901652A CN101901652A CN 201010183072 CN201010183072A CN101901652A CN 101901652 A CN101901652 A CN 101901652A CN 201010183072 CN201010183072 CN 201010183072 CN 201010183072 A CN201010183072 A CN 201010183072A CN 101901652 A CN101901652 A CN 101901652A
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- porcelain bushing
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- organic bonding
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- bonding porcelain
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Abstract
The invention relates to the field of the manufacturing of high-voltage electrotechnical porcelain, and discloses a method for separating an organic bonding porcelain bushing without damage, which comprises the following steps of: putting the organic bonding porcelain bushing into a kiln car in an industrial kiln; after the temperature is raised to 50 DEG C, raising the temperature of the organic bonding porcelain bushing to 100 DEG C, 150 DEG C, 200 DEG C and 500 DEG C sequentially according to 10 DEG C/hour, 15 DEG C/hour, 25 DEG C/hour and 35 DEG C/hour, and preserving the heat at 500 DEG C for 1 hour; reducing the temperature to 300 DEG C and 150 DEG C sequentially according to 25 DEG C/hour and 20 DEG C/hour; and finally, cooling naturally with the kiln.
Description
Technical field
The present invention relates to high tension insulator and make field, particularly a kind of harmless separation method of organic bonding porcelain bushing.
Background technology
In the high tension insulator process of producing product, the electric insulators of voltage levels generally adopts sectional forming, and is then that each section porcelain spare is as a whole with the bonding one-tenth of organic adhesion agent.For check organic bonding porcelain bushing interface bonding quality, need carry out the interface withstand voltage test.If the interface withstand voltage test is defective, general processing method is: docking port is withstand voltage underproof insulator, heat at interface one side distance interface 200~300mm place winding resistance wire and energising, when being heated to uniform temperature, throw cold water at the heating position again, utilize the method for chilling to make insulator from the fracture of heating position.The result who does like this keeps a joint insulator, scraps another joint insulator.And then the insulator that remains is carried out interface grind, select another joint insulator to carry out organic bonding again again.Do like this and not only cause waste, grind workload but also increased the insulator interface.
Summary of the invention
The object of the present invention is to provide a kind of harmless separation method of organic bonding porcelain bushing,, make its forfeiture adhesive strength, realize the harmless separation of insulator by heating and decomposition, carbonization organic adhesion agent.
In order to achieve the above object, the present invention is achieved by the following technical solutions.
A kind of harmless separation method of organic bonding porcelain bushing, it is characterized in that, described harmless separation method may further comprise the steps: on the kiln car in the Industrial Stoves of at first organic bonding porcelain bushing being packed into, after being warmed up to 50 ℃, being warmed up to 100 ℃, 15 ℃/h according to 10 ℃/h successively is warmed up to 150 ℃, 25 ℃/h and is warmed up to 200 ℃, 35 ℃/h and is warmed up to 500 ℃, 500 ℃ of insulation 1h; Then, cool to 300 ℃, 20 ℃/h according to 25 ℃/h successively and cool to 150 ℃; At last, with the stove natural cooling.
Technique scheme is applicable to that more the organic adhesive that described organic bonding porcelain bushing uses is: the organic adhesive of the cold curing of being made up of E-51 epoxy resin, diethylenetriamine, aminopropyl triethoxysilane, aerosil, wollastonite in powder; Or the organic adhesive that described organic bonding porcelain bushing uses is: by E-51 epoxy resin, right-that MDA, aminopropyl triethoxysilane, liquid polysulfide rubber, aerosil, silicon powder are formed the hot setting organic adhesive.
The inventor is through the organic adhesion agent performance is studied, and when organic adhesive was heated to 500 ℃ according to certain heating rate, the organic adhesion agent adhesive began to decompose, carbonization, the forfeiture adhesive strength, and can not produce infringement to insulator.Therefore, the present invention adopts Industrial Stoves to heat to organic bonding porcelain bushing, and decomposition, carbonization organic adhesion agent make its forfeiture adhesive strength, and the realization insulator is harmless to be separated.
Embodiment
Embodiment 1, organic bonding porcelain bushing is packed on the kiln car in the Industrial Stoves, wherein, the organic adhesive that uses of organic bonding porcelain bushing is: the organic adhesive of the cold curing of being made up of E-51 epoxy resin, diethylenetriamine, aminopropyl triethoxysilane, aerosil, wollastonite in powder.
Referring to the Industrial Stoves temperature control table, at first, be warmed up to 50 ℃ after, be warmed up to 100 ℃, 15 ℃/h according to 10 ℃/h successively and be warmed up to 150 ℃, 25 ℃/h and be warmed up to 200 ℃, 35 ℃/h and be warmed up to 500 ℃, 500 ℃ of insulation 1h; Then, cool to 300 ℃, 20 ℃/h according to 25 ℃/h successively and cool to 150 ℃; At last, with the stove natural cooling, the insulator natural separation.
Embodiment 2, organic bonding porcelain bushing is packed on the kiln car in the Industrial Stoves, wherein, the organic adhesive of organic bonding porcelain bushing use is: by E-51 epoxy resin, right-that MDA, aminopropyl triethoxysilane, liquid polysulfide rubber, aerosil, silicon powder are formed the hot setting organic adhesive.
Referring to the Industrial Stoves temperature control table, at first, be warmed up to 50 ℃ after, be warmed up to 100 ℃, 15 ℃/h according to 10 ℃/h successively and be warmed up to 150 ℃, 25 ℃/h and be warmed up to 200 ℃, 35 ℃/h and be warmed up to 500 ℃, 500 ℃ of insulation 1h; Then, cool to 300 ℃, 20 ℃/h according to 25 ℃/h successively and cool to 150 ℃; At last, with the stove natural cooling, the insulator natural separation.
The Industrial Stoves temperature control table
Temperature (℃) | Wen Su (℃/h) | Time (h:min) | Cumulative time (h:min) |
50℃~100℃ | 10℃/h | 5:00 | 5:00 |
100℃~150℃ | 15℃/h | 3:20 | 8:20 |
150℃~200℃ | 25℃/h | 2:00 | 10:20 |
200℃~500℃ | 35℃/h | 8:35 | 18:55 |
500℃ | 0℃/h | 1:00 | 19:55 |
500℃~300℃ | 25℃/h | 8:00 | 27:55 |
300℃~150℃ | 20℃/h | 7:30 | 35:25 |
150℃~50℃ | Natural cooling |
Claims (3)
1. the harmless separation method of an organic bonding porcelain bushing, it is characterized in that, described harmless separation method may further comprise the steps: on the kiln car in the Industrial Stoves of at first organic bonding porcelain bushing being packed into, after being warmed up to 50 ℃, being warmed up to 100 ℃, 15 ℃/h according to 10 ℃/h successively is warmed up to 150 ℃, 25 ℃/h and is warmed up to 200 ℃, 35 ℃/h and is warmed up to 500 ℃, 500 ℃ of insulation 1h; Then, cool to 300 ℃, 20 ℃/h according to 25 ℃/h successively and cool to 150 ℃; At last, with the stove natural cooling.
2. the harmless separation method of organic bonding porcelain bushing according to claim 1, it is characterized in that the organic adhesive that described organic bonding porcelain bushing uses is: the organic adhesive of the cold curing of forming by E-51 epoxy resin, diethylenetriamine, aminopropyl triethoxysilane, aerosil, wollastonite in powder.
3. the harmless separation method of organic bonding porcelain bushing according to claim 1, it is characterized in that the organic adhesive that described organic bonding porcelain bushing uses is: by E-51 epoxy resin, right-that MDA, aminopropyl triethoxysilane, liquid polysulfide rubber, aerosil, silicon powder are formed the hot setting organic adhesive.
Priority Applications (1)
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CN2010101830726A CN101901652B (en) | 2010-05-25 | 2010-05-25 | Method for separating organic bonding porcelain bushing without damage |
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CN2010101830726A CN101901652B (en) | 2010-05-25 | 2010-05-25 | Method for separating organic bonding porcelain bushing without damage |
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CN101901652A true CN101901652A (en) | 2010-12-01 |
CN101901652B CN101901652B (en) | 2011-11-09 |
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CN2010101830726A Active CN101901652B (en) | 2010-05-25 | 2010-05-25 | Method for separating organic bonding porcelain bushing without damage |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5792584A (en) * | 1980-11-27 | 1982-06-09 | Hitachi Chemical Co Ltd | Manufacture of insulator |
JPH04215214A (en) * | 1990-12-13 | 1992-08-06 | Ngk Insulators Ltd | Junction porcelain insulator |
CN100569886C (en) * | 2007-09-04 | 2009-12-16 | 中国西电电气股份有限公司 | The electric insulation insulator is with the adhering method of caking agent and insulator |
CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
-
2010
- 2010-05-25 CN CN2010101830726A patent/CN101901652B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5792584A (en) * | 1980-11-27 | 1982-06-09 | Hitachi Chemical Co Ltd | Manufacture of insulator |
JPH04215214A (en) * | 1990-12-13 | 1992-08-06 | Ngk Insulators Ltd | Junction porcelain insulator |
CN100569886C (en) * | 2007-09-04 | 2009-12-16 | 中国西电电气股份有限公司 | The electric insulation insulator is with the adhering method of caking agent and insulator |
CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
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CN101901652B (en) | 2011-11-09 |
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Application publication date: 20101201 Assignee: XI'AN XD HIGH VOLTAGE PORCELAIN INSULATOR CO., LTD. Assignor: China XD Electronic Corporation Contract record no.: 2013610000028 Denomination of invention: Method for separating organic bonding porcelain bushing without damage Granted publication date: 20111109 License type: Exclusive License Record date: 20130425 |
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