CN101900501A - Novel heat pipe radiator - Google Patents
Novel heat pipe radiator Download PDFInfo
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- CN101900501A CN101900501A CN200910074675XA CN200910074675A CN101900501A CN 101900501 A CN101900501 A CN 101900501A CN 200910074675X A CN200910074675X A CN 200910074675XA CN 200910074675 A CN200910074675 A CN 200910074675A CN 101900501 A CN101900501 A CN 101900501A
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- heat
- pipe radiator
- heat pipe
- evaporation ends
- semicircular arc
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Abstract
The invention aims at providing a heat pipe radiator with a new structure, which can overcome the factors of complex manufacturing process, low working efficiency and unstable product quality in the prior art. The modern production means, that is one-time extrusion molding is used for rapid production, a product has consistency and interchangeability, and a finished product can be assembled without other processing procedures. The heat pipe radiator can not only ensure the product quality, but also improve the working efficiency and reduce the production cost, thereby playing the role of achieving excellent results by using different approaches.
Description
Affiliated technical field:
The present invention relates to the structure and the technology of heat pipe heat radiation apparatus, concrete is a kind of new construction heat-pipe radiating apparatus
Background technology:
At present, the energy that heat-pipe radiator is mainly used in the semiconductor cooling device hot junction discharges, its function is: when semiconductor cooling device has electric current to pass through, the device hot junction can produce very high heat flow density in moment, the energy that discharges then relies on the evaporation cavity of heat-pipe radiator to absorb its energy, liquid medium in the evaporation cavity is vaporized rapidly, passing through the circuitous crooked circulation line of spiral, energy is discharged in the ambient air goes.And the manufacture craft of heat-pipe radiator evaporation cavity is very complicated, promptly needs sheet metal, and through four mechanical stretchings, trapezoidal box-like of formation hollow needs the welding production technology of large tracts of land, many solder joints again, can finish a trapezoidal cavity of airtight hollow.Since need very high vacuum in the cavity, thus do not allow any small leakage, the manufacturing cost height, inefficiency, the technological problems that unstable product quality etc. are difficult to overcome.
Summary of the invention:
The object of the present invention is to provide a kind of novel heat-pipe radiator.It is characterized in that adopting and a kind ofly had the metallic aluminium section bar plate of good heat conductive performance to replace heat conductivility relatively poor, the manufacturing process complexity, the trapezoidal evaporation cavity of the hollow of unstable product quality, and the circuitous crooked heat dissipation pipeline of spiral, the manufacturing process that has then adopted the whole piece pipeline to dock from beginning to end makes original large tracts of land, and the welding manufacturing process of many solder joints has reduced more than 95 percent, effectively solve small leakage problem, solved the technological problems of unstable product quality completely.
Concrete structure of the present invention is:
What the evaporation ends of novel heat pipe radiator adopted is that one one side has boss, another side then is the metallic aluminium plate that has the semicircular arc groove, the external diameter of the circuitous radiating tube evaporator section of spiral closely contacts with semicircular arc groove metallic aluminium plate and forms an integral body, the pipeline of the circuitous radiating tube of spiral has then taked to dock from beginning to end manufacturing process, make it form a closed type circulation canal, be filled with heat-conducting medium in the circulation canal, when the evaporation ends of heat-pipe radiator receives energy, heat energy then passes to heat-conducting medium in the circulation canal rapidly by metallic aluminium plate boss, after heat-conducting medium absorbs heat, understand the vaporization of moment, and heat is taken in the whole tube chamber along the circuitous pipeline of spiral, carry out exchange heat with ambient air, condensed heat-conducting medium relies on gravity to get back to evaporation cavity again, do the self-loopa campaign of evaporative condenser, thereby reach the purpose of heat radiation.
The obtained technological progress of the present invention is:
The evaporation ends of novel heat pipe radiator, employing be one block of metallic aluminium section bar 2..Its geometry is determined by mould, need not any other procedure.So just saved the processing and manufacturing cost because aluminium section bar is disposable extrusion molding, so can produce continuously in enormous quantities, be cut into plate after, parts can be accomplished uniformity, interchangeability.Parts steady quality, cheap.
The tube chamber of the circuitous heat pipe (see figure 1) of spiral needs very high vacuum, the technological improvement measure that the present invention takes is: the moulding of whole piece canal curvature, pipe is first, the manufacturing process of pipe tail butt joint, it is big to have solved the labour intensity that large tracts of land, the welding production technology of many solder joints brought completely, production efficiency is low, unstable product quality.Effectively must stop small leakage phenomenon, the quality of product and efficient are significantly improved.
Description of drawings:
Accompanying drawing of the present invention has:
Fig. 1 is the structural representation of embodiments of the invention.
Fig. 2 is the left side view of Fig. 1.
Fig. 3 is the top plan view of Fig. 1.
Fig. 4 is the structural representation of second kind of embodiment of the present invention.
Fig. 5 is the top plan view of Fig. 4
Fig. 6 is the structural representation of the third embodiment of the present invention.
Fig. 7 is the top plan view of Fig. 6
In the above-mentioned accompanying drawing, each Reference numeral is:
1. 2. 3. 4. heat-conducting plate semicircular arc groove of heat-conducting plate boss of aluminium section bar heat-conducting plate of the circuitous radiating tube of spiral
5. heat pipe docks from beginning to end and overlaps the heat-conducting plate that 7. 6. heat pipe tube chamber connects fin
8. 9. radiating fin of heat-conducting plate semicircular arc groove
The work of novel heat pipe radiator of the present invention is achieved in that
1 further specify with reference to the accompanying drawings, when the hot junction of semiconductor cooling device with after 2. the heat-conducting plate of heat-pipe radiator closely contacts, the heat that the hot junction discharges of semiconductor cooling device, 2. the heat-conducting medium of radiating tube in 1. that is embedded in the semicircular arc groove passed to rapidly by heat-conducting plate, meeting instant vaporization after heat-conducting medium absorbs heat, and do clockwise along the hand of spiral of radiating tube and to move, the heat that vaporization is simultaneously brought out, be discharged in the ambient air through radiating pipe wall and go, condensed heat-conducting medium then is back to the evaporation ends of radiator again along radiating tube.So repeatedly, thus reach the purpose of heat radiation.
Fig. 4 is the structural representation of second kind of embodiment of the present invention, its operation principle is identical with first kind of embodiment, its difference is that the metallic aluminium plate is provided with a semicircular arc groove, its purpose has been to strengthen the diameter of radiating tube tube chamber, be that the heat-conducting medium volume increases, help absorbing heat.
Fig. 6 is the structural representation of the third embodiment of the present invention, its operation principle is identical with first kind of embodiment, its difference is to have set up a metallic aluminium plate, its purpose is after the heat of first metallic aluminium plate derivation is absorbed by the heat-conducting medium in the chamber of dispelling the heat, all the other heats can be passed to second metallic aluminium plate, pass to radiating fin or condensed water box etc. again by the boss face of second metallic aluminium plate, can strengthen heat dissipation capacity.
Claims (7)
1. a novel heat pipe radiator is characterized in that 2. the evaporation ends of heat-pipe radiator is provided with one metallic aluminium plate, its geometry for the one side have boss 3., another side then be the semicircular arc groove 4..4. the circuitous pipeline external diameter 1. of spiral closely contacts with the semicircular arc groove and forms an integral body, and the head and the tail butt joint of the circuitous pipeline of spiral 5., then forms the closed type circulation canal, and passage contains the heat-conducting medium (see figure 1).
2. according to claim 1, novel heat pipe radiator, it is characterized in that: the evaporation ends of heat-pipe radiator, be provided with one metal aluminum sheet, its geometry has boss for one side, and another side then is the semicircular arc groove, simultaneously two metallic aluminium plates can also be set, its geometry is identical, and two metallic aluminium plate closely contacts mutually can form more than one a plurality of through hole (see figure 7)s of inlaying the spiral pipeline
3. according to claim 1, novel heat pipe radiator is characterized in that: the semicircular arc groove end face of two metallic aluminium plates that the heat-pipe radiator evaporation ends is provided with, it closely contacts, available bolt mechanical fasteners connects, and also available resin glue is bonding, can also closely contact of soldering heating.
4. according to claim 1, novel heat pipe radiator, it is characterized in that: the raised head face of two metallic aluminium plate (see figure 7)s of heat-pipe radiator evaporation ends setting closely contacts with the semiconductor cooling device hot junction, and 9. other end raised head face then can add fan, cooling water box, absorbent cloth or latent heat of fusion material with heat radiation aluminium fin and contact.
5. according to claim 1, novel heat pipe radiator, it is characterized in that: the evaporation ends of heat-pipe radiator be provided with one metallic aluminium plate 2. its geometry have a boss for one side, another side then is the semicircular arc groove, the semicircular arc groove can be provided with one, a plurality of (seeing Fig. 5, Fig. 3) radiating tube external diameter also can be set closely contact with the semi arch groove.
6. according to claim 1, novel heat pipe radiator is characterized in that: the evaporation ends of the circuitous pipeline of spiral and the closely contact mutually of the groove of two aluminium section bar plates, its radiator is whole pipe, and the head and the tail butt joint, forms the closed type circulation canal.
7. according to claim 1, novel heat pipe radiator, it is characterized in that: after two aluminium section bar plates that the heat-pipe radiator evaporation ends is provided with and tight contact of the circuitous radiating tube of spiral, its overall geometry and plate boss face can form parallel shape, also can form 90 ° of angles or other irregular status.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200910074675XA CN101900501A (en) | 2009-06-08 | 2009-06-08 | Novel heat pipe radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200910074675XA CN101900501A (en) | 2009-06-08 | 2009-06-08 | Novel heat pipe radiator |
Publications (1)
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CN101900501A true CN101900501A (en) | 2010-12-01 |
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CN200910074675XA Pending CN101900501A (en) | 2009-06-08 | 2009-06-08 | Novel heat pipe radiator |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103954155A (en) * | 2014-05-09 | 2014-07-30 | 中国科学院工程热物理研究所 | Spiral pipe-type non-phase-change heating device |
CN104121794A (en) * | 2014-07-25 | 2014-10-29 | 中国科学院工程热物理研究所 | One-way loop gravity assisted heat pipe and manufacturing method thereof |
CN104329827A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator |
CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
-
2009
- 2009-06-08 CN CN200910074675XA patent/CN101900501A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104329827A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator |
CN104329827B (en) * | 2014-03-28 | 2017-01-11 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator |
CN103954155A (en) * | 2014-05-09 | 2014-07-30 | 中国科学院工程热物理研究所 | Spiral pipe-type non-phase-change heating device |
CN104121794A (en) * | 2014-07-25 | 2014-10-29 | 中国科学院工程热物理研究所 | One-way loop gravity assisted heat pipe and manufacturing method thereof |
CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
CN108762443A (en) * | 2018-05-24 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of T-type radiator applied to computer |
CN108762443B (en) * | 2018-05-24 | 2020-08-04 | 苏州浪潮智能科技有限公司 | T-shaped heat dissipation device applied to computer |
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Open date: 20101201 |